Reaction Product Of A Polyhydric Phenol And Epichlorohydrin Or Diepoxide, Having A Molecular Weight Of Over 5,000 (e.g., Phenoxy Resins) Patents (Class 525/930)
  • Patent number: 8835012
    Abstract: A coating composition for a food or beverage can that includes an emulsion polymerized latex polymer formed by combining an ethylenically unsaturated monomer component with an aqueous dispersion of a water-dispersible polymer.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: September 16, 2014
    Assignee: Valspar Sourcing, Inc.
    Inventors: Robert M. O'Brien, Daniel E. Rardon, Rachael Ann Spynda, George K. Bartley, Richard H. Evans
  • Patent number: 8092876
    Abstract: A coating composition for a food or beverage can that includes an emulsion polymerized latex polymer formed by combining an ethylenically unsaturated monomer component with an aqueous dispersion of a water-dispersible polymer.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: January 10, 2012
    Assignee: Valspar Sourcing, Inc.
    Inventors: Robert M. O'Brien, Daniel E. Rardon, Rachael Ann Spynda, George K. Bartley, III, Richard H. Evans, T. Howard Killilea, Carl Cavallin
  • Patent number: 6887951
    Abstract: The present printing process provides a multilayer coating system comprising a low viscosity, latent, heat-curable thermoplastic adhesive layer, colored ink interlayer, and an abrasion-resistant top lacquer layer that can be utilized for production of heat transferable labels suitable for labeling bottles and other containers that are subjected for over ten cycles to immersion in heated aqueous sodium hydroxide solution for cleaning prior to re-use.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: May 3, 2005
    Assignee: Gotham Ink Corporation
    Inventors: Mukund R. Patel, Robert E. Lafler
  • Patent number: 6762251
    Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: July 13, 2004
    Assignee: Tohto Kasei Co., Ltd.
    Inventors: Masao Gunji, Chiaki Asano, Hiroshi Sato
  • Patent number: 6620907
    Abstract: The present invention provides a process for eliminating contaminants from epihalohydrin-derived epoxy resins. Another embodiment of the present invention is an epoxy product formed using said process. Yet another embodiment of the present invention is an epoxy derived in part from epihalohydrin wherein said epoxy is has a hydrolyzable halogen content of less than 10 ppm and an epoxide equivalent weight within 2 percent of the theoretical epoxide equivalent weight.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: September 16, 2003
    Assignee: 3M Innovative Properties Company
    Inventor: Roger A. Mader
  • Patent number: 6451878
    Abstract: A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.
    Type: Grant
    Filed: November 2, 2000
    Date of Patent: September 17, 2002
    Assignee: Resolution Performance Products, LLC
    Inventors: Takao Fukuzawa, Takayoshi Hirai, Tetsuro Imura, Yoshinobu Ohnuma
  • Patent number: 6107419
    Abstract: Present invention relates to a process for preparing a high molecular weight epoxy resin which has a weight average molecular weight value more than 40,000 and an epoxy equivalent weight less than 10,000 g/eq. This high molecular weight epoxy is prepared by a reaction of a divalent epoxy resin with a bisphenol compound in the presence of a catalyst and a solvent characterized in utilizing 1.10 to 1.03/1 of molar ratio of epoxy group/phenolic hydroxyl group.
    Type: Grant
    Filed: December 10, 1997
    Date of Patent: August 22, 2000
    Assignee: Shell Oil Company
    Inventors: Yoshikazu Kobayashi, Takaya Shinmura, Yojiro Yamamoto
  • Patent number: 5976699
    Abstract: An insulating adhesive for a multilayer printed circuit board, which is to be laminated to an internal layer circuit board coated with an undercoating agent comprising an epoxy resin and a curing agent therefor, and which comprises as essential components:(a) a bisphenol type epoxy resin or phenoxy resin having a weight average molecular weight of at least 10,000,(b) a bisphenol type epoxy resin having an epoxy equivalent of not more than 500, and(c) an epoxy resin curing agent, said insulating adhesive being excellent in storage stability in the form of a varnish or as coated on a copper foil, and when coated on an internal layer circuit board coated with an undercoating agent, being able to be well integrally cured with the undercoating agent.
