Polysulfone Patents (Class 525/906)
  • Patent number: 5036146
    Abstract: High temperature resistant polysulfone-polyimide block copolycondensates suitable for example for producing shaped articles are composed of at least one polyarylene ether sulfone block comprising units of the structure ##STR1## and at least one polyimide block comprising units of the structure ##STR2## where R.sup.1 and R.sup.2 are identical or different and each is hydrogen or methyl and X is methylene or 1,2-ethylene, and are prepared by condensing conventionally obtained amine-terminated polyarylene ether sulfone blocks with polyimide blocks in the melt.
    Type: Grant
    Filed: December 15, 1989
    Date of Patent: July 30, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Carola Hedtmann-Rein, Gerhard Heinz
  • Patent number: 4968758
    Abstract: Novel poly(aryl ether sulfone)-poly(aryl ether ketone) block copolymers are described. They are prepared by the nucleophilic polycondensation of a hydroxy- or halo-terminated poly(aryl ether ketone) oligomer with the poly(aryl ether sulfone) forming reagents; alternatively, a preformed poly(aryl ether sulfone) block may be used.The novel copolymers are tough materials with excellent heat, solvent, and stress-crack resistanced. They display high HDT's (heat distortion temperatures) and are useful in molding, extrusion and composites applications.
    Type: Grant
    Filed: August 22, 1988
    Date of Patent: November 6, 1990
    Assignee: Amoco Corporation
    Inventors: Markus Matzner, James H. Botkin, Paul A. Winslow
  • Patent number: 4895913
    Abstract: A wire coating resin composition comprising 25 to 95% by weight of a polyetherketone and 75 to 5% by weight of an aromatic polysulfone, which is characterized by the intrinsic viscosity (y) of the polyetherketone complying with the condition0.83.ltoreq.y.ltoreq.0.01x+0.65,wherein x represents weight percentage of the polyetherketone in the wire coating resin composition.
    Type: Grant
    Filed: July 15, 1988
    Date of Patent: January 23, 1990
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Teruo Saito, Kuniaki Asai, Yasurou Suzuki
  • Patent number: 4822832
    Abstract: Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardner and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.
    Type: Grant
    Filed: April 7, 1987
    Date of Patent: April 18, 1989
    Assignee: Hercules Incorporated
    Inventors: Sung G. Chu, Harold Jabloner, Brian J. Swetlin
  • Patent number: 4798855
    Abstract: Thermoplastic molding materials contain, as essential components,(A) from 2 to 97.9% by weight of a nylon,(B) from 2 to 97.9% by weight of a polyaryl ether sulfone(C) from 0.1 to 30% by weight of a polymeric component having hydroxyl groupsand in addition(D) from 0 to 50% by weight of a rubber impact modifier and(E) from 0 to 60% by weight of reinforcing fillers.
    Type: Grant
    Filed: May 13, 1987
    Date of Patent: January 17, 1989
    Assignee: BASF Aktiengesellschaft
    Inventors: Dietrich Lausberg, Gerd Blinne, Peter Ittemann, Gerhard Heinz, Erhard Seiler, Manfred Knoll
  • Patent number: 4757120
    Abstract: Polyimide polymers which are reaction products of active methylene compounds and N,N'-bismaleimide derivatives are improved by incorporating them with 2 to 15% by weight of a polyethersulfone polymer. The polymer blend is useful in producing films, moldings, prepegs, laminates and filled composites which are particularly useful in structural components which have stability at high temperatures.
    Type: Grant
    Filed: October 3, 1986
    Date of Patent: July 12, 1988
    Assignee: ICI Americas Inc.
    Inventors: William W. Bristowe, Hong C. Kim
  • Patent number: 4746710
    Abstract: Described herein is a shaped article formed from a blend of a poly(aryl ether) resin and an aromatic polycarbonate resin and/or a polyacrylate resin. An article molded from such a blend has improved hydrolytic stability as compared with an article molded from the constituent components of the blend.
