Abstract: It is aimed to provide a wiring harness protection material utilized as a wiring harness protection member and having protection performance in a high-temperature and high-humidity environment and a wiring harness. A wiring harness 1 is formed by molding wiring harness protection materials 1 using a thermally moldable nonwoven fabric containing polyethylene terephthalate fibers having a weight-average molecular weight in a range of 10000 to 200000 into a wiring harness protection member 2 having a predetermined shape and covering a wire bundle 4 with the wiring harness protection member 2.

Abstract: Methods for making polymer particles in gel form via an emulsion and/or suspension process are provided. The method can include preparing a reactant mixture comprising a carrier fluid and a monomer component containing one or more phenolic compounds and optionally one or more crosslinking compounds, a mixture of Maillard reactants, or a combination thereof. The monomer component can polymerize to form the polymer particles in gel form. The reactant mixture can be located within a reactor having one or more inner surfaces in contact with the reactant mixture during polymerization of the monomer component. The one or more inner surfaces limit a release of metal, metal ions, or a combination thereof into the reactant mixture to produce the polymer particles in gel form containing less than 1 wt % metal atoms, metal ions, or a combination thereof, based on the total weight of the polymer particles in gel form.

Abstract: A phenolic compound for manufacturing a modified polyamide that has an increased degree of crystallinity is described. A polyamide composition comprising at least one such phenolic compound and optionally reinforcing fillers or extenders is also described. The composition is preferably a composition to be molded, for example in the form of granules or powder, that is used for the manufacture of articles by an injection-molding process.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The use of a phenolic compound for producing a modified polyamide having enhanced mechanical properties is described. A polyamide composition including at least such phenolic compound and optionally reinforcing or filler loads is also described. The composition is preferably a composition for molding, for example in the form of granules or powder, that can be used for the production of articles by injection-molding.

Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).

Abstract: Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.

Abstract: Fiber reinforced composites fabricated using a low-temperature, solution-based growth of nanowires such as ZnO nanowires on the surface of the reinforcing fibers such as carbon fibers and functionalized aramid fibers. The composites with nanowire interphase may have an enhanced fiber/matrix interface strength and a comparable in-plane strength, as compared to similar composites without such nanowire interphase.

Abstract: Novolak resins are incorporated for enhancing the acid resistance of polyamide compositions. Polyamide compositions containing such novolak resins are useful for producing various plastic shaped articles, such as calibrated particles or injection-molded parts, and are particularly useful for the recovery of sludge, liquids, and gases present in underground reservoirs, especially in the field of hydrocarbon extraction such as crude oil or natural gas.

Abstract: Composite Maillard-resole binders to produce or promote cohesion in non-assembled or loosely assembled matter.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: Yarns, fibers or filaments, in particular based on polyamides, are shaped into a variety of articles, especially ropes and more particularly climbing ropes which have good mechanical properties, especially under both low and relatively high humidity conditions.

Abstract: An imide-naphthoxazine copolymer comprising a repeating unit represented by General Formula (1) below: (wherein X and Y independently represent a single bond, an oxygen atom, a carbonyl group, or an organic group which may be substituted by a heteroatom; R represents CH3 or H, n represents an integer from 1 to 10; and m represents an integer from 1 to 20).

Abstract: Novolac resins are incorporated into thermoplastic polyamide compositions for increasing the melt flow index thereof; such compositions containing the novolac resins are useful for the manufacture of plastic shaped articles, in particular by injection molding.

Abstract: Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.

Abstract: Thermosetting resin compositions for manufacturing circuit boards and build-up circuit boards, and build-up boards, and multilayer bodies and circuit boards manufactured using these compositions are provided. A composition contains polyimide resin (A), phenol resin (B), and epoxy resin (C) components. The mixing ratio by weight (A)/[(B)+(C)] is 0.4 to 2.0, the ratio being the ratio of the weight of (A) to the total weight of (B) and (C). By using such a composition, multilayer bodies and circuit boards, excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. can be manufactured. A composition contains a polyimide resin (A), a phosphazene (D), and a cyanate ester (E). D includes a phenolic hydroxyl group-containing phenoxyphosphazene (D-1) and/or a crosslinked phenoxyphosphazene (D-2) prepared by crosslinking (D-1), (D-2) having at least one phenolic hydroxyl group.

Abstract: There is provided an aqueous resin composition excellent in settability, flexibility, retort resistance, hygienicity, sprayability and dispersibility in water, and used to coat an internal surface of a can.

Abstract: The present invention provides compounds that have an amide linkage and at least two epoxy groups. The compounds are preferably aliphatic.

