Mixed With 1,2-epoxy Reactant Containing More Than One 1,2-epoxy Group Per Mole Or Polymer Derived Therefrom Patents (Class 525/407)
  • Patent number: 9605190
    Abstract: Disclosed is an adhesive composition for hydrophobic or water-repellent substrate comprises an modified epoxy resin, a urethane resin, and a dilution solvent. The adhesive composition according to the present invention can be employed to be adhered the same or different materials or print pattern on a hydrophobic or water-repellent substrate.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: March 28, 2017
    Assignee: KOLON GLOTECH, INC.
    Inventor: Jae-Kuk Park
  • Patent number: 9523159
    Abstract: Cross-linked fibers include first and second precursors, each possessing a core and at least one functional group known to have click reactivity when exposed to UV radiation. Mixtures of the first and second precursors are extruded to produce a filament and irradiated with UV light during the extrusion process.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: December 20, 2016
    Assignees: Covidien LP, SOFRADIM PRODUCTION
    Inventors: Ahmad Robert Hadba, Sébastien Ladet
  • Patent number: 9133376
    Abstract: A composition including at least one curable structural adhesive, and at least one chemically crosslinked elastomer on the bases of a silane-functional polymer, wherein the elastomer is in the form of an interpenetrating polymer network in the structural adhesive. The composition can be used to form a shape-memory material and is suitable for reinforcing cavities in structural components such as, for example, in automobile bodies.
    Type: Grant
    Filed: March 12, 2014
    Date of Patent: September 15, 2015
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Rui Xu-Rabl, Matthias Gössi, Jürgen Finter
  • Patent number: 8952097
    Abstract: A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: February 10, 2015
    Assignee: Sika Technology AG
    Inventors: Jürgen Finter, Matthias Gössi
  • Patent number: 8912300
    Abstract: There are provided a radical polymerizable composition having a low viscosity suitable for coating and a cured product and a plastic lens each obtained by curing the composition, the cured product having a high refractive index, good adhesiveness to a plastic film substrate, and good adhesiveness kept even under high-temperature and high-humidity conditions. The radical polymerizable composition includes phenylbenzyl (meth)acrylate (A), an epoxy (meth)acrylate (X) having an aromatic ring in its molecular structure, and a radical polymerization initiator (Y) as essential components.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: December 16, 2014
    Assignee: DIC Corporation
    Inventors: Nobuo Kobayashi, Akihiro Kondo, Atsuhisa Miyawaki, Naoya Ikushima, Kazuaki Hatsusaka
  • Patent number: 8883932
    Abstract: New alkoxylation products which carry alkoxysilyl groups, mostly in the form of (poly)ether alcohols or copolymers comprising polyether blocks, which are characterized in that the reactivity of the hydroxyl function is reduced, and also to processes for preparing them and to their use.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: November 11, 2014
    Assignee: Evonik Degussa GmbH
    Inventors: Bastian Matthias Brugger, Melanie Roessing, Matthias Lobert, Frank Schubert, Tammo Boinowitz, Michael Ferenz
  • Patent number: 8871872
    Abstract: Provided is a method for a poly(GAP-co-THF)diol prepolymer in which THF monomer units are copolymerized to GAP, having high difunctionality, a reduced amount of cyclic oligomer side products having a small molecular weight, a wide copolymer composition and controlled molecular weight. The resulted poly(GAP-co-THF)diol prepolymer according to the present invention is used as a binder for a high-energy PBX or composite propellant, specifically used as a binder in the preparation of polyurethane having excellent mechanical properties.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: October 28, 2014
    Assignee: Agency For Defense Development
    Inventors: Bum Jae Lee, In Joo Bae, Jin Seuk Kim, Seung Hee Kim
  • Patent number: 8846856
    Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: September 30, 2014
    Assignee: Dow Global Technologies LLC
    Inventor: Maurice J. Marks
  • Patent number: 8846822