    Type: Grant
    Filed: October 10, 1996
    Date of Patent: November 2, 1999
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui
  • Patent number: 5965269
    Abstract: An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.
    Type: Grant
    Filed: October 3, 1997
    Date of Patent: October 12, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Teiichi Inada, Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro
  • Patent number: 5767175
    Abstract: An aqueous coating composition comprising an acrylic resin-modified epoxy resin (D), which is obtained by the reaction between a mixture of a bisphenol F based epoxy resin (A) and a bisphenol F based phenoxy resin (B) and an acrylic resin having carboxyl functionality (C), said acrylic resin-modified epoxy resin (D) being dispersed into water, preferably by using ammonia or amine, provides a composition with low viscosity, excellent storage stability and excellent application workability. In addition, the coating of the present invention can be applied to an interior surface and the resulting film has a smooth surface, excellent processability, excellent retorting resistant properties, excellent adhesion properties, and excellent corrosion resistant properties.
    Type: Grant
    Filed: February 1, 1996
    Date of Patent: June 16, 1998
    Assignee: Kansai Paint Company, Ltd.
    Inventors: Yasuo Kamekura, Tomokuni Ihara, Kaoru Morita
  • Patent number: 5574079
    Abstract: The present invention relates to water-borne thermoplastic polyhydroxyether resins having narrow polydispersity (M.sub.w /M.sub.n <4.0 and M.sub.n >7,000 <12,000), and the use of such resins in water-borne coating compositions.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: November 12, 1996
    Assignee: Union Carbide Chemicals & Plastics Technology Corporation
    Inventors: Robert F. Eaton, Robert N. Johnson
  • Patent number: 5278259
    Abstract: An epoxy resin composition comprising:(A) as a resin chief material a bisphenol A type epoxy resin having the following formula (1), ##STR1## wherein n is 0 to 10, R.sup.1 and R.sup.2 each represents a glycidyl group, and A.sup.1 to A.sup.8 each represents a hydrogen atom or a bromine atom;(B) as an epoxy resin curing agent,(b1) a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), or(b2) a novolac resin of a bisphenol A or a brominated product thereof that is obtained by linking two or more molecules of a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), through a methylene group(s) at any of A.sup.1 to A.sup.
    Type: Grant
    Filed: April 12, 1991
    Date of Patent: January 11, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Michio Futakuchi, Hiroyuki Nakajima, Takashi Takahama
  • Patent number: 5241020
    Abstract: Novel blends of polymers are produced by polymerizing interreactive compounds that form polymers in a non-free radical polymerization, and at least one monomer possessing carbon-to-carbon double bonds capable of polymerization by means of a free radical mechanism, in the presence of reactive initiators. In a preferred mode, a reaction mixture is formed comprising the interactive compounds, the monomers, and the reactive initiators. The interactive compounds are reacted in a initial step to form a first polymer connected to the reactive initiator. In a subsequent reaction, free radicals derived from the reactive initiator promote polymerization of the monomers to form a second polymer. The first polymer forms the continuous phase of the blend, while the second polymer comprises the discontinuous phase.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: August 31, 1993
    Inventor: Max Roha
  • Patent number: 5219957
    Abstract: Vehicles, which are water dilutable after neutralization with bases, have an acid number of 5 to 60 and are obtainable by polymerization or copolymerization of 10 to 90 parts by weight of one or several acidic, phosphoric acid-functional unsaturated monomers, which are polymerizable by a free radical mechanism and can be present in admixture with one or several ethylenically unsaturated monomers, which are also polymerizable by a free radical mechanism, with addition of a free radical initiator, in the presence of 90 to 10 parts by weight of one or several epoxide resins or modified epoxide resins, in one or several solvents. Methods of synthesizing them, aqueous coating materials containing them and their use.
