Abstract: Vinyl ester resins of the type already having reactive liquid polymers reacted into the backbone of the resins, are cured in the presence of a reactive liquid polymer additive admixed with the prereacted vinyl ester resin. Heating of the system during cure causes the reactive liquid polymer additive to miscibilize with the vinyl ester base resin. The vinyl ester resin modified in the manner described above shows a significant enhancement in toughness as measured by fracture energy over unmodified counterparts or counterparts modified by known methods of adduction or admixing alone.

Abstract: Epoxy acrylate resins of this invention having a structure of the general formula (I) ##STR1## in which R is hydrogen or a lower alkyl group, R' is hydrogen or methyl group, and n is an integer from 0 to 20 are heat-resistant, solvent-soluble, and photosensitive and photosensitive resin compositions containing said epoxy acrylate resins as main component exhibit high photosensitivity in addition to strong adhesion to substrates, good resistance to heat and chemicals, and good mechanical and electrical properties and are useful as materials for forming insulation films for multilayer devices and protective films for image sensors and as protective films for solder resists, plating resists, and color filters.

Abstract: Radiation-curable catalysts are obtainable by reactingA) 1 equivalent of a dihydric to hexahydric oxyalkylated C.sub.2 -C.sub.10 -alcohol withB) from 0.05 to 1 equivalent of a dibasic to tetrabasic C.sub.3 -C.sub.36 -carboxylic acid or its anhydride andC) from 0.1 to 1.5 equivalents of acrylic acid and/or methacrylic acidand reacting the excess carboxyl groups with an equivalent amount of epoxide compound, and are used in radiation-curable coating materials.

Abstract: A resin composition comprising(a) 40 to 80% by weight of a resin comprisingan oligomer having a number average molecular weight of 900 to 3,000 in terms of polystyrene equivalent obtained by gel permeation chromatography and having two or more terminal (meth)acrylate groups andan unsaturated polyester, and(b) 20 to 60% by weight of methyl (meth)acrylate monomer.

Abstract: This invention relates to aryloxy polyvinyl ethers having the formula ##STR1## wherein R is a radical having from 2 to 20 carbon atoms and is selected from the group of alkylene, alkyleneoxy alkylene, polyalkyleneoxy alkylene, arylene, alkarylene, alkarylalkylene and aralkylene; X is oxygen or sulfur; A is branched or linear alkylene having from 1 to 20 carbon atoms; B is halo or lower alkyl; n has a value of from 1 to 6 and p has a value of from 0 to 4. The invention also relates to the preparation and use of said aryloxy divinyl ethers.

Abstract: The instant invention relates to vinylic macromers containing perfluoropolyalkylether and polyalklether segments, polymers and ophthalmic devices such as intraocular implants and contact lenses and particularly soft hydrogel contact lenses made therefrom.

Abstract: The invention provides a radiation-curable liquid resin for use as a secondary coating of lightwave guides which is a reaction product of (meth)acrylic acid or -acid chloride or isocyanatoalkyl-(meth)acrylate with a 1:2 addition compound of a diepoxide with a mean molecular weight.ltoreq.1000 and a short-chain .alpha.,.omega. -diol with a mean molecular weight.ltoreq.700 or with a 1:2 addition compound of a diepoxide with a mean molecular weight.ltoreq.400 and a monovalent aliphatic alcohol with a mean molecular weight.ltoreq.200, where the diepoxide is an aliphatic-aromatic or aromatic diglycidylether, an aliphatic or cycloaliphatic diepoxide or a silicon-organodiepoxide, and where the short-chain .alpha.,.omega. -diol is an .alpha..omega. -hydroxy-terminated polyoxyalkylene, an .alpha.,.omega. -hydroxy-terminated polyester, an .alpha.,.omega. -hydroxy-terminated polybutadiene, an .alpha.,.omega. -hydroxyterminated organo-functional polysiloxane or an .alpha.,.omega. -alkanediol with a mean molecular weight.

Abstract: Described herein are curable molding compositions comprising a mixture of:(a) a vinyl ester produced by the addition of an unsaturated monocarboxylic acid to a polyepoxide and having a molecular weight greater than 300;(b) acrylic or methacrylic acid or a functionalized derivative thereof having a molecular weight of less than 300;(c) an ethylenically unsaturated monomer which is soluble in and copolymerizable with (a) and (b) and which is different from (b).The compositions can also contain one or more fibers with a melting point or a glass transition temperature above about 130.degree. C.

