Solid Polymer Derived From Compound Containing More Than Two Carboxylic Acid Groups Or Derivatives Thereof Patents (Class 525/436)
  • Patent number: 11768434
    Abstract: The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: September 26, 2023
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Masashi Iio, Hiroyuki Urano, Kazuya Honda
  • Patent number: 11735556
    Abstract: A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on the first electrode and a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: August 22, 2023
    Assignee: MIKUNI ELECTRON CORPORATION
    Inventor: Sakae Tanaka
  • Patent number: 11700687
    Abstract: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: July 11, 2023
    Assignee: DUPONT ELECTRONICS, INC.
    Inventors: Joseph Casey Johnson, Delanie J Losey, Peggy Scott, Christopher Dennis Simone
  • Patent number: 11655323
    Abstract: The present invention relates to an aromatic poly(amide-imide) copolymer film having high retardation in the thickness direction and exhibiting a low moisture absorption rate, and a method for preparing the same.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: May 23, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Bi Oh Ryu, Soonyong Park, Youngseok Park, Il Hwan Choi, Young Ji Tae, Kwanyeol Paek
  • Patent number: 11333975
    Abstract: Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): wherein T1 and T2 may be the same as, or different from, each other and represent any of —CO— and —SO2—; X1 is a tetravalent organic group; and l is 0 or 1; and X2 is a divalent organic group.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: May 17, 2022
    Assignees: International Business Machines Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Dmitry Zubarev, Hiroyuki Urano, Katsuya Takemura, Masashi Iio, Kazuya Honda, Yoshio Kawai
  • Patent number: 11150556
    Abstract: This is to provide a polymer of a polyimide precursor which is soluble in an aqueous alkaline solution, and capable of using a base resin of a positive type and negative type photosensitive resin composition which is capable of forming a fine pattern and obtaining high resolution. Also provided is a positive type and negative type photosensitive resin composition using such a polymer of a polyimide precursor. Further provided are a patterning process and a method of forming a cured film using the composition. Provided is a polymer of a polyimide precursor which comprises a structural unit represented by the following general formula (1), wherein, X1, R1, Z, a repeating number “s”, Y1, Rf, a repeating number “n” and “k” represent the same meanings as mentioned in the specification.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: October 19, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Katsuya Takemura, Hiroyuki Urano, Masashi Iio
  • Patent number: 10990008
    Abstract: The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: April 27, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Yuki Masuda, Ryoji Okuda
  • Patent number: 10488407
    Abstract: Redox of an analyte is coupled with redox of a precipitation precursor to generate a precipitating molecule that precipitates on the surface of a thin film bulk acoustic resonance (TFBAR) to allow mass detection of the precipitation molecule as a surrogate for the analyte. This disclosure describes, among other things, detection of an analyte using a TFBAR operating at a high frequency without direct binding of the analyte on a surface of the TBAR. Detection of the analyte is indirect with a precipitating molecule serving as a surrogate for the analyte.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: November 26, 2019
    Assignee: QORVO US, INC.
    Inventors: Michael Salvati, Ian Robert Harmon
  • Patent number: 10316145
    Abstract: Provided are a polyamic acid composition, a polyamideimide film thereof, and a method for preparing the polyamideimide film. More specifically, provided are a polyamideimide film capable of implementing excellent optical properties in addition to inherent physical properties of polyimide by using a polyamic acid composition including a combination of specific components, and a method for preparing the polyamideimide film.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 11, 2019
    Assignee: SK Innovation Co., Ltd.
