Nitrogen-containing Compound Is A Reactant Other Than Wherein Nitrogen Is Solely Present As A Carboxylic Acid Derivative Patents (Class 528/172)
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Patent number: 5580950Abstract: A class of soluble polymers having a rigid rod backbone, which when used to cast films, undergo a self-orientation process whereby the polymer backbone becomes more or less aligned parallel to the film surface. This in-plane orientation results in a film that displays negative birefringence. The degree of in-plane orientation and thus, the magnitude of the negative birefringence is controlled by varying the backbone linearity and rigidity of the class of polymers which includes polyesters, polyamides, poly(amide-imides) and poly(ester-imides) through selection of substituents in the polymer backbone chain. By increasing the polymer backbone linearity and rigidity, the degree of in-plane orientation and associated negative birefringence can be increased, and that conversely, by decreasing the polymer backbone linearity and rigidity, the negative birefringence can be decreased.Type: GrantFiled: October 13, 1994Date of Patent: December 3, 1996Assignee: The University of AkronInventors: Frank W. Harris, Stephen Z. D. Cheng
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Patent number: 5578696Abstract: A heat-resistant adhesive film, an adhesion structure obtained using the same, and an adhesion method using the same are disclosed, the film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR1## wherein R.sub.1 represents a tetravalent aromatic or aliphatic residue; R.sub.2 represents a divalent aromatic or aliphatic residue; and the arrow represents a bond replaceable on isomerization, in the molecule thereof. The isoimide unit of the polyisoimide resin is easily converted to an imide unit on heating, e.g., hot pressing with an adherend, to provide a cover-lay film or a single-sided or double-sided base for printed circuit boards having excellent adhesion, heat resistance, dimensional precision, and workability.Type: GrantFiled: April 6, 1994Date of Patent: November 26, 1996Assignee: Nitto Denko CorporationInventors: Amane Mochizuki, Kazumi Higashi, Masako Maeda
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Patent number: 5578697Abstract: A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40.Type: GrantFiled: March 29, 1995Date of Patent: November 26, 1996Assignee: Kabushiki Kaisha ToshibaInventors: Yoshiaki Kawamonzen, Masayuki Oba, Yukihiro Mikogami, Shigeru Matake, Shuzi Hayase, Satoshi Mikoshiba
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Patent number: 5567800Abstract: Controlled molecular weight phenylethynyl terminated imide oligomers (PETIs) have been prepared by the cyclodehydration of precursor phenylethynyl terminated amic acid oligomers. Amino terminated amic acid oligomers are prepared from the reaction of dianhydride(s) with an excess of diamine(s) and subsequently endcapped with phenylethynyl phthalic anhydride(s) (PEPA). The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide under nitrogen at room temperature. The amic acid oligomers are subsequently cyclodehydrated either thermally or chemically to the corresponding imide oligomers. Direct preparation of PETIs from the reaction of dianhydride(s) with an excess of diamine(s) and endcapped with phenylethynyl phthalic anhydride(s) has been performed in m-cresol. Phenylethynyl phthalic anhydrides are synthesized by the palladium catalyzed reaction of phenylacetylene with bromo substituted phthalic anhydrides in triethylamine.Type: GrantFiled: October 28, 1994Date of Patent: October 22, 1996Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Paul M. Hergenrother, Joseph G. Smith, Jr.
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Patent number: 5565527Abstract: Polymeric, catalytically active compounds comprising polymer chains to which imidazole groups are linked terminally or laterally are used as catalysts for the dimerization of isocyanates.Type: GrantFiled: June 1, 1995Date of Patent: October 15, 1996Assignee: BASF AktiengesellschaftInventors: Bernd Bruchmann, Roland Minges, Christian Schade, Konrad Stiefenhoefer
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Patent number: 5554715Abstract: Novel poly(N-arylenebenzimidazole)s (PNABls) are prepared by the aromatic nucleophilic displacement reaction of novel di(hydroxyphenyl-N-arylene benzimidazole) monomers with activated aromatic dihalides or activated aromatic dinitro compounds. The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide using alkali metal bases such as potassium carbonate at elevated temperatures under nitrogen. The di(hydroxyphenyl-N-arylenebenzimidazole) monomers are synthesized by reacting phenyl-4-hydroxybenzoate with bis(2-aminoanilino)arylenes in diphenylsulfone. Moderate molecular weight PNABIs of new chemical structures were prepared that exhibit a favorable combination of physical and mechanical properties. The use of the novel di(hydroxyphenyI-N-arylenebenzimidazole)s permits a more economical and easier way to prepare PNABIs than previous routes.Type: GrantFiled: January 17, 1995Date of Patent: September 10, 1996Assignee: The United States of America as represented by the Administrator of National Aeronautics and Space AdministrationInventors: John W. Connell, Paul M. Hergenrother, Joseph G. Smith, Jr.
