Specified Material Contains A Peroxy Group, I.e., -o-0- Patents (Class 525/27)
  • Resin composition having low shrink properties
    Patent number: 4228251
    Abstract: A resin composition which comprises (A) 50 to 90 parts by weight of an unsaturated ester oligomer produced by reacting a glycol, hydroxylated dicyclopentadiene, and at least one unsaturated dibasic acid or anhydride thereof until an acid value of less than 40, (B) 50 to 10 parts by weight of one or more polymerizable monomers, and (C) 3 to 15 parts by weight of polystyrene based on 100 parts by weight of the total of the components (A) and (B), can give molded articles having low shrink properties and improved color shading, cracks, etc.
    Type: Grant
    Filed: November 30, 1978
    Date of Patent: October 14, 1980
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Iwao Maekawa, Isao Uchigasaki, Noboru Monma
  • Process for the preparation of a copolymerizable composition
    Patent number: 4196269
    Abstract: A copolymerizable composition containing an unsaturated polyester resin and a metal accelerator, suitable for copolymerization with an ethylenically unsaturated monomer, has incorporated therein as a peroxide initiator composition an alkylaldehyde peroxide which may be unsubstituted, or alkyl- or aryl-substituted, the alkylaldehyde peroxide containing not more than 20 carbon atoms and at least 1.5 active oxygen atoms per carbonyl group of said alkylaldehyde.
    Type: Grant
    Filed: October 27, 1978
    Date of Patent: April 1, 1980
    Assignee: Akzona Incorporated
    Inventors: Lodewijk Roskott, Arnold Schroeder