Abstract: A photosetting liquid ink composition developable with a dilute alkaline aqueous solution and comprising (A) a resin curable with an activated energy ray, obtained by the reaction of a saturated or unsaturated polybasic acid anhydride with a product of the reaction of a novolak type epoxy compound and an unsaturated monocarboxylic acid, (B) a photopolymerization initiator, and (C) a diluent can be used for the production of an etching resist or a solder resist in the manufacture of a printed circuit. This composition, when combined with a thermosetting component, produces a photosetting and thermosetting liquid ink composition.

Abstract: There is provided a photo-curable coating composition comprising (a) a photo-curable monomer of polymer and (b) a compound having a blocked isocyanate group and at least one ethylenically unsaturated group.

Abstract: Vinyl ester resins of substituted epoxidized hydroxystyrylaza compounds are disclosed. These vinyl esters may be combined with various reactive monomers, prepolymers or polymers and cured to give a combination of high mechanical strength and glass transition temperature.

Abstract: A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the hydroxyl value of the photocurable resin is not more than 10 carbons. Coating films formed from the subject composition have excellent adhesion, heat resistance, moisture insulation resistance and alkaline developable properties.

Abstract: A method of accelerating the curing of a vinyl ester resin (e.g., vinyl ester adhesives) and related compositions comprising: a vinyl ester resin (e.g., bisphenol/epichlorohydrin condensation polymer end capped with methacrylic or ethylacrylic acid); a vinyl monomer (e.g., styrene or the like); a free radical initiator (e.g., MEKP); a free radical promoter (e.g., polyvalent metal naphthenates, polyvalent metal octoates or the like); and an accelerator selected from the group consisting of methyl acetoacetate and ethyl acetoacetate, such compositions are characterized by gel times under ten minutes and physical properties approaching fully cured values within one hour.

Abstract: A solder resist ink composition is disclosed which contains a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a bisphenol A novolak- or cycloaliphatic oxirane novolak-type opoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, at least one photo-polymerizable compound selected from photo-polymerizable monomers, a photo-polymerization initiator, an organic solvent, and an inorganic filler. Also disclosed are two other solder resist ink compositions each having a different photo-curable component.

Abstract: Aqueous solvent dispersible, radiation crosslinkable compounds and oligomers containing poly(ethylenically unsaturated) group-containing components and carboxyl groups are disclosed. Each compound is a monester of a cyclic dicarboxylic acid anhydride and a 2-hydroxyalkylpolyester, said 2-hydroxyalkylpolyester being the ester of a polyepoxide with a monoester which is the monoester of a poly(ethylenically-unsaturated)alkanol and a dicarboxylic acid. These compounds and oligomers are useful in the field of graphic arts and protective coatings.

Abstract: An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

Abstract: Vinyl ester resins of substituted epoxidized hydroxystyrylaza compounds are disclosed. These vinyl esters may be combined with various reactive monomers, prepolymers or polymers and cured to give a combination of high mechanical strength and glass transition temperature.

Abstract: A photocurable composition comprising (1) an epoxy compound having at least one epoxy group and at least one unsaturated double bond in the same molecule; (2) a metal compound present in an amount ranging from 0.001 to 10 wt. %, based on the epoxy compound; and (3) a silicon compound which is capable of forming a silanol group when irradiated with light and which is present in an amount ranging from 0.1 to 20 wt. %, based on the epoxy compound, is characterized by a particularly rapid curing rate.

Abstract: Disclosed are photocurable compositions which comprise(A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule;(B) an organometallic compound and(C) a silicon compound capable of generating silanol group by irradiation of light, or comprise(A) a compound having at least one epoxy group and at least one photocurable unsaturated ethylenic double bond within the same molecule;(E) an epoxy compound;(F) an organic phosphorus compound; and(G) a photosensitizer.The compositions of the present invention have excellent film characteristics such as good adhesion property, light resistance, heat resistance and weathering resistance.

Abstract: Dispersions of polymers and optional dispersion stabilizers in a polyepoxide resin continuous phase is characterized in that the dispersion remains stable above 60.degree. C. The compositions are curable and are useful as coatings, in preparing laminates and reinforced plastics, and as adhesives. The compositions exhibit properties which are superior to compositions containing reactive liquid polymers.

Abstract: A printable dielectric composition comprising finely divided particles of talc and/or mica dispersed in a curable liquid composition containing acrylated rubber modified epoxy resin oligomer, acrylated polydiene oligomer and alkyl acrylate.