    Inventors: Sang Yoon Park, Hyeon Jeong Kim, Jin Hyung Park, Tae Sug Jang
  • Patent number: 10294255
    Abstract: A multifunctional crosslinking agent, a crosslinked polymer, and a method of making the same are disclosed. The multifunctional crosslinking agent, which may be used to crosslink amine-terminated polyamides, polyimides, or poly(amide-imide)s, includes three or four anhydride functional groups. The multifunctional crosslinking agent may be defined by a general chemical formula (I): (Z—Ar—)n—W, wherein W represents an anhydride functional group that is directly or indirectly bonded to Ar; Ar represents an aryl group that is directly bonded to W; and n is equal to 3 when W is P?O or N, or n is equal to 4 when W is Si or a carbon moiety.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: May 21, 2019
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Loon-Seng Tan, David Huabin Wang
  • Patent number: 10240002
    Abstract: A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thereof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: March 26, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Hongkyoon Choi, Chanjae Ahn, Hyunjeong Jeon, Sang Soo Jee, Sungwon Choi, Sung Woo Hong, Byunghee Sohn
  • Patent number: 10090473
    Abstract: Provided are a substrate for an OED and a use thereof. The substrate may be applied to manufacture a flexible device exhibiting a suitable haze to have an excellent physical property such as transmittance, and also have excellent physical properties such as surface smoothness and refractive index when needed.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: October 2, 2018
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Ji Hee Kim, Jung Hyoung Lee, Sang Jun Park, Yong Nam Kim
  • Patent number: 9988493
    Abstract: A poly(amide-imide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2, and/or an amic acid precursor structural unit which forms the structural unit represented by Chemical Formula 2 through imidization; and a structural unit represented by Chemical Formula 3, and/or an amic acid precursor structural unit which forms the structural unit represented by Chemical Formula 3 through imidization, wherein the poly(amide-imide) copolymer has a modulus of greater than or equal to about 5.5 giga Pascals after being cured, a yellowness index YI of less than or equal to about 3.5, and an increase in yellowness index ?YI of less than or equal to about 0.7 after being exposed to ultraviolet light for 72 hours: wherein in Chemical Formulae 1 to 3, groups and variables are the same as described in the specification.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: June 5, 2018
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Chanjae Ahn, Sungwon Choi, Sungwoo Hong, Byunghee Sohn, Sun Jin Song, Kyeong-sik Ju
  • Patent number: 9909065
    Abstract: A photo-aligning liquid crystal aligning agent for forming a liquid crystal alignment layer capable of materializing a liquid crystal display device, which has a high transmittance while maintaining a liquid crystal aligning property, a voltage holding ratio and the like, and in which flickering is inhibited from being caused after operating for a long time. The photo-aligning liquid crystal aligning agent contains [A] polyamic acid or a derivative thereof which is synthesized by reacting tetracarboxylic acid dianhydride and diamine, and [B] polyamic acid or a derivative thereof obtained by reacting tetracarboxylic acid dianhydride having no photoreactive structure and diamine having no photoreactive structure.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: March 6, 2018
    Assignees: JNC CORPORATION, JNC PETROCHEMICAL CORPORATION
    Inventors: Youichiro Ooki, Yuko Katano, Tomoyuki Matsuda, Keisuke Izawa, Rika Hisada
  • Patent number: 9394638
    Abstract: A non-woven fabric which is excellent in thermal resistance, mechanical strength, and thermal dimensional stability for applications exposed to high temperature circumstance and has an extremely large surface area and exhibit an excellent filter performance is obtained. The non-woven fabric is composed of polyimide fibers which are obtained by polycondensation of at least an aromatic tetracarboxylic acid and an aromatic diamine having a benzoxazole structure and have a fiber diameter in the range of 0.001 ?m to 1 ?m. The non-woven fabric is obtained by the steps of preparing a polyamic acid by polycondensation of an aromatic tetracarboxylic acid and an aromatic diamine having a benzoxazole structure, and electro-spinning the polyamic acid to form a polyimide precursor non-woven fabric; and imidizing a polyimide precursor fiber bundle.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: July 19, 2016
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Masahiko Nakamori, Satoshi Maeda, Tooru Kitagawa, Hisato Kobayashi, Yasuo Ohta
  • Patent number: 9195137
    Abstract: A composition for forming a resist underlayer film for lithography, including a polymer having a repeating structural unit of Formula (1): R1 is a hydrogen atom or a methyl group and Q1 is a group of Formula (2) or Formula (3): (wherein R2, R3, R5, and R6 are independently a hydrogen atom or a linear or branched hydrocarbon group having a carbon atom number of 1 to 4, R4 is a hydrogen atom or a methyl group, R7 is a linear or branched hydrocarbon group having a carbon atom number of 1 to 6, a C1-4 alkoxy group, a C1-4 alkylthio group, a halogen atom, a cyano group, or a nitro group, w1 is an integer of 0 to 3, w2 is an integer of 0 to 2, and x is an integer of 0 to 3), and v1 and v2 are independently 0 or 1; and an organic solvent.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: November 24, 2015
    Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Takafumi Endo, Rikimaru Sakamoto, Noriaki Fujitani
  • Patent number: 9127138
    Abstract: A method and compositions are described which improve extrusion- and creep-resistance of components for use in a high temperature applications including sealing elements and seal connectors among others. The method includes providing a composition having an aromatic polymer and a crosslinking compound, and subjecting the composition to a heat molding process to form the component and crosslink the aromatic polymer.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: September 8, 2015
    Assignee: Delsper LP
    Inventors: Kerry A. Drake, Charles P. Burke, Ronald R. Campbell, William F. Burgoyne, Burak Bekisli
  • Patent number: 9109075
    Abstract: Methods are disclosed to prepare elastomeric materials by providing aromatic polymer(s) which is/are non-elastomeric at room temperature; cross-linking the aromatic polymer using a cross-linking compound to form a cross-linked aromatic polymer which is substantially cured; and heating the cross-linked aromatic polymer to a temperature at or above a glass transition temperature of the cross-linked aromatic polymer. Materials formed thereby and end products are also described which may be formed using the aromatic polymer cross-linking techniques to develop strong elastomeric materials for high temperature and/or harsh condition end applications.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: August 18, 2015
    Assignee: Delsper LP
    Inventors: Kerry A. Drake, Le Song, William F. Burgoyne, Jr.