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Patent number: 5539080Abstract: A process is disclosed for making circuit elements by photolithography comprising depositing an antireflective polyimide or polyimide precursor layer on a substrate and heating the substrate at 200.degree. C. to 500.degree. to provide a functional integrated circuit element that includes an antireflective polyimide layer. The antireflective polyimide layer contains a sufficient concentration of at least one chromophore to give rise to an absorbance sufficient to attenuate actinic radiation at 405 or 436 nm. Preferred chromophores include those arising from perylenes, naphthalenes and anthraquinones. The chromophore may reside in a dye which is a component of the polyimide coating mixture or it may reside in a residue which is incorporated into the polyimide itself.Type: GrantFiled: April 19, 1995Date of Patent: July 23, 1996Assignee: International Business Machines CorporationInventors: Dennis P. Hogan, Harold G. Linde, Ronald A. Warren
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Patent number: 5532334Abstract: A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.Type: GrantFiled: November 14, 1994Date of Patent: July 2, 1996Assignee: Korea Research Institute of Chemical TechnologyInventors: Kil-Yeong Choi, Dong-Hack Suh, Mi-Hie Yi, Young-Taik Hong, Jong-Chan Won
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Patent number: 5521276Abstract: Polyamideimide resins having the formula (I) ##STR1## in which repeating units are bound in a head to tail or head to head manner,R is at least two divalent groups selected from the group consisting of ##STR2## (cis-, trans- conformational mixture) wherein one divalent group is ##STR3## group in a PAI molecule, produced by introducing isophorone diamine into the conventional aromatic polyamideimide resins.Type: GrantFiled: June 22, 1994Date of Patent: May 28, 1996Assignee: Korea Research Institute of Chemical TechnologyInventors: Kil-Yeong Choi, Mi-Hie Yi, Jae-Heung Lee, Moon-Young Jin, Young-Taik Hong
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Patent number: 5516875Abstract: This invention concerns positive-working photodefinable polyimide precursors which make use of chemical amplification based on photoacid catalyzed cleavage of acid labile-poly(amic acetal esters).Type: GrantFiled: December 15, 1994Date of Patent: May 14, 1996Assignee: E. I. Du Pont de Nemours and CompanyInventor: Howard E. Simmons, III
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Patent number: 5508357Abstract: A polyimide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.Type: GrantFiled: September 16, 1994Date of Patent: April 16, 1996Assignee: Hitachi Chemical Company, Ltd.Inventors: Hidekazu Matsuura, Yoshihide Iwasaki, Kaori Ikeda, Takayuki Suzuki, Masashi Tanaka, Yasuo Miyadera
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Patent number: 5508377Abstract: This invention relates to a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is ##STR2## and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.Type: GrantFiled: December 13, 1994Date of Patent: April 16, 1996Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Wataru Yamashita, Yuichi Okawa, Shoji Tamai, Akihiro Yamaguchi
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Patent number: 5504182Abstract: Thermoplastically processable aromatic polyether amideThermoplastically processable aromatic polyether amide of the formula (I) ##STR1## in which the symbols Ar, Ar', Ar.sub.1, Ar.sub.2, R, R', Y, x, y and z have the following meanings:Ar is a divalent, substituted or unsubstituted, aromatic or heteroaromatic radical or a group--Ar*--Q--Ar*--in whichQ is a bond or an --O--, --C(CH.sub.3).sub.2, --CO--, --S--, --SO-- or --SO.sub.2 -- bridge and Ar* is an aromatic radical. The carbonyl groups of the Ar radical are on non-adjacent ring carbon atoms.A is up to three different radicals.Ar' has the meaning given for Ar or is an Ar--Z--Ar group.In this case, Z is a --C(CH.sub.3).sub.2 -- or --O--Ar*--O--bridge.Y is a --C(CH.sub.3).sub.2 --, --SO.sub.2 --, --S-- or a --C(CF.sub.3).sub.2 --bridge and has up to two different meanings in the same polymer.Ar.sub.1 and Ar.sub.2 are identical or different from one another and are each a substituted or unsubstituted para- or meta-arylene radical.Type: GrantFiled: April 30, 1993Date of Patent: April 2, 1996Assignee: Hoechst AktiengesellschaftInventors: Harald Cherdron, Willi Kreuder, Arnold Schneller, Otto Herrmann-Schonherr
