Solid Polymer Derived From Hydroxyl Group-containing Reactant Patents (Class 525/434)
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Patent number: 6350530Abstract: The present invention provides a card base which is degradable by microbes in natural environment. The card base is excellent in properties necessary for card bases, such as tensile strength, impact strength, flex temperature, heat resistance, resistance to thermal expansion and contraction, blocking resistance and humidity resistance, and has rigidity, bending resistance and durability. The card base contains, as essential components, a 3-hydroxybutylate/3-hydroxyvalerate copolymer and a lactic acid polymer, and, where necessary, a polycaprolactone or a high-molecular aliphatic polyester. The card base has a single-layer structure, or a sandwich structure further having overlay layers comprising a composition containing, as essential components, a lactic acid polymer and either or both of a polycaprolactone and a high-molecular alphatic polyester.Type: GrantFiled: September 25, 1998Date of Patent: February 26, 2002Assignee: Gunze LimitedInventors: Akira Morikawa, Mamoru Oishi, Yoshikiyo Saito
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Patent number: 6344535Abstract: Polyether ester amides having high water vapor permeability are disclosed. The amides which are prepared simply and reliably, crystallize quickly, are biodegradable and/or compostable, and are suitable in the manufacture of films by extrusion.Type: GrantFiled: May 18, 2000Date of Patent: February 5, 2002Assignee: Bayer AktiengesellschaftInventors: Ralf Timmermann, Wolfgang Schulz-Schlitte, Michael Voigt
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Publication number: 20020013424Abstract: A liquid crystalline polyesters or poly(ester-amides) having improved melt viscosity, is made by reacting the polymer with limited amounts of a compound containing specified functionality, such as hydroxyl, carboxyl, or amine. The process may be carried out in a typical polymer melt mixing apparatus such as an extruder. The low viscosity polymer product of the claimed invention has surprising toughness and is particularly useful for encapsulation of electronic components.Type: ApplicationFiled: August 16, 2001Publication date: January 31, 2002Inventor: Richard Robert Soelch
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Patent number: 6335417Abstract: A novel modified polyimide resin having a polybutadiene sheleton and obtainable by reacting the following three (3) kinds of compounds, i.e., a bifunctional hydroxyl-terminal polybutadiene having a number average molecular weight of 800 to 5,000, a tetrabasic acid dianhydride, and a diisocyanate compound, imparts reduced shrinkage upon setting to a thermosetting resin composition comprising the same and also imparts heat resistance and pliability and the like to a hardened mass or article of such thermosetting resin composition. Therefore, such thermosetting resin composition is an excellent resin composition capable of fully satisfying the requirements with regard to the characteristics of an overcoat agent for a wiring circuit which should be pliable, such as a flexible wiring circuit substrate, a film carrier and the like.Type: GrantFiled: August 17, 2000Date of Patent: January 1, 2002Assignee: Ajinomoto Co., Inc.Inventors: Hiroshi Orikabe, Tadahiko Yokota
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Patent number: 6327521Abstract: A method for controlling the properties of the product polymer of a polymerization process to improve the process productivity and product quality in both batch and continuous production of polyamides.Type: GrantFiled: May 28, 1998Date of Patent: December 4, 2001Assignee: E.I. du Pont de Nemours and CompanyInventor: James Merrill Prober
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Patent number: 6323290Abstract: A substantially transparent, moldable, thermoplastic multipolymer composition comprising a methyl methacrylate copolymer containing a predominant amount of methyl methacrylate and a minor amount of one or more ethylenically unsaturated monomers; and an effective amount of a polyetheresteramide to enhance the electrostatic charge dissipation of the copolymer. The polyetheresteramide has a refractive index within about 0.005 units of the refractive index of the copolymer. The composition, when subjected to injection molding, is such that the injection-molded composition exhibits a haze of not greater than about 25% and a light transmission of at least about 60%. Preferably, the composition includes an impact modifier which also has a refractive index within about 0.005 units of the refractive index of the copolymer. The composition may also include a minor amount of a polyethylene glycol having a weight average molecular weight of about 2,000 to about 10,000.Type: GrantFiled: August 25, 1999Date of Patent: November 27, 2001Assignee: Cyro IndustriesInventor: Daniel Zimmerman