  • Patent number: 9109080
    Abstract: The invention includes a cross-linking composition comprising a cross-linking compound and a cross-linking reaction additive selected from an organic acid and/or an acetate compound, wherein the cross-linking compound has the structure according to formula (IV): wherein the cross-linking reaction additive is capable of reacting with the cross-linking compound to form a reactive oligomer intermediate, which is capable of cross-linking an organic polymer. Also included is an organic polymer composition for use in forming a cross-linked organic polymer, comprising a cross-linking compound of Formula (IV), a cross-linking reaction additive and at least one organic polymer. In one embodiment, the at least one organic polymer has at least one halogen-containing reactive group and is dehalogenated by reacting with an alkali metal compound.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: August 18, 2015
    Assignee: Delsper LP
    Inventors: Kerry A. Drake, Andrew F. Nordquist, Sudipto Das, William F. Burgoyne, Jr., Le Song, Shawn P. Williams, Rodger K. Boland
  • Patent number: 9040636
    Abstract: A hydroxy ester resin composition such as a vinyl ester resin including the reaction product of (a) divinylarene dioxide resin; and (b) at least one ring opening reactant such as at least one monocarboxylic acid for example (meth)acrylic acid, in the presence of (c) at least one non-gelling catalyst such as a Lewis acid catalyst; a process for making the hydroxy ester resin composition; a curable hydroxy ester resin composition such as a curable resin composition made from the hydroxy ester resin composition; a process for curing the curable hydroxy ester resin composition; and a cured product made from the curable hydroxy ester resin composition. The cured product made from the above hydroxy ester resin composition is thermally stable and offers improved properties such as a lower viscosity and a high heat resistance compared to known cured products prepared from known epoxy resins.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: May 26, 2015
    Assignee: Dow Global Technologies LLC
    Inventor: E. J. Campbell
  • Publication number: 20150119534
    Abstract: A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component.
    Type: Application
    Filed: December 24, 2014
    Publication date: April 30, 2015
    Applicant: KANEKA CORPORATION
    Inventors: Hisayasu KANESHIRO, Toshihisa Itoh, Kiyokazu Akahori
  • Patent number: 9018343
    Abstract: Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2?-bistrifluoromethyl-4,4?-biphenyl diamine), a unit structure derived from 6FDA (4,4?-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3?,4,4?-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: April 28, 2015
    Assignee: Kolon Industries, Inc.
    Inventors: Hyo Jun Park, Hak Gee Jung
  • Patent number: 9017805
    Abstract: The present disclosure relates to a polyimide-graphene composite material and a method for preparing same. More particularly, it relates to a polyimide-graphene composite material prepared by adding modified graphene and a basic catalyst during polymerization of a polyimide precursor so as to improve mechanical strength and electrical conductivity and enable imidization at low temperature and a method for preparing same.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: April 28, 2015
    Assignee: Korea Institute of Science and Technology
    Inventors: Nam Ho You, Ok-kyung Park, Bon-Cheol Ku, Joong Hee Lee, Munju Goh
  • Patent number: 9012567
    Abstract: Supramolecular polymers having repeat units connected by hydrogen bonds, where the repeat units are monomers, macromers, oligomers or polymers where at least one on the monomers contains at least one 2,5-diketopiperazine group are described. Composition prepared from these supramolecular polymers and articles produced from these compositions are also described.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: April 21, 2015
    Assignee: Rhodia Operations
    Inventors: Thierry Badel, Stéphane Jeol, Franck Touraud
  • Patent number: 9011998
    Abstract: Phase separated blends of polyaryl ether ketones, polyaryl ketones, polyether ketones, polyether ether ketones and mixtures thereof with at least one polysulfone etherimide, wherein the polysulfone etherimide has greater than or equal to 50 mole % of the polymer linkages contain at least one aryl sulfone group are described. Such blends have improved load bearing capability at high temperature. In another aspect a high crystallization temperature, especially at fast cooling rates, is achieved.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: April 21, 2015
    Assignee: Sabic Global Technologies B.V.