Abstract: Semi-bleached to bleached sulfonated aromatic condensation resin alone or in combination with a semi-soluble methacrylic polymer of high molecular weight provides improved resistance to staining by acid colorants in a fibrous polyamide or wool substrate.

Abstract: There is provided an aqueous resin composition excellent in settability, flexibility, retort resistance, hygienicity, sprayability and dispersibility in water, and used to coat an internal surface of a can.

Abstract: The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 ?m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 ?m, is integrally molded.

Abstract: There is disclosed an inorganic reinforced polyamide resin compositions obtainable by melt kneading of (A) a crystalline polyamide rein, (B) a semi-aromatic amorphous polyamide resin, and (C) an inorganic reinforcing material, wherein the relative viscosity of 96% sulfuric acid solution of the composition is 2.1 or lower and wherein the crystallization temperature (TC2) of the composition as measured with a temperature drop by differential scanning calorimetry (DSC) is 180° C. or lower. The inorganic reinforced polyamide resin composition can provide shaped articles having satisfactory strength and rigidity without deteriorating their appearances and further having excellent coating properties and weathering resistance, and requires a mold temperature of 100° C. or lower in the preparation of shaped articles.

Abstract: Semi-bleached to bleached sulfonated aromatic condensation resin alone or in combination with a semi-soluble methacrylic polymer of high molecular weight provides improved resistance to staining by acid colorants in a fibrous polyamide or wool substrate.

Abstract: The present invention provides a composition for use in coated abrasives. The curable composition comprises a mixture of: i) from about 30 to about 60 weight percent of an oligomeric aminoplast resin having on average at least one pendant &agr;,&bgr;-unsaturated carbonyl group per oligomeric unit; ii) from about 70 to about 40 weight percent of a thermoplastic polyamide miscible in said aminoplast resin, the weight percents being based on the total resin content; and iii) a sufficient amount of a catalyst for the curable oligomeric aminoplast resin having on average at least one pendant &agr;,&bgr;-unsaturated carbonyl group per oligomeric unit, said catalyst being stable at a temperature of mixing of the components. The curable composition can either be in the form of a melt-processable solid or a molten mixture. The present invention also provides single and multilayered treated backing substrates used in coated abrasives.

Abstract: The rheological properties of a crosslinkable resin system are modified by the presence of a side chain crystalline (SCC) polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs) in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.

Abstract: Semi-bleached to bleached sulfonated aromatic condensation resin alone or in combination with a semi-soluble methacrylic polymer of high molecular weight provides improved resistance to staining by acid colorants in a fibrous polyamide or wool substrate.

Abstract: This invention discloses a flame retarding thermoplastic resin composition, which is comprised of (i) a thermoplastic resin and (ii) a phenolic resin compound as a flame retardant, wherein the phenolic resin compound contains a nitrogen-containing heterocycle and phosphorus. Since the flame retarding thermoplastic resin composition of this invention does not contain halogen, and has excellent flame retardant properties and high heat resistance, it is useful in producing parts and products in the fields of electronics, electricity and automobile.

Abstract: The present invention modifies a cross-linkable thermoset polymer with a thermoplastic polymer to create a spinnable thermoset/thermoplastic polymer composition that may be spun into thermoset/thermoplastic fibers.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: A solution of phenolic and polyamide polymers is used as a dipping resin to coat composite honeycomb structures. The phenolic/polyamide dipping resin increases the heat formability and strength of composite honeycomb structures. The coating formed by the resin includes from 30 to 95 weight percent phenolic resin and 5 to 30 weight percent polyamide resin.

Abstract: Pulverulent coating compositions exhibiting excellent adhesion to metal substrates are formulated from a polyamide, e.g., nylon 6, nylon 11, nylon 12, or copolyamide thereof, and minor amounts of at least one phenolic polycondensate and/or at least one polyalkyl (meth)acrylate.

Abstract: The present invention provides a highly impact resistant polyamide composition which comprises a polyamide resin and an acid modification product of a metallocene catalyzed polyolefin elastomer. The invention also provides a less hygroscopic and highly impact resistant polyamide composition which comprises a polyamide resin, novolak phenol and an acid modification product of a metallocene catalyzed polyolefin elastomer. Used as the polyamide resin is less expensive nylon 6.

Abstract: An adhesive for semiconductor device, comprising (a) a polyamide resin having an amine value of 20 to 60 and a weight average molecular weight of 1,000 to 5,000 and (b) a phenolic compound having a weight average molecular weight of 2,000 or less and having a skeleton containing at least 2 methylol groups.

