Imide-containing Reactant Patents (Class 528/170)
  • Patent number: 5750636
    Abstract: This invention provides a process wherein a stable solution of polycarbodiimide with a number-average molecular-weight of 5,000 to 60,000 can be very easily prepared by using an organic diisocyanate (e.g., 2,4-tolylene diisocyanate or 2,6-tolylene diisocyanate) as starting material, a cyclic phosphine oxide as catalyst and a chlorinated aromatic compound as solvent and by controlling certain reaction conditions within the reaction temperature range of 110.degree. to 150.degree. C.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: May 12, 1998
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasuyoshi Komoto, Yasuyuki Takiguchi, Ken Yahata, Akira Hayashida, Minoru Takamizawa
  • Patent number: 5750637
    Abstract: This invention provides a process for the preparation of a polycarbodiimide solution wherein the polycarbodiimide is synthesized by heating an organic diisocyanate (e.g., 2,4-tolylene diisocyanate or 2,6-tolylene diisocyanate) in the presence of a carbodiimidation catlayst characterized in that a non-chlorinated aromatic hydrocarbon is used as the solvent and the resulting polycarbodiimide has a number average molecular weight from about 3,000 to about 10,000; wherein the synthesis is performed in the temperature range of from about 100.degree. to about 120.degree. C.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: May 12, 1998
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasuyuki Takiguchi, Ken Yahata, Yasuyoshi Komoto, Akira Hayashida, Minoru Takamizawa
  • Patent number: 5750641
    Abstract: An angularity enhancement layer in a liquid crystal display, which display comprises a liquid crystal cell, wherein the angularity enhancement layer includes a negative birefringent polyimide layer comprising a plurality of structural units having pendant fluorene groups, said angularity enhancement layer being disposed on at least one surface of said liquid crystal cell. A liquid crystal display can comprise an angularity enhancement construction of the invention which comprises a polyimide layer.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: May 12, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Stephen A. Ezzell, Hassan Sahouani, Ernest L. Thurber
  • Patent number: 5744570
    Abstract: Claimed is a copolyether amide having a melting point in the range of 180.degree. to 260.degree. C., incorporating at least 10 wt. % and not more than 30 wt. % of ethylene oxide groups, and composed of 30 to 60 wt. % of polyamide segments and 70 to 40 wt. % of segments derived from a (cyclo)aliphatic or aromatic dicarboxylic acid or a dimeric fatty acid and a polyoxyalkylene diamine derived from a polyoxyalkylene group having a molecular weight of 600 to 6000 and an atomic ratio of carbon to oxygen of 2.0 to 4.3. Also claimed is a non-porous, waterproof film having a water vapour permeability of at least 1000 g/m.sup.2 day determined at 30.degree. C. and 50% RH in accordance with ASTM E96-66 which is based on a the use of these films in rainwear, shoes, tents, chairs, as mattress covers and understating, for medical purpose garments, and for the manufacture of dressings.
    Type: Grant
    Filed: August 16, 1996
    Date of Patent: April 28, 1998
    Assignee: Akzo Nobel NV
    Inventor: Bert Gebben
  • Patent number: 5739263
    Abstract: The present invention provides a film adhesive comprising, as the main constituent, a polyimide resin having a glass transition temperature of 350.degree. C. or lower and soluble in organic solvents, which polyimide resin is obtained by reacting at least one of the following acid components (A) and (B)(A) 4,4'-oxydiphthalic acid dianhydride(B) 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or 3,3',4,4'-benzophenonetetracarboxylic acid dianhydridewith at least one of the following amine components (C) and (D)(C) a siloxane compound represented by the following general formula (1) and/or 2,2-bis(4-(4-amino-phenoxy)phenyl)propane ##STR1## wherein R.sub.1 and R.sub.2 are each a bivalent aliphatic (C.sub.1-4) or aromatic group; R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each a mono-valent aliphatic or aromatic group; and k is an integer of 1-20,(D) bis(aminophenoxy)benzene and/or dimethylphenylene-diamineto give rise to ring closure of imide, as well as a process for producing said film adhesive.