    Inventors: Ashish Aneja, Robert Russell Gallucci, Roy Ray Odle, Kapil Chandrakant Sheth
  • Publication number: 20150101986
    Abstract: Disclosed are mixed matrix polymeric membranes comprising a plurality of metal-organic frameworks (MOFs), or in some aspects a zeolitic imidazolate frameworks (ZIFs), and a polymeric matrix, wherein the plurality of MOFs are attached to the polymeric matrix through covalent or hydrogen bonds or Van der Waals interaction.
    Type: Application
    Filed: October 7, 2014
    Publication date: April 16, 2015
    Inventors: Ihab Nizar ODEH, Yunyang LIU
  • Patent number: 9006348
    Abstract: Phase separated blends of polyaryl ether ketones, polyaryl ketones, polyether ketones, polyether ether ketones and mixtures thereof with at least one polysulfone etherimide, wherein the polysulfone etherimide has greater than or equal to 50 mole % of the polymer linkages contain at least one aryl sulfone group are described. Such blends have improved load bearing capability at high temperature. In another aspect a high crystallization temperature, especially at fast cooling rates, is achieved.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: April 14, 2015
    Assignee: Sabic Global Technologies B.V.
    Inventors: Ashish Aneja, Robert Russell Gallucci, Roy Ray Odle, Kapil Chandrakant Sheth
  • Publication number: 20150099088
    Abstract: Disclosed is a substrate structure for manufacturing a flexible electronic device, including a supporting layer, a release layer covering the supporting layer with a first area, wherein the release layer is an aromatic polyimide, and a flexible layer covering the supporting layer and the release layer with a second area. The second area is greater than the first area. The adhesion force between the flexible layer and the supporting layer is stronger than the adhesion force between the release layer and the supporting layer.
    Type: Application
    Filed: April 29, 2014
    Publication date: April 9, 2015
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Cheng LIN, Chyi-Ming LEU, Yu-Ju KUO
  • Patent number: 9000122
    Abstract: The present invention is for aromatic poly(ether sulfone imide) membranes and methods for making and using these membranes for gas, vapor, and liquid separations. The membranes may be fabricated into any known membrane configuration including a flat sheet or hollow fiber. An embodiment of the present invention is for aromatic poly(ether sulfone imide) polymers, aromatic poly(ether sulfone imide) membranes and UV cross-linked aromatic poly(ether sulfone imide) membranes made from these polymers.
    Type: Grant
    Filed: December 16, 2013
    Date of Patent: April 7, 2015
    Assignee: UOP LLC
    Inventors: Zhixue Zhu, Chunqing Liu
  • Publication number: 20150094430
    Abstract: A dinitro compound I, a diamine compound II and polyimides are provided. The diamine compound II is a reduction product of the dinitro compound I. The polyimides using the diamine compound II as one of the monomers can increase the solubility of the polyimides in various organic solvents and make the color of the polyimides to be transparent and colorless.
    Type: Application
    Filed: April 7, 2014
    Publication date: April 2, 2015
    Applicant: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventor: Wen-Hsiang Chen
  • Publication number: 20150073101
    Abstract: The present invention relates to a method for preparing polymer-nanoparticles having a core-shell structure by uniformly coating a polymer on metal and inorganic particles, polymer-nanoparticles prepared thereby, and a polymer-nanoparticle composite comprising the same, and more specifically, a method for preparing polymer-nanoparticles having a core-shell structure by uniformly coating a polymer on metal and inorganic particles, polymer-nanoparticles prepared thereby, and a polymer-nanoparticle composite including the same, wherein when forming a polymer coating layer on surfaces of particles that are not subjected to separate surface treatment, excessive polymers uncoated on nanoparticles are easily removed by adding to an ionic liquid or an apolar solvent so that the polymer coating layer is formed with a nanometer-scale uniform thickness and a dense coating density, thereby showing excellent dispersibility in a polymer matrix.