    Type: Grant
    Filed: June 14, 1991
    Date of Patent: June 15, 1993
    Assignee: Herberts Gesellschaft mit beschrankter Haftung
    Inventors: Hans-Peter Patzschke, Joachim Blum, Gerhard Friederichs, Wolfgang Bogdan, deceased
  • Patent number: 5112887
    Abstract: A coating composition capable of substantial deformation without loss of continuity, adhesion or protective properties. The coating composition comprises a phenoxy resin mixed with a relatively soft modifier resin having certain specific properties. In a preferred embodiment, a particulate material, such as a zinc pigment, may also be included. A crosslinker may also be included.
    Type: Grant
    Filed: August 8, 1991
    Date of Patent: May 12, 1992
    Assignee: Union Carbide Chemicals & Plastics Technology Corporation
    Inventors: Ismael Colon, Charles N. Merriam, Philip F. Wolf
  • Patent number: 5093424
    Abstract: Disclosed is a coating composition for metal coating, said coating composition containing (A) at least one of an epoxidized polybutadiene resin and an epoxy group-containing polyhydric phenol-modified epoxidized polybutadiene resin, and (B) at least one of a capped epoxy resin and a methylol group-containing capped epoxy resin.
    Type: Grant
    Filed: August 6, 1990
    Date of Patent: March 3, 1992
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Kaoru Morita, Atsushi Shioda, Kazumi Fukudome, Naruhito Ueno
  • Patent number: 5053307
    Abstract: Process for the preparation of toner particles for electrostatic liquid developers, which upon fusing to paper have a gloss .gtoreq.10 units over the paper gloss comprising:(A) dispersing at least one thermoplastic resin, at least one pigment, and a hydrocarbon liquid having a Kauri-butanol value of greater than 120 such that the dispersion contains 10% or more by weight solids by means of particulate media whereby the moving particulate media creates shear and/or impact while maintaining the temperature for 5 to 180 minutes in the vessel at a temperature of at least 15.degree. C. above the point at which the resin is plasticized or liquified by the hydrocarbon liquid and below that at which the hydrocarbon liquid boils and the resin and/or pigment decomposes,(B) continuing dispersion of the resin, pigment and hydrocarbon liquid as in Step (A) while maintaining the temperature for 5 to 180 minutes in the vessel at least 5.degree. C. below the point to at least 10.degree. C.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: October 1, 1991
    Assignee: DXImaging
    Inventors: William A. Houle, Gregg A. Lane, Carolyn C. Legere-Krongauz
  • Patent number: 5006575
    Abstract: A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: April 9, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Man-Sheung Chan
  • Patent number: 4954553
    Abstract: Waterborne, neutralized, carboxyl-bearing phenoxy resin with which is blended a relatively soft, neutral, non-carboxyl-bearing modifier resin. A coalescing solvent is preferably included in the aqueous blend.
    Type: Grant
    Filed: September 30, 1988
    Date of Patent: September 4, 1990
    Assignee: Union Carbide Chemicals and Plastics Company Inc.
    Inventors: Robert N. Johnson, Ismael Colon
  • Patent number: 4861693
    Abstract: This invention relates to carriers for electrophotography comprising a binder component including a binder resin, a polymeric-magnetic coordination complex, and an inorganic magnetic material dispersed in the binder component at the ratio of 100-900 parts by weight to 100 parts by weight of the binder component, which effect the electrical resistance as well as magnetic properties. Carriers of the invention are suitable, in particular, for a copier furnished with a high rotation developing sleeve.
    Type: Grant
    Filed: February 19, 1988
    Date of Patent: August 29, 1989
    Assignee: Minolta Camera Kabushiki Kaisha
    Inventors: Junji Ohtani, Junji Machida, Eiichi Sano, Fumio Masuda
  • Patent number: 4839444
    Abstract: The invention discloses a high solids wire enamel having a surprisingly low viscosity. The enamel comprises a mixture of high molecular weight and low molecular weight linear hydroxy polyethers, a phenolic resin, an isocyanate and possibly a melamine. The resulting enamel has excellent flexibility and resistance to crazing.
    Type: Grant
    Filed: February 23, 1988
    Date of Patent: June 13, 1989
    Assignee: Essex Group, Inc.