    Type: Grant
    Filed: January 28, 1994
    Date of Patent: April 14, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Tatsuhiro Yoshida, Yoshitaka Okugawa, Toshio Suzuki, Toshiro Takeda, Yushi Sakamoto, Takuya Tochimoto
  • Patent number: 5739256
    Abstract: High performance polyester sulfone oligomers are prepared for aerospace applications by condensing mono- or difunctional crosslinkable end caps (i.e. unsaturated hydrocarbons having one or two crosslinking sites) with dicarboxylic acid halides and dialcohols (i.e. diols). Multidimensional oligomers have an aromatic hub from which the polyester chains radiate. Blends of the linear and multidimensional oligomers can be made using compatible, non-crosslinking polymers. Prepregs and composites are formed from the oligomers or blends.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: April 14, 1998
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5734008
    Abstract: The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1): ##STR1## wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4;with a tetracarboxylic dianhydride represented by the general formula (2) ##STR2## wherein Y represents a tetravalent organic group having 2 or more carbon atoms.The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: March 31, 1998
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Mika Shirasaki, Youichi Ueda, Mitsuhiro Shibata
  • Patent number: 5731405
    Abstract: A process for inducing pre-tilt in alignment of a liquid crystal medium comprising exposing at least one optical alignment layer, comprising anisotropically absorbing molecules and hydrophobic moieties, to polarized light; the polarized light having a wavelength within the absorption band of said anisotropically absorbing molecules; wherein the exposed anisotropically absorbing molecules induce alignment of the liquid crystal medium at an angle + and -.theta. with respect to the direction of the polarization of the incident light beam and along the surface of the optical alignment layer, and induce a pre-tilt at an angle .PHI. with respect to the surface of the optical alignment layer and applying a liquid crystal medium to said optical alignment layer, is described. The invention also is directed to liquid crystal display elements made by the process of the invention and to novel polyimide compositions that are useful as optical alignment layers in the invention.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: March 24, 1998
    Assignee: Alliant Techsystems Inc.
    Inventors: Wayne M. Gibbons, Paul J. Shannon, Shao-Tang Sun
  • Patent number: 5723571
    Abstract: A novel polyimide is soluble in organic solvents and excels in heat resistance. The polyimide comprises 95-40 mol % of the repeating unit represented by the formulas (1) and 60-5 mol % of the repeating unit represented by the formula (2) and has a number average molecular weight of 4,000-200,000: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1-10 carbon atoms or a group: --CH.sub.2 OC.sub.6 H.sub.4 --, and n is an integer of 1-20.
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: March 3, 1998
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Takeshi Nishigaya
  • Patent number: 5714566
    Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## in the oligomers, wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## --O--.O slashed.--COOH, --O--.O slashed.--COX, --X, --O.paren open-st.(R.sub.8 .paren close-st.OH, ##STR4## --O--.O slashed.--NH.sub.2 ; E= ##STR5## R.sub.8 =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --, --S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.THETA.=--C.tbd.N; --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.2.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: February 3, 1998
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowtiz, Clyde H. Sheppard
  • Patent number: 5708127
    Abstract: The invention relates to a PMR type resin which comprises a mixture of:(a) nadic acid of Formula (Ia) or a derivative thereof ##STR1## (b) a diaminobisimide of Formula (Ib) ##STR2## (c) an aromatic tetracarboxylic acid of Formula (Ic) or a derivative thereof ##STR3## the components (a), (b) and (c) being present in the approximate molar proportions of 2:n:n-1 respectively.