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Patent number: 5502157Abstract: A copolyimide was prepared by reacting 3,4'-oxydianiline (3,4'-ODA) with a dianhydride blend comprising, based on the total amount of the dianhydride blend, about 67 to 80 mole percent of 4,4'-oxydiphthalic anhydride (ODPA) and about 20 to 33 mole percent of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA). The copolyimide may be endcapped with up to about 10 mole percent of a monofunctional aromatic anhydride and has unbalanced stoichiometry such that a molar deficit in the dianhydride blend is compensated with twice the molar amount of the monofunctional aromatic anhydride. The copolyimide was used to prepare composites, films and adhesives. The film and adhesive properties were significantly better than those of LaRC.TM.-IA.Type: GrantFiled: August 31, 1994Date of Patent: March 26, 1996Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Alice C. Chang, Terry L. St. Clair
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Patent number: 5502156Abstract: Disclosed is a thermally-stable SnO.sub.2 -surfaced polyimide film wherein the electrical conductivity of the SnO.sub.2 surface is within the range of about 3.0.times.10.sup.-3 to about 1.times.10.sup.-2 ohms.sup.-1,. Also disclosed is a method of preparing this film from a solution containing a polyamic acid and SnCl.sub.4 (DMSO).sub.2.Type: GrantFiled: July 28, 1994Date of Patent: March 26, 1996Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Anne K. St. Clair, Stephen A. Ezzell, Larry T. Taylor, Harold G. Boston
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Patent number: 5498691Abstract: Disclosed are bis-meta-benzotrifluoride compounds having the general formula ##STR1## where each A is independently selected from the group consisting of NO.sub.2, NH.sub.2, and NH.sub.3.sup.+ Z.sup.-, Z.sup.- is an anion and B is selected from the group consisting of O, CO, S, SO, and SO.sub.2. The diamine compounds are useful as monomers in making polyimides, polyamide-imides, and polyamides.Type: GrantFiled: October 9, 1990Date of Patent: March 12, 1996Assignee: Occidental Chemical CorporationInventors: Jeffrey S. Stults, Henry C. Lin, Robert A. Buchanan, Robert L. Ostrozynski
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Patent number: 5498784Abstract: Alcohol-soluble aromatic heterocyclic copolymers having repeating units of the formula: ##STR1## wherein x has a value of 0.05 to 0.50 and y has a value of 1.0-x. These copolymers are useful in the preparation of organic/inorganic hybrid materials having transparency which comprise the sol-gel derived, hydrolytically condensed reaction product of a metal alkoxide of the formula M(OR).sub.w wherein R is a lower alkyl group, M is Si, Ti, Al or a mixture thereof, and w is the valence value of M, and the above copolymer.Type: GrantFiled: February 21, 1995Date of Patent: March 12, 1996Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Fred E. Arnold, Jom P. Chen
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Patent number: 5496915Abstract: Polyimides are obtainable by reacting a dianhydride component with a diamine component, at least one diamine containing cycloaliphatic units, with the proviso that the dianhydride component is a mixture of different dianhydrides if the diamine component consists only of one diamine containing cycloaliphatic units and the diamine component is a mixture of different diamines if the dianhydride component consists of only one dianhydride.Type: GrantFiled: February 13, 1995Date of Patent: March 5, 1996Assignee: BASF AktiengesellschaftInventors: Christian Fischer, Karin Elbl-Weiser, Ju/ rgen Koch
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Patent number: 5494991Abstract: Polyimides comprising recurring units of the following general formula (1) ##STR1## wherein Ar.sub.1 represents a tetravalent aromatic group and each Ar.sub.2 represents a divalent aromatic group. Polyimide copolymers and preparations of the polyimides and the polyimide copolymers are also described.Type: GrantFiled: June 17, 1994Date of Patent: February 27, 1996Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Ichiro Kaneko, Atushi Sugitani, Masahiro Yuyama, Kiyoshi Motomi