Abstract: Disclosed is a process for the preparation of a three dimensionally crosslinkable film-forming resin composition which process comprises irradiating an electron beam in an irradiation dose of from 0.1 to 40 Mrad onto a mixture of a film-forming resin with an alkoxysilane compound having a polymerizable unsaturated group for radical polymerization therebetween.

Abstract: Linear fluorooligomers having at least two reactive end groups per polymer molecule are incorporated into radiation sensitive polymer systems which have improved continuous temperature resistance and low dielectric constant. The polymer systems can be applied as lacquers. Preferably perfluorated poly-ethers and perfluorated alkanes are used as starting compounds. The polymeric product is usable as a coating for the production of printed multi-layer wirings and economises on through-bores and additional copper intermeidate layers. A further field of application exists in the field of integrated semiconductor ciruits in VLSI-technology for the production of negative photo-resists.

Abstract: Polymer modified vinyl ester resin compositions are disclosed which comprise (I) a polymer modified epoxy resin which comprises (A) an epoxy resin wherein a portion of the epoxide groups have been reacted to provide groups containing polymerizable ethylenic unsaturation; (B) at least one vinyl terminated urethane oligomer and optionally (C) at least one polymerizable ethylenically unsaturated compound and (II) a monounsaturated monocarboxylic acid or mixture of such acids.

Abstract: Dispersions of polymers and optional dispersion stabilizers in a polyepoxide resin continuous phase is characterized in that the dispersion remains stable above 60.degree. C. The compositions are curable and are useful as coatings, in preparing laminates and reinforced plastics, and as adhesives. The compositions exhibit properties which are superior to compositions containing reactive liquid polymers.

Abstract: A resin composition is suitable to seal an electronic device, when cured, and comprises:(a) an unsaturated alicyclic epoxy ester compound obtained by reacting an alicyclic epoxy compound having at least two epoxy groups in the molecule with 0.5 to 1.1 equivalent, per equivalent of the epoxy group, of acrylic or methacrylic acid,(b) a polymerizable vinyl monomer, and(c) a photopolymerization initiator.

Abstract: This invention relates to the addition of lithium bromide to a polymeric material to reduce the viscosity of the polymeric material. This invention finds particular use in the reduction of the viscosity of radiation curable compositions, such as polyacrylates.

Abstract: The invention relates to acrylic telomers with grafts which can be cross linked by light, methods of synthesizing them and their applications. The telomers comprise a telogen of the mercaptan family, in particular dodecanethiol, and links of a taxogen of the acrylic family, some of which are grafted. The telomers are synthesized semi-continuously by radical initiation in the presence of initiators such as azobisisobutyronitrile, at a temperature below 75.degree. C., making it possible to obtain a number of links adapted to the desired applications. Grafting is carried out by means of glycidyl and aziridinyl groups.

Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

Abstract: Polymer modified epoxy resin compositions are disclosed which comprise (A) an epoxy resin wherein a portion of the epoxide groups have been reacted to provide groups containing polymerizable ethylenic unsaturation; (B) at least one vinyl terminated urethane oligomer and optionally (C) at least one polymerizable ethylenically unsaturated compound. These compositions are useful as intermediates to novel polymer modified vinyl esters and thermoset (cured) products.

Abstract: Production of a reaction mixture comprising the multifunctional acrylates, methacrylates or halogenated derivatives thereof of oxyalkylated allyl alcohol characterized as being free of odor typical of allyl compounds, not lachrimatory and substantially reduced skin irritation as compared with acrylates and methacrylates of allyl alcohol. The acrylate and methacrylate compositions of the invention are useful as radiation-crosslinkable diluents for radiation-hardenable compositions (binders).

Abstract: Coating compositions are made from a blend of an acrylic or methacrylic ester of an aliphatic polyol and an acrylic or methacrylic ester of a polyglycidyl ether of a bisphenol A-formaldehyde condensate. Such coating compositions, when cured by radiation, are useful as abrasion resistant coatings for plastics.

Abstract: Epoxide-vinyl ester resins having significant amounts of epoxide and ethylenically unsaturated groups may be thickened by reaction thereof with polyfunctional amines. The resulting resinous products, when molded at elevated temperatures, exhibit increased viscosity and controlled flow.

Abstract: Vinyl ester resins are prepared by reacting a polymerizable unsaturated carboxylic acid-containing compound with an epoxy resin prepared by dehydrohalogenating the reaction product of an epihalohydrin with the reaction product of an aromatic hydroxyl-containing compound and an unsaturated hydrocarbon.

