With Specified Material Patents (Class 525/511)
  • Patent number: 9840588
    Abstract: Disclosed are epoxy resins exhibiting a highly favorable combination of tensile strength and elongation with respect to prior art epoxy systems. The elastomeric epoxy resin systems of the invention are prepared utilizing a curing agent containing at least one monoprimary amine, and are particularly useful in applications such as, for example, castings, potting, composites, crack sealing, coatings, adhesives, roofing materials, flooring or reinforced membranes.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: December 12, 2017
    Assignee: HEXION INC.
    Inventors: Larry Steven Corley, Carlton E. Ash
  • Patent number: 9394213
    Abstract: Provided is a production process for ?-olefin which does not comply the Shultz-Flory distribution and which is excellent in the yields of ?-olefins of 1-hexene up to 1-tetradecene each having 6 to 14 carbon atoms, particularly a yield of 1-octene. The above production process is characterized by polymerizing ethylene using (A) a specific chromium compound, (B) a specific aminophosphine ligand compound and (C) a promoter.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: July 19, 2016
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Yasushi Shiraki, Masahiko Kuramoto, Takuji Okamoto
  • Patent number: 8912113
    Abstract: Described herein are metal amidine complexes in combination with a second compound useful as catalysts in a number of polymerization reactions, including polyurethane and epoxy polymerization reactions. Also described herein are various coating compositions and methods of using same for coating substrates using the metal amidine complexes in combination with a second compound.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: December 16, 2014
    Assignee: King Industries, Inc.
    Inventors: Ramanathan Ravichandran, Robert Coughlin, Bing Hsieh, Farouk Abi-Karam, John Florio
  • Patent number: 8674039
    Abstract: The invention relates to a crosslinkable polymer powder composition redispersible in water, obtainable by means of free radical polymerization, in an aqueous medium, of one or more monomers from the group consisting of vinyl esters of straight-chain or branched alkylcarboxylic acids having 1 to 15 C atoms, methacrylates and acrylates of alcohols having 1 to 15 C atoms, vinylaromatics, olefins, dienes and vinyl halides, no epoxide-functional comonomers being copolymerized, and subsequent drying of the polymer dispersion obtained thereby, wherein, before and/or during the polymerization and/or before the drying of the polymer dispersion obtained thereby, an epoxy resin is added and, if appropriate after the drying, a curing agent crosslinking with the epoxy resin is added.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: March 18, 2014
    Assignee: Wacker Chemie AG
    Inventors: Michael Faatz, Reinhard Haerzschel
  • Patent number: 8383738
    Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: February 26, 2013
    Assignee: Taiwan Union Technology Corporation
    Inventors: Hsien-Te Chen, Tsung-Hsien Lin
  • Publication number: 20120225982
    Abstract: Described herein are metal amidine complexes in combination with a second compound useful as catalysts in a number of polymerization reactions, including polyurethane and epoxy polymerization reactions. Also described herein are various coating compositions and methods of using same for coating substrates using the metal amidine complexes in combination with a second compound.
    Type: Application
    Filed: March 5, 2012
    Publication date: September 6, 2012
    Inventors: Ramanathan Ravichandran, Robert Coughlin, Bing Hsieh, Farouk Abi-Karam, John Florio
  • Patent number: 7875669
    Abstract: A production process of a rubber composition superior in low rolling resistance, air permeation resistance and durability performance is provided, the production process comprising the following (X), (Y) and (F): (1) step (X) of kneading a rubber component (A) including a butyl rubber and filler for reinforcement, (2) step (Y) of then adding a rubber component (B) and mica to the kneaded article obtained by step (X) and kneading it, and (3) step (F) of then further adding sulfur, a vulcanization accelerator and a vulcanization accelerating aid to the kneaded article obtained by step (Y) and kneading it, wherein 10 to 50 parts by mass of mica and/or talc is included based on 100 parts by mass of the whole rubber components (C).
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: January 25, 2011
    Assignee: Sumitomo Rubber Industries, Ltd.