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Patent number: 5492996Abstract: Alcohol-soluble aromatic heterocyclic polymers having repeating units of the formula: ##STR1## wherein X is --O-- or --S--, and R is selected from the group consisting of: ##STR2## and R' is selected from the group consisting of alkyl having 1 to 5 carbon atoms, alkaryl having 7 to 12 carbon atoms, aralkyl having 7 to 12 carbon atoms and substituted aromatic having 1 to 3 substituent groups.The alcohol-soluble polymers may be used for fabricating organic/inorganic hybrid composites with metal alkoxides M(OQ).sub.v, wherein M is Si, Ti, Al or the like and Q is a lower alkyl group. These polymers can also be used to coat materials or substrates which are susceptible to attack by highly corrosive acids. On drying, the ionic bond between the trialkylamine and the sulfo group is broken and the polymer reverts to the parent structure, thereby leaving a polymer coating. Yet further, the original amine can be exchanged with a less volatile amine or an amine having a desired functionality.Type: GrantFiled: February 21, 1995Date of Patent: February 20, 1996Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Thuy D. Dang, Jom P. Chen, Fred E. Arnold
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Patent number: 5493003Abstract: Solutions of polyimide-forming substances containA) polyamines andB) amides and/or esters of tetracarboxylic acids, the amido or ester groups carrying substituents selected from the group consisting of carboxyl, sulfo and silicon-containing groups,and are used as polyimide coatings.Type: GrantFiled: October 11, 1994Date of Patent: February 20, 1996Assignee: BASF Lacke + Farben AktiengesellschaftInventors: Rainer Blum, Manfred Schwarz, Gerhard Hoffmann
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Patent number: 5489644Abstract: Solutions of polyimide-forming substances containA) aromatic or partly aromatic diamines andB) tetraesters of imide-forming aromatic or partly aromatic tetracarboxylic acids or mixtures of these tetraesters with the corresponding tri-, di- and/or monoesters.These solutions are suitable for the production of coatings.Type: GrantFiled: March 31, 1994Date of Patent: February 6, 1996Assignee: BASF Lacke + FarbenInventors: Rainer Blum, Gerhard Hoffmann
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Patent number: 5484880Abstract: The present invention relates to an amorphous polyimide or a polyimide copolymer having a requisite structural unit consisting of one or more recurring structural units represented by the formula (1): ##STR1## wherein X is a direct bond, oxygen atom or sulfur atom, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are individually a hydrogen atom or methyl, and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.Polyimide and the polyimide copolymer of the invention has excellent heat resistance, is outstanding in melt-flow stability, has greatly improved processability, and can be applied to structural materials, and electric- electronic appliances.Type: GrantFiled: December 13, 1994Date of Patent: January 16, 1996Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Wataru Yamashita, Yuichi Okawa, Shoji Tamai, Mitsunori Matsuo, Tsutomu Ishida, Keizaburo Yamaguchi, Akihiro Yamaguchi
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Patent number: 5484879Abstract: Polyimide polymers of the following recurring structure and the corresponding polyamic acids are disclosed: ##STR1## wherein AR.sub.1 is ##STR2## where X is O, S, SO, SO.sub.2, CO, C(CF.sub.3).sub.2, C(CH.sub.3).sub.2, Si(CH.sub.3).sub.2, or a single bond, wherein AR.sub.2 may be pyromellitic dianhydride, a substituted pyromellitic dianhydride, naphthanoic dianhydride, or ##STR3## where Y is O, S, SO, SO.sub.2, CO, C(CF.sub.3).sub.2, C(CH.sub.3).sub.2, Si(CH.sub.3).sub.2 --O--AR--O--, or a single bond, where AR is an aromatic nucleus.Type: GrantFiled: December 17, 1990Date of Patent: January 16, 1996Assignee: Occidental Chemical CorporationInventors: Robert A. Buchanan, Jeffrey S. Stults, Ronald F. Spohn