Abstract: A composition is described which thermosets when admixed with a free radical generating catalyst which composition comprises (A) an unsaturated polyester resin or vinyl ester resin, (B) a reactive monomer prepared by reacting (1) an aromatic material containing, per molecule, one polymerizable ethylenically unsaturated group and one group containing an ether linked epoxide group; and (2) a material containing at least one oxyalkylene group and is terminated in a group having at least one hydrogen atom which is reactive with an ether linked epoxide group, and (C) a polymerizable ethylenically unsaturated non-resinous monomer different from Component (B).

Abstract: This invention discloses a creep resistant thermoset molding composition which is of particular value as a material from which wheels can be made. The creep resistant molding composition of this invention is comprised of a mixture of a vinyl ester resin and a dicyclopentadiene polyester resin.

Abstract: A light- and thermosetting resin composition comprising (a) an unsaturated epoxy ester having a resin acid value of 5 or less, or a reaction product having a resin acid value of 5 or less obtained by reacting an unsaturated epoxy ester having a resin acid value of more than 5 with a monoepoxide, (b) one or more .alpha.,.beta.-unsaturated ethylenic monomers, and (c) one or more photosensitizers and peroxides can produce insulated electrical machinery and appliances improved in reliance and performance in a short treating time.

Abstract: A cathode-precipitating electrodeposition coating composition consisting essentially of (A) 100 parts of a high-molecular-weight compound having a molecular weight of 500 to 10,000 and containing an amino group and a carbon-carbon double bond, (B) 3 to 200 parts by weight of a reaction product obtained by reacting an unsaturated carboxylic acid having 3 or 4 carbon atoms with the terminal glycidyl group of a glycidyl compound obtained by reacting a bisphenol with epichlorohydrin, and (C) 0.2 to 20 parts by weight of an oil-soluble manganese salt of a monoester of a 1,2-dicarboxylic acid or a manganese salt of sulfonated or maleinized polybutadiene having a molecular weight of 300 to 3,000.

Abstract: A reinforced plastic molding having excellent heat resistance, toughness and adhesion property to a fibrous substrate is disclosed, comprising a fibrous substrate having impregnated and cured therein a curable composition comprising tri(meth)acrylate of trishydroxyalkyl isocyanurate, a modified phenol novolak-based epoxy resin and a polymerization initiator.

Abstract: New compositions of matter are disclosed which are allylated di and polycyclopentadiene diphenols. These new compositions are useful in thermoset resin compositions comprising styrene, a dicyclopentadiene-modified unsaturated polyesteramide and said allylated di and polycyclopentadiene diphenol(s).

Abstract: High solids thermosetting organic solvent solution coating compositions are disclosed which are particularly useful for sealing the pores in fiber reinforced plastics. These compositions contain a mixture of resins comprising (1) from 30% to 70% of one or more hydroxy functional resins having a number average molecular weight of at least about 700, a Gardner bubble viscosity less than about Z.sub.4 measured in methyl ethyl ketone at 90% solids at 25.degree. C., and at least 5% of the hydroxy groups thereof being primary hydroxy groups, (2) from 10% to 70% of low molecular weight epoxy ester made by esterifying one or more resinous polyepoxides having a 1,2-epoxy equivalency of at least 1.2 with an approximately stoichiometric proportion of monocarboxylic fatty acid to provide an essentially epoxy-free ester having a Gardner bubble viscosity less than Z.sub.4 at 75% solids in xylol at 25.degree. C.

Abstract: A silicone sealant composition comprising(A) 100 parts by weight of a silanol terminated polydiorganosiloxane having a viscosity of 100 to 200,000 cSt at 25.degree. C.,(B) 0.1 to 30 parts by weight of an aminoxy group-containing organosilicon compound containing, on the average, more than two organoaminoxy groups per molecule,(C) 5 to 300 parts by weight of an inorganic filler, and(D) 1 to 30 parts by weight of an ultraviolet-curable oligomer containing acryl groups.

Abstract: Disclosed is a UV-curable coating composition and method of preparing it, a method of coating a conductor with it, and the resulting coated conductor. The composition comprises about 20 to about 40% by weight of an acrylated epoxy which is the reaction product of an epoxy resin and an acrylate adduct. The acrylate adduct is the reaction product of an acrylate which may be either 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate or mixture thereof, and either an anhydride or a diisocyanate. The anhydride may be phthalic anhydride, maleic anhydride, trimellitic anhydride, or mixtures thereof. The diisocyanate can be toluene diisocyanate, 4,4'-diisocyanato diphenyl methane, or mixtures thereof. The composition also includes about 4 to about 15% by weight of an acrylated blocked isocyanate which is the reaction product of caprolactam and an acrylated isocyanate.

