Phenolic Reactant Contains At Least Two Aryl Rings And Two Diverse Phenolic To Oxygen Bonds Patents (Class 528/185)
  • Patent number: 10407605
    Abstract: A polymer composition that has an in-plane thermal conductivity of about 2.0 W/m-K or more is provided. The composition comprises 100 parts by weight of at least one aromatic polymer; from about 10 to about 50 parts by weight of an inorganic material having a hardness value of about 2.5 or more based on the Mohs hardness scale; and from about 20 to about 80 parts by weight of a thermally conductive particulate material having an average size of from about 1 to about 100 micrometers.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: September 10, 2019
    Assignee: Ticona LLC
    Inventors: Young Shin Kim, Kevin A. McCullough, Xinyu Zhao
  • Patent number: 9862809
    Abstract: A camera module that comprises a molded part is provided. The molded part includes a polymer composition that has an in-plane thermal conductivity of about 2.0 W/m-K or more. The polymer composition includes an aromatic polymer and a thermally conductive particulate material.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: January 9, 2018
    Assignee: Ticona LLC
    Inventors: Young Shin Kim, Kevin A. McCullough, Xinyu Zhao
  • Patent number: 9255181
    Abstract: The disclosure relates to a process that includes blending a polyimide resin and a primary alky amine organic compound to produce an aryl amine functionalized polyimide, having aryl amine functionality in excess of any anhydride functionality. The polyimide resin can have a weight average molecular weight (Mw) from 5,000 to 100,000 daltons. The organic compound can include at least one primary aliphatic amine without a direct linkage of a nitrogen to an aryl group and without a functionality selected from a halogen functionality, a hydroxyl functionality, a sulfonic acid functionality, a sulfonic acid salt functionality, and combinations thereof. The disclosure also relates to alkyl imide functionalized polyimides also with aryl amine functionalized polyimides, having aryl amine functionality in excess of any anhydride functionality and articles produced therefrom.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: February 9, 2016
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Robert R. Gallucci, Roy Odle, Daniel F. Lowery, Richard Peters
  • Publication number: 20150132591
    Abstract: A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI): in which A is tetravalent aromatic group or aliphatic group, B is divalent aromatic group, and each R2 independently represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, in which B in general formula (AI) includes a triazine moiety represented by following formula (AB1): in which R1 represents hydrogen, an alkyl group having 1 to 6 carbon atoms or an aromatic group, and R3 represents hydrogen, methyl or ethyl.
    Type: Application
    Filed: May 14, 2013
    Publication date: May 14, 2015
    Inventors: Yoshiyuki Oishi, Shin-ichiro Kohama, Nobuharu Hisano
  • Patent number: 8975365
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: March 10, 2015
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Patent number: 8974903
    Abstract: Porous cross-linked polyimide-urea networks are provided. The networks comprise a subunit comprising two anhydride end-capped polyamic acid oligomers in direct connection via a urea linkage. The oligomers (a) each comprise a repeating unit of a dianhydride and a diamine and a terminal anhydride group and (b) are formulated with 2 to 15 of the repeating units. The subunit was formed by reaction of the diamine and a diisocyanate to form a diamine-urea linkage-diamine group, followed by reaction of the diamine-urea linkage-diamine group with the dianhydride and the diamine to form the subunit. The subunit has been cross-linked via a cross-linking agent, comprising three or more amine groups, at a balanced stoichiometry of the amine groups to the terminal anhydride groups. The subunit has been chemically imidized to yield the porous cross-linked polyimide-urea network. Also provided are wet gels, aerogels, and thin films comprising the networks, and methods of making the networks.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 10, 2015
    Assignees: Ohio Aerospace Institute, The United States of America, represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Mary Ann B. Meador, Baochau N. Nguyen
  • Publication number: 20140213722
    Abstract: A thermosetting composition containing a compound (A) and a compound (B) is described, wherein the compound (A) is a carboxylic acid ester having at least one group represented by formula (1): and the compound (B) is a diamine. In formula (1), R1 is alkyl having 1 to 10 carbons, R2 is independently alkylene having 2 or 3 carbons, and n is an integer of 1 to 3.