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Patent number: 5480964Abstract: A negative birefringent film, useful in liquid crystal displays, and a method for controlling the negative birefringence of a polyimide film is disclosed which allows the matching of an application to a targeted amount of birefringence by controlling the degree of in-plane orientation of the polyimide by the selection of functional groups within both the diamine and dianhydride segments of the polyimide which affect the polyimide backbone chain rigidity, linearity, and symmetry. The higher the rigidity, linearity and symmetry of the polyimide backbone, the larger the value of the negative birefringence of the polyimide film.Type: GrantFiled: April 21, 1994Date of Patent: January 2, 1996Assignee: The University of AkronInventors: Frank W. Harris, Stephen Z. D. Cheng
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Patent number: 5480965Abstract: This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide.Type: GrantFiled: July 26, 1994Date of Patent: January 2, 1996Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Wataru Yamashita, Yuichi Okawa, Hideaki Oikawa, Tadashi Asanuma, Yuko Ishihara, Mitsunori Matsuo, Keizaburo Yamaguchi, Akihiro Yamaguchi, Shoji Tamai
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Patent number: 5478916Abstract: A solvent resistant copolyimide was prepared by reacting 4,4'-oxydiphthalic anhydride with a diaimine blend comprising, based on the total amount of the diamine blend, about 75 to 90 mole percent of 3,4'-oxydianiline and about 10 to 25 mole percent p-phenylene diamine. The solvent resistant copolyimide had a higher glass transition temperature when cured at 350.degree. , 371.degree. and 400.degree. C. than LaRC.TM.-IA. The composite prepared from the copolyimide had similar mechanical properties to LaRC.TM.-IA. Films prepared from the copolyimide were resistant to immediate breakage when exposed to solvents such as dimethylacetamide and chloroform. The adhesive properties of the copolyimide were maintained even after testing at 23.degree., 150.degree., 177.degree. and 204.degree. C.Type: GrantFiled: September 1, 1994Date of Patent: December 26, 1995Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Alice C. Chang, Terry L. St. Clair
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Patent number: 5478914Abstract: Polyimides comprising recurring units of the following general formula (1) ##STR1## wherein R.sub.1 represents a tetravalent aromatic group. Polyimide copolymers and preparations of the polyimides and the polyimide copolymers are also described.Type: GrantFiled: July 1, 1994Date of Patent: December 26, 1995Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Ichiro Kaneko, Atushi Sugitani, Masahiro Yuyama, Kiyoshi Motomi
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Patent number: 5478918Abstract: A polyimide precursor composition solution includes a tetracarboxylic acid component containing not less than 70 mol % of at least one selected from the group consisting of benzenetetracarboxylic acid and its reactive derivatives; a maleimide compound; and a diamine component containing not less than 70 mol % of 2,2'-substituted-4,4'-benzidine represented by the general formula (I) and siloxydiamine amounting to from 1 to 10 mol %. The tetracarboxylic acid component, the maleimide compound and the diamine component are dissolved in a solvent which is consisting essentially of .gamma.-butyrolactone. The amount of the tetracarboxylic acid component is substantially equivalent to that of the diamine component. The amount of the maleimide compound is from 5 to 30 wt % of the total weight of the tetracarboxylic acid and the diamine component.Type: GrantFiled: February 1, 1994Date of Patent: December 26, 1995Assignee: Central Glass Company, LimitedInventors: Masamichi Maruta, Hidehisa Nanai, Yoshihiro Moroi, Hiroshi Takahashi, Seiji Hasegawa
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Patent number: 5478913Abstract: Copolyimides from 1,4-bis(4-aminophenoxy)-2-phenylbenzene and m- or p-phenylene diamine with biphenyl dianhydride exhibit a high Tg and reduced melt viscosity.Type: GrantFiled: August 31, 1994Date of Patent: December 26, 1995Assignee: E. I. Du Pont de Nemours and CompanyInventors: Richard J. Boyce, Thomas P. Gannett, James M. Sonnett, Murty S. Tanikella, Brian C. Auman