Abstract: Radiation-curable coating compositions adapted for application to buffer-coated optical fibers are disclosed. These are intended to apply an adherent topcoat having greater toughness and greater hardness than the buffer coating. The new compositions comprise: (1) from 25% to 70% of diethylenic-terminated polyurethane, which may include urea linkages, the polyurethane being based on a diisocyanate having an average molecular weight of from 400 to 5000; (2) from 5% to 40% of a diethylenically unsaturated ester of a diglycidyl ether of a bisphenol, said ether having a molecular weight up to about 1000; and (3) from 5% to 30% of liquid radiation-curable monoethylenically unsaturated monomer having a T.sub.g above about 55.degree. C., especially N-vinyl pyrrolidone. Ultraviolet cures using acrylates as the ethylenic group are preferred.

Abstract: The compositions disclosed herein comprise a mixture of:(1) An unsaturated polyester resin; such as the polymeric ester of maleic acid or anhydride and a glycol such as ethylene glycol; and(2) The reaction product of a polyepoxy compound, such as the diglycidyl ether of bisphenol-A, and an unsaturated monocarboxylic acid, such as acrylic or methacrylic acid, in which reaction product there remains unreacted at the time of mixing with said polyester resin at least 5 percent of the original epoxy groups of said polyepoxy compound.This mixture when molded or cured gives improvement with respect to thermal and humid aging as compared to similar compositions in which the epoxy groups of said reaction product are substantially all reacted prior to mixture with said unsaturated polyester resin. The flexural strength, in particular, of the compositions are better retained on aging without adverse effect on other properties.

Abstract: A resin composition comprising (A) a polymer having, in the molecule, at least two groups represented by the following structural formula (I): ##STR1## wherein R.sub.1 is isopropyl, sec-butyl, tert-butyl, a C.sub.5-20 alkyl group, a C.sub.3-20 cycloalkyl group, a C.sub.5-20 alkenyl group, a C.sub.3-20 hydroxyalkyl group, a C.sub.5-20 alkoxyalkyl group, a C.sub.3-20 aminoalkyl group, a C.sub.6-20 aryl group or a C.sub.6-20 arylalkyl group, and n is 0, 1 or 2, and (B) a polymer having an electron attractive group and an .alpha.,.beta.-ethylenic double bond adjacent thereto. Though said composition is stable at room temperature, it is crosslinked and cured at high temperatures because the amino group of the polymer (A) adds to the double bond of the polymer (B). Accordingly, said resin composition is suitable for use as a cathodic electrocoating material.

Abstract: Polymerizable compositions comprise(a) a compound containing both(i) at least one acryloyloxy or methacryloyloxy group,(ii) at least one allyl, methallyl, or 1-propenyl group attached directly to a carbon atom which forms part of an aromatic nucleus or to an oxygen atom or an oxycarbonyl group which are in turn directly attached to such a carbon atom,the total of the said groups (i) and (ii) being at least three, and(b) a compound containing at least two mercaptan groups directly attached to aliphatic carbon atoms, in a proportion as to supply at least 0.8 such mercaptan group per allyl, methallyl or 1-propenyl group in (a) but less than 1.0 such mercaptan group in (a) per acryloyl, methacryloyl, allyl, methallyl, or 1-propenyl group.

Abstract: Radiation curable monomers useful in coating compositions are prepared by reacting part of the epoxy groups of a polyepoxide resin with acrylic or methacrylic acid followed by esterifying the remaining epoxy groups with phosphoric acid.

Abstract: Sulfonium-stabilized, water-compatible, radiation-curable vinyl ester resins are prepared by the process of reacting an epoxy resin having on the average at least one vicinal epoxy group with a mercaptan and with an unsaturated monocarboxylic acid to form vinyl ester resins containing sulfide moieties which are then reacted with a protonic acid and an alkylene oxide.Compounds so prepared can be diluted with water and used as coatings.

Abstract: A polymerizable mixture for adhesive bonding is disclosed. The polymerizable mixture comprises a polymerizable acrylic-based material, a polymerizable epoxide-based material and a bifunctional molecular material reactable with said acrylic-based material and said epoxide-based material.