    Type: Grant
    Filed: September 6, 1985
    Date of Patent: May 24, 1988
    Assignee: Amoco Corporation
    Inventors: Barry L. Dickinson, Lloyd M. Robeson
  • Patent number: 4734470
    Abstract: A block copolymer composed of polyphenylene sulfide segments and aromatic sulfide sulfone polymer segments and having a logarithmic viscosity [.eta.], determined at 206.degree. C. for its solution in alpha-chloronaphthalene in a polymer concentration of 0.4 g/100 ml of solution and calculated in accordance with the equation [.eta.]=ln (relative viscosity)/polymer concentration, of 0.03 to 1.0. A resin composition comprising the block copolymer and polyphenylene sulfide and/or an aromatic sulfide sulfone polymer and optionally a filler. The block copolymer and the resin composition have improved mechanical strength and are suitable, for example, for encapsulation of electronic component parts.
    Type: Grant
    Filed: November 12, 1986
    Date of Patent: March 29, 1988
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Juheiji Kawabata, Toshinori Sugie, Fumihiro Kobata, Hitoshi Izutsu, Manabu Chiba
  • Patent number: 4666991
    Abstract: A graft copolymer consisting essentially of a main chain polymer having a glass transition temperature (Tg) of at least 30.degree. C. and a graft chain fluorine-containing polymer having a repreating unit of the formula: ##STR1## wherein R.sup.1 is a hydrogen atom or a lower alkyl group, and R.sup.2 is a polyfluoroalkyl group.
    Type: Grant
    Filed: October 30, 1985
    Date of Patent: May 19, 1987
    Assignee: Sagami Chemical Research Center
    Inventors: Kiyohide Matsui, Kazuhiko Ishihara
  • Patent number: 4663401
    Abstract: A thermosettable epoxy resin composition comprising 100 parts by weight of an epoxy resin, 5 to 40 parts by weight of polysulfone resin having both a resorcinol moiety and 4,4'-dichlorodiphenylsulfone moiety in the molecular chain, and an effective amount of a curing agent, which gives a cured product excellent in toughness as well as in curability, adhesion, mechanical strength at high temperatures and resistance to chemicals.
    Type: Grant
    Filed: May 2, 1985
    Date of Patent: May 5, 1987
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Yasuhisa Saito, Akira Morii, Hiroshi Nakamura
  • Patent number: 4661559
    Abstract: Described herein is a composition which contains a specific group of hardeners, an epoxy resin and a thermoplastic polymer. When combined with a structural fiber the composition produces composites which have improved impact resistance, improved tensile properties and high compressive properties.
    Type: Grant
    Filed: January 10, 1985
    Date of Patent: April 28, 1987
    Assignee: Union Carbide Corporation
    Inventors: Hugh C. Gardner, Michael J. Michno, Jr., George L. Brode, Robert J. Cotter
  • Patent number: 4656208
    Abstract: Described are novel thermosetting epoxy resin compositions suitable for making cured resins, prepregs and stiff, tough thermoset composites. The thermosetting compositions comprise a polyepoxide component, an amine hardener and a specified amount of certain aromatic oligomers containing functional groups which are reactive with the polyepoxide and/or hardener under curing conditions for the composition. The cured resins have a multiphase morphology which comprises at least one glassy continuous phase and at least one glassy discontinuous phase and have a fracture toughness, K.sub.IC, of at least 1.0 MPam.sup.1/2.
    Type: Grant
    Filed: April 17, 1985
    Date of Patent: April 7, 1987
    Assignee: Hercules Incorporated
    Inventors: Sung G. Chu, Harold Jabloner, Brian J. Swetlin
  • Patent number: 4656207
    Abstract: Disclosed is a stiff, tough thermoset composite, the composite comprising a crosslinked epoxy resin matrix and high strength filaments. The resin matrix comprises a glassy discontinuous phase dispersed in a glassy continuous phase that continues throughout the resin matrix. Volume fractions of the discontinuous phase are at least about 35% of the total volume of the continuous and discontinuous phases combined in exceptionally tough composites.Also disclosed are novel resin compositions suitable for making these thermosets.
    Type: Grant
    Filed: February 19, 1985
    Date of Patent: April 7, 1987
    Assignee: Hercules Incorporated
    Inventors: Harold Jabloner, Brian J. Swetlin, Sung G. Chu
  • Patent number: 4645804
    Abstract: A thermoplastic composition includes compatible blends of a mixed polycarbonate comprising units derived from a first dihydric phenol, which is a bis(hydroxyaryl) sulfone, a second dihydric phenol; and one or more thermoplastic condensation polymers containing hetero groups.