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Patent number: 5478915Abstract: Polyimide oligomers are described which comprise the condensation product of: at least one phenylindane diamine and at least one aromatic bis(ether anhydride). The polyimide oligomers of the invention are readily processed to form solution prepregable polyimide composites having high glass transition temperatures and high temperature and oxidative stability. More particularly, the present invention provides for crosslinkable polyimide oligomers prepared by reacting, in a suitable solvent under an inert atmosphere, a mixture of monomers comprising: (A) an aromatic diamine component comprising from about 25 to 100 mole % of at least one phenylindane diamine; (B) a dianhydride component comprising from about 25 to 100 mole % of at least one aromatic his(ether anhydride); and (C) at least one end-cap monomer selected from the group consisting of monoanhydrides, acyl halides and aromatic amines, wherein each end-cap monomer contains at least one crosslinkable functional group in the molecule.Type: GrantFiled: December 30, 1993Date of Patent: December 26, 1995Assignee: Ciba-Geigy CorporationInventors: Michael Amone, Mark R. Southcott
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Patent number: 5478917Abstract: Solutions of polyimide-forming substances containA) aromatic or partly aromatic polyamines andB) amides or a mixture of esters and amides of tetracarboxylic acids.Solutions are useful as coating compositions.Type: GrantFiled: October 11, 1994Date of Patent: December 26, 1995Assignee: BASF Lacke + Farben AktiengesellschaftInventors: Rainer Blum, Gerhard Hoffmann
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Patent number: 5472823Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.Type: GrantFiled: January 15, 1993Date of Patent: December 5, 1995Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima
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Patent number: 5473010Abstract: The present invention relates to a polyimide based resin composition comprises 1 to 50 parts by weight of polyetherimide for 100 parts by weight a resin composition comprising 50 to 99 parts by weight of polyarylether ketone and 50 to 1 parts by weight of polyimide having specific structural units.The polyimide based resin compositions have excellent fatigue characteristics and creep resistance and are expected widely to apply in field of machine and automobile parts which is required permanence for mechanical strength.Type: GrantFiled: August 30, 1994Date of Patent: December 5, 1995Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Atsushi Morita, Tomohito Koba, Toshiaki Takahashi, Katsunori Shimamura, Toshiyuki Kataoka, Hiroyuki Furukawa, Hiroaki Tomimoto
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Patent number: 5470943Abstract: This invention relates to a novel fluorine-containing polyimide or polyimide copolymer being colorless and having transparency and very low dielectric characteristics, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.Type: GrantFiled: December 21, 1994Date of Patent: November 28, 1995Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Yoshihiro Sakata, Wataru Yamashita, Yuichi Okawa, Shoji Tamai, Tsutomu Ishida, Mitsunori Matsuo, Keizaburo Yamaguchi, Akihiro Yamaguchi
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Patent number: 5464925Abstract: The present invention is an oligomer represented by the formula: ##STR1## wherein X is a moiety selected from the group consisting of: ##STR2## where each Y is independently S, O, CH.sub.2, C.dbd.O, CH.sub.3 --C--CH.sub.3, O.dbd.S.dbd.O, or CF.sub.3 --C--CF.sub.3.In another aspect, the present invention is a polymer of the above-described oligomer.Type: GrantFiled: May 25, 1994Date of Patent: November 7, 1995Assignee: The Dow Chemical CompanyInventors: Eric S. Moyer, Denise J. D. Moyer
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Patent number: 5464923Abstract: The present invention provides novel substituted biphenyl pyrazines or pyrazine derivatives ("BPD") which are functional and have useful application as a monomer for a variety of high performance polymers such as polyester, polyarylate, polycarbonate, polyetherketones, epoxides, polyimides, polyamides, and polyamides-imides; and as pigments for coating compositions such as paints. These BPD have the general formula: ##STR1## wherein R.sub.1 -R.sub.8 and n are defined herein.Type: GrantFiled: October 19, 1994Date of Patent: November 7, 1995Assignee: Hoechst Celanese CorporationInventors: Richard Vicari, George Kvakovszky, Olan S. Fruchey