    Inventor: Tatsuya Miyazaki
  • Patent number: 7476444
    Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: January 13, 2009
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Michael J. Pawlik, Dennis W. Jones, Ralph C. Gray, Richard M Nugent, Jr., Yves Le Disert, Laurent Deronne
  • Patent number: 7459504
    Abstract: The present invention provides a film-forming composition. The composition includes a reaction product of: a) a polyamine containing a primary amino group and a secondary amino group; and b) an acyclic carbonate. Also provided is a method of preparing a film-forming composition and an article coated with such compositions.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: December 2, 2008
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Venkatachalam Eswarakrishnan, Gregory J. McCollum, Matthew Scott, Geoffrey R. Webster, Jr., Judith A. Orzechowski, Kevin J. Dufford, David Robert Fenn, Alan J. Kaylo, Thomas C. Moriarity
  • Patent number: 7368513
    Abstract: The invention is an electrically insulative aqueous polymer composition. The composition includes a thermoplastic acrylic-styrene copolymer emulsion, a wetting agent, water, a surfactant, and a ductility agent. The invention also includes methods of using the electrically insulative composition, as well as methods of using a related electrically conductive aqueous polymeric vehicular emulsion composition.
    Type: Grant
    Filed: January 25, 2005
    Date of Patent: May 6, 2008
    Assignee: SemGreen, L.P.
    Inventors: Wyatt B. Orsbon, Rex A. Hodge, Rolf R. Becker
  • Patent number: 7141619
    Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: November 28, 2006
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Michael J. Pawlik, Dennis W. Jones, Ralph C. Gray, Richard M Nugent, Jr., Yves Le Disert, Laurent Deronne
  • Patent number: 7122132
    Abstract: A branched vapor-grown carbon fiber having an outer diameter of 0.5 ?m or less and an aspect ratio of at least 10, the carbon fiber having a compressed specific resistance of 0.02 ?·cm or less, each fiber filament having a hollow cylindrical structure, preferably the carbon fiber containing boron and having a compressed specific resistance of 0.018 ?·cm or less. An electrically conductive transparent composition comprising a resin binder and carbon fiber incorporated into the binder, having transparency and comprising vapor grown carbon fiber having an outer diameter of 0.01–0.1 ?m, an aspect ratio of 10–15,000, and a compressed specific resistance of 0.02 ?·cm or less, and surface resistivity of 10,000 ?/? or less. An electrically conductive transparent material formed from the aforementioned electrically conductive transparent composition.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: October 17, 2006
    Assignee: Showa Denko K.K.
    Inventors: Toshio Morita, Hitoshi Inoue, Ryuji Yamamoto
  • Patent number: 6743522
    Abstract: The present invention is directed to saturants for fibrous webs that will confer upon those webs the ability to be heat sealed to many materials without compromising the drapability of the fibrous webs. The present invention is further directed to fibrous webs saturated with the saturant of the present invention and methods for saturating such webs. The invention is further directed to packages or containers comprising the saturated webs and methods of manufacturing such packages. The invention is further directed to temperature sensitive adhesive coatings that can be used with the saturated webs and a method for applying the coating.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: June 1, 2004
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Karen H. Bean, Bruce G. Stokes
  • Patent number: 6653411
    Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: November 25, 2003
    Assignee: Brewer Science, Inc.
    Inventors: Rama Puligadda, Runhui Huang
  • Patent number: 6518331
    Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: February 11, 2003
    Assignee: Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Akio Sekimoto, Shinichi Yamada
  • Patent number: 6300428
    Abstract: The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of an epoxy resin, acid, and tertiary amine; (B) a reactive diluent, and, optionally, (C) a curing agent. The compositions are useful for forming cured coated substrates, that are especially suitable for food and beverage packaging.
