Abstract: Polycarbonate compositions with high flame retardance are disclosed. The compositions include a polycarbonate having repeating units derived from a monomer with an ester side group, and also include a flame retardant additive. These compositions may be further blended with another polycarbonate. The resulting compositions have high flame retardance and improved anti-drip properties.

Abstract: A composition comprising: a first polycarbonate comprising a poly(siloxane-carbonate); a second polycarbonate different from the first polycarbonate; and optionally, a third polycarbonate different from the first and second polycarbonate; wherein the first polycarbonate is present in an amount effective to provide the siloxane units of in the first polycarbonate in an amount of at least 0.3 wt %, and the second polycarbonate is present in an amount effective to provide the bromine of the second polycarbonate in an amount of at least 7.8 wt %; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.

Abstract: A composition comprising: a first polycarbonate comprising a poly(siloxane-carbonate); a second polycarbonate different from the first polycarbonate; and optionally, a third polycarbonate different from the first and second polycarbonate; wherein the first polycarbonate is present in an amount effective to provide the siloxane units of in the first polycarbonate in an amount of at least 0.3 wt %, and the second polycarbonate is present in an amount effective to provide the bromine of the second polycarbonate in an amount of at least 7.8 wt %; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.

Abstract: The present invention describes the preparation of an aqueous polyurethane dispersion which is cured by radiation, and its use as binder.

Abstract: Disclosed are compositions, glass filled compositions, articles made therefrom, and processes for making articles therefrom. In an embodiment, a composition can comprise: one or more polycarbonates wherein at least one of the polycarbonates is a polyester-polycarbonate having at least one unit derived from sebacic acid and has a biocontent of at least 5 weight % based upon a total weight of the polyester-polycarbonate, determined according ASTM-D6866; a glass content of 10 weight % or greater based upon a total weight of the composition; and an epoxy resin. The composition has a melt volume rate of greater than 10.5 cm3/10 minutes at 300° C./1.2 kg according to ASTM-D1238-10. A part molded having a 0.8 mm thickness molded from the composition has a gloss value of 89 or higher at 60°, according to ASTM-D523.

Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

Abstract: A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A1, A2, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan ? of 0.3% or less at a temperature of 125° C. The mixture has a glass transition temperature of 130° C. or higher and preferably 280° C. or lower.

Abstract: Methods for forming high molecular weight chain-extended condensation polymers are disclosed. The methods include adding a chain extender during the polymerization process of a condensation polymer to provide a chain-extended condensation polymer, wherein the chain extender comprises a polymerization product of at least one epoxy-functional (meth)acrylic monomer, and at least one styrenic and/or (meth)acrylic monomer.

Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.

Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.

Abstract: An aircraft component wherein the component is a partition or a light cover, and wherein the aircraft component is molded or formed from a thermoplastic polymer composition including: a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt % of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt % of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt % of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt %, and 0.05 to 10 wt % of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.

Abstract: Disclosed herein is a polycarbonate-polysiloxane copolymer resin composition comprising: (A) about 100 parts by weight of a thermoplastic polycarbonate resin; and (B) about 0.1 to about 30 parts by weight of an organo-siloxane polymer having an epoxy group. The polycarbonate-polysiloxane copolymer resin composition has high impact strength at low temperature and high mechanical strength.

Abstract: A poly(siloxane) copolymer composition comprising: a first polymer comprising a first repeating unit, and a poly(siloxane) block unit, a second polymer different from the first polymer and comprising of bromine; and optionally, one or more third polymers different from the first polymer and second polymer; wherein siloxane units are present in the composition in an amount of at least 0.3 wt %, and bromine is present in the composition in an amount of at least 7.8 wt %, each based on the sum of the wt % of the first, second, and optional one or more third polymers; and further wherein an article molded from the composition has an OSU integrated 2 minute heat release test value of less than 65 kW-min/m2 and a peak heat release rate of less than 65 kW/m2, and an E662 smoke test Dmax value of less than 200.

Abstract: A polyester block terpolymer comprising an amorphous block comprising a polystyrene dicarboxylate; a crystallizable block comprising a polyethylene glycol; and an aliphatic diol block; wherein the amorphous block is a continuous phase and the crystallizable block is a dispersed phase, and wherein the dispersed phase is less than about 200 nanometers in size.

Abstract: A modified polyurethane including a lipid substituent from at least one urethane nitrogen and/or at least carbon atom of the modified polyurethane.

Abstract: Disclosed are random copoly(phosphonate carbonate)s with the high molecular weight and narrow molecular weight distribution exhibiting a superior combination of properties compared to prior art.

Abstract: Disclosed are a polycarbonate resin composition obtained by blending a specific amount of an acrylic resin (B) having a specific viscosity average molecular weight or a specific amount of a polyorganosiloxane into a polycarbonate resin containing a polycarbonate copolymer (A) having repeating structural units represented by the general formulae (I) and (II) below and an optical molded body using the resin composition such as a light guide member. The polycarbonate resin composition enables to obtain a molded body having good light conductivity and being free from yellowing due to thermal deterioration, even when it is molded into a large-sized light guide member or light guide plate.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×103 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.

Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: There is provided an aromatic polycarbonate resin composition having excellent flame retardancy, mechanical properties and fluidity and affording a thin-walled molded article. The aromatic polycarbonate resin composition includes a resin component containing (A) 90 to 99.5% by mass of an aromatic polycarbonate resin and (B) 10 to 0.5% by mass of a polyorganosiloxane-containing graft copolymer, and, compounded in 100 parts by mass of the resin component, (C) 0.1 to 5 parts by mass of a bisphenol type epoxy compound and (D) 0.05 to 2 parts by mass of polytetrafluoroethylene capable of forming fibrils, wherein the polyorganosiloxane-containing graft copolymer in the resin composition has a dispersion average particle diameter of 0.1 to 1.0 ?m. The molded article has a section with a thickness of 1 mm or less and is obtainable by molding the aromatic polycarbonate resin composition.

Abstract: A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

Abstract: A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.

Abstract: A crosslinker for polymerizing a film-forming material including an alkyl or aromatic compound comprising at least two functional groups reactive with a film-forming resin and at least one pendent group having a nonionic metal coordinating structure. Coating compositions can include a film-forming material and the crosslinker. The coating compositions can be used to coat a substrate, such as a metal substrate. Applied coating layers on substrates can be cured to form coating films.

Abstract: Film-forming materials include nonionic metal coordinating structures. Nonionic metal coordinating structures can coordinate metals, such as metal catalysts and metal substrates. Example film-forming materials can be the product of a poly-functional epoxide and a nucleophilic ligand having a nonionic metal coordinating structure, or the product of a poly-functional alcohol and an electrophilic ligand having a nonionic metal coordinating structure.

Abstract: A polycarbonate resin composition comprising polycarbonate resin (A) and, blended therewith per 100 parts by mass thereof, 0.001 to 0.1 part by mass of arylphosphine (B) and 0.01 to 1.0 part by mass of alicyclic epoxy compound (C); or a polycarbonate resin composition comprising polycarbonate resin (A) and, blended therewith per 100 parts by mass thereof, 0.001 to 0.1 part by mass of arylphosphine (B), 0.01 to 1.0 part by mass of alicyclic epoxy compound (C) and 0.01 to 1.0 part by mass of acrylic resin (D). The polycarbonate resin composition exhibits excellent optical properties, excelling in resistance to high temperature high humidity, resistance to heat aging (especially high temperature aging), heat resistance and impact resistance, and is suitable for production of optical parts, such as a lens of optical semiconductor device mounted on vehicles which can be used even in especially severe environment. There is further provided an optical part molded from the polycarbonate resin composition.

Abstract: Multi-modal vinyl ester resins having one or more of good fracture toughness, good processing viscosity, and low volatile organic compound emissions are provided. The multi-modal vinyl ester resins are the reaction product of a liquid or crystalline epoxy and an amorphous, solid epoxy, as determined at 25° C., with a vinyl carboxylic acid. The multi-modal vinyl ester resins may contain a reactive diluent, though generally, lower reactive diluent contents are required for such resins than for similar, commercially available vinyl ester resins.

Abstract: A modified polyurethane including a lipid substituent pendant from at least one urethane nitrogen and/or at least one carbon atom of the modified polyurethane, methods of preparing modified polyurethanes and the use thereof as an implantable biomaterial.

Abstract: A thermoplastic composition is disclosed, comprising: a polymer component comprising a polyestercarbonate copolymer comprising ester units of the formula wherein each D and T is the same or different and is independently a divalent C6-30 aromatic organic group; and carbonate units of the formula wherein at least about 60 percent of the total number of R1 groups are a divalent C6-36 aromatic organic group, and the balance thereof are C1-36 aliphatic, C5-36 alicyclic, or C6-36 aromatic organic groups; and 0.01 to 10 wt. %, based on the total weight of the polymer component, of a polymeric compound comprising at least two epoxy groups, wherein the polymeric compound has a weight average molecular weight of 1,500 to 18,000; wherein a test article having a thickness of 3.2 mm and molded from the thermoplastic composition retains more ductility after aging at 134° C. and 100% humidity for 48 hours than an article having a thickness of 3.

Abstract: A low VOC clear coat composition which comprises an epoxy compound, a melamine component and an aliphatic polyisocyanate having an average of 2 to 6 isocyanate functionalities, and optionally contains a catalyst (e.g., organotin catalysts, acid catalysts and combinations); a polyhydroxyl functional compound (e.g., polycarbonate polyol); or other additives (e.g., light absorbers and light stabilizers). Also disclosed is an article coated with the clear coat composition, a process of making the composition, and a process of applying the composition to, for example, an automobile body.