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Patent number: 5464927Abstract: Copolyamic acid is obtained from tetracarboxylic acid dianhydride, diamine and a fluorinated diamine and/or fluorinated tetracarboxylic acid dianhydride; and optionally ester or amine salt derivative thereof to obtain radiation sensitive polymer; and low optical high thermally stable polyimide from curing the above polyamic acid and/or derivative thereof.Type: GrantFiled: May 10, 1993Date of Patent: November 7, 1995Assignee: International Business Machines CorporationInventors: Marie Angelopoulos, Jeffrey D. Gelorme, Jeffrey W. Labadie, David A. Lewis, Sally A. Swanson, Nancy C. Labianca
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Patent number: 5464928Abstract: The invention is a direct process for preparing semi-crystalline polyimides. This process comprises the steps of: providing a polar aprotic solvent, adding a dianhydride and a diamine to the solvent to form a mixture, stirring the mixture at ambient temperature, and adding glacial acetic acid to the mixture to provide a ratio of polar aprotic solvent to glacial acetic acid which ranges from about 90 to 10 to about 75 to 25 by volume to form a solution. The solution was heated to a range from about 110.degree. C. to about 140.degree. C. to form a polyimide precipitate. The polyimide precipitate was recovered as a semi-crystalline polyimide powder.Type: GrantFiled: September 1, 1994Date of Patent: November 7, 1995Assignee: The United States of America as represented by the United States National Aeronautics and Space AdministrationInventors: Alice C. Chang, Terry L. St. Clair
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Patent number: 5463016Abstract: This invention provides (1) a granular material of a polyimide precursor, which has excellent solubility in solvents and excellent moldability and from which a polyimide molding having excellent mechanical properties can be produced, (2) a mixture of a granular material of a polyimide precursor with a solvent, in which the polyimide precursor shows excellent storage stability and (3) a process for the production of a granular material of a polyimide precursor, in which a solvent can be easily removed. Particularly provided are a polyimide precursor granular material having an intrinsic viscosity of 0.7 or higher and a polyimide precursor mixture which consists of a polyimide precursor granular polyimide having an intrinsic viscosity of 0.7 or higher and a solvent that does not exhibit a strong-mutual interaction with the polyimide precursor, as well as a process for the production of the polyimide precursor granular material.Type: GrantFiled: February 9, 1994Date of Patent: October 31, 1995Assignee: Unitika Ltd.Inventors: Isao Tomioka, Takeshi Nakano, Mikio Furukawa, Yoshiaki Echigo
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Patent number: 5459233Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.Type: GrantFiled: December 7, 1993Date of Patent: October 17, 1995Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi
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Patent number: 5459232Abstract: A nonlinear optical material composed of a polyimide obtained from a diamine and/or a diacid anhydride or dithioacid anhydride substituted by a portion having a nonlinear optical effect or of molecules having a benzocyclobutene structure substituted at the portions having an nonlinear linear optical effect.Type: GrantFiled: July 9, 1993Date of Patent: October 17, 1995Assignee: Fujitsu LimitedInventors: Wataru Sotoyama, Satoshi Tatsuura, Tetsuzo Yoshimura, Azuma Matsuura, Tomoaki Hayano
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Patent number: 5457154Abstract: A moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide resin. A further aspect relates to a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide resin. A still further aspect relates to a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.Type: GrantFiled: November 9, 1992Date of Patent: October 10, 1995Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Masahiro Ohta, Akio Matsuyama, Eiji Senoue, Fumiaki Kuwano, Osamu Yasui, Yasunori Yoshida, Akinori Ryu, Tadashi Kobayashi
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Patent number: 5455327Abstract: Two monomers containing meta-biphenylenedioxy moieties were prepared. One monomer, a diamine, is used to prepare polyimide, polyamide, and epoxy polymers. The other monomer, a dianhydride, was used to prepare polyimide polymers. These polymers are used to make films, coatings, and selective membranes.Type: GrantFiled: December 16, 1993Date of Patent: October 3, 1995Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Terry L. St. Clair, J. Richard Pratt