    Type: Grant
    Filed: January 27, 2000
    Date of Patent: October 9, 2001
    Assignee: The Valspar Corporation
    Inventors: Thomas A. Stevenson, Larry Brandenburger, William McCarty, John Mazza, Jeffrey Niederst
  • Patent number: 6224894
    Abstract: The present invention describes a polyoxaester copolymer and blends thereof that may be used to produce hydrogels, surgical devices such as sutures, sutures with attached needles, molded devices, drug matrices, adhesives, sealants and the like. The invention also contemplates a process for producing these polyesters. The polyoxaester copolymers of the present invention are formed from a first divalent repeating unit of formula IA: [—O—C(O)—R30—C(O)—]  IA a second divalent repeating unit of the formula IB: [O—C(O)—C(R1)(R2)—O—R3—O—C(R′1)(R′2)—C(O)—]  IB and a third repeating unit selected from the group of formulas consisting of: [—O—R4—]A,  II [—O—R5—C(O)—]B,  III ([—O—R5—C(O)]P—O—)LG  XI and combinations thereof.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: May 1, 2001
    Assignee: Ethicon, Inc.
    Inventors: Dennis D. Jamiolkowski, Rao S. Bezwada
  • Patent number: 6207791
    Abstract: Described is a liquid, partially alkoxymethylated melamine crosslinker composition having from about 2.6 to about 4.6 moles of combined formaldehyde per mole of melamine, from about 1.4 to about 4.4 moles of alkyl per mole of melamine, from about 1.3 to about 3.4 moles of NH per mole of melamine, a free formaldehyde level of less than about 0.5 weight percent based on 100 percent solids, and an N-methylol level of less than about 6.0 weight percent; processes for its preparation; a low formaldehyde emitting curable composition containing the crosslinker; as well as a method of coating a substrate and substrates so coated.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: March 27, 2001
    Assignee: Cytec Technologies Corp.
    Inventors: John H. Bright, Barry A. Lawless, Robert G. Lees, Lon-Tang Wilson Lin, Jeno G. Szita
  • Patent number: 6147168
    Abstract: The present invention describes a polyoxaester copolymer and blends thereof that may be used to produce hydrogels, surgical devices such as sutures, sutures with attached needles, molded devices, drug matrices, adhesives, sealants and the like. The invention also contemplates a process for producing these polyesters. The polyoxaester copolymers of the present invention are formed from a first divalent repeating unit of formula IA:[--O--C(O)--R.sub.30 --C(O)--] IAa second divalent repeating unit of the formula IB:[O--C(O)--C(R.sub.1)(R.sub.2)--O--R.sub.3 --O--C(R'.sub.1)(R'.sub.2)--C(O)--] IBand a third repeating unit selected from the group of formulas consisting of:[--O--R.sub.4 --].sub.A, II[--O--R.sub.5 --C(O)--].sub.B, III([--O--R.sub.5 --C(O)].sub.P --O--).sub.L G XIand combinations thereof. These aliphatic polyoxaesters may be blended with other polymers that are preferably biocompatable.
    Type: Grant
    Filed: April 20, 1998
    Date of Patent: November 14, 2000
    Assignee: Ethicon, Inc.
    Inventors: Dennis D. Jamiolkowski, Rao S. Bezwada
  • Patent number: 6100346
    Abstract: The present invention describes a polyoxaamide copolymer and blends thereof that may be used to produce hydrogels, surgical devices such as catheters, molded devices, and the like. The polyoxaamide copolymers of the present invention are composed of a first divalent repeating unit of formula IA:[--X'--C(O)--R.sub.30 --C(O)--] IAa second divalent repeating unit of the formula IB:[X--C(O)--C(R.sub.1)(R.sub.2)--O--R.sub.3 --O--C(R.sub.1)(R.sub.2)--C(O)--]IBand a third repeating unit selected from the group of formulas consisting of:[--Y--R.sub.17 --].sub.T II[--O--R.sub.5 --C(O)--].sub.B, III([--O--R.sub.9 --C(O)].sub.P --O--).sub.L G XIand combinations thereof, wherein R.sub.30 is an alkylene, arylene, arylalkylene, substituted alkylene, substituted arylene and substituted alkylarylene provided that R.sub.30 cannot be --[C(R.sub.1)(R.sub.2)].sub.1--2 --O--R.sub.3 --O--[C(R'.sub.1)(R'.sub.2)].sub.
    Type: Grant
    Filed: April 20, 1998
    Date of Patent: August 8, 2000
    Assignee: Ethicon, Inc.