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Patent number: 6312621Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.Type: GrantFiled: November 12, 1999Date of Patent: November 6, 2001Assignee: Johnson Matthey Electronics, Inc.Inventors: Jesse L. Pedigo, Nancy E. Iwamoto, Alan Grieve, Xiao-Qi Zhou
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Patent number: 6294618Abstract: A liquid crystalline polyesters or poly(ester-amides) having improved melt viscosity, is made by reacting the polymer with limited amounts of a compound containing specified functionality, such as hydroxyl, carboxyl, or amine. The process may be carried out in a typical polymer melt mixing apparatus such as an extruder. The low viscosity polymer product of the claimed invention has surprising toughness and is particularly useful for encapsulation of electronic components.Type: GrantFiled: March 17, 1999Date of Patent: September 25, 2001Assignee: E. I. du Pont de Nemours and CompanyInventor: Richard Robert Soelch
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Patent number: 6291586Abstract: An ultraviolet light absorbing material that resists blooming and migration is made up of a polyurethane or polyurea polymer and an amide functional ultraviolet light absorbing compound, wherein the polymer and the amide functional ultraviolet light absorbing compound are hydrogen bonded to one another. Polymeric films that contain a polymeric matrix and the ultraviolet light absorbing material are useful as the top layer in multilayer constructions such as retroreflective sheetings and conformable marking sheets.Type: GrantFiled: October 31, 1997Date of Patent: September 18, 2001Assignee: 3M Innovative Properties CompanyInventors: James E. Lasch, David B. Olson, David M. Burns
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Patent number: 6284865Abstract: A polymeric composition, a process for producing the composition, and a process for using the composition in, for example, hydrocyanation or isomerization are disclosed. The composition comprises repeat units derived from (1) a carbonyl compound, a monomer, and phosphorochloridite; (2) phosphorus trichloride, a polyhydric alcohol, and an aromatic diol; or (3) combinations of (1) and (2) in which the monomer can be a polyhydric alcohol, an amine, combinations thereof. The composition can further comprise a Group VIII metal and optionally a Lewis acid.Type: GrantFiled: September 20, 1999Date of Patent: September 4, 2001Assignee: E. I. du Pont de Nemours and CompanyInventors: Wilson Tam, Sigridur Soley Kristjansdottir, Robin Nikolas Greene
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Publication number: 20010012882Abstract: A method for the preparation of a succinimide copolymer by the catalytic co-polymerization of aspartic acid with a selected polyfunctional monomer in the presence of a cyclic carbonate solvent. Succinimide copolymers of relatively high weight average molecular weight and high purity can be produced in relatively high yields while employing a relatively low catalyst loading.Type: ApplicationFiled: March 5, 2001Publication date: August 9, 2001Applicant: Donlar CorporationInventors: Grigory Ya. Mazo, Robert J. Ross, James F. Kneller, Jacob Mazo
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Patent number: 6204356Abstract: Heat resistant polybenzoxazole resins useful as layer insulation films and protective films for semiconductor, layer insulation films for multilayer circuits, cover coats for flexible copper-clad sheets, solder resist films, liquid crystal-aligned films and the like. These resins have excellent thermal, electrical, physical and mechanical characteristics. Polybenzoxazole precursors are provided, represented by the general formula (A), and are used to obtain polybenzoxazole resins, represented by the general formula (D). In the formulas (A) and (D), n denotes an integer from 2-1000, and X denotes a structure having a formula selected from structures indicated at (B). In the formulas at (B), Y denotes a structure having a formula selected from those indicated at (C), and the hydrogen atom(s) on the benzene ring in these structures are optionally substituted.Type: GrantFiled: September 27, 1999Date of Patent: March 20, 2001Assignee: Sumitomo Bakelite Company LimitedInventors: Hidenori Saito, Michio Nakajima, Tsuyoshi Watanabe, Maki Tokuhiro
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Patent number: 6048898Abstract: The present invention relates to an improved composition of copolymer-1 comprising copolymer-1 substantially free of species having a molecular weight of over 40 kilodaltons.Type: GrantFiled: February 27, 1998Date of Patent: April 11, 2000Assignee: Yeda Research and Development Co., Ltd.Inventors: Eliezer Konfino, Michael Sela, Dvora Teitelbaum, Ruth Arnon