Abstract: A resin composition comprises a resin (A) and a resin (B) as constituents, said resin (A) having a number average molecular weight of 1,000 to 35,000 and being at least one member selected from the group consisting of following (A1) and (A2): (A1) a polyester polyol, a polyether polyol, a polycarbonate polyol, a polyurethane polyol, a polyolefin polyol and an acrylic polyol, (A2) a polymer obtained by reacting said (A1) with a compound having at least one functional group selected from the group consisting of isocyanato, carboxyl and epoxy groups within a molecule thereof, a dialkyl carbonate, a cyclic carbonate, an alcohol, or a mixture of these, and said resin (B) having a sulfonium group and a propargyl group within the molecule thereof.

Abstract: A method of joining electrically conductive materials comprises: Applying an electrically conductive adhesive to at least one electrically conductive material(s), wherein the electrically conductive adhesive is prepared from an epoxide-modified polyurethane, a cross-linking agent, an adhesion promotor and a conductive filler; and joining the electrically conductive material(s) with the applied adhesive to a substrate and curing the adhesive.

Abstract: Solid particles containing 10 to 90 parts by weight of a dihydroxy compound and 10 to 90 parts by weight of a carbonic acid ester are disclosed. Also disclosed is a process for the production of these particles, an apparatus suitable for the process and a method for their use in production of polycarbonate by transesterification of carbonic acid esters with dihydroxy compounds.

Abstract: By heating at above the melting point and/or glass transition point of the polycondensate and adding an aromatic dicyanate; or adding a mixture comprising an aromatic dicyanate and a polyfunctional compound selected from the class of sterically hindered hydroxyphenyl-alkyl-phosphonic esters and monoesters, diphosphonites and secondary aromatic amines; or adding a mixture comprising (i) an aromatic dicyanate, (ii) at least one polyfunctional compound selected from the class of sterically hindered hydroxyphenyl-alkyl-phosphonic esters and monoesters, diphosphonites and secondary amines, and (iii) a difunctional epoxide, it is possible to bring about an increase in the molecular weight and/or viscosity of virgin polycondensate and polycondensate recyclates.

Abstract: A precision product container of the present invention comprises a resin composition as a base material, which comprises a polycarbonate resin and an epoxy compound. Such precision product container can remarkably prevent products contained therein from being contaminated by chlorine and is suitable as a container for a precision product which is free from operational errors of the precision product contained therein when this product is subsequently assembled or processed.

Abstract: This invention relates to a process for increasing the molecular weight and/or for the modification of polycondensates during the processing in the melt, which comprises adding to the polycondensate a blend comprising a) at least one polyfunctional anhydride (polyanhydride); b) at least one polyfunctional compound, the functional groups of which can react with the anhydride groups of component a); and c) at least one phosphonate. This invention also relates to the use of an additive blend for increasing the molecular weight and for the modification of polycondensates during the processing in the melt.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: A thermoplastic resin composition containing a polyetherimide resin, a glycidyl ester impact modifier and a organometallic compound exhibits improved impact strength and ductility.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: There is provided by the present invention a thermal transfer ribbon which employs reactive binder components that increase in molecular weight when heated during transfer to provide images with high scratch and smear resistance. The reactive components comprise an epoxy resin binder and crosslinker for the epoxy resin binder which are maintained in separate phases within the thermal transfer layer until exposed to a thermal print head through the use of a coating formulation solvent which does not solubilize either the crosslinker or the epoxy resin binder or both.

Abstract: A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of a brominated bisphenol A epoxy resin optionally advanced with brominated bisphenol A by reaction of the epoxy groups with a C1-C8 alcohol such as methanol or butanol to the extent that the ratio of unmodified epoxy groups to alcohol-modified epoxy groups is from 2/1 to 1/2.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: Process for preparing a thermosetting coating composition comprising;(a) mixing(i) a cleavable carbonyl polymer having an activated carbonyl group adjacent to oxygen or nitrogen, in the backbone, and having a molecular weight greater than 5,000(ii) a multifunctional compound having a molecular weight less than 5,000 having a functional group capable of reacting with the cleavable carbonyl polymer to cleave the polymer at the carbonyl group and bond with the cleaved polymer, the compound having a crosslinking group;(b) reacting the mixture in an extruder, at 50 to 350.degree. C. for 15 to 600 seconds, to cleave the polymer, and react the cleaved polymer with the functional group on the multifunctional compound(c) quenching the reaction mixture cooling prior to equilibrium reaction, to produce a functionalized cleaved polymer having crosslinking groups derived from the multifunctional compound and capable of crosslinking by heat reaction outside the extruder.

Abstract: Multi-modal vinyl ester resins having one or more of good fracture toughness, good processing viscosity, and low volatile organic compound emissions are provided. The multi-modal vinyl ester resins are the reaction product of a liquid or crystalline epoxy and an amorphous, solid epoxy, as determined at 25° C., with a vinyl carboxylic acid. The multi-modal vinyl ester resins may contain a reactive diluent, though generally, lower reactive diluent contents are required for such resins than for similar, commercially available vinyl ester resins.