    Type: Grant
    Filed: July 21, 1995
    Date of Patent: January 13, 1998
    Assignee: Commonwealth Scientific and Industrial Research Organisation
    Inventors: Jonathan Howard Hodgkin, Robert Eibl
  • Patent number: 5708122
    Abstract: Poly(ester-imides) containing t-butylhydroquinone and trimellitic anhydride as part of the repeat units, as well as other monomers, are useful as molding resins. The polymers have a high glass transition temperature and are particularly useful in applications requiring good wear resistance.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: January 13, 1998
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Robert Ralph Luise
  • Patent number: 5705574
    Abstract: Polyimide oligomers include (1) linear, mono-functional crosslinking oligomers prepared by condensing a monoanhydride end cap with a diamine that includes alternating ether and "sulfone" (--SO.sub.2 --, --S--, --CO--, --(CF.sub.3).sub.2 C--, or --(CH.sub.3).sub.2 C--) linkages connecting alternating aromatic radicals and with a dianhydride (or dianhydride mixture), particularly the unsaturated, aliphatic dianhydride commonly known as MCTC; (2) linear, mono- or difunctional crosslinking oligomers prepared by condensing an amine end cap with a diamine and a dianhydride; and (3) multidimensional, crosslinking oligomers having an aromatic hub and at least three radiating arms connected to the hub, each arm including a crosslinking end cap at its distal end and at least one imide linkage.Blends, prepregs, and composites can be prepared from the oligomers.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: January 6, 1998
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5705598
    Abstract: High performance polyester sulfone oligomers are prepared for aerospace applications by condensing mono- or difunctional crosslinkable end caps (i.e. unsaturated hydrocarbons having one or two crosslinking sites) with dicarboxylic acid halides and dialcobols (i.e. diols). Multidimensional oligomers have an aromatic hub from which the polyester chains radiate. Blends of the linear and multidimensional oligomers can be made using compatible, non-crosslinking polymers. Prepregs and composites are formed from the oligomers or blends.
    Type: Grant
    Filed: December 23, 1987
    Date of Patent: January 6, 1998
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5696235
    Abstract: Novel polyimides which are soluble in various organic solvents and excellent in thermal resistance, processability are disclosed. The polyimides comprise repeating units represented by the following formula (1) and/or (2) and having a number average molecular weight of 4,000-200,000. ##STR1## wherein Ar is a divalent group represented by the following formula (2) or (3): ##STR2## wherein Y is --O--, --CO--, --S--, --SO.sub.2 -- or --C(CH.sub.3).sub.2 --, ##STR3## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group, Ra is a divalent group having 2-6 benzene rings, X.sup.1 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group) or S, Rb is C.sub.2-20 alkylene group, ether group or dimethylsiloxane group, and X.sub.2 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: December 9, 1997
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Takeshi Hashimoto, Takeshi Nishigaya
  • Patent number: 5686559
    Abstract: A poly(imide amic ester) having repeating unit of formula (I) and a process for the preparation thereof are provided, wherein formula (I) has the structure ##STR1## wherein Ar is, ##STR2## Ar' is, ##STR3## Ar" is ##STR4## R is selected from the group consisting of CH.sub.3, CH.sub.2 CH.sub.3, CH(CH.sub.3).sub.2, CH.sub.2 CH.sub.2 CH.sub.3, CH.sub.2 (CH(CH.sub.3).sub.2 and C(CH.sub.3).sub.3. Further, processes for the preparation of polyimide, polyimide film and polyimide fiber using the above poly(imide amic ester) are provided.
    Type: Grant
    Filed: October 30, 1995
    Date of Patent: November 11, 1997
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Suh Bong Rhee, Myong Hoon Lee, Ji Woong Park
  • Patent number: 5686558
    Abstract: The invention relates to a liquid crystal orientation film having a specific polymer, the main chain of the polymer formed of urea bonds and imide bonds, and a liquid crystal display element incorporating the film. The liquid crystal orientation film does not require high temperature heat treatment when prepared, allowing treatment below about 150.degree. C. Hence, the production of a liquid crystal display element using the liquid crystal orientation film is simplified. Furthermore, other element materials are protected, and the substrate used can be a plastic substrate lower in heat resistance than glass. Moreover, the liquid crystal orientation film is excellent in such properties as liquid crystal orienting capability, heat resistance, transparency, strength and adhesion to the substrate, and has an especially large and stable pre-tilt angle.
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: November 11, 1997
    Assignee: Toray Industries, Inc.