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Patent number: 6037420Abstract: The polymer composite material is produced using no solvent and includes a rigid polymer (B) dispersed uniformly into a matrix (A) at the molecular level in a state of a copolymer (A/B and/or A'/B) thereby enhancing the interface bonding of the rigid polymer (B) to the matrix (A). The non-solvent method includes a step of polymerizing a thermoplastic polymer (A) and a monomer to form a rigid polymer (B) with no solvent in the molten and kneaded state to provide a copolymer (A/B and/or A'/B) in which the flexible molecular chains (A and/or A') are made up of the thermoplastic polymer to the rigid polymer (B) to reduce the stress concentrating sources of the rigid polymer dispersed microscopically at the molecular level in the thermoplastic polymer matrix and enhance the interface bonding between the rigid polymer (B) and the matrix (A).Type: GrantFiled: December 1, 1995Date of Patent: March 14, 2000Assignee: Mazda Motor CorporationInventor: Takahiro Tochioka
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Patent number: 6036948Abstract: Polyaspartamide derivatives as adsorbents for bile acids, polyaspartamide derivatives loaded with bile acids and process for their preparation and their use as pharmaceuticals.alpha.- or .beta.-linked polyaspartamide derivatives of the formula I ##STR1## in which R.sup.I, R.sup.II, R.sup.III, R.sup.IV, r, s, t, u and v have the stated meanings, are described. They adsorb bile acids and can be used as pharmaceuticals.Type: GrantFiled: October 22, 1997Date of Patent: March 14, 2000Inventors: Volker Krone, Axel Walch, Stefan Mullner, Ernold Granzer
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Patent number: 6025439Abstract: Molecular dispersions of rigid-rod polybenzobisazole polymer/copolymer in thermoplastic matrices in a weight ratio of about 1:99 to 50:50 are prepared by dissolving the rigid-rod polymer in an alcoholic or aprotic solvent, dissolving the thermoplastic polymer in an alcoholic or aprotic solvent, combining the two solutions and recovering the resulting molecular composite from the combined solution. These molecular dispersions consist essentially of rigid-rod polybenzobisazole polymer/copolymer having sulfonic acid groups pendant to the polymer/copolymer backbone and thermoplastic polymers selected from the group consisting of polyvinylpyridines, poly(arylene ether ketone)s with a pyridyl functionality, aromatic poly(pyridine ether)s and poly(pyridine ether sulfone) copolymers, and polyimides with a pyridyl functionality.Type: GrantFiled: July 30, 1998Date of Patent: February 15, 2000Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Fred E. Arnold, Narayanan Venkatasubramanian, Thuy D. Dang, Derrick R. Dean
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Patent number: 5998550Abstract: Molecular dispersions of rigid-rod polybenzobisazole polymer/copolymer in thermosetting matrices in a weight ratio of about 1:99 to 50:50 are prepared by dissolving the rigid-rod polymer in an alcoholic or aprotic solvent, dissolving the thermosetting polymer in an alcoholic or aprotic solvent, combining the two solutions and recovering the resulting molecular composite from the combined solution. These molecular dispersions consist essentially of rigid-rod polybenzobisazole polymer/copolymer having sulfonic acid groups pendant to the polymer/copolymer backbone and thermosetting polymers selected from the group consisting of iminobis(N-propyl-2-phenylethynyl-phthalimide), N-ethyl-(2,6-di-benzocyclobutenoxy)benzylamine, iminobis(N-propylnadic imide) and difunctional benzoxazine monomers of the formula ##STR1## wherein X is a single bond, --CO-- or --C(CH.sub.3).sub.2 -- and Q is --CH.sub.3 or --C.sub.6 H.sub.5.Type: GrantFiled: July 30, 1998Date of Patent: December 7, 1999Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Fred E. Arnold, Narayanan Venkatasubramanian, Thuy D. Dang, Derrick R. Dean
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Patent number: 5998570Abstract: A low molecular weight, ester-terminated polyamide may be blended with a liquid hydrocarbon to form a transparent composition having gel consistency. The ester-terminated polyamide is prepared by reacting "x" equivalents of dicarboxylic acid wherein at least 50% of those equivalents are from polymerized fatty acid, "y" equivalents of diamine such as ethylene diamine, and "z" equivalents of monoalcohol having at least 4 carbon atoms. The stoichiometry of the reaction mixture is such that 0.9.ltoreq.{x/(y+z)}.ltoreq.1.1 and 0.1.ltoreq.{z/(y+z)}.ltoreq.0.7. The reactants are heated until they reach reaction equilibrium. The gel contains about 5-50% ester-terminated polyamide with the remainder preferably being pure hydrocarbon. The gels are useful in formulating personal care products and other articles wherein some degree of gel-like or self-supporting consistency is desired.Type: GrantFiled: May 6, 1998Date of Patent: December 7, 1999Assignee: Union Camp CorporationInventors: Mark S. Pavlin, Richard C. MacQueen