Abstract: A coated panel formed from a self-supporting cellulosic substrate and a top coating containing a thermoset resin having about 0.1-1.5 wt % free formaldehyde admixed with said resin; and (b) a thermoplastic polymer thoroughly admixed with said resin, wherein said thermoplastic polymer exhibits amine groups capable of reacting with at least some of the free formaldehyde under resin curing conditions. The coated panel can be embossed with decorative patterns such as wood grain without fracture of the coated surface or significant buildup on the press or embossing die surfaces.

Abstract: Associative thickeners of the present invention are water soluble polymer compositions that have a backbone of poly(acetal- or ketal-polyether) with ends that are capped with hydrophobic groups. They are prepared by copolymerizing an alpha, omega-diol, -di,thiol or-diamino polyether with a gem-dihalide compound in the presence of a base to form an alpha, omega-diol, -dithiol or -diamino poly(acetal- or ketal-polyether) which in turn is reacted with hydrophobic reagents to form the final product. These associative thickeners are used in film forming coating compositions, such as latex paints.

Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.

Abstract: Thermoplastic molding resin composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.

Abstract: New process for blowing molding polyamide compositions, employing a composition comprising a polyamide and one or more cyanate components, specifically cross-linking cyanates which form a triazine upon curing.

Abstract: A fiber having a reduced dye rate compared to nylon 6 formed from a block copolymer of 2-30 wt % nylon 6,6 and 70-98 wt % nylon 6 which fiber has a stain resist applied thereto.

Abstract: Compositions containing an aryl phosphite and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.

Abstract: The thermal properties, such as heat distortion temperature of biodegradable polymers, such as polylactic acid, polyglycolides, polybutyric acid and copolymers of butyric and valeric acid, may be increased by blending them with a polymer having Tg from 75.degree. C. to 200.degree. C. and a Hildebrand parameter (.sigma.) of not more than 3 MPA.sup.1/2 different from the biopolymer.

Abstract: This invention relates to mixtures of short fibers of varying lengths, diameters and aspect ratios composed of an anisotropic polymer, to compositions containing said fibers and one or more thermoplastic or thermoset resins, and to a process for forming said mixtures.

Abstract: Comb-shaped polymers, comprised of hydrophilic backbones and dye-containi hydrophobic side chains are synthesized for use in multilayered, noncentrosymmetric, thin films by means of Langmuir-Blodgett processing techniques. The second harmonic signal generation exhibited by these films increases quadratically with the number of layers of polymeric dye in the film.

Abstract: Thermoplastic molding compositions are provided which comprise polycarbonate resins, polyester resins and polyphenylene ether resins or various combinations thereof modified with a multi-stage polyorganosiloxane/polyvinyl-based graft (meth)acrylate polymer. When the resultant compositions are molded, impact strength, ductility, tendency to agglomerate, rubber dispersion, blend morphology, weld line strength, and thermal stability are improved with no delamination or surface mottling.

Abstract: Water-dilutable binders for water-dilutable lacquers, coating compositions or sealing compounds consist essentially of a mixture of 5 to 40 parts by weight of a crosslinker resin and 60 to 95 parts by weight of a copolymer containing carboxyl groups or acid anhydride groups or both and further containing hydroxyl groups, and wherein the carboxyl or acid anhydride groups have been at least partially converted into carboxylate groups to the degree necessary to provide solubility or dispersibility of the binder in water and said copolymer is obtained by copolymerizing an alpha, beta-unsaturated carboxylic acid, a hydroxyalkyl acrylate or methacrylate, an olefinic monomer, a hydroxy-free acrylate or methacrylate and, optionally other mono-or polyunsaturated monomer, and wherein at least 30% of the hydroxyl groups of the copolymer are modified by esterification with a lactone.

Abstract: Thermoplastic molding materials contain, as essential components,(A) from 2 to 97.9% by weight of a nylon,(B) from 2 to 97.9% by weight of a polyaryl ether ketone and(C) from 0.1 to 30% by weight of a polymeric component containing hydroxyl groupsand in addition(D) from 0 to 50% by weight of an impact-modifying rubber and(E) from 0 to 60% by weight of fibrous and/or particulate fillers.

Abstract: The present invention relates to a composition comprising a phenolic resin, as for example phenol formaldehyde, an active hydrogen containing polymer as for example a polyamide, and a curing agent, such as a polyepoxide.

Abstract: A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) a soluble polyimide resin, (b) a solvent for said polyimide resin, (c) an epoxy resin, (d) a cross-linking agent reactive with the polyimide solvent of (b), and (e) a catalyst which accelerates the reaction between (b) and (d). Optionally, the adhesive may also contain a conductive material. A process for making the adhesive is also disclosed.