    Abstract: Provided is a curable composition that has low modulus, high elongation and low viscosity, and can be used for building sealing materials. This curable composition includes: an organic polymer (A) containing on average at least 1.4 reactive silyl groups per molecule; and an organic polymer (B) containing on average less than one reactive silyl group per molecule, wherein the number average molecular weight of component (B) is lower than the number average molecular weight of component (A) by at least 3,000, and the ratio (y)/(x) of the number of moles (y) of organic polymers containing only one reactive silyl group per molecule among components (A) and (B) to the number of moles (x) of organic polymers containing at least 2 reactive silyl groups per molecule among components (A) and (B) is not more than 5.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: September 30, 2014
    Assignee: Kaneka Corporation
    Inventors: Ayako Yano, Takahiro Saito, Takeshi Yao
  • Patent number: 8791211
    Abstract: High refractive polymers, optical elements, and optical elements employing the same are provided. The polymer includes a repeat unit represented by Formula (I): wherein: R1 is independently an H, C1-8 alkyl group, C1-8 alkoxy group, or halides; R2 is independently an C1-8 alkyl group, C1-8 alkoxy group, or C1-8 alkanol group; n is 0, or 1; Y is R3 and R4 are each independently an H, C1-8 alkyl group, C1-8 alkoxy group, cycloalkyl group, aryl group, heteroaryl group, or heterocycloalkyl group, and two adjacent R3 groups are optionally combined with the carbon atoms which they are attached thereto, to form a cycloalkyl group, aryl group, heteroaryl group, or heterocycloalkyl group; and Z is independently a residual group of polycaprolactone diol, or a residual group of polyethylene glycol.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: July 29, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Jyh Chang, Zhi-Long Chen
  • Patent number: 8658742
    Abstract: The present invention relates to a stable aqueous dispersion of thermoplastic polymer particles imbibed with a thermosettable compound. The polymer particles are characterized by having a sufficient concentration of anti-agglomerating functional groups to stabilize the latex against agglomeration. The dispersion is useful as one part of a two-pack formulation.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: February 25, 2014
    Assignee: Rohm and Haas Company
    Inventors: Gary William Dombrowski, Zhenwen Fu, Caroline Slone, Andrew Swartz
  • Publication number: 20140046001
    Abstract: Compositions and methods for forming surfactants, aqueous dispersions, and curing agents are provided. In one aspect, the invention relates to improved epoxy functional surfactants prepared by reaction of an epoxy composition and an amidoamine composition formed from a blend of acid-terminated polyoxyalkylene polyols. The improved epoxy functional surfactants may be reacted with an excess of epoxy composition and water to result in an aqueous dispersion. The amidoamine composition may be a reaction mixture of a diamine compound and an acid terminated polyoxyalkylene composition formed from two or more polyoxyalkylene polyol compounds. The epoxy functional surfactant may be reacted with amine compounds to form a compound suitable as a curing agent.
    Type: Application
    Filed: October 23, 2013
    Publication date: February 13, 2014
    Applicant: Momentive Specialty Chemicals Inc.
    Inventors: Jim D. Elmore, Larry Steven Corley, Jerry R. Hite
  • Publication number: 20130281632
    Abstract: Provided is a curable composition that has low modulus, high elongation and low viscosity, and can be used for building sealing materials. This curable composition includes: an organic polymer (A) containing on average at least 1.4 reactive silyl groups per molecule; and an organic polymer (B) containing on average less than one reactive silyl group per molecule, wherein the number average molecular weight of component (B) is lower than the number average molecular weight of component (A) by at least 3,000, and the ratio (y)/(x) of the number of moles (y) of organic polymers containing only one reactive silyl group per molecule among components (A) and (B) to the number of moles (x) of organic polymers containing at least 2 reactive silyl groups per molecule among components (A) and (B) is not more than 5.