    Inventors: Dennis D. Jamiolkowski, Rao Bezwada
  • Patent number: 6087417
    Abstract: The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of epoxy resin, acid, and tertiary amine; (B) reactive diluent, and, optionally, (C) curing agent. The compositions are useful for forming cured coated substrates, that are especially suitable for food and beverage packaging.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: July 11, 2000
    Assignee: The Valspar Corporation
    Inventors: Thomas A. Stevenson, Larry Brandenburger, William McCarty, John Mazza, Jeffrey Niederst
  • Patent number: 5885709
    Abstract: There are described polyester fibers and filaments which, following reaction with carbodiimides, have capped carboxyl end groups, the carboxyl end groups being predominantly capped by reaction with mono- and/or biscarbodiimides which are present in the fibers and filaments in an amount of from 30 to 200 ppm, based on the weight of the polyester, the free carboxyl end group content being less than 3 meq/kg of polyester, and the fibers and filaments additionally containing at least 0.02 percent by weight of at least one free polycarbodiimide or of a reaction product containing still reactive carbodiimide groups, and also a process for the preparation thereof.The filaments described are suitable in particular for producing papermaker's machine wire-cloths.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: March 23, 1999
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Gottfried Wick, Erhard Kruger, Herbert Zeitler
  • Patent number: 5859150
    Abstract: The present invention describes a prepolymer of an aliphatic polyoxaester having a polymerizable end group that may be used to produce hydrogels, surgical devices such as sutures, sutures with attached needles, molded devices, and the like.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: January 12, 1999
    Assignee: Ethicon, Inc.
    Inventors: Dennis D. Jamiolkowski, Rao S. Bezwada
  • Patent number: 5789494
    Abstract: Methods and compositions for encapsulated polymeric gels swollen with nonaqueous reactive materials are provided. The methods include gel synthesis, swelling of a gel precursor with a first nonaqueous reactive material, and encapsulation of the swollen gel with a second nonaqueous reactive material. Gels precursors may be synthesized from crosslinking polymers, or alternatively, may be formed by crosslinking and polymerizing a monomer starting material. An accelerator may be utilized to facilitate swelling of the gel precursor with the first nonaqueous reactive material. Foams and composites may also be swollen with the first nonaqueous reactive material. The swollen gel is then contacted with a second nonaqueous reactive material such that an encapsulation layer is formed thereby. The encapsulated gels may be stored for subsequent use.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: August 4, 1998
    Assignee: Medlogic Global Corporation
    Inventors: Barry Joseph Hand, E. C. Lupton, Jr., Lev Bromberg, Xiaohong Yu
  • Patent number: 5698213
    Abstract: The present invention describes a new crossslinkable and crosslinked aliphatic polyoxaesters and blends thereof that may be used to produce hydrogels, surgical devices such as sutures, sutures with attached needles, molded devices, and the like. The invention also contemplates a process for producing these polyesters. The crosslinked aliphatic polyoxaesters of the present invention are formed from an aliphatic polyoxaester a first divalent repeating unit of formula I:?O--C(O)--C(R.sub.1) (R.sub.2)--O--(R.sub.3)--O--C(R.sub.1) (R.sub.2)--C(O)--! Iand a second repeating unit selected from the group of formulas consisting of:?--O--R.sub.4 --!.sub.A, II?--O--R.sub.5 --C(O)--!.sub.B, IIIand(?--O--R.sub.5 --C(O)!.sub.P --O--).sub.L G XIand combinations thereof. These aliphatic polyoxaesters may be blended with other polymers which are preferably biocompatible.
    Type: Grant
    Filed: November 6, 1996
    Date of Patent: December 16, 1997
    Assignee: Ethicon, Inc.
    Inventors: Dennis D. Jamiolkowski, Rao S. Bezwada
  • Patent number: 5639828
    Abstract: A curable coating composition is described comprising two components that are reactive with one another upon curing to form urethane linkages. The urethane-forming components are an active hydrogen groups-containing component and a polyisocyanate, or a carbamate groups-containing component and a carbamate group-reactive component. The composition further comprises a third component that includes one or more epoxide groups. Coatings prepared with this coating composition can be cured and coated with additional coating(s), providing good intercoat adhesion to the subsequent coating.