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Patent number: 5981589Abstract: The present invention relates to an improved composition of copolymer-1 comprising copolymer-1 substantially free of species having a molecular weight of over 40 kilodaltons.Type: GrantFiled: February 27, 1998Date of Patent: November 9, 1999Assignee: Yeda Research and Development Co., Ltd.Inventors: Eliezer Konfino, Michael Sela, Dvora Teitelbaum, Ruth Arnon
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Patent number: 5969079Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## R.sub.R =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --,--S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.theta.=--C.tbd.N, --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.Type: GrantFiled: October 21, 1994Date of Patent: October 19, 1999Assignee: The Boeing CompanyInventors: Hyman R. Lubowitz, Clyde H. Sheppard
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Patent number: 5952434Abstract: The invention relates to synthetic yarns spun from suophuric acid anistropic solutions of rigid aromatic polyamides blended with aliphatic polyamides. Disclosed is a spinning dope composition comprising an aromatic polyamide, an aliphatic polyamide and concentrated sulphuric acid, wherein at least one of the aromatic and aliphatic plyamides is a copolymer composed of two aromatic and two aliphatic homopolymer units, respectiveyl; the aromatic copolymer having the formula: ?.paren open-st.(HN C.sub.6 H.sub.4 --HH CO C.sub.6 H.sub.4 CO.paren close-st.u.paren open-st.NH C.sub.6 H.sub.4 NH CONH C.sub.6 H.sub.4 NH CO C.sub.6 H.sub.4 CO.paren close-st.w!, wherein u=75-95 wt. % and w=5-25 wt. % and the aliphatic copolymer has the formula ?.paren open-st.HN(CH.sub.2).sub.6 --NHCO(CH.sub.2).sub.4 CO.paren close-st.n.paren open-st.HN(CH.sub.2).sub.5 CO.paren close-st.m wherein n=95-50 wt. % and m=5-50 wt. %.Type: GrantFiled: January 9, 1998Date of Patent: September 14, 1999Assignee: Vserossiisky Nauchno-Issledovatedlsky Institut Polimernykh Volokon S Opytnym Zavodom (Vniipv)Inventors: Tatyana Sergeevna Sokolova, Vera Dmitrievna Kalmykova, Vera Nikolaevna Sheptukhina, Ljudmila Dmitrievna Serova, Tatyana Andreevna Rozhdestvenskaya, Vladimir Nikolaevich Kiya-Oglu, Alexandra Vasilievna Volokhina, Ljubov Yakovlevna Tikanova, Georgy Ivanovich Kudryavtsev, deceased
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Patent number: 5939517Abstract: A method for the preparation of a succinimide copolymer by the catalytic co-polymerization of aspartic acid with a selected polyfunctional monomer in the presence of a cyclic carbonate solvent. Succinimide copolymers of relatively high weight average molecular weight and high purity can be produced in relatively high yields while employing a relatively low catalyst loading.Type: GrantFiled: January 13, 1998Date of Patent: August 17, 1999Assignee: Donlar CorporationInventors: Grigory Ya. Mazo, Robert J. Ross, James F. Kneller, Jacob Mazo
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Patent number: 5886134Abstract: The invention relates to a Bismaleimide-Triazine resin (BT resin ) and production method thereof and in particular, a series of novel BT resin prepared by reacting a novel bismaleimide with various aromatic cyanate esters. By combining said novel bismaleimide monomer with various proportions of cyanate esters having different structures, BT resins having various processing temperature conditions can be formulated, which, after polymerizing and crosslinking, can provide materials with various thermal stability, dielectric constants, and mechanical properties for various applications.Type: GrantFiled: October 6, 1997Date of Patent: March 23, 1999Assignee: National Science Council of Republic of ChinaInventors: Chun-Shan Wang, Haan-Jang Hwang
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Patent number: 5886098Abstract: A polyetheresteramide having good heat resistance, permanent antistatic property and superior compatibility with thermoplastic resins and a resin composition containing the polyetheresteramide are disclosed, wherein the polyetherester-amide consists essentially of a polyamide oligomer with carboxylic chain ends having a number average molecular weight between 200 and 5,000 and a bisphenol compound with oxyalkylene units having a number average molecular weight between 300 and 3,000. Antistatic resin compositions with good antistatic property and heat resistance are obtained from compositions comprising 3 to 40% by weight of the polyetheresteramide and 60 to 97% by weight of thermoplastic resins. The antistatic resin compositions can contain as compatibilizers vinyl polymers having functional groups such as carboxyl and epoxy groups or block polymers containing polyolefin blocks and aromatic vinyl polymer blocks.Type: GrantFiled: November 10, 1997Date of Patent: March 23, 1999Assignee: Sanyo Chemical Industries, Ltd.Inventors: Yasuhiro Ueda, Eiichi Senda, Yoshitsugu Takai, Tokiko Kokubu, Toshiaki Okamoto, Eiji Ichihara