    Type: Application
    Filed: October 24, 2011
    Publication date: October 24, 2013
    Applicant: KANEKA CORPORATION
    Inventors: Ayako Yano, Takahiro Saito, Takeshi Yao
  • Patent number: 8541512
    Abstract: A resin component for a one- or two-component adhesive, a matrix resin, or a structural foam, comprising: C1) at least one epoxy resin, having an average of more than one epoxy group per molecule, that does not correspond to the definition of component C2); C2) at least one oligomeric or polymeric urethane-group-free polyether compound. A one- or two-component epoxy adhesive, structural foam, or matrix material for composites, comprising the aforesaid resin components.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: September 24, 2013
    Assignee: Henkel AG & Co. KGaA
    Inventors: Rainer Schoenfeld, Emilie Barriau, Stefan Kreiling, Pablo Walter
  • Patent number: 8536284
    Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: September 17, 2013
    Assignee: Air Products & Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Michael Ian Cook, Gamini Ananda Vedage, Robert Marjo Theodoor Rasing, Vipul P. Dholakia
  • Patent number: 8512594
    Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: August 20, 2013
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Robert Marjo Theodoor Rasing, Gamini Ananda Vedage, Michael Ian Cook, Peter Andrew Lucas
  • Patent number: 8461275
    Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: June 11, 2013
    Assignee: Hexcal Composites Limited
    Inventor: John Cawse
  • Patent number: 8373286
    Abstract: A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: February 12, 2013
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Makoto Yoshitake, Hiroji Enami, Tomoko Kato, Masayoshi Terada
  • Patent number: 8354467
    Abstract: An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: January 15, 2013
    Assignee: Intel Corporation
    Inventors: Linda A. Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Anathakrishan
  • Patent number: 8318870
    Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: November 27, 2012
    Assignee: Sika Technology AG
    Inventors: Markus Haufe, Andreas Kramer
  • Patent number: 8298634
    Abstract: An inkjet printing system contains an inkjet printer loaded with a recording element comprising a support and an ink receiving layer containing: a) fusible polymeric particles; and b) a water soluble block copolymer having ethylene oxide and propylene oxide segments, the copolymer exhibiting a Draves wetting coefficient, for a 0.1 wt % solution in water at 25° C., of not more than 360 seconds. An inkjet printing method and an inkjet recording medium are also contemplated.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: October 30, 2012
    Assignee: Eastman Kodak Company
    Inventors: Kurt M. Schroeder, Lawrence P. DeMejo, Gregory E. Missell
  • Patent number: 8278396
    Abstract: A curing agent for epoxy resin has one or more five- or six-membered aromatic rings, and substituted on the one or more five- or six-membered rings at least two functionalities reactive with the epoxy selected from the group consisting of hydroxyl, amine, imidazole, azine, hydrazide, anhydride, and Lewis acid groups. Choice of functionality can provide a mixed polymer network, one with a more densely cross-linked polymer structure having a high Tg, and the other with a more linear polymer structure to contribute to stress reduction.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: October 2, 2012
    Assignee: Henkel Corporation
    Inventors: Pukun Zhu, Puwei Liu
  • Publication number: 20120128987
    Abstract: A resin component for a one- or two-component adhesive, a matrix resin, or a structural foam, comprising: C1) at least one epoxy resin, having an average of more than one epoxy group per molecule, that does not correspond to the definition of component C2); C2) at least one oligomeric or polymeric urethane-group-free polyether compound. A one- or two-component epoxy adhesive, structural foam, or matrix material for composites, comprising the aforesaid resin components.
    Type: Application
    Filed: January 30, 2012
    Publication date: May 24, 2012
    Inventors: Rainer Schoenfeld, Emilie Barriau, Stefan Kreiling, Pablo Walter
  • Publication number: 20120123039
    Abstract: The disclosure provides a thermosetting composition, including: (a) about 1-35 wt % of an oligomer, wherein the oligomer is obtained by reacting a liquid epoxy resin with an aromatic primary amine having four active hydrogen atoms, and the liquid epoxy resin and the primary amine have an equivalent mole ratio of 1:0.15-1:2.50; (b) about 5-10 wt % of a long chain resin; (c) about 50-80 wt % of an epoxy resin having at least two functional groups; and (d) about 5-15 wt % of a plasticizer.