    Type: Grant
    Filed: April 25, 1996
    Date of Patent: June 17, 1997
    Assignee: BASF Corporation
    Inventors: Rodney L. Briggs, John W. Rehfuss, Walter H Ohrbom, Gregory G. Menovcik
  • Patent number: 5618552
    Abstract: The present invention describes a new aliphatic polyoxaesters that is bioabsorbable and may be used to produce surgical devices such as sutures, sutures with attached needles, molded devices, and the like. The invention also contemplates a process for producing these polyesters. The aliphatic polyoxaesters of the present invention have a first divalent repeating unit of formula I:[O--C(O)--C(R.sub.1)(R.sub.2)--O--(R.sub.3)--O--C(R.sub.1)(R.sub.2)--C(O)-- ]Iand a second repeating unit selected from the group of formulas consisting of:[--O--R.sub.4 --].sub.A, II[--O--R.sub.5 --C(O)--].sub.B, and III([--O--R.sub.5 --C(O)].sub.P --O--).sub.L G XIand combinations thereof.
    Type: Grant
    Filed: March 5, 1996
    Date of Patent: April 8, 1997
    Assignee: Ethicon, Inc.
    Inventors: Rao S. Bezwada, Dennis D. Jamiolkowski
  • Patent number: 5607687
    Abstract: The present invention describes a new aliphatic polyoxaesters and blends thereof that may be used to produce surgical devices such as sutures, sutures with attached needles, molded devices, and the like. The invention also contemplates a process for producing these polyesters. The aliphatic polyoxaesters of the present invention have a first divalent repeating unit of formula I:[O--C(O)--C(R.sub.1)(R.sub.2)--O--(R.sub.3)--O--C(R.sub.1l)(R.sub.2)--C(O)- -] Iand a second repeating unit selected from the group of formulas consisting of:[--O--R.sub.4 --].sub.A, II[--O--R.sub.5 --C(O)--].sub.B, and III([--O--R.sub.5 --C(O)].sub.P --O--).sub.L G XIand combinations thereof. These aliphatic polyoxaesters may be blended with other polymers which are preferably biocompatable.
    Type: Grant
    Filed: March 5, 1996
    Date of Patent: March 4, 1997
    Assignee: Ethicon, Inc.
    Inventors: Rao S. Bezwada, Dennis D. Jamiolkowski
  • Patent number: 5464910
    Abstract: An epoxy resin composition having high epoxy curing property and sufficient storage stability, and an epoxy curing agent therefor. The curing agent or the cure accelerating agent obtained by treating the surfaces of (1) an epoxy adduct obtained by adding a nitrogen-containing heterocyclic compound, an aliphatic amine or an aromatic amine to an epoxy compound having one, two or more epoxy groups in one molecule, with (2) a boric acid compound or (3) a boric acid compound and a phenolic compound, exhibits high curing property and storage stability, and can be favorably used as a curing agent for the epoxy resin composition. The epoxy resin composition prepared by mixing the epoxy resin with (1) and (2) or (1) and (3), exhibits excellent curing property and storage stability.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: November 7, 1995
    Assignee: Shikoku Chemicals Corporation
    Inventors: Takuo Nakatsuka, Tsuyoshi Toyota, Mie Tanimoto, Akiko Matsumoto
  • Patent number: 5439986
    Abstract: A thermo-curable resin composition which contains (a) an aromatic polyamide oligomer having polymerizable unsaturated group(s) at both terminals or within side chain(s), (b) a maleimide compound and (c) an epoxy resin; and a copper foil laminate which comprises impregnating said composition into substrates, followed by bonding by co-pressing copper foils is provided. The copper-clad laminate of the present invention has excellent adhesiveness to copper foil, heat resistance and electrical properties.
    Type: Grant
    Filed: November 16, 1993
    Date of Patent: August 8, 1995
    Assignee: Showa Highpolymer Co., Ltd.