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Patent number: 5880220Abstract: Biodegradable polyetheresteramides P1 which are obtained by reacting(a1) a mixture containing20-95 mol % of adipic acid or ester-forming derivatives thereof or mixtures thereof and5-80 mol % of terephthalic acid or ester-forming derivatives thereof or mixtures thereof, and(a2) a mixture of dihydroxy compounds(a21) from 15 to 99.3 mol % of a dihydroxy compound selected from the group consisting of C.sub.2 -C.sub.6 -alkanediols and C.sub.5 -C.sub.10 -cycloalkanediols,(a22) from 0.2 to 85 mol % of a dihydroxy compound containing ether functionalities of the formula IHO--((CH.sub.2).sub.n --O).sub.m --H Iwhere n is 2, 3 or 4 and m is an integer from 2 to 250, or mixtures thereof and(a23) from 0.5 to 80 mol % of an amino-C.sub.2 -C.sub.12 -alkanol or amino-C.sub.5 -C.sub.10 -cycloalkanol,where the molar ratio of (a1) to (a2) is from 0.4:1 to 1.5:1, with the proviso, inter alia, that the polyetheresteramides P1 have a molecular weight (M.sub.Type: GrantFiled: July 3, 1997Date of Patent: March 9, 1999Assignee: BASF AktiengesellschaftInventors: Volker Warzelhan, Gunnar Schornick, Frank Braun, Ursula Seeliger, Motonori Yamamoto, Peter Bauer
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Patent number: 5834560Abstract: The present invention is directed to in situ reinforced thermoplastic fibers having improved mechanical properties and a method of making same. These composites have improved tensile strength and tensile moduli that exceed that predicted by composite theory under the rule of mixtures. The in situ composites can be used in woven preforms.Type: GrantFiled: April 29, 1996Date of Patent: November 10, 1998Assignee: Virginia Tech Intellectual Properties Inc.Inventors: Donald G. Baird, Christopher G. Robertson, Jose P. de Souza
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Patent number: 5811495Abstract: Elastomeric block copolymers comprising polyether chains as soft segment in combination with aromatic polyamide chains as hard segment are disclosed, the soft and hard segments being introduced under a sequence control so as to develop excellent physical and mechanical properties. Processes for producing the elastomeric block copolymers are also disclosed.Type: GrantFiled: August 12, 1996Date of Patent: September 22, 1998Assignee: Tosoh CorporationInventors: Isamu Kirikihira, Hiroshi Yamakawa, Yuji Kubo
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Patent number: 5800808Abstract: The present invention relates to an improved composition of copolymer-1 comprising copolymer-1 substantially free of species having a molecular weight of over 40 kilodaltons.Type: GrantFiled: May 22, 1995Date of Patent: September 1, 1998Assignee: Veda Research and Development Co., Ltd.Inventors: Eliezer Konfino, Michael Sela, Dvora Teitelbaum, Ruth Arnon
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Patent number: 5714138Abstract: Polyaspartamide derivatives as adsorbents for bile acids, polyaspartamide derivatives loaded with bile acids and process for their preparation and their use as pharmaceuticals.alpha..sup.- or .beta.-linked polyaspartamide derivatives of the formula I ##STR1## in which R.sup.I R.sup.II, R.sup.III, R.sup.IV, r, s, t, u and v have the stated meanings, are described. They adsorb bile acids and can be used as pharmaceuticals.Type: GrantFiled: December 10, 1993Date of Patent: February 3, 1998Assignee: Hoechst AktiengesellschaftInventors: Volker Krone, Axel Walch, Stefan Mullner, Ernold Granzer
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Patent number: 5710233Abstract: Polyurethane elastomers with reduced gas permeability are prepared by reaction of:a) diisocyanates,b) compounds with a molecular weight of 500 to 10,000 having at least two hydrogen atoms that are reactive towards isocyanates,c) compounds with a molecular weight of 61 to 499 having at least two hydrogen atoms that are reactive towards isocyanates, and optionallyd) further auxiliaries and additives,characterized in thati) the ratio of the isocyanate groups in a) to the sum of the isocyanate-reactive groups in b) and c) is between 1:0.80 and 1:1.05 (isocyanate:isocyanate-reactive), andii) the compound b) contains 3 to 15% by wt.Type: GrantFiled: January 6, 1997Date of Patent: January 20, 1998Assignee: Rhein Chemie Rheinau GmbHInventors: Walter Meckel, Klaus Konig, Hans-Dieter Thomas