    Inventors: Kazuo Kitamura, Satoshi Okawa
  • Patent number: 5677394
    Abstract: A melt-processable block copolyesterimide comprising the repeating units (I), (II) and (III) and, optionally, a repeating unit (IV), wherein (I) is a repeating unit of the formula ##STR1## wherein R is an aliphatic polyether chain and/or a polysiloxane chain; (II) and (III) are repeating units of the formulas ##STR2## wherein Z is hydrogen, alkyl, alkoxy, aryl, halogen and w is zero or one; and (IV) is a repeating unit of the formula ##STR3## wherein Z' is hydrogen, alkyl, alkoxy, aryl or halogen and the phenylene ring is substituted in by Z' in the m- or p-positions. The repeating unit of formula (I) is present in an amount of 5 to 50 mole-%, the repeating unit of formula (II) is present in an amount of 10 to 80 mole-%, the repeating unit of formula (III) is present in an mount of 5 to 50 mole-% and the repeating unit of formula (IV) is present in an amount of 0 to 45 mole-% of the block copolyesterimide.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: October 14, 1997
    Assignee: Neste OY
    Inventors: Frank Bohme, Doris Pospiech, Manfred Ratzsch, Christer Bergstrom, Mika Harkonen, Heli Alanko, Pentti Passiniemi
  • Patent number: 5670609
    Abstract: A polyimide alignment film based on pyromellitic dianhydride and a 2,2'-bis(perfluoroalkoxy)benzidine, as major components, for use in liquid crystal display devices.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: September 23, 1997
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Brian Carl Auman, Edgar Bohm
  • Patent number: 5668248
    Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
    Type: Grant
    Filed: August 22, 1995
    Date of Patent: September 16, 1997
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima
  • Patent number: 5668247
    Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.
    Type: Grant
    Filed: December 16, 1993
    Date of Patent: September 16, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Furutani, Kazuhisa Danno, Yoshifumi Okamoto, Junya Ida, Yoshihide Oonari, Hitoshi Nojiri, Hirosaku Nagano
  • Patent number: 5663275
    Abstract: Aromatic polyether polymers, illustrated by polyethersulfones, polyetherketones and polyetherimides, are prepared by a phase transfer catalyzed reaction between a hydrate of a salt of a dihydroxyaromatic compound and a substituted aromatic compound such as bis(4-hydroxyphenyl) sulfone, bis(4-hydroxyphenyl) ketone or 1,3-bis[N-(4-chlorophthalimido)]benzene. Isolation of the hydrate and its conversion to the anhydrous salt prior to the polymerization reaction affords a polymer of higher molecular weight than other methods of preparing the anhydrous salt.
    Type: Grant
    Filed: July 5, 1996
    Date of Patent: September 2, 1997
    Assignee: General Electric Company
    Inventor: John Christopher Schmidhauser
  • Patent number: 5654396
    Abstract: We achieve solvent resistance and extended use life for advanced polyimides by including at least some solvent-resistant linkages in the backbone in place of phenoxyphenyl sulfone linkages and using diPEPA or PEPA crosslinking end caps.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: August 5, 1997
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5648451
    Abstract: A process for producing a photosensitive resin, comprises reacting a diamine with a tetracarboxylic acid tetraester represented by the formula (1) at a temperature of 0.degree. to 50.degree. C. in an aprotic polar solvent: ##STR1## wherein R.sub.1 is a tetravalent organic group; R.sub.2 is a group represented by the formula: ##STR2## in which R.sub.5 is a divalent to hexavalent organic group, R.sub.6 is H or CH.sub.3 and p is an integer of 1 to 5; R.sub.3 is a group represented by --OCH.sub.3, --OC.sub.2 H.sub.5, --OC.sub.3 H.sub.7 or the formula: ##STR3## and R.sub.4 is a group of the formula: ##STR4## the tetracarboxylic acid tetraester of the formula (1) is obtained by subjecting to addition reaction a tetracarboxylic dianhydride, an alcohol compound represented by the formula R.sub.2 H in which R.sub.2 is as defined above and an alcohol compound represented by the formula R.sub.3 H in which R.sub.
    Type: Grant
    Filed: October 10, 1995
    Date of Patent: July 15, 1997
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Nobuyuki Sashida, Toshio Banba, Naoshige Takeda
  • Patent number: 5644016
    Abstract: Use of a polymer containing maleimide units of the formula I ##STR1## in which R.sup.1 is hydrogen, an acyclic or cyclic, aliphatic, aromatic or araliphatic radical which is chiral or achiral, can be monosubstituted or polysubstituted by functional groups and in which one or more CH.sub.2 groups can be replaced by functional groups, as alignment layer in liquid-crystal displays.Alignment layers containing a polymer conforming to the formula I effect, in particular, a suppression of twist states and ghost images and thus an improvement in the optical contrast.