    Inventor: Francois A. Lavallee
  • Patent number: 4835240
    Abstract: An epoxy resin composition comprising a trifunctional epoxy resin derived from a trisphenol having the structure represented by the following general formula ##STR1## wherein R represents a hydrogen atom, an alkyl group or a halogen atom, and a novolak-type phenolic resin. This epoxy resin composition gives a cured product having excellent pliability and a high glass transition temperature. It is especially useful as a semiconductor encapsulating material.
    Type: Grant
    Filed: May 31, 1988
    Date of Patent: May 30, 1989
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Eiki Togashi, Toshimasa Takata
  • Patent number: 4798855
    Abstract: Thermoplastic molding materials contain, as essential components,(A) from 2 to 97.9% by weight of a nylon,(B) from 2 to 97.9% by weight of a polyaryl ether sulfone(C) from 0.1 to 30% by weight of a polymeric component having hydroxyl groupsand in addition(D) from 0 to 50% by weight of a rubber impact modifier and(E) from 0 to 60% by weight of reinforcing fillers.
    Type: Grant
    Filed: May 13, 1987
    Date of Patent: January 17, 1989
    Assignee: BASF Aktiengesellschaft
    Inventors: Dietrich Lausberg, Gerd Blinne, Peter Ittemann, Gerhard Heinz, Erhard Seiler, Manfred Knoll
  • Patent number: 4769399
    Abstract: An adhesive composition which is particularly suitable for use as a die-attach adhesive. The adhesive composition comprises the reaction product of an admixture of an effective amount of a phenoxy resin, at least one epoxy resin and a fluorene curative.
    Type: Grant
    Filed: March 12, 1987
    Date of Patent: September 6, 1988
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: James L. Schenz
  • Patent number: 4721759
    Abstract: A resin composition with which to coat a steel structure used as a reinforcement, in a lightweight foam concrete produced under the condition of high temperature, high pressure and high alkalinity. The resin composition with which to coat a steel structure comprises a phenoxy resin and a hardening agent having a blocked isocyanate group.
    Type: Grant
    Filed: January 23, 1987
    Date of Patent: January 26, 1988
    Assignee: Nippon Oil and Fats Co., Ltd.
    Inventor: Takeyuki Tanaka
  • Patent number: 4719269
    Abstract: A novel epoxy resin composition is comprised of a mixture of a cyclic epoxide type epoxy resin having an epoxy equivalent of 200 or below and a phenoxy resin having a molecular weight of approximately 30,000, a curing agent, and an inorganic filler. This resin composition is useful in the fabrication of cast insulators to be employed in electric machines.
    Type: Grant
    Filed: April 24, 1986
    Date of Patent: January 12, 1988
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshiharu Ando, Kazuo Yasuda, Yoshifumi Itabashi, Masaru Tsuchihashi
  • Patent number: 4690957
    Abstract: A resin composition of excellent ultra-violet ray curing property and remarkably improved adhesive force to a base material to form a cured coating film, the resin composition being composed of cationically polymerizable compound, photo-initiator, phenoxy resin, and polyhydric alcohol.
    Type: Grant
    Filed: February 27, 1986
    Date of Patent: September 1, 1987
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hirofumi Fujioka, Masami Inoue
  • Patent number: 4680348
    Abstract: The present invention relates to an epoxy-based heat-curing type primer coating composition which is specifically excellent in corrosion resistance and other physical properties. The invention is characterized by using a heat curing type epoxy resin which has incorporated into the resin or admixed therewith a resorcin structure or an epoxy resin having a strong acid so as to give a particular resinous acid value or an epoxy resin amphoterized with alkyleneimine compound.
    Type: Grant
    Filed: October 16, 1984
    Date of Patent: July 14, 1987
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Haruhiko Satoh, Hisaki Tanabe, Hirotoshi Umemoto
  • Patent number: 4638038
    Abstract: Phenoxy resins are acid-grafted by reaction of secondary hydroxyls with monoanhydrides of di- or polycarboxylic acids. The grafted resins have improved adhesion to smooth surfaces, can be readily emulsified, and are also useful in coatings for magnetic recording media.