    Type: Application
    Filed: May 23, 2011
    Publication date: May 17, 2012
    Inventors: Tien-Shou Shieh, Pei-Ching Liu
  • Patent number: 8138580
    Abstract: In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is ?10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: March 20, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Yukitsuna Konishi, Hirohumi Tsuchiya, Shinsuke Kimura, Yasushi Sawamura
  • Patent number: 8080614
    Abstract: A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: December 20, 2011
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Yoshitsugu Morita, Masayoshi Terada, Hiroji Enami, Makoto Yoshitake
  • Patent number: 8076424
    Abstract: The present invention relates to compositions which contain at least one epoxide adduct A having on average more than one epoxide group per molecule, at least one polymer B of the formula (I), at least one thixotropic agent C, based on a urea derivative in a nondiffusing carrier material, and at least one curing agent D for epoxy resins, which is activated by elevated temperature. This composition serves in particular as an adhesive and has an extremely high dynamic resistance to cleavage, in particular at low temperatures. The invention furthermore relates to impact strength modifiers terminated with epoxide groups and of the formula (I). It has been found that these novel impact strength modifiers result in a significant increase in impact strength in epoxy resin compositions, in particular in two-component epoxy resin compositions.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: December 13, 2011
    Assignee: Sika Technology AG
    Inventors: Andreas Kramer, Jürgen Finter, Ulrich Gerber
  • Patent number: 8063143
    Abstract: A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: November 22, 2011
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Yoshitsugu Morita, Tomoko Kato, Hiroshi Ueki
  • Patent number: 8043460
    Abstract: One embodiment of the invention includes product comprising an elastomeric epoxy dry adhesive with a pull-off strength of 1-200 N/cm2 from a substrate and reversibly detached with a peel-off force less than 1 N/cm.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: October 25, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Tao Xie, Xingcheng Xiao
  • Patent number: 8021586
    Abstract: A curable resin composition and powder coating compositions made therefrom including (a) an epoxy resin; (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units having at least four carbon atoms; such that when the epoxy resin composition is cured, the toughness of the resulting cured epoxy resin composition is increased; and (c) at least one curing agent required for the manufacturing, application and proper performance of the powder coating. The amphiphilic block copolymer is preferably an all polyether block copolymer such as a PEO-PBO diblock copolymer or a PEO-PBO-PEO triblock copolymer.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: September 20, 2011
    Assignee: Dow Global Technologies LLC
    Inventors: Kandathil E. Verghese, Marcos P. Franca
  • Patent number: 8012292
    Abstract: One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: September 6, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Tao Xie, Xingcheng Xiao, Ruomiao Wang, Hamid G. Kia, Jessica A. Schroeder, Todd E. Durocher
  • Publication number: 20110213096
    Abstract: A curing agent for epoxy resin has one or more five- or six-membered aromatic rings, and substituted on the one or more five- or six-membered rings at least two functionalities reactive with the epoxy selected from the group consisting of hydroxyl, amine, imidazole, azine, hydrazide, anhydride, and Lewis acid groups. Choice of functionality can provide a mixed polymer network, one with a more densely cross-linked polymer structure having a high Tg, and the other with a more linear polymer structure to contribute to stress reduction.
    Type: Application
    Filed: May 13, 2011
    Publication date: September 1, 2011
    Inventors: Pukun Zhu, Puwei Liu
  • Publication number: 20110196068
    Abstract: A resin composition for optical lenses and optical packaging includes (1) 1 to 99.99 wt % mixture of epoxy, siloxane and epoxy-siloxane copolymers, (2) 0.01 to 5 wt % catalyst and (3) 0 to 40 wt % curing agent. The mixture of epoxy, siloxane and epoxy-siloxane copolymers includes (1) 1 to 85 wt % epoxy and siloxane oligomers, based on total weight of the mixture; (2) 1 to 90 wt % siloxane containing at least one alkoxy group, based on total weight of the mixture; (3) 1 to 80 wt % a epoxy resin having a benzene ring with at least one epoxy group or a hydrogenated benzene ring, or aliphatic epoxy resin, based on total weight of the mixture; (4) 1 to 70 wt % epoxy resin containing at least one hydroxyl group and at least an epoxy group, based on total weight of the mixture.