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Patent number: 5677384Abstract: Grafted polyamidoamines and grafted polyethyleneimines obtainable by free-radically initiated polymerization of(a) 1-vinylpyrrolidone, 1-vinyltriazole, 1-vinylimidazoles, mixtures of said monomers or mixtures of at least one of said monomers with up to 20% by weight of other monoethylenically unsaturated monomers in the presence of(b) water-soluble or -dispersible polyamidoamines, polyethyleneimines or mixtures thereof in a weight ratio of (a):(b) from 5:95 to 95:5, are useful as dye transfer inhibitors in surfactant-based detergents when included therein in an amount from 0.05 to 10% by weight.Type: GrantFiled: September 7, 1995Date of Patent: October 14, 1997Assignee: BASF AktiengesellschaftInventors: Juergen Detering, Christian Schade, Knut Oppenlaender, Michael Zirnstein, Guenter Scherr, Wolfgang Trieselt, Volker Schwendemann
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Patent number: 5658995Abstract: Random block copolymers having the formula: ##STR1## wherein R.sub.1 is --CH.dbd.CH-- or (--CH.sub.2 --).sub.j, in which j is zero or an integer from one to eight; R.sub.2 is selected from hydrogen, straight and branched alkyl and alkylaryl groups containing up to 18 carbon atoms and derivatives or biologically and pharmaceutically active compounds covalently bonded to said copolymer; each R.sub.3 is independently an alkylene group containing up to 4 carbon atoms; y is an integer between about 5 and about 3000; and f is the percent molar fraction of alkylene oxide in the copolymer and ranges between about 1 and about 99 mole percent. Implantable medical devices and drug delivery implants containing the random block copolymers are also disclosed, along with methods for drug delivery and for preventing the formation of adhesions between injured tissues employing the random block copolymers. Polyarylate random block copolymers are also described.Type: GrantFiled: November 27, 1995Date of Patent: August 19, 1997Assignee: Rutgers, The State UniversityInventors: Joachim B. Kohn, Chun Yu
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Patent number: 5594089Abstract: Thermomechanical and thermo-oxidative stabilities in heterocycle or heterocycle sulfone resin composites are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities.Type: GrantFiled: October 21, 1994Date of Patent: January 14, 1997Assignee: The Boeing CompanyInventors: Hyman R. Lubowtiz, Clyde H. Sheppard
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Patent number: 5594075Abstract: The compound 2-ethynyl-5-(4-pyridyl)ethynyl thiophene: ##STR1## when incorporated into a thermoplastic polymer having repeating units of the formula: ##STR2## wherein X is --O-- or --S--, and R is selected from the group consisting of: ##STR3## and Ar is selected from the group consisting of: ##STR4## wherein X is as previously defined, poled to align the molecules and cured to crosslink at least the terminal acetylenic groups, has second-order nonlinear optical activity.Type: GrantFiled: August 7, 1995Date of Patent: January 14, 1997Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Bruce A. Reinhardt, Jayprakash C. Bhatt
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Patent number: 5571874Abstract: A molecular composite material having excellent properties such as mechanical strength, heat resistance, solvent resistance, etc. is produced by dissolving a prepolymer of a rigid aromatic polymer in a monomer of a matrix polymer to form a homogeneous solution and then heating the homogeneous solution to cause a thiazole ring closure reaction of the prepolymer and a polymerization reaction of the monomer.Type: GrantFiled: August 22, 1994Date of Patent: November 5, 1996Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Tatsuya Hattori, Kazuhiro Kagawa, Hiroshi Akita, Hiroto Kobayashi
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Patent number: 5569739Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide.Type: GrantFiled: February 17, 1994Date of Patent: October 29, 1996Assignee: International Business Machines CorporationInventors: Eleftherios Adamopoulos, Kang-Wook Lee, Terrence R. O'Toole, Sampath Purushothaman, Jane M. Shaw, Alfred Viehbeck, George F. Walker
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Patent number: 5543489Abstract: The invention relates to a composition based on a thermoplastic elastomer comprising polyether sequences in which the amount of matter extractable by ethanol is less than a value sufficient to prevent exudation. Thermoplastic elastomer block copolymer compositions according to the invention comprise polyether blocks and blocks selected from the group consisting of polyamide blocks and polyester blocks, said copolymer compositions incorporating a quantity of terpolymer, selected from the group consisting of ethylene/unsaturated acid ester/unsaturated dicarboxylic acid anhydride terpolymer and ethylene/unsaturated acid ester/unsaturated glycidyl monomer terpolymer, sufficient to prevent exudation of polyamide, polyester, or polyether oligomers or impurities.Type: GrantFiled: April 19, 1994Date of Patent: August 6, 1996Inventors: Patrick Alex, Yves Aubert, Alain Frey
