Abstract: The disclosure relates to a process that includes blending a polyimide resin and a primary alky amine organic compound to produce an aryl amine functionalized polyimide, having aryl amine functionality in excess of any anhydride functionality. The polyimide resin can have a weight average molecular weight (Mw) from 5,000 to 100,000 daltons. The organic compound can include at least one primary aliphatic amine without a direct linkage of a nitrogen to an aryl group and without a functionality selected from a halogen functionality, a hydroxyl functionality, a sulfonic acid functionality, a sulfonic acid salt functionality, and combinations thereof. The disclosure also relates to alkyl imide functionalized polyimides also with aryl amine functionalized polyimides, having aryl amine functionality in excess of any anhydride functionality and articles produced therefrom.
Type:
Grant
Filed:
October 31, 2011
Date of Patent:
May 13, 2014
Assignee:
Sabic Innovative Plastics IP B.V.
Inventors:
Robert R. Gallucci, Roy Odle, Daniel F. Lowery, Richard Peters
Abstract: The present invention relates to an optical fiber (1) comprising an optical core (2) for guiding the majority of the lightwaves transmitted by the fiber, and surrounded by optical cladding (3), itself surrounded by a protective covering (4) of a plastics material, characterized in that the plastics material (4) is a reversibly cross-linked material.
Abstract: A heat resistant polymer composition, an alignment layer formed using the same, and an LCD having the alignment layer are provided. The heat resistant polymer composition includes 10-25% by weight of a polyimide resin or polyamic acid, 0.1-1% by weight of an adhesive agent, and balance of a solvent. The adhesive agent improves thermal stability. Thus, the LCD having the alignment layer formed using the same can accomplish a desirable pre-tilt angle of liquid crystals and desirable alignment properties of liquid crystal molecules.
Abstract: A heat resistant composition comprising a mixture of (a) a polyurethane or a modified polyurethane and (b) a bismaleimide oligomer, in which the bismaleimide oligomer is in an amount of about 1 to 35 percent by weight based on overall solid contents. The polyurethane is formed by reacting a diisocyanate-containing compound with a dihydroxy diol-compound. Then the polyurethane is reacted with a trimellitic anhydride, a diacid or a mixture thereof to form the modified polyurethane. The bismaleimide oligomer is formed by reacting a bismaleimide resin with a barbituric acid or a derivative thereof.
Type:
Grant
Filed:
July 9, 1993
Date of Patent:
February 11, 1997
Assignee:
Industrial Technology Research Institute
Inventors:
Sheng-Yaw Hsu, Tzong-Ming Lee, Jing-Pin Pan
Abstract: A polymer composition especially suitable for producing fiber-reinforced structures having advantageous fracture toughness comprises a polyarylsulphone component and a thermoset resin component, each of which components is present at least partly as a phase continuous in at least one dimension. Preferred polyarylsulphones contain repeating units (PhSO.sub.2 Ph).sub.n and (Ph).sub.a linked through ether and/or thioether, where Ph is phenylene, n=1 to 2 and a=1 to 3; and such polyarylsulphones having amino end groups are provided as new compounds. The compositions can be made by spinodal decomposition of a mixture of the polyarylsulphone and a thermoset resin precursor.
Type:
Grant
Filed:
March 8, 1993
Date of Patent:
July 18, 1995
Assignee:
Imperial Chemical Industries PLC
Inventors:
Patrick T. McGrail, Mark S. Sefton, Judith A. Peacock, Gregory R. Almen, Steven P. Wilkinson
Abstract: Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.
Abstract: Nylon molding powders are prepared by melt blending a nylon with a minor amount of a heat reactive polyimide resin. The mixture is cooled and ground and mixed with the desired filler. The heat reactive polyimide increases the melt viscosity of the nylon during subsequent melt forming of shapes so that the filler particles are not wet out or their interstices filled leaving them as discrete clusters of filler material held in pockets in the nylon/polyimide matrix. By these means, the filler material is more effective in contributing desired properties to a molded article.