    Type: Application
    Filed: November 4, 2010
    Publication date: August 11, 2011
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: DEIN-RUN FUNG, TE-CHAO LIAO, CHENG-YU YANG
  • Patent number: 7985524
    Abstract: A process for forming curable powder comprises providing an aqueous dispersion of particles of curable resin and optionally particles comprising at least one curing agent; aggregating the particles optionally with the curing agent to form aggregated particles; coalescing the aggregated particles to form fused particles; and removing the fused particles from the aqueous dispersion. By this process, a curable powder is formed. The curable powder may be used in powder coating.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: July 26, 2011
    Assignee: Xerox Corporation
    Inventors: Guerino G. Sacripante, Hadi K. Mahabadi, Patricia A. Burns, Dan A. Hays, Kip L. Jugle
  • Patent number: 7976665
    Abstract: One embodiment of the invention includes a method of joining two substrates with multilayer thermo-reversible dry adhesives and separating the two bonded substrates by completely thermally reversing the adhesion via heating.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: July 12, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Tao Xie, Xingcheng Xiao, Ruomiao Wang
  • Publication number: 20100311916
    Abstract: The present invention provides a new epoxy resin which is modified with halide and oxazolidone ring. This epoxy resin can improve the peeling strength, Tg, heat resistance, and flame resistance for CCL and be used for print circuit board. The composition comprising (A) a halogen-containing epoxy which containing a oxazolidone ring, about 5˜95 wt % of total weight, (B) epoxy resins with two or above epoxy groups, about 95˜5 wt % of total weight, (C) a curing agent, example of phenol novolac, and (D) a curing accelerator. After laminating the prepreg which had been made by impregnation of the mentioned composition at 170˜210 with 10˜30k gf/cm2, the electric circuit board composition with excellent properties can be obtained. This epoxy resin composition in this invention can achieve the peeling strength>10 lbf/inch, glass transition temperature>155, water absorption<0.2, outstanding heat resistance and pass the UL94 V-0 flame resistance test.
    Type: Application
    Filed: June 8, 2009
    Publication date: December 9, 2010
    Inventors: Ming Jen Tzou, Jung Chung CHIANG, Wen Lung WEI, June Che LU
  • Patent number: 7842755
    Abstract: A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: November 30, 2010
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Yoshitsugu Morita, Tomoko Kato, Hiroshi Ueki
  • Patent number: 7842756
    Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: November 30, 2010
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Jonathan T. Martz, Erick B. Iezzi
  • Patent number: 7834101
    Abstract: The invention is a composition comprising a blend of two or more epoxide containing compositions selected from epoxidized vegetable oils, epoxidized alkyl esters or cycloaliphatic epoxides. In another embodiment, the invention is a blend of one or more epoxidized vegetable oils, epoxidized alkyl esters, or cycloaliphatic epoxides with one or more aromatic epoxides or epoxy functionalized polyoxyalkylene polyols.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: November 16, 2010
    Assignee: Ashland Licensing and Intellectual Property LLC
    Inventors: Robert L. Seats, Carroll G. Reid
  • Patent number: 7772333
    Abstract: Film-forming materials include resins and/or crosslinkers having a —Si(OR)3 group. Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins. A process to produce a film-forming resin includes reacting various polymers to incorporate a pendent group comprising a —Si(OR)3 group. Film-forming resins can be used in methods of producing coating compositions. Coating compositions can be used to coat a substrate, such as a metal substrate, by electrodeposition. Applied coatings containing the film-forming resins can be cured to form crosslinked films on substrates.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: August 10, 2010
    Assignee: BASF Coatings GmbH
    Inventors: Sergio Gonzalez, Timothy S. December
  • Publication number: 20100193961
    Abstract: In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is ?10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less.