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Patent number: 5532334Abstract: A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.Type: GrantFiled: November 14, 1994Date of Patent: July 2, 1996Assignee: Korea Research Institute of Chemical TechnologyInventors: Kil-Yeong Choi, Dong-Hack Suh, Mi-Hie Yi, Young-Taik Hong, Jong-Chan Won
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Patent number: 5527844Abstract: A thermoplastic molding material consists of from 5 to 95% by weight of a polyaryl ether A, from 5 to 95% by weight of a partly aromatic copolyamide B and, if required, not more than 40% by weight of a fibrous or particulate filler C or a mixture thereof, the percentages being based on the sum of A to C.Type: GrantFiled: February 13, 1995Date of Patent: June 18, 1996Assignee: BASF AktiengesellschaftInventors: Martin Weber, Klaus Muehlbach
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Patent number: 5462996Abstract: A thermosettable resin composition is prepared by admixing a liquid mixture of thermosettable resins such as a polyepoxide and amorphous thermoplastic polymer particles such as a polyetherimide to form a homogeneous cured resin composition. The particles have an average diameter of from 0.5-50 micrometers, a surface area of at least 1.0 m.sup.2 /g, a dissolution temperature of at least 50.degree. C., and are essentially insoluble in the thermosettable resin at temperatures of up to 15.degree. C. below the dissolution temperature but are completely dissolved at a temperature of at least 20.degree. C. below the cure temperature of the resin.Type: GrantFiled: February 6, 1995Date of Patent: October 31, 1995Assignee: Minnesota Mining and Manufacturing CompanyInventors: Gene B. Portelli, William J. Schultz, John T. Boden, Daniel M. Kaufer
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Patent number: 5438105Abstract: A polyamic acid composite comprising i) a polyamic acid having three dimensional network molecular structure obtained by a ring-opening polyaddition reaction of a tetracarboxylic acid dianhydride with an aromatic diamine and a tri- or tetramino compound and ii) (a) a high polymer component having a different molecular structure from the polyamic acid, which is dispersed in the three dimensional network molecular structure of the polyamic acid and of which molecular chains are interpenetrated with molecular chains of the polyamic acid or (b) a curable resin composition which is dispersed in the three dimensional network molecular structure of the polyamic acid and which is capable of forming a cured resin of which molecular chains are interpenetrated with molecular chains of the polyamic acid, and a polyimide composite obtained from the polyamic acid composite, and process for production thereof.Type: GrantFiled: February 28, 1994Date of Patent: August 1, 1995Assignee: Toho Rayon Co., Ltd.Inventor: Yasuhisa Nagata
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Patent number: 5416171Abstract: The invention relates blending compositions comprising (a) a polyamide and (b) a block copolyetheramide with hard polyamide segments and soft polyether segments. The block copolyetheramide is defined by the formula:--[--CO--R.sup.1 --CO--(NHR.sup.2 CO).sub.m --O--(R.sup.3 --O--).sub.p --(CO--R.sup.2 --NH).sub.q --].sub.n --wherein R represents the alkylene group of an aliphatic diacid having between about 2 and about 18 carbon atoms; R.sup.2 represents an alkylene group having between about 3 and about 11 carbon atoms; R.sup.3 represents an alkylene group having between about 2 and about 4 carbon atoms; m and q independently range between about 2 and about 40; p ranges between about 10 and about 100; and n ranges between about 2 and about 50, said blending composition containing a polyether content ranging between about 1 and about 50%. The blocking copolyetheramides may be prepared by reacting a polyetherdiol, caprolactam and an aliphatic diacid in a two-stage method.Type: GrantFiled: August 11, 1994Date of Patent: May 16, 1995Assignee: Industrial Technology Research InstituteInventors: Lie-Zen Chung, De-Lun Kuo, Hong-Bing Tsai
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Patent number: 5409999Abstract: Thermoplastic powder coating compositions including a polyamide and/or polyetheresteramide constituent and an epoxy/sulfonamide resin constituent are well adapted for coating a wide variety of metal substrates, e.g., by electrostatic spraying, without the requirement for first treating such substrates with an adhesion primer.Type: GrantFiled: August 16, 1993Date of Patent: April 25, 1995Assignee: Elf Atochem S.A.Inventors: Jean-Paul Merval, Eric Perraud, Stephen Rennie