    Type: Application
    Filed: April 3, 2013
    Publication date: March 12, 2015
    Inventors: Byoung Gak Kim, Jong Chan Won, Yong Seok Kim, No Kyun Park, Jin Young Park
  • Patent number: 8969486
    Abstract: Disclosed are a liquid crystal alignment agent, a liquid crystal alignment film manufactured using the same, and a liquid crystal display including the liquid crystal alignment film. The liquid crystal alignment agent includes a polymer comprising a polyamic acid including a repeating unit represented by Chemical Formula 1, polyimide including a repeating unit represented by Chemical Formula 2, or a combination thereof: wherein Y1 and Y2 are each independently a divalent organic group derived from diamine, wherein the diamine includes photodiamine represented by Chemical Formula 3 and functional diamine represented by Chemical Formula 5: and wherein the other substituents are the same as defined in the detailed description.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: March 3, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Jae-Deuk Yang, Yong-Sik Yoo, Guk-Pyo Jo
  • Patent number: 8969487
    Abstract: A coating for an ink jet printhead front face, wherein the coating comprises an oleophobic low adhesion coating having high thermal stability as indicated by less than about 15 percent weight loss when heated to up to 300° C., and wherein a drop of ultra-violet (UV) gel ink or a drop of solid ink exhibits a contact angle of greater than about 45° and sliding angle of less than about 30° with a surface of the coating, wherein the coating maintains the contact angle and sliding angle after the coating has been exposed to a temperature of at least 200° C. for at least 30 minutes. In particular, the coating shows no oil on the coating surface after curing.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: March 3, 2015
    Assignee: Xerox Corporation
    Inventors: Varun Sambhy, Jin Wu, Kock-Yee Law, Kyle B. Tallman, Darren Smith, Michael S. Roetker
  • Patent number: 8956986
    Abstract: A binding fiber having, as at least one first thermoplastic component, a copolyamide which has a relative viscosity of at least 1.50 (measured at 0.5% in m-cresol at 25° C.), a MVR of maximum 20 cm3/10 min at 190° C. and 2.16 kg load, a hydrophobicity of less than 7.2, a melting temperature lower than 105° C. in the water saturated condition and a higher melting temperature in the dry condition. The binding fiber can, on the one hand, be activated with hot steam at approximately ambient pressure during the manufacture of flat materials containing natural fibers, such as paper, cardboard, wood fiber boards, or fiber mats. The finished flat material can, on the other hand, be subjected to higher temperatures, and the copolyamide develops good bonding with respect to the cellulose fibers normally used in the indicated flat materials.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: February 17, 2015
    Assignee: EMS-Patent AG
    Inventors: Klaus Bender, Gunther Schäch, Eberhard Kinkelin
  • Patent number: 8956638
    Abstract: A method is provided for the preparation of a poly(amic acid) in which ring opening polymerization is employed to react the monomers ethylenediaminetetraacetic dianhydride and paraphenylenediamine in an aprotic solvent. The resulting poly(amic acid) composition is suitable as a biocompatible material, such as a biomedical implant, implant coating material, tissue scaffold material, controlled release drug delivery vehicle, and cellular growth substrate.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: February 17, 2015
    Assignee: Axcelon Biopolymers Corporation
    Inventors: Wankei Wan, Donna Padavan
  • Patent number: 8945694
    Abstract: Filled phase-separated blends of polyaryl ether ketones, polyaryl ketones, polyether ketones, polyether ether ketones and mixtures thereof with at least one polysulfone etherimide, wherein the polysulfone etherimide has greater than or equal to 50 mole % of the polymer linkages contain at least one aryl sulfone group are described. Such filled blends have improved load-bearing capability at high temperature. In another aspect the filled blends have a higher crystallization temperature, especially at fast cooling rates.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: February 3, 2015
    Assignee: Sabic Global Technologies B.V.