    Type: Grant
    Filed: November 17, 1994
    Date of Patent: July 1, 1997
    Inventors: Horst Roschert, Norbert Rosch, Peter Wegener
  • Patent number: 5644022
    Abstract: Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA), and terminating with an effective amount of a reactive endcapper. The reactive endcappers employed include 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride) (NA). Within a relatively narrow ratio of diamines, from .sup..about. 50% ODA/50% APB to .sup..about. 95% ODA/5% APB, the copolyimides prepared with BPDA and terminated with reactive endgroups have a unique combination of properties that make them very attractive for a number of applications. This unique combination of properties includes low pressure processing (200 psi and below), long term melt stability (several hours at 300.degree. C.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: July 1, 1997
    Assignee: The United States of America as represented by the Admninistrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 5621068
    Abstract: A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.
    Type: Grant
    Filed: February 22, 1995
    Date of Patent: April 15, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshifumi Okamoto, Hiroyuki Furutani, Kazuhisa Danno, Junya Ida, Hirosaku Nagano
  • Patent number: 5612443
    Abstract: Low molecular weight polyaldehydes are prepared by converting the acetal groups of the low molecular weight polyacetal to aldehyde groups or by reacting an aldehyde-containing reagent (e.g., glyoxal) with a polyamide.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: March 18, 1997
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Gary T. Martino, Martin M. Tessler
  • Patent number: 5610265
    Abstract: A rigid-rod aromatic polyimide having repeating units of the formula: ##STR1##
    Type: Grant
    Filed: February 2, 1996
    Date of Patent: March 11, 1997
    Assignee: The United States of America as represented by The Secretary of the Air Force
    Inventor: Loon-Seng Tan
  • Patent number: 5606014
    Abstract: Controlled molecular weight imide oligomers and co-oligomers containing pendent phenylethynyl groups (PEPIs) and endcapped with nonreactive or phenylethynyl groups have been prepared by the cyclodehydration of the precursor amide acid oligomers or co-oligomers containing pendent phenylethynyl groups and endcapped with nonreactive or phenylethynyl groups. The amine terminated amide acid oligomers or co-oligomers are prepared from the reaction of dianhydride(s) with an excess of diamine(s) and diamine containing pendent phenylethynyl groups and subsequently endcapped with a phenylethynyl phthalic anhydride or monofunctional anhydride. The anhydride terminated amide acid oligomers and co-oligomers are prepared from the reaction of diamine(s) and diamine containing pendent phenylethynyl group(s) with an excess of dianhydride(s) and subsequently endcapped with a phenylethynyl amine or monofunctional amine. The polymerizations are carried out in polar aprotic solvents such as under nitrogen at room temperature.
    Type: Grant
    Filed: August 4, 1995
    Date of Patent: February 25, 1997
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventors: John W. Connell, Joseph G. Smith, Jr., Paul M. Hergenrother
  • Patent number: 5606012
    Abstract: Polymeric polyetheramidoamine hydrogel materials, which are capable of complexing heparin in physiological conditions are herein described. Said materials are useful in the manufacturing of medical devices.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: February 25, 1997
    Assignee: Societa' Consortile Ricerche Angelini S.p.A.
    Inventors: Maria C. Tanzi, Gianfranco Palumbo
  • Patent number: 5597889
    Abstract: An alternating copolymer comprising a repeating unit of the formula:--Z--(X-Y).sub.n -- (I)wherein n is at least 2, X is O, S, Se or Te, and Y and Z are independently an aromatic or substituted aromatic group, and at least one other repeating unit, which is useful as a photosensitive material used in a spatial light modulator.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: January 28, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akio Takimoto, Hirofumi Wakemoto, Eiichiro Tanaka, Masanori Watanabe, Junko Asayama, Hisahito Ogawa, Shigehiro Sato, Fumiko Yokotani
  • Patent number: 5594089
    Abstract: Thermomechanical and thermo-oxidative stabilities in heterocycle or heterocycle sulfone resin composites are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities.