    Type: Grant
    Filed: April 22, 1985
    Date of Patent: January 20, 1987
    Assignee: Union Carbide Corporation
    Inventor: George A. Salensky
  • Patent number: 4629760
    Abstract: A composition comprisinga. a major amount of an aromatic polycarbonate;b. a minor quantity of a polyester selected from polyalkylene terephthalate and polycycloalkylene terephthalate, isophthalate or a mixture of the two acids;c. a minor quantity of an elastomeric acrylate copolymer with a second order transition temperature, Tg, of less than -10.degree. C. and phenoxy resin effective to significantly maintain the impact strength and ductility at break after exposing a stressed part to brake fluid comprising alcohols and ethers.
    Type: Grant
    Filed: November 1, 1985
    Date of Patent: December 16, 1986
    Assignee: General Electric Company
    Inventors: Ping Y. Liu, Harold F. Giles, Jr.
  • Patent number: 4607079
    Abstract: A composition comprising a major amount of an aromatic polycarbonate and quantities of both an acrylate elastomeric copolymer with a second order transition temperature, Tg, of less than -10.degree. C. and a phenoxy resin effective to substantially maintain the impact strength and ductility at break after exposing a stressed part to brake fluid comprising alcohols and ethers.
    Type: Grant
    Filed: June 24, 1985
    Date of Patent: August 19, 1986
    Assignee: General Electric Company
    Inventors: Harold F. Giles, Jr., Ping Y. Liu
  • Patent number: 4605708
    Abstract: A method for preparing flame retardant thermoplastic nylon compositions comprising incorporating into the thermoplastic nylon a halogenated bisphenol-A epoxy resin having a halogen content of at least 20% and a molecular weight above 8,000 in an amount sufficient to impart flame retardance.
    Type: Grant
    Filed: September 11, 1985
    Date of Patent: August 12, 1986
    Assignee: Makteshim Chemical Works Ltd.
    Inventors: Yoav-Bar Yaacov, Ram Minke
  • Patent number: 4603180
    Abstract: A thermosetting resin composition, consists essentially of:(a) 100 parts by weight of a mixture of liquid acid anhydride and an imide ring-containing epoxy compound obtained from reaction of an epoxy compound having in one molecule thereof at least two epoxy groups and either one or both of imide ring-containing dicarboxylic acid compounds represented by the following general formulae (I) and (II): ##STR1## (where: R.sub.1 is a divalent organic radical) ##STR2## (where: R.sub.2 is a divalent organic radical): (b) 5 to 200 parts by weight of a tri-functional vinyl monomer; and(c) 0.1 to 10 parts by weight of phenoxy resin.
    Type: Grant
    Filed: June 18, 1985
    Date of Patent: July 29, 1986
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroyuki Nakajima, Fumiyuki Miyamoto, Masakazu Murayama, Seiji Oka, Eiki Jidai
  • Patent number: 4559247
    Abstract: Coating compositions based on a binder which is the reaction product of lactone grafted onto hydroxy substituted polyphenylether possess improved properties useful for deformable substrates.
    Type: Grant
    Filed: September 20, 1983
    Date of Patent: December 17, 1985
    Assignee: Union Carbide Corporation
    Inventors: Peter W. Kopf, Charles N. Merriam
  • Patent number: 4544692
    Abstract: Fast curing resin coating compositions for coating metal surfaces and a one-step method are described. The coatings comprise a high molecular weight epoxy resin, although a portion thereof may be low molecular weight, an effective amount of a cross-linking agent for the epoxy resin, a polysiloxane resin system, an effective amount of a curing agent for the polysiloxane fluid system, a fluorocarbon polymer, and the balance being suitable solvents. The coatings are applied in one-step and dry in less than one minute and may be formed into various shapes and forms useful for stovetop cookware.