    Inventors: Tadayuki Hosogane, Hiroshi Nakajima, Eiichiro Takiyama
  • Patent number: 5387655
    Abstract: Described is a composition with integral intumescence properties, the composition being obtained by combining: a) one or more aminoformaldehyde resins and b) a mixture of mono- and di- esters of orthophosphoric acid with one or more polyols, the average hydroxy-group content of the polyols being at least 40% by weight, the molar ratio of mono-ester to di-ester not exceeding 12:1 and the phosphorus content of the mixture being at least 10% by weight.
    Type: Grant
    Filed: July 28, 1993
    Date of Patent: February 7, 1995
    Assignees: Chemische Fabrik Budenheim, Rudolf A. Oetker
    Inventor: Charles D. Aslin
  • Patent number: 5378740
    Abstract: A waterborne structural adhesive bonding primer composition (a) that can be effectively applied to an adherend for structural adhesive applications, (b) that emits a VOC content of less than about 250 grams per liter, (c) is thermally stable, and (d) may be employed with 350.degree. F. (176.7.degree. C.) cure epoxy resin systems, which contains the combination of (i) a dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane dissolved in a water vehicle, and (ii) a rigid ring substituted polyethylenically unsaturated carboxylate, carboxamide or carboximide intimately dispersed in the water vehicle and the dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane. Formulations are described that contain chromate-free corrosion inhibitors.
    Type: Grant
    Filed: April 30, 1992
    Date of Patent: January 3, 1995
    Assignee: The Dexter Corporation
    Inventor: Yiuto D. Ng
  • Patent number: 5314984
    Abstract: Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.
    Type: Grant
    Filed: February 5, 1993
    Date of Patent: May 24, 1994
    Assignee: General Electric Company
    Inventors: Mark Markovitz, Jeffrey D. Sheaffer
  • Patent number: 5284917
    Abstract: Disclosed is a thermoplastic resin composition having excellent moldability and thermal resistance which comprises(A) a methacrylimide-containing polymer having at least 10% by weight of units represented by the general formula ##STR1## where R is a hydrogen atom or an aliphatic, aromatic or alicyclic hydrocarbon radical having 1 to 20 carbon atoms,(B) at least one thermoplastic polymer selected from the group consisting of a thermoplastic polyester (B-1) and a thermoplastic polyamide (B-2), and(C) at least one multifunctional compound selected from the group consisting of a multifunctional epoxy compound, a multifunctional oxazoline compound and a multifunctional isocyanate compound.
    Type: Grant
    Filed: July 5, 1991
    Date of Patent: February 8, 1994
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Naoki Yamamoto, Hiroshi Mori, Masaharu Fujimoto
  • Patent number: 5264502
    Abstract: An epoxy resin composition useful as a molded article is cured with a combination of curing agents including diamino-alpha-alkylstilbenes and other curing agents wherein the epoxy resin and/or the other curing agent can contain rodlike mesogenic moieties.
    Type: Grant
    Filed: April 10, 1991
    Date of Patent: November 23, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5241021
    Abstract: The present invention refers to active hydrogen-containing compositions comprising alkoxylated epoxy resin adducts useful in the preparation of rigid polyurethane foams. The active hydrogen-containing compositions comprising alkoxylated epoxy resin adducts of the present invention provide improved physical properties, such as, for example, friability. This invention also refers to prepolymers and foamed articles prepared therefrom.
    Type: Grant
    Filed: November 6, 1991
    Date of Patent: August 31, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Deborah I. Haynes
  • Patent number: 5144011
    Abstract: A method for controlling the release of durgs or other passenger molecules form carrier conjugates, and a class of conjugates that releases drugs when ingested by a cell or subjected to acidic conditions, are disclosed. These conjugates contain a passenger molecule which is attached to a spacer molecule through an acidic bonding group, such as carboxyl, that is in a "cis" configuration with another acidic group, and a carrier molecule that is bonded to the spacer molecule at another site. When subjected to a mild increase in acidity, such as occurs within a lysosome of a cell, the drug or other passenger molecule is hydrolyzed from the the conjugate and released in unmodified, active form.