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Patent number: 5387653Abstract: Thermoplastic powders well adapted for the direct adherent coating of metal substrates, i.e., without requiring an intermediate adherence primer layer, are based on a polyamide and/or a polyetheresteramide, and contain an effective amount of a polycondensate of an aromatic sulfonamide with an aldehyde or dicarboxylic acid.Type: GrantFiled: August 2, 1993Date of Patent: February 7, 1995Assignee: AtochemInventors: Jean-Paul Merval, Jean-Yves Peschard, Stephen Rennie
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Patent number: 5387651Abstract: Block copolyetheramide suitable for injection molding, consisting of polyamide blocks and polyalkylene ether blocks and having a melting point ranging from 215.degree. to 223.degree. C., an apparent viscosity, at 230.degree. C., ranging from 50 to 150 Pa, a number average molecular weight ranging from 10,000 to 50,000 and a yellow degree, measured by means of an Elrepho.RTM. apparatus, lower than or equal to 20. They are prepared by polymerizing the polyamide monomers in the presence of hypophosphorous acid or meta-hypophosphorous acid and then by polycondensing the polyamide with polyalkylene ether having hydroxyl end groups.Type: GrantFiled: July 15, 1993Date of Patent: February 7, 1995Assignee: Enichem S.p.A.Inventor: Aldemaro Ciaperoni
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Patent number: 5382637Abstract: A solid state chain extension method provides for the formation of a solid state film comprised of a high molecular weight polymer by chain extending a deblocked Lewis base with Lewis acid oligomers while the reactants are in a solid state form. In one embodiment, a negative resist is prepared by selectively exposing regions of the solid state film. The Lewis base is deblocked at the exposed regions by a suitable deblocking means. The Lewis acid oligomers and the deblocked Lewis base chain extend at the exposed regions. Development of the film removes the non-polymerized reactants. Optionally, the Lewis acid oligomers, when radiation-cross-linking, are cross-linked with one another prior to deblocking the Lewis base to form a negative resist. The cross-linked oligomers polymerize with the subsequently deblocked base to provide a high molecular weight polymer film.Type: GrantFiled: October 31, 1991Date of Patent: January 17, 1995Assignee: International Business Machines CorporationInventors: Marie Angelopoulos, Claudius Feger, Jeffrey D. Gelorme, Jane M. Shaw
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Patent number: 5378769Abstract: A molding composition is provided which is effective as an agent for imparting compatibility in thermoplastic blends or as an adhesion-promoting layer in composite materials which comprises:A. a polyamideB. a polyester, andC. an oxazoline derivative.Type: GrantFiled: August 12, 1992Date of Patent: January 3, 1995Assignee: Huls AktiengesellschaftInventors: Joachim Mugge, Friedrich Sosna
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Patent number: 5376499Abstract: Cost-effective, highly heat-resistant positive resists based on oligomer and/or polymer polybenzoxazole precursors and diazo quinones possess a high [level of] stability in storage when the polybenzoxazole precursors are hydroxypolyamides of the following structure: ##STR1## whereby R, R*, R.sub.1, R*.sub.1, and R.sub.2 are aromatic groups, R.sub.3 is an aliphatic, cycloaliphatic or aromatic group having at least one alkenyl or alkynyl grouping and, with respect to n.sub.1, n.sub.2 and n.sub.3, the following applies:n.sub.1 =1 to 100, n.sub.3 and n.sub.3 =0 orn.sub.1 and n.sub.2 =1 to 100, n.sub.3 =0 orn.sub.2 =1 to 100, n.sub.1 and n.sub.3 =0 orn.sub.1, n.sub.2 and n.sub.3 =1 to 100 (whereby R.noteq.R* and/or R.noteq.R*.sub.1) orn.sub.1 and n.sub.3 =1 to 100, n.sub.2 =0 (whereby R.noteq.R* and/or R.sub.1 .noteq.R*.sub.1) ,provided that: n.sub.1 +n.sub.2 +n.sub.3 >3.Type: GrantFiled: May 7, 1992Date of Patent: December 27, 1994Assignee: Siemens AktiengesellschaftInventors: Albert Hammerschmidt, Siegfried Birkle, Hellmut Ahne
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Patent number: 5366781Abstract: An oriented, shaped article comprising at least about 55% and less than about 80% by weight of a first polymer phase of at least one lyotropic polymer and at least about 20% and less than about 45% by weight of a second polymer phase of at least one thermally-consolidatable polymer and consolidated parts made therefrom.Type: GrantFiled: June 5, 1992Date of Patent: November 22, 1994Assignee: E. I. Du Pont de Nemours and CompanyInventors: John C. Coburn, Hung H. Yang
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Patent number: 5344896Abstract: Water-soluble rigid-rod aromatic heterocyclic polymers having repeating units of the formula: ##STR1## wherein n has a value of 0.05 to 1.Type: GrantFiled: February 7, 1994Date of Patent: September 6, 1994Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Thuy D. Dang, Fred E. Arnold