    Type: Grant
    Filed: October 21, 1994
    Date of Patent: January 14, 1997
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowtiz, Clyde H. Sheppard
  • Patent number: 5594093
    Abstract: A nonlinear optical polymer material comprising at least one polymer selected from the group consiting of polyimides, acrylic resins and benzocyclobutene resins containing, as a guest molecule, as a side chain, or in the main chain, a molecule or a chemical moiety having a basic structure of merocyanine dye represented by the formula (I): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 independently represent hydrogen or an organic group, provided that R.sup.1 and R.sup.2 or R.sup.3 and R.sup.5 may independently combine together to form an organo ring structure, and n is an integer of 1 to 3.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: January 14, 1997
    Assignee: Fujitsu Limited
    Inventors: Wataru Sotoyama, Satoshi Tatsuura, Tetsuzo Yoshimura, Azuma Matsuura, Tomoaki Hayano
  • Patent number: 5587452
    Abstract: The invention relates to a polyamide-imide containing recurring units according to the formula ##STR1## where Y is an arylene group, andR and R' are alkylene groups, in which at least 50 mole % of R and/or R' is a butylene group.The polyamide-imides are semi-crystalline.They are suitable for injection moulding applications, structural moulded parts, films, coatings and fibres. They can preferably be used in fields of application where temperatures above 200.degree. C. occur.
    Type: Grant
    Filed: July 3, 1995
    Date of Patent: December 24, 1996
    Assignee: DSM N.V.
    Inventors: Cornelis E. Koning, Lilian M. J. Teuwen
  • Patent number: 5580950
    Abstract: A class of soluble polymers having a rigid rod backbone, which when used to cast films, undergo a self-orientation process whereby the polymer backbone becomes more or less aligned parallel to the film surface. This in-plane orientation results in a film that displays negative birefringence. The degree of in-plane orientation and thus, the magnitude of the negative birefringence is controlled by varying the backbone linearity and rigidity of the class of polymers which includes polyesters, polyamides, poly(amide-imides) and poly(ester-imides) through selection of substituents in the polymer backbone chain. By increasing the polymer backbone linearity and rigidity, the degree of in-plane orientation and associated negative birefringence can be increased, and that conversely, by decreasing the polymer backbone linearity and rigidity, the negative birefringence can be decreased.
    Type: Grant
    Filed: October 13, 1994
    Date of Patent: December 3, 1996
    Assignee: The University of Akron
    Inventors: Frank W. Harris, Stephen Z. D. Cheng
  • Patent number: 5578697
    Abstract: A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40.
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: November 26, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki Kawamonzen, Masayuki Oba, Yukihiro Mikogami, Shigeru Matake, Shuzi Hayase, Satoshi Mikoshiba
  • Patent number: 5578696
    Abstract: A heat-resistant adhesive film, an adhesion structure obtained using the same, and an adhesion method using the same are disclosed, the film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR1## wherein R.sub.1 represents a tetravalent aromatic or aliphatic residue; R.sub.2 represents a divalent aromatic or aliphatic residue; and the arrow represents a bond replaceable on isomerization, in the molecule thereof. The isoimide unit of the polyisoimide resin is easily converted to an imide unit on heating, e.g., hot pressing with an adherend, to provide a cover-lay film or a single-sided or double-sided base for printed circuit boards having excellent adhesion, heat resistance, dimensional precision, and workability.
    Type: Grant
    Filed: April 6, 1994
    Date of Patent: November 26, 1996
    Assignee: Nitto Denko Corporation
    Inventors: Amane Mochizuki, Kazumi Higashi, Masako Maeda
  • Patent number: 5571890
    Abstract: Polyetheramidoamine hydrogels consisting of polyetheramidomaine and/or polyamidoamine prepolymers crosslinked by Michael's nuceophilic polyaddition with alpha-omega-diamino monomers or with alpha-omega-diamino monomers or oligomers; said hydrogels having a swelling degree in water higher than 500% and are useful as superabsorbent materials.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: November 5, 1996
    Assignee: Societa Consortile Ricerche Angelini S.p.A.