    Type: Grant
    Filed: February 6, 1989
    Date of Patent: September 1, 1992
    Assignee: Boston University
    Inventors: Wei C. Shen, Hugues J.-P. Ryser
  • Patent number: 5128403
    Abstract: A one-coat adhesive composition which utilizes environmentally acceptable ingredients and which can withstand high temperature conditions such as those experienced during injection molding processes. The adhesive contains a Diels-Alder adduct of a perhalogenated cyclic conjugated diene and an olefinically unsaturated dienophile having a vinyl content in excess of 50 percent, a phenolic resin, an aromatic hydroxy compound, a formaldehyde donor, a heat-activated unsaturated elastomer crosslinker, a vulcanizing agent, and a metal oxide. An adhesive bond prepared with the adhesive is resistant to high temperature fluids and corrosive agents.
    Type: Grant
    Filed: April 10, 1991
    Date of Patent: July 7, 1992
    Assignee: Lord Corporation
    Inventors: Patrick A. Warren, Mark A. Weih, Karen M. Bond
  • Patent number: 4980429
    Abstract: A low cure cathodic electrodepositable resin is disclosed. The backbone of the resin is a polyepoxide amine adduct which is crosslinked with aminoplast resins and catalyzed by metal catalysts. The resin is capable of curing in a basic environment at a temperature below 150.degree. C. The resin can be salted with an acid and can be dissolved or dispersed in water. The aqueous dispersions can then be formulated into electrocoat primer coatings for metal objects.
    Type: Grant
    Filed: January 26, 1990
    Date of Patent: December 25, 1990
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Edward Chu
  • Patent number: 4929651
    Abstract: A process is provided for manufacturing ballistic resistant composites of an isophthalic thermoset polyester and woven roving made of magnesia aluminosilicate glass fibers. An impregnating solution is provided whereby pregregs can be conveniently formed and then vacuum bag molded. The ingredients in the impregnating solution are critically selected to provide prescribed viscosities after the elapse of certain periods of time and thereby allow the final articles to be formed in an economical and expedient manner.
    Type: Grant
    Filed: November 10, 1988
    Date of Patent: May 29, 1990
    Assignee: Owens-Corning Fiberglas Corporation
    Inventors: James V. Gauchel, Edward L. Wilson, Edward J. Kerle
  • Patent number: 4847348
    Abstract: Epoxy resins having low melt viscosities and high softening points are prepared by partially reacting the epoxy resin with a monoimide. These modified epoxy resins are useful as binders in preparing high flow-out, non-sintering powder paints, particularly in epoxy resin/polyester hybrid coatings.
    Type: Grant
    Filed: June 6, 1988
    Date of Patent: July 11, 1989
    Assignee: The Dow Chemical Company
    Inventors: Gordon C. Fischer, Linda M. McKinney
  • Patent number: 4837278
    Abstract: The invention relates to a reduced temperature coating composition which dries to form films exhibiting desirable properties comprises a blend of (1) a principle film forming resin with reactive functional groups, typically hydroxyl, and (2) a fully alkylated, low imino aminoplast.
    Type: Grant
    Filed: November 13, 1987
    Date of Patent: June 6, 1989
    Assignee: BASF Corporation
    Inventors: James M. Cameron, Timothy P. Stanton, Anthony J. Tye, Timothy S. December
  • Patent number: 4800215
    Abstract: Uncured compositions are prepared from dialkanolamines and polyglycidyl ethers of tris(hydroxyphenyl)alkanes. These compositions are water soluble or water miscible.
    Type: Grant
    Filed: March 18, 1988
    Date of Patent: January 24, 1989
    Assignee: The Dow Chemical Company
    Inventors: James L. Bertram, Willie L. Myles, Michael P. Kubisiak
  • Patent number: 4736000
    Abstract: A method for curing an aromatic polythioether sulfone, which comprises mixing an aromatic polythioether sulfone polymer with a member selected from the group consisting of (a) a compound having at least two epoxy, isocyanate or maleimide groups per molecule, (b) an aminoplast resin, (c) a metal chelate compound of acetylacetone, and (d) a halide of a metal belonging to Group VIII or IB of the Periodic Table, followed by heat treatment.