    Type: Grant
    Filed: December 28, 1984
    Date of Patent: February 24, 1987
    Assignee: General Electric Company
    Inventors: Daniel W. Fox, Edward N. Peters, Gary F. Smith
  • Patent number: 4569989
    Abstract: A method of inhibiting microbial growth by employing an addition copolymer is disclosed. The addition copolymer consists essentially of an olefin and sulfur dioxide; said olefin containing at least one substituent selected from the group consisting of hydrogen, chloride, and fluoride radicals. These compositions inhibit bacterial growth while functioning as plastic materials and can be used in coatings, packaging, paints, structural members and supports.
    Type: Grant
    Filed: December 24, 1984
    Date of Patent: February 11, 1986
    Assignee: The Dow Chemical Company
    Inventor: Norman L. Madison
  • Patent number: 4510289
    Abstract: A thermoplastic composition includes compatible blends of a mixed polycarbonate comprising units derived from a first dihydric phenol, which is a bis(hydroxyaryl) sulfone, a second dihydric phenol; and one or more thermoplastic condensation polymers containing hetero groups.
    Type: Grant
    Filed: December 20, 1982
    Date of Patent: April 9, 1985
    Assignee: General Electric Company
    Inventors: Daniel W. Fox, Edward N. Peters, Gary F. Smith
  • Patent number: 4460736
    Abstract: A polymer blend which is capable of exhibiting an anisotropic melt phase, improved processability characteristics, and the ability to form shaped articles having satisfactory mechanical properties is provided. The polymer blend comprises approximately 5 to approximately 75 percent by weight, based upon the total weight of the blend, of a sulfone polymer which is selected from the group consisting of polyether sulfone having recurring units of the formula ##STR1## polysulfone having recurring units of the formula ##STR2## a mixture of the above sulfone polymers, and approximately 25 to approximately 95 percent by weight, based upon the total weight of the blend, of a melt processable wholly aromatic polyester which is capable of forming an anisotropic melt phase apart from the blend.
    Type: Grant
    Filed: July 3, 1980
    Date of Patent: July 17, 1984
    Assignee: Celanese Corporation
    Inventors: Michael F. Froix, Norman Trouw
  • Patent number: 4459253
    Abstract: A new magnetic medium permits magnetic recording either in the longitudinal or the vertical direction. The medium, unlike prior art structures, does not require a nonmagnetic substrate. The medium is a rigid magnetic disk homogeneously prepared from ferric oxide particles and polyethersulfone in ratios and proportions that produce effective and inexpensive magnetic recording media.
    Type: Grant
    Filed: August 30, 1982
    Date of Patent: July 10, 1984
    Assignee: International Business Machines Corporation
    Inventors: Haik Marcar, Hans Traeg
  • Patent number: 4451424
    Abstract: Polysulfone cast films, including polyethersulfone cast films, are partially gelled with mineral acid prior to or during the conventional water gelation to control the porosity of and improve the productivity of reverse osmosis and ultrafiltration membranes thus produced. The partial gelation may be carried out prior to the water gelation by contacting the cast film with the mineral acid in a gaseous or aqueous form and the gaseous form may be diluted with air. The partial gelation may, in different embodiments, be carried out simultaneously with the conventional gelation by dissolving the mineral acid in the gelation liquid.
    Type: Grant
    Filed: September 10, 1982
    Date of Patent: May 29, 1984
    Assignee: Canadian Patents & Development Limited
    Inventors: Thomas A. Tweddle, William L. Thayer, Oleh Kutowy, Srinivasa Sourirajan
  • Patent number: 4369136
    Abstract: Described herein are molding compositions comprising a blend of a poly(aryl ether), a polyester and a compatibilizing amount of an aromatic polycarbonate. These compositions are especially suited for molding articles useful in electrical applications.