    Inventors: Maria C. Tanzi, Gianfranco Palumbo, Giovanni Carlucci
  • Patent number: 5569738
    Abstract: This invention relates to melt processable copolymer of etherimideimide/etherimide herein-after identified as PEII/PEI copolymer of following structural formula(I). ##STR1## wherein, R and R' are independently selected from the groups of ##STR2## Ar and Ar' are independently selected from the groups of ##STR3## (wherein, R1 is H or C1-C6 alkyl group,R2 is II or C1-C4 alkyl group, andR3 is --O--, --CO--, --SO--, --SO2--.); andn and m are independently an integer between 5 and 500.
    Type: Grant
    Filed: March 14, 1995
    Date of Patent: October 29, 1996
    Assignees: Korea Research Institute of Chemical Technology, Cheil Industries, Inc.
    Inventors: Kil Y. Choi, Jong C. Won, Young T. Hong, Sang S. Woo, Youn S. Don
  • Patent number: 5554765
    Abstract: A moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide resin. A further aspect relates to a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide resin. A still further aspect relates to a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: September 10, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Akio Matsuyama, Eiji Senoue, Fumiaki Kuwano, Osamu Yasui, Yasunori Yoshida, Akinori Ryu, Tadashi Kobayashi
  • Patent number: 5539080
    Abstract: A process is disclosed for making circuit elements by photolithography comprising depositing an antireflective polyimide or polyimide precursor layer on a substrate and heating the substrate at 200.degree. C. to 500.degree. to provide a functional integrated circuit element that includes an antireflective polyimide layer. The antireflective polyimide layer contains a sufficient concentration of at least one chromophore to give rise to an absorbance sufficient to attenuate actinic radiation at 405 or 436 nm. Preferred chromophores include those arising from perylenes, naphthalenes and anthraquinones. The chromophore may reside in a dye which is a component of the polyimide coating mixture or it may reside in a residue which is incorporated into the polyimide itself.
    Type: Grant
    Filed: April 19, 1995
    Date of Patent: July 23, 1996
    Assignee: International Business Machines Corporation
    Inventors: Dennis P. Hogan, Harold G. Linde, Ronald A. Warren
  • Patent number: 5532334
    Abstract: A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: July 2, 1996
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Kil-Yeong Choi, Dong-Hack Suh, Mi-Hie Yi, Young-Taik Hong, Jong-Chan Won
  • Patent number: 5530089
    Abstract: Polysulfoneimide oligomers having crosslinking end cap moleties which provide improved solvent-resistance to cured composites are generally represented by backbones of the formula: ##STR1## wherein ##STR2## n=1 or 2; R and R' are divalent aromatic organic radicals having from 2-20 carbon atoms; ##STR3## E=allyl or methallyl; R=a trivalent C.sub.(6-13) aromatic organic radical;R.sub.1 =any of lower alkyl, lower alkoxy, aryl, or substituted aryl;R'=a divalent C.sub.(6-30) aromatic organic radical;j=0, 1, or 2; andG=--CH.sub.2 --, --O--, --S--, or --SO.sub.2 --The crosslinkable oligomers are made by reacting substituted phthalic anhydrides with hydroxyaryl amines and suitable crosslinking end cap reactants, or by self-condensation of phthalimide salts followed by capping the polymers.
    Type: Grant
    Filed: September 6, 1988
    Date of Patent: June 25, 1996
    Assignee: The Boeing Company
    Inventors: Clyde H. Sheppard, Hyman R. Lubowitz
  • Patent number: 5525699
    Abstract: A copolymer consisting essentially of a repeating sequence represented by the formula ##STR1## where Ar.sub.1, Ar.sub.2, and Ar.sub.3, are each independently chosen from the group consisting of ##STR2## which are either unsubstituted or are substituted with one or more substituents chosen from the group consisting of alkyl groups having 1-6 carbon atoms, halogen (F, Cl or Br), and phenyl; Z, Y.sub.1 and Y.sub.2 are each independently O, NH, or S; n and m are positive integers; and X is a covalent bond, O, S, SO.sub.2, CO, C(C.sub.6 H.sub.5).sub.2, C(C.sub.6 H.sub.5)H, C(C.sub.6 H.sub.5)(CH.sub.3), C(CH.sub.3).sub.2, C(CH.sub.3)H, CH.sub.2, C(CF.sub.3).sub.2, or 3,3,5-trimethyl cyclohexyl. The polymers of this invention are derived from a minimum of three different monomers.