    Type: Grant
    Filed: December 5, 1986
    Date of Patent: April 5, 1988
    Assignee: Asahi Glass Company Ltd.
    Inventors: Josho Kashiwame, Shigeyuki Kozawa, Takao Doi, Nobuyuki Tamai
  • Patent number: 4725653
    Abstract: This invention is directed to adducts of a polycaprolactone polyol and a polyepoxide comprising the reaction product of at least one polycaprolactone polyol and a polyepoxide containing two or more epoxy groups per molecule in a molar ratio of polycaprolactone polyol to polyepoxide of from about 2:1 to about 3:1, said adducts having an oxirane content of less than about 0.10 percent and a viscosity of less than about 3700 centistokes at 54.5.degree. C. The adducts are useful in the formulation of high solids coating compositions, polyurethane elastomers, inks, sealants, adhesives and the like.
    Type: Grant
    Filed: November 13, 1985
    Date of Patent: February 16, 1988
    Assignee: Union Carbide Corporation
    Inventor: Joseph V. Koleske
  • Patent number: 4713137
    Abstract: An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester of anhydride of such acid. The epoxy resin composition can also contain a bisphenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.
    Type: Grant
    Filed: July 30, 1986
    Date of Patent: December 15, 1987
    Assignee: The Dow Chemical Company
    Inventor: Diane Sexton
  • Patent number: 4711936
    Abstract: A curing agent for an epoxy resin comprises a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group, a curing agent for an epoxy resin comprising a mixture of a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group with a trace amount of amylase, and methods for the preparation of these curing agents. The curing agents are stable at room temperature, and the curing reaction is initiated under remarkably simple conditions.
    Type: Grant
    Filed: November 13, 1985
    Date of Patent: December 8, 1987
    Assignee: Japan Liquid Crystal Co., Ltd.
    Inventors: Ichiro Shibanai, Kenji Nakamura
  • Patent number: 4596843
    Abstract: A high solids coating composition which comprises 10-96 percent by weight resin solids of a low molecular weight epoxy oligomer, 2-35 percent by weight crosslinking glycoluril-formaldehyde resin and a primary sulfonic acid catalyst. The oligomer is condensed upon heating into a high molecular weight polymer film with simultaneous crosslinking with the crosslinking agent to provide the desired film properties.
    Type: Grant
    Filed: March 20, 1985
    Date of Patent: June 24, 1986
    Assignee: Insilco Corporation
    Inventor: Donald G. Wind
  • Patent number: 4508765
    Abstract: A heat curable water dispersible film-forming synthetic resin useful in aqueous coating compositions for coating metal substrates, particularly cans used for food and beverages, comprises the reaction product of a water insoluble phenolic resin or a water insoluble amino resin with an epoxy resin and a phosphoric acid.
    Type: Grant
    Filed: September 30, 1982
    Date of Patent: April 2, 1985
    Assignee: International Paint public limited company
    Inventors: John Ring, David French, Michael Hickling, Michael G. Sturgess
  • Patent number: 4383073
    Abstract: Water-compatible compositions are described which consist essentially of at least one resinous compound whose backbone is linear or substantially linear and consists essentially of at least one oxyaryleneoxyalkylene or oxyaryleneoxy(1,3-(2-hydroxy)alkylene) unit and which bears at least two functional organic moieties through which cross-linking can occur (preferably groups having active hydrogen, more preferably aliphatic hydroxyl groups) and at least one terminal carbamoylpyridinium group covalently bonded through the ring nitrogen atom combined with an acid curable cross-linking agent. The compositions are useful coating compositions which find particular utility in cathodic electrodeposition. The compounds are prepared, for example, by reacting a linear or substantially linear epoxy resin with a carbamoylpyridine in the presence of sufficient amount of a Bronsted acid and water to stabilize the carbamoylpyridinium salt thus formed.
    Type: Grant
    Filed: August 20, 1981
    Date of Patent: May 10, 1983
    Assignee: The Dow Chemical Company
    Inventors: Ritchie A. Wessling, Larry D. Yats, William O. Perry