    Inventors: Ashish Aneja, Robert Russell Gallucci, Roy Ray Odle, Kapil Chandrakant Sheth
  • Publication number: 20150025200
    Abstract: A composition including a diamine compound and a dianhydride compound, wherein the diamine compound includes a first diamine compound represented by Chemical Formula 1, wherein, in Chemical Formula 1, T1 to T8 and L1 to L8 are the same as defined in the detailed description.
    Type: Application
    Filed: March 5, 2014
    Publication date: January 22, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung Hee SOHN, Yoon Seok KO
  • Patent number: 8937127
    Abstract: A composition comprising: a first polymer comprising a poly(etherimide-siloxane) copolymer comprising (a) a repeating polyetherimide unit, and (b) a poly(siloxane) block unit, a second polymer different from the first polymer and comprising bromine; and optionally, a third polymer comprising a polycarbonate different from the first polymer and second polymer; wherein polysiloxane block units are present in the composition in an amount of at least 0.3 wt %, and bromine is present in the composition in an amount of at least 7.8 wt %, each based on the sum of the wt % of the first, second, and third polymers; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: January 20, 2015
    Assignee: SABIC Global Technologies B.V.
    Inventors: Paul D. Sybert, Thomas L. Evans
  • Publication number: 20150017370
    Abstract: An object is to provided a polyimide resin that is prevented from generation of volatiles due to decomposition or the like even at high temperatures equal to or higher than 250° C. and has good adhesiveness, and a resin composition and a laminated film using the same. Provided is a polyimide resin having at least a tetracarboxylic dianhydride residue and a di-amine residue and having a glass transition temperature of 30° C. or lower, wherein a residue of a polysiloxane di-amine represented by general formula (1) is contained as the di-amine residue, wherein n is a natural number and the average calculated from the average molecular weight of the polysiloxane di-amine is within the range of from 5 to 30; R1 and R2 may be the same or different and each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; R3 to R6 may be the same or different and each represent an alkylene group having 1 to 30 carbon atoms, a phenyl group, or a phenoxy group.
    Type: Application
    Filed: September 10, 2012
    Publication date: January 15, 2015
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Takuo Watanabe, ChungSeon Lee
  • Publication number: 20150018484
    Abstract: A polyimide film includes a polyimide polymer forming a main molecular structure of the polyimide film, and polyimide particles present in the polyimide film at a weight ratio between about 15 wt % and 30 wt % of a total weight of the polyimide film, the polyimide particles having an average diameter between about 3 ?m and 8 ?m. The polyimide film can have a 60° gloss value equal to or smaller than 10, a haze equal to or higher than 90%, and a Young's modulus equal to or higher than 280 kgf/mm2. In some embodiments, methods of fabricating the polyimide film are also described.
    Type: Application
    Filed: April 10, 2014
    Publication date: January 15, 2015
    Applicant: TAIMIDE TECHNOLOGY INCORPORATION
    Inventors: Chih-Wei Lin, Meng-Ying Tsai
  • Publication number: 20150000519
    Abstract: This invention relates to high hydrocarbon resistant chemically cross-linked aromatic polyimide polymers, membranes and methods for making and using these polymers and membranes. The high hydrocarbon resistant chemically cross-linked aromatic polyimide membrane described in the present invention comprises a plurality of repeating units of a first aromatic polyimide comprising hydroxyl groups cross-linked with a second aromatic polyimide comprising carboxylic acid groups via covalent ester bonds. These membranes exhibit high permeability and selectivity in separation of mixtures of gases and liquids.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: Chunqing Liu, Zara Osman
  • Patent number: 8912272
    Abstract: The invention relates to a moisture resistant composition comprising: a) from 20 to 80 weight percent based on the total weight of the composition of a polyetherimide copolymer made from a monomer mixture comprising 3,3? bisphenol-A dianhydride (BPADA), and 4,4?-diaminodiphenyl sulfone (DDS); b) from 5 to 75 weight percent based on the total weight of the composition of polyetheretherketone (PEEK); and c) from 0 to 30 weight percent based on the total weight of the composition of a filler. The invention relates to a reflector substrate comprising a moisture resistant layer metalized with a reflective layer, wherein the moisture resistant layer comprising the moisture resistant composition. The invention relates to a method for producing a metalized coating without a primer comprising applying a reflective layer directly to a moisture resistant layer in the absence of a primer, wherein the moisture resistant layer comprises the moisture resistant composition.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: December 16, 2014