    Type: Grant
    Filed: August 29, 1983
    Date of Patent: October 1, 1985
    Assignee: Material Sciences Corporation
    Inventor: Edmund J. Kuziemka
  • Patent number: 4542064
    Abstract: The self-bonding enameled wire has an electric insulation layer coated thereon and a bonding layer coated over the insulation layer. The bonding layer is prepared with a mixture including: (a) 100 parts by weight of a phenoxy resin and/or an epoxy resin, both the resins containing not larger than 5 ppm of sodium chloride and having a limiting viscosity of not less than 0.440 as measured in tetrahydrofuran solvent at 25.degree. C.; and (b) 20 to 100 weight parts of a n-butylated melamine resin. In place of this n-butylated melamine resin, there is, according to another aspect of the present invention, used 20 to 50 parts by weight of a mixture of a stabilized polyisocyanate and one of a n-butylated melamine resin and a benzoguanamine resin is used. These self-bonding enameled wire are excellent in refrigerant resistance and may be suitably used for windings of a stator coil in hermetic compressor motors.
    Type: Grant
    Filed: February 23, 1984
    Date of Patent: September 17, 1985
    Assignees: Fujikura Ltd., Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Sueji Chabata, Keiji Nakano, Kichizo Ito, Katsuhiko Ueda, Hirokazu Iizuka, Hisao Miyako, Katsumi Fukagawa
  • Patent number: 4542191
    Abstract: Tackifying agents for rubber comprising at least one chemically or physically treated guayule resin fraction are disclosed. Physical treatments include vacuum deoiling, steam stripping deoiling, hexane deoiling, while chemical treatments include formaldehyde reaction, phenol/formaldehyde reaction, urea formaldehyde reaction, acid reaction and sulphur reaction. Untreated guayule resin fractions can also be used. Vulcanized and unvulcanized rubber compositions containing guayule resin derived tackifying agents as well as articles made therefrom are also disclosed.
    Type: Grant
    Filed: October 19, 1981
    Date of Patent: September 17, 1985
    Assignee: The Firestone Tire & Rubber Company
    Inventors: Edward L. Kay, Richard Gutierrez
  • Patent number: 4540742
    Abstract: Under particular conditions, a cationic ring-opening polymerization of an oxirane monomer selected from the group consisting of an acyclic glycidyl ether, a cyclic glycidyl ether, and a haloalkyl epoxide, in the presence of a hydroxyl-containing backbone of a polymer ("HCB") and a particular catalyst, produces a polymerization having `living polymerization` characteristics, provided the OH groups are aliphatic OH groups and not aromatic OH groups. The result is a graft copolymer the molecular weight (mol wt) of which is directly proportional to the conversion of the monomer. The HCB, which may have from 1 to about 400 pendant OH groups, and more preferably at least 7 pendant OH groups, provides grafting sites for the grafting segments. Where a grafted segment contains halogen, the segment may be aminated. If the HCB is hydrophobic, the aminated block copolymer is amphiphilic.
    Type: Grant
    Filed: November 12, 1982
    Date of Patent: September 10, 1985
    Assignee: The B. F. Goodrich Company
    Inventor: Yoshihisa Okamoto
  • Patent number: 4526912
    Abstract: This invention relates to a composition comprising (1) a phenoxy resin and (2) at least two compositions selected from (a) phenolic resins, (b) melamine resins and (c) polyisocyanates; to the cured products thereof; and to an electrical conductor coated with said cured products.
    Type: Grant
    Filed: December 1, 1983
    Date of Patent: July 2, 1985
    Assignees: The P. D. George Co., Industrie Vernici Italiane S.p.A.
    Inventors: Luciano Biorcio, Carlo Mensi
  • Patent number: 4510289
    Abstract: A thermoplastic composition includes compatible blends of a mixed polycarbonate comprising units derived from a first dihydric phenol, which is a bis(hydroxyaryl) sulfone, a second dihydric phenol; and one or more thermoplastic condensation polymers containing hetero groups.