    Type: Grant
    Filed: May 15, 1992
    Date of Patent: June 11, 1996
    Assignee: Hoechst Celanese Corp.
    Inventors: Eui W. Choe, Marie Borzo
  • Patent number: 5521276
    Abstract: Polyamideimide resins having the formula (I) ##STR1## in which repeating units are bound in a head to tail or head to head manner,R is at least two divalent groups selected from the group consisting of ##STR2## (cis-, trans- conformational mixture) wherein one divalent group is ##STR3## group in a PAI molecule, produced by introducing isophorone diamine into the conventional aromatic polyamideimide resins.
    Type: Grant
    Filed: June 22, 1994
    Date of Patent: May 28, 1996
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Kil-Yeong Choi, Mi-Hie Yi, Jae-Heung Lee, Moon-Young Jin, Young-Taik Hong
  • Patent number: 5516876
    Abstract: Polyimide oligomers include (1) linear, monofunctional crosslinking oligomers prepared by condensing a monoanhydride end cap with a diamine that includes alternating ether and "sulfone" (--SO.sub.2 --, --S--, --CO--, --(CF.sub.3).sub.2 C--, or --(CH.sub.3).sub.2 C--) linkages connecting alternating aromatic radicals and with a dianhydride (or dianhydride mixture), particularly the unsaturated, aliphatic dianhydride commonly known as MCTC; (2) linear, mono- or difunctional crosslinking oligomers prepared by condensing an amine end cap with a diamine and a dianhydride; and (3) multidimensional, crosslinking oligomers having an aromatic hub and at least three radiating arms connected to the hub, each arm including a crosslinking end cap at its distal end and at least one imide linkage. Blends, prepregs, and composites can be prepared from the oligomers.
    Type: Grant
    Filed: April 25, 1994
    Date of Patent: May 14, 1996
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5514747
    Abstract: A method for preparing a polyamide-imide-modified polyurethane varnish composition for coating a conductive wire to form a varnished wire. The method comprises the steps of: (a) preparing a first intermediate reaction product, which is an isocyanate compound, (b) preparing a second intermediate reaction product, which is a hydroxy compound, and (c) mixing the first and second intermediate reaction products with a diluent to form the polyamide-imide-modified polyurethane varnish composition. The first intermediate reaction comprises the steps of: (I) preparing a first reaction mixture containing a phenol or a derivative of phenol, a diisocyanate, and a dihydroxy compound in a first organic solvent, and reacting the first reaction mixture at room temperature; (ii) adding a diacid compound or trimellitic anhydride or mixture thereof to the first reaction mixture, and reacting at 100.degree..about.140.degree. C.
    Type: Grant
    Filed: February 17, 1995
    Date of Patent: May 7, 1996
    Assignee: Industrial Technology Research Institute
    Inventors: Sheng Yaw Hsu, Tzong-Ming Lee
  • Patent number: 5514769
    Abstract: A crosslinkable polymer having repeating units of the formula: ##STR1## wherein Ar is selected from the group consisting of ##STR2## These polymers are useful in the preparation of molecular composites with rigid-rod polymers, including para-oriented benzobisazole polymers, such as benzobisthiazole, benzobisoxazole and benzobisimidazole polymers.
    Type: Grant
    Filed: June 19, 1995
    Date of Patent: May 7, 1996
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Loon-Seng Tan, Narayanan Venkatasubramaian
  • Patent number: 5502156
    Abstract: Disclosed is a thermally-stable SnO.sub.2 -surfaced polyimide film wherein the electrical conductivity of the SnO.sub.2 surface is within the range of about 3.0.times.10.sup.-3 to about 1.times.10.sup.-2 ohms.sup.-1,. Also disclosed is a method of preparing this film from a solution containing a polyamic acid and SnCl.sub.4 (DMSO).sub.2.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: March 26, 1996
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Anne K. St. Clair, Stephen A. Ezzell, Larry T. Taylor, Harold G. Boston