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Patent number: 5453326Abstract: The present invention relates to a polymeric film in-line coated with polyamido-polyethyleneimine to render the film receptive to direct extrusion coating with other polymers or to ink adhesion and to a method of making the same. Additionally, the present invention relates to an oriented polymeric film which has been in-line coated with polyamido-polyethyleneimine so that it has anti-static properties for other packaging applications.Type: GrantFiled: December 22, 1994Date of Patent: September 26, 1995Inventor: Junaid A. Siddiqui
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Patent number: 5453515Abstract: Benzophenone iminodiimides of the formula I ##STR1## which Y denotes hydroxyl or carboxyl, R.sub.1 denotes the optionally substituted radicals alkylene, phenylene or benzylidene, R.sub.2 denotes the radicals OH, substituted or unsubstituted alkyl or NH--CO--NHR.sub.3 and R.sub.3 denotes the radicals H, alkyl, phenyl or benzyl, processes for their preparation and polymers prepared therefrom.Type: GrantFiled: December 27, 1993Date of Patent: September 26, 1995Assignee: Chemie Linz Gesellschaft m.b.H.Inventors: Gerd Greber, deceased, Heinrich Gruber, Afschin Hassanein
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Patent number: 5453482Abstract: Provided is a new process useful for preparing arylsulfonyl halides, which comprises the addition or drowning of halosulfonation reaction products, produced by the reaction of aromatic compounds (arenes), with excess halosulfonic acid, into C.sub.3 -C.sub.6 aliphatic ketones, preferably acetone, isopropyl alcohol, or mixtures thereof, instead of drowning into water as is known in the art of aromatic sulfonyl chloride preparation. Less heat of reaction is observed, thus making the drowning of the halosulfonation reaction mixture safer and more controllable. Further, less hydrogen chloride gas is evolved from the drowning mixture and generally more highly pure arylsulfonyl chlorides are produced.Type: GrantFiled: March 18, 1994Date of Patent: September 26, 1995Assignee: Eastman Chemical CompanyInventors: Max A. Weaver, William W. Parham, James J. Krutak, Kim S. Chamberlin
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Patent number: 5453484Abstract: A diamine compound of the general formula ##STR1## wherein the arrows denote isomerism, R.sub.1 is a divalent aromatic group selected from the group consisting of ##STR2## R.sub.2 is a tetravalent aromatic group selected from the group consisting of ##STR3## and R.sub.4 is a monovalent aliphatic group selected from the group consisting of ethyl and isopropyl; and, a process for preparing same.Type: GrantFiled: June 30, 1994Date of Patent: September 26, 1995Assignee: Korea Research Institute of Chemical TechnologyInventors: Suh Bong Rhee, Ji Young Chang, Bong Seok Moon, Ji-Woong Park
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Patent number: 5449742Abstract: Polyimide optical waveguide structures comprising a core within a cladding wherein at least one of the core and the cladding is a polyimide containing 6FDA, BTDA, an aromatic diamine having bulky methyl groups ortho to the amine, and a co-diamine wherein the polyimides have the properties of low optical loss, low optical absorbance, controllable refractive index, and high thermal stability, and wherein the polyimides are photosensitive and solvent resistant.Type: GrantFiled: February 15, 1994Date of Patent: September 12, 1995Assignee: Amoco CorporationInventors: Allyson J. Beuhler, David A. Wargowski
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Patent number: 5449741Abstract: A polyimide optical material, composed of a perfluorinated polyimide having a perfluorinated repeating unit represented by general formula (1) ##STR1## wherein R.sub.1 is a tetravalent perfluorinated organic group; and R.sub.2 is a divalent perfluorinated organic group.Type: GrantFiled: October 25, 1993Date of Patent: September 12, 1995Assignee: Nippon Telegraph and Telephone CorporationInventors: Shinji Ando, Toru Matsuura, Shigekuni Sasaki, Fumio Yamamoto