    Type: Grant
    Filed: December 20, 1982
    Date of Patent: April 9, 1985
    Assignee: General Electric Company
    Inventors: Daniel W. Fox, Edward N. Peters, Gary F. Smith
  • Patent number: 4482671
    Abstract: Provides new and improved water-reducible coating compositions and methods of making them. Three preferred processes are disclosed. These differ in the manner of incorporating and chemical nature of an extender polymer.Broadly, the process of the invention is one for forming an aqueous dispersion of a fluent resinous composition ofa. a mixture in an organic solvent of(i) an ionizable graft polymer of an epoxy resin and an addition polymerized resin, the addition polymerized resin being bonded to aliphatic backbone carbon atoms of the epoxy resin by carbon-to-carbon bonds, and(ii) an extender resin;b. an aqueous vehicle, andc. an ionizing agent;the ionization present from said combined components being sufficient to establish the components as a dispersion in the aqueous vehicle, and then addition polymerizing a quantity of addition polymerizable monomer, under addition polymerizing conditions, in said aqueous dispersion, the aqueous dispersion serving as a vehicle therefor.
    Type: Grant
    Filed: November 1, 1982
    Date of Patent: November 13, 1984
    Assignee: SCM Corporation
    Inventors: James T. K. Woo, Vincent W. Ting, Richard M. Marcinko
  • Patent number: 4456732
    Abstract: A thermoplastic resin composition having improved weld strength, said composition consisting essentially of(A) 45 to 94.9% by weight of polycarbonate resin,(B) 5 to 40% by weight of a rubber-modified styrene-maleic anhydride copolymer resin, and(C) 0.1 to 15% by weight of an epoxy resin and/or a phenoxy resin.
    Type: Grant
    Filed: June 10, 1983
    Date of Patent: June 26, 1984
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Junji Nambu, Kenji Yoshino, Nagao Ariga, Kyotaro Shimazu, Hiroyuki Sato
  • Patent number: 4446176
    Abstract: The invention herein disclosed provides a method for preparing fluoroelastomer film compositions including the steps of dissolving a fluoroelastomer gum selected from the group consisting of copolymers of vinylidene fluoride and hexafluoropropylene, and terpolymers of vinylidene fluoride, hexafluoropropylene and tetrafluoroethylene in a solvent, adding a phenoxy resin to the gum solution, evaporating the solvent and baking the resulting film. A method is also provided for adhering fluoroelastomer film compositions, devoid of metallic oxides, to substrates which includes the steps of dissolving the fluoroelastomer gum in a solvent, adding a phenoxy resin to the gum solution, coating the substrate with the fluoroelastomer gum-phenoxy resin solution, evaporating the solvent and baking the resulting film, leaving a cured film firmly adhered to the substrate.
    Type: Grant
    Filed: July 23, 1982
    Date of Patent: May 1, 1984
    Assignee: David Hudson, Inc.
    Inventor: Donald Close
  • Patent number: 4362847
    Abstract: The present invention is directed to thermosetting binder compositions for coating, comprising:(I) (1) A non-acidic resinous compound, saturated, molecular weight at least 900, alcoholic hydroxyl content at least 0.2 eq/100 g;(2) a cross-linking agent comprising a non-acidic polyester of a polycarboxylic acid, having more than one beta-hydroxyl ester group per molecule, at least one of components (1) and (2) having an alcoholic hydroxyl functionality of more than 2, and(II) a curing catalyst comprising a transesterification-promoting metal compound which is insoluble in liquid hydrocarbons.These compositions can be used in solvent-based lacquers and paints, in coating powders, aqueous powder suspensions, in aqueous coating compositions for cathodic electrodeposition; for aqueous compositions component (I) (1) is preferably an epoxy resin/amine adduct.
    Type: Grant
    Filed: April 20, 1981
    Date of Patent: December 7, 1982
    Assignee: Shell Oil Company
    Inventors: Petrus G. Kooijmans, Werner T. Raudenbusch, Adrianus M. C. Van Steenis, Wolfgang Kunze, Josepha M. E. Seelen-Kruijssen
  • Patent number: 4355122
    Abstract: Water-borne thermoplastic polyhydroxyether resins are prepared by grafting carboxyl-containing vinyl monomers onto phenoxy resins with a free radical initiator and then converting the graft copolymer to an ionomer suitable for use as coatings or adhesives.