    Type: Application
    Filed: September 12, 2008
    Publication date: August 5, 2010
    Inventors: Yukitsuna Konishi, Hirohumi Tsuchiya, Shinsuke Kimura, Yasushi Sawamura
  • Patent number: 7759431
    Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: July 20, 2010
    Assignee: Tyco Healthcare Group LP
    Inventor: Mark S. Roby
  • Patent number: 7759432
    Abstract: The emulsion herein is of an epoxy resin having a glass transition temperature of at least about 40° C., wherein the average diameter of the epoxy resin particles in the emulsion is 500 nm or less. The emulsion may include an epoxy resin, a sulfonated polyester resin and a nonionic surfactant. The emulsion may be used to produce a toner particle in an emulsion aggregation method.
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: July 20, 2010
    Assignee: Xerox Corporation
    Inventors: Ke Zhou, Anna-Karin Eriksson, Guerino G. Sacripante
  • Patent number: 7754824
    Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: July 13, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Rafil A. Basheer, Derek B. Workman, Arun K. Chaudhuri, Mohamed Bouguettaya
  • Patent number: 7691949
    Abstract: Bioabsorbable compounds which include a polyalkylene oxide backbone with two or more isocyanate substituents are useful as one component adhesives. Absorbable compositions useful as a two component adhesive contain a) a polyethylene oxide having two or more amine substituents with b) a bioabsorbable diisocyanate compound, or alternatively contain a) a polyethylene oxide having two or more isocyanate substituents with b) a bioabsorbable diamine compound, or, alternatively contain a) a bioabsorbable diisocyanate compound and b) a bioabsorbable diamine compound.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: April 6, 2010
    Assignee: Tyco Healthcare Group LP
    Inventor: Mark S. Roby
  • Publication number: 20100080906
    Abstract: An inkjet printing system contains an inkjet printer loaded with a recording element comprising a support and an ink receiving layer containing: a) fusible polymeric particles; and b) a water soluble block copolymer having ethylene oxide and propylene oxide segments, the copolymer exhibiting a Draves wetting coefficient, for a 0.1 wt % solution in water at 25° C., of not more than 360 seconds. An inkjet printing method and an inkjet recording medium are also contemplated.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Inventors: Kurt M. Schroeder, Lawrence P. DeMejo, Gregory E. Missell
  • Publication number: 20100048828
    Abstract: Viscosifiers, especially terminated polymers that have functional terminal groups, the polymers being pre-extended by polyols and being reacted to give polymers that are terminated by other functional groups, are produced. The viscosifiers have a low content in educts or educt descendants that deteriorate the properties of compositions. The formation of high-molecular addition products is considerably reduced or even excluded so that the products obtained have low viscosity and good storage stability. The epoxy-terminated polymer of formula (I) is especially preferred.
    Type: Application
    Filed: December 21, 2007
    Publication date: February 25, 2010
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Andreas Kramer, Jan Olaf Schulenburg
  • Patent number: 7666954
    Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: February 23, 2010
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Michael Ian Cook, Gamini Ananda Vedage, Robert Marjo Theodoor Rasing, Vipul P. Dholakia
  • Publication number: 20100019271
    Abstract: The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): (A) an epoxy resin represented by the following structural formula (1): in which n is a positive number, (B) an epoxy resin except for the epoxy resin represented by the structural formula (1), and (C) a curing agent.
    Type: Application
    Filed: July 27, 2009
    Publication date: January 28, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinya OTA, Kazuhiro FUKE, Chisato GOTO, Hisataka ITO, Takashi TANIGUCHI, Kazuhiko YOSHIDA, Masao GUNJI, Seigou TAKUWA
  • Publication number: 20090321117
    Abstract: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system comprising a combination of: (i) at least a first catalyst compound comprising at least one nitrogen-containing catalyst compound; and (ii) at least a second catalyst compound comprising at least one phosphorus-containing catalyst compound; wherein at least one or more of the above components (a)-(c) is halogenated or contains halogen; or if none of the above components are halogenated wherein the resin composition includes (d) a halogenated or halogen-containing flame retardant compound that does not contain nitrogen. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 170° C.
    Type: Application
    Filed: December 19, 2006
    Publication date: December 31, 2009
    Inventors: Ludovic Valette, Tomoyuki Aoyama