    Type: Grant
    Filed: March 31, 1980
    Date of Patent: January 18, 1983
    Assignee: Union Carbide Corporation
    Inventors: Lloyd M. Robeson, William D. Claus, Jr., Harvey L. Batleman
  • Patent number: 4356292
    Abstract: The acid chloride of bis-m-carboxyphenyl acetylene was copolymerized with a mixture of isophthaloyl chloride, diphenyl ether and 4,4'-diphenoxydiphenyl sulfone to produce novel polyaromatic ether-ketone-sulfones easily cured by a Diels-Alder cycloaddition reaction.
    Type: Grant
    Filed: May 20, 1981
    Date of Patent: October 26, 1982
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Venkatesa Sankaran, Carl S. Marvel
  • Patent number: 4343756
    Abstract: Mixtures of polyaryl sulphones and polycarbonates solutions made stable by the introduction of solubilizing agents are used to prepare cast films of improved properties.
    Type: Grant
    Filed: November 17, 1980
    Date of Patent: August 10, 1982
    Assignee: Bayer Aktiengesellschaft
    Inventors: Hans-Leo Weber, Eckart Reese, Hans Kaloff, Hans-Josef Fausten
  • Patent number: 4340697
    Abstract: The present invention relates to a heat resistant molding resin composition comprising 60-99.9% by weight of an aromatic polyamideimide resin, and 40-0.1% by weight of a thermoplastic resin which comprises at least one member selected from the group consisting of a polyphenylene sulfide resin, a polyamide resin, a polysulfone resin, an aromatic polyester resin, a polyphenylene-ether resin and a phenoxy resin. The thermoplastic resin must have a melt viscosity at 350.degree. C. of not more than 1.times.10.sup.5 poise and a decomposition temperature of not lower than 350.degree. C. The aromatic polyamideimide resin is improved in melt viscosity characteristics by being blended with the thermoplastic resin. Therefore, a resin composition is obtained which is excellent in moldability characteristics. This composition may optionally comprise various kinds of fillers.
    Type: Grant
    Filed: April 1, 1980
    Date of Patent: July 20, 1982
    Assignee: Toray Industries, Inc.
    Inventors: Toshihiko Aya, Yasushi Kubo
  • Patent number: 4321174
    Abstract: An aqueous dispersion of an aromatic polyethersulphone of sole repeat unit ##STR1## and having mean particle size below 25 .mu.m, preferably below 12 .mu.m, is prepared by (1) stirring the polyethersulphone in methylene chloride to form a solution and then a coarse particulate solid, (2) adding further methylene chloride to form a slurry, (3) milling the slurry to form a dispersion, (4) mixing a methylene chloride - and water-miscible liquid which does not swell the polyethersulphone with the milled dispersion, (5) filtering the dispersion and washing the wet cake with the liquid and then water, and (6) dispersing the wet cake in water, optionally with milling, to provide the aqueous dispersion.
    Type: Grant
    Filed: January 5, 1981
    Date of Patent: March 23, 1982
    Assignee: Imperial Chemical Industries Limited
    Inventors: Leslie R. J. Hoy, Peter S. Westgate
  • Patent number: 4293670
    Abstract: Described herein are molding compositions of blends of a poly(aryl ether) resin and a polyetherimide resin. These compositions have improved environmental stress crack resistance.
    Type: Grant
    Filed: December 26, 1979
    Date of Patent: October 6, 1981
    Assignee: Union Carbide Corporation
    Inventors: Lloyd M. Robeson, Markus Matzner, Louis M. Maresca
  • Patent number: 4222918
    Abstract: Aqueous impregnating emulsions for the impregnation of fibrous rovings are provided in which water has emulsified therein particles of epoxy resin in compatible admixture with thermoplastic resin, and a curing agent for the epoxy resin is dispersed in the emulsion, the curing agent being nonreactive under ambient conditions, such as dicyandiamide. Polysulfone resins are preferably used by dissolving them in methylene chloride and then evaporating this solvent after the epoxy resin has been dissolved in. Polycarboxylic acid emulsifying agents provide superior properties in the cured product.
    Type: Grant
    Filed: March 19, 1979
    Date of Patent: September 16, 1980
    Assignee: DeSoto, Inc.
    Inventors: Mark R. Zentner, Edward P. Zahora, Angelo F. Leo