    Type: Grant
    Filed: December 15, 1980
    Date of Patent: October 19, 1982
    Assignee: Union Carbide Corporation
    Inventor: You-Ling Fan
  • Patent number: 4343841
    Abstract: The invention herein disclosed provides a method for preparing fluoroelastomer film compositions including the steps of dissolving a fluoroelastomer gum selected from the group consisting of copolymers of vinylidene fluoride and hexafluoropropylene, and terpolymers of vinylidene fluoride, hexafluoropropylene and tetrafluoroethylene in a solvent, adding a phenoxy resin to the gum solution, evaporating the solvent and baking the resulting film. A method is also provided for adhering fluoroelastomer film compositions, devoid of metallic oxides, to substrates which includes the steps of dissolving the fluoroelastomer gum in a solvent, adding a phenoxy resin to the gum solution, coating the substrate with the fluoroelastomer gum-phenoxy resin solution, evaporating the solvent and baking the resulting film, leaving a cured film firmly adhered to the substrate.
    Type: Grant
    Filed: August 18, 1980
    Date of Patent: August 10, 1982
    Assignee: David Hudson, Inc.
    Inventor: Donald Close
  • Patent number: 4340697
    Abstract: The present invention relates to a heat resistant molding resin composition comprising 60-99.9% by weight of an aromatic polyamideimide resin, and 40-0.1% by weight of a thermoplastic resin which comprises at least one member selected from the group consisting of a polyphenylene sulfide resin, a polyamide resin, a polysulfone resin, an aromatic polyester resin, a polyphenylene-ether resin and a phenoxy resin. The thermoplastic resin must have a melt viscosity at 350.degree. C. of not more than 1.times.10.sup.5 poise and a decomposition temperature of not lower than 350.degree. C. The aromatic polyamideimide resin is improved in melt viscosity characteristics by being blended with the thermoplastic resin. Therefore, a resin composition is obtained which is excellent in moldability characteristics. This composition may optionally comprise various kinds of fillers.
    Type: Grant
    Filed: April 1, 1980
    Date of Patent: July 20, 1982
    Assignee: Toray Industries, Inc.
    Inventors: Toshihiko Aya, Yasushi Kubo
  • Patent number: 4337330
    Abstract: Described herein are blends of water soluble polyethers and poly(hydroxyether)s. These blends are miscible and exhibit controlled extractability and a controlled water dissolution rate.
    Type: Grant
    Filed: September 2, 1980
    Date of Patent: June 29, 1982
    Assignee: Union Carbide Corporation
    Inventor: Lloyd M. Robeson
  • Patent number: 4319008
    Abstract: Semi-permeable, e.g., ultrafiltration membranes are shaped from a solvent solution of an admixture of at least one polyether comprising recurring units of the structural formula:--O--Ar--O--CH.sub.2 --CHOH--CH.sub.2 -- (I)and at least one polyether comprising recurring units of the structural formula:--O--E--R--E'.sub.m O--G--SO.sub.2 --G'-- (II)wherein Ar, E, E', G and G' are divalent aromatic radicals, m is an integer, and R is a valence bond or a member selected from the group comprising --CO--, --O--, --SO.sub.2 -- and a divalent hydrocarbon.
    Type: Grant
    Filed: May 3, 1979
    Date of Patent: March 9, 1982
    Assignee: Rhone-Poulenc Industries
    Inventors: Xavier Marze, Michel Minfray
  • Patent number: RE31193
    Abstract: The thermosetting heat bondable lacquer comprises a solution of a thermosetting mixture of various resins in a solvent or mixture of solvents which boils at a temperature in the range of 50.degree. to 230.degree. C., preferably 130.degree. to 210.degree. C. The thermosetting mixture consists of a polyhydantoin resin, a polyhydroxy polyether or phenoxy resin and a polyurethane resin, each of which must have a pre-determined structure and a pre-determined specific viscosity. The composition of the thermosetting mixture must be within the hatched area in FIG. 1.The thermosetting heat bondable lacquer can be obtained by mixing solutions of the three resin components and can contain auxiliaries and additives and/or catalysts. If the solvent or mixture of solvents is removed from the heat bondable lacquer, e.g.
    Type: Grant
    Filed: September 8, 1981
    Date of Patent: March 29, 1983
    Assignee: Schweizerische Isola-Werke
    Inventors: Peter Heim, Karl Borer, Werner Alleman