Abstract: The present invention provides a pressure-sensitive acrylic adhesive composition which is excellent in the adhesion to polyester films as an adhesive material having tackiness at ordinary temperature and has such high heat resistance as withstanding solder reflow during mounting.

Abstract: An acrylic fiber comprises an acrylic fiber polymer precursor having acrylonitrile in an amount from 90 to 98.0 wt. % of said fiber and a neutral vinyl monomer in an amount from greater than 0 to 7.0 wt. %, the fiber possessing hot-wet elongation less than 9.0% at 70° C.

Abstract: The process of curing a radical-polymerizable multicomponent mixture containing an olefinically-unsaturated compound with ambient air by adding to the mixture an alkyl, cycloalkyl or aryl hydrazone of an aliphatic, cycloaliphatic or aromatic aldehyde or ketone which forms a hydroperoxide as an initiator for curing the mixture.

Abstract: A pressure sensitive adhesive composition comprising: (A) a carboxyl group containing copolymer obtained by solution polymerization of (a) a carboxyl group containing polymerizable monomer and (b) another monomer copolymerizable with the monomer (a); (B) a neutralizer; and (C) a crosslinking agent. This pressure sensitive adhesive composition is suitable for use in a wafer surface protective sheet employed for protecting a circuit pattern formed on a wafer surface from cutting debris, etc. at the time of polishing the back of the wafer. When this pressure sensitive adhesive composition is used, not only is the voltage of peel electrification extremely low at the time of stripping of the pressure sensitive adhesive sheet but also, even if the pressure sensitive adhesive remains on the wafer surface, the residual pressure sensitive adhesive can easily be removed by washing with water.

Abstract: A Process for the selective preparation acrylate- or methacrylate-homo- or acrylate- or methacrylate-co-oligomers with a weight average molecular weight (Mw) from 1000 to 20000, a polydispersity≦3 and a conversion of the monomers to polymers greater than or equal to 70%, or for the selective preparation of polyvinylacetate and its hydrolysis product polyvinylalcohol with a weight average molecular weight (Mw) from 1000 to 25000, a polydispersity≦3 and a conversion of the monomers to polymers greater than or equal to 70%, is characterized in that a mixture of the corresponding monomers is irradiated in the presence of a specific photoinitiator or photoinitiator mixture at a temperature from −20 to 70° C. in an inert solvent or inert solvent mixture, with light of a wavelength from 305 to 450 nm, wherein the contents of monomers in the reaction mixture is up to 70%.

Abstract: A pressure sensitive adhesive composition comprising: (A) a carboxyl group containing copolymer obtained by solution polymerization of (a) a carboxyl group containing polymerizable monomer and (b) another monomer copolymerizable with the monomer (a); (B) a neutralizer; and (C) a crosslinking agent. This pressure sensitive adhesive composition is suitable for use in a wafer surface protective sheet employed for protecting a circuit pattern formed on a wafer surface from cutting debris, etc. at the time of polishing the back of the wafer. When this pressure sensitive adhesive composition is used, not only is the voltage of peel electrification extremely low at the time of stripping of the pressure sensitive adhesive sheet but also, even if the pressure sensitive adhesive remains on the wafer surface, the residual pressure sensitive adhesive can easily be removed by washing with water.