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Michael Stephen Donovan, Gurulingamurthy M. Haralur, Daniel Lowery
  • Patent number: 8912288
    Abstract: The present invention discloses a new type of polyimide membrane with high permeances and high selectivities for gas separations and particularly for CO2/CH4 and H2/CH4 separations. The polyimide membranes have CO2 permeability of 50 Barrers or higher and single-gas selectivity for CO2/CH4 of 15 or higher at 50° C. under 791 kPa for CO2/CH4 separation. The polyimide membranes have UV cross-linkable functional groups and can be used for the preparation of UV cross-linked polyimide membranes having CO2 permeability of 20 Barrers or higher and single-gas selectivity for CO2/CH4 of 35 or higher at 50° C. under 791 kPa for CO2/CH4 separation.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: December 16, 2014
    Assignee: UOP LLC
    Inventors: Chunqing Liu, Travis C. Bowen, Emily G. Harbert, Raisa Minkov, Syed A. Faheem, Zara Osman
  • Patent number: 8907045
    Abstract: Block co-polymers including a hydrophilic block and a hydrophobic poly(amino acid) block which further includes dihydroxyphenyl moieties are provided, as well as methods of making and using the same. Such block copolymers may be used to prepare biocompatible adhesives which display good adhesives properties in aqueous environments, including in in vivo applications.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: December 9, 2014
    Assignee: Empire Technology Development LLC
    Inventors: Josef Peter Klein, Floyd Brian Karp, Yansong Gu, Roger A. Sahm
  • Publication number: 20140355173
    Abstract: A uniaxially-stretched, high yield extruded film comprising a polyetherimide comprising units derived from polymerization of an aromatic dianhydride with a diamine selected from a meta-phenylene diamine, a para-phenylene diamine, and a combination thereof, wherein the polyetherimide is endcapped with an a substituted or unsubstituted aromatic primary monoamine; and wherein the high yield extruded film comprises at least 90 weight % of the polyetherimide before extrusion.
    Type: Application
    Filed: May 30, 2014
    Publication date: December 4, 2014
    Applicant: SABIC GLOBAL TECHNOLOGIES BV
    Inventors: Roy Ray Odle, Matthew Frank Niemeyer, Mark A. Sanner, Anne E. Bolvari, Neal Pfeiffenberger
  • Patent number: 8895676
    Abstract: The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: November 25, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Kazuto Miyoshi, Mika Koshino, Masao Tomikawa
  • Publication number: 20140343199
    Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 20, 2014
    Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
  • Publication number: 20140336276
    Abstract: Disclosed are a biodegradable, biocompatible hydrogel that can be used for sealants of suppressing the leakage of blood or air during surgical operation, tissue adhesives, anti-adhesive agents and drug delivery carriers, and a method for producing the same
    Type: Application
    Filed: December 28, 2012
    Publication date: November 13, 2014
    Inventors: Young-Joo Koh, Hea-Kyung Kim, Sun-Woo Kim, Guw-Dong Yeo
  • Patent number: 8865855
    Abstract: The problem to be solved by the present invention is to provide a polycarbonate copolymer containing a plant-derived raw material, which is excellent in the mechanical strength and heat-resistant and assured of small refractive index, large Abbe number, small birefringence and excellent transparency. The present invention provides a polycarbonate copolymer containing a constitutional unit derived from a dihydroxy compound represented by the following formula (1) and a constitutional unit derived from an alicyclic dihydroxy compound, wherein the Abbe number is 50 or more and the 5% thermal reduction temperature is 340° C. or more; and a method of producing this polycarbonate copolymer by reacting a dihydroxy compound represented by the following formula (1) and an alicyclic hydroxy compound with a carbonic acid diester in the presence of a polymerization catalyst.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: October 21, 2014
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Michiaki Fuji, Minako Akita, Tomohiko Tanaka
  • Patent number: 8859186
    Abstract: A polyimide precursor and a polyimide precursor resin composition, the polyimide precursor having repeating units represented by formula (1) and a photosensitive resin composition comprising the polyimide precursor and a photoacid generator or photobase generator: where R1 is a tetravalent organic group; R2 is a divalent organic group; R1s may be the same or different from each other and R2s may be the same or different from each other in the repeating units; R3 and R4 respectively represent a monovalent organic group having a structure represented by formula (2) and may be the same or different from each other; and R3s and R4s in the repeating units may be the same or different from each other, respectively. R5, R6, R7 and R8 are as described in the specification.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: October 14, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Katsuya Sakayori