    Type: Application
    Filed: January 27, 2014
    Publication date: July 31, 2014
    Applicant: JNC CORPORATION
    Inventors: TAKAYUKI HIROTA, HIROSHI ANRAKU, AYAKO KIKUCHI, HIROYUKI SATO
  • Patent number: 8785589
    Abstract: Cross-linked polyimides based on a novel crosslinker and methods of making the same. The general structure of these heat-resistant and amorphous polyimides is shown as follows: in which n, m, and l denote the degrees of polymerization (DP) of each arm and the linking group R? is one of the following moieties: —C(CF3)2—, —O—, —SO2—, >C(?O), —OPh-C(CH3)2-PhO-, -(Ph)C(CF3)—, or a direct bond (—). Films (cantilevers) comprising cross-linked polyimides according to the present invention demonstrate photodirected bending upon exposure to linearly polarized light.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: July 22, 2014
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Loon-Seng Tan, David Huabin Wang, Kyung Min Lee, Timothy J. White
  • Publication number: 20140178823
    Abstract: A photosensitive polyimide and negative type photo-resist composition containing the same are provided. The photosensitive polyimide is represented by formula (I): wherein X1 and X3 are the same or different organic functional groups having four covalent bonds; X2 and X4 are the same or different organic functional groups having two covalent bonds, and X2 contains functional groups of OH or COOH and any one selected from the functional groups below: wherein R is H or CH3, p and q are integers of 1 to 20, and m and n in formula (I) are numbers of repeat units.
    Type: Application
    Filed: June 3, 2013
    Publication date: June 26, 2014
    Inventors: Chen-Lung LIN, Fu-Shun HSU, Kuo-Chan CHIOU
  • Publication number: 20140135447
    Abstract: Reactive extrusion can be used in a continuous, solvent-less preparation of imide oligomers involving two competing reactions among three ingredients, the first reaction between a dianhydride and a diamine and the second reaction between an endcap and the diamine. The imide oligomer can form a composite via conventional production methods or via formation of a film from imide oligomer re-melted in an extruder before being impregnated into tape or fabric.
    Type: Application
    Filed: July 3, 2012
    Publication date: May 15, 2014
    Applicant: POLYONE CORPORATION
    Inventors: Joseph C. Golba, Thomas W. Hughes, Roger W. Avakian
  • Publication number: 20140114027
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Application
    Filed: December 31, 2013
    Publication date: April 24, 2014
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Patent number: 8658743
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 25, 2014
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Patent number: 8618244
    Abstract: Disclosed herein are a method for preparing a benzoxazole-based polymer by thermal rearrangement, the benzoxazole-based polymer prepared by the method and a gas separation membrane comprising the polymer. More specifically, provided are a method for preparing a benzoxazole-based polymer by subjecting poly(hydroxyamide) as an intermediate to thermal treatment involving dehydration, the benzoxazole-based polymer obtained thereby and gas separation membrane comprising the polymer. The benzoxazole-based polymer of the present invention can be simply prepared by thermally rearrangement via thermal treatment at low temperatures, and thus exhibits superior mechanical and morphological properties and has well-connected microcavities. Due to showing excellent permeability and selectivity for various gases, the benzoxazole-based polymer is suited for application to gas separation membranes, in particular, gas separation membranes for small gases.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: December 31, 2013
    Assignee: Industry-University Cooperation Foundation, Hanyang University
    Inventors: Young Moo Lee, Keun-Young Kim, Chul-Ho Jung, Ho-Bum Park
  • Publication number: 20130319229
    Abstract: An asymmetric gas separation membrane made of an aromatic polyimide mainly containing repeating units having an ether bond which is heated at a temperature near a softening point (Ts) of the aromatic polyimide, and a method for separating methanol from a methanol-containing mixed organic vapor by allowing methanol to selectively permeate the asymmetric gas separation membrane using the membrane.
    Type: Application
    Filed: December 9, 2011
    Publication date: December 5, 2013
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Ryoichi Takada, Harutoshi Hoshino, Tomonori Kanougi, Toshimune Yoshinaga, Kenji Fukunaga
  • Publication number: 20130324662
    Abstract: The present invention provides a polybenzoxazole resin containing a repeating unit represented by the following general formula (1): wherein R1 is a tetravalent aromatic group; N atoms and O atoms which are bonded to R1 are present in the form of pairs each consisting of an N atom and an O atom such that the N atom and the O atom in each pair are respectively bonded to adjacent two carbon atoms constituting the same aromatic ring in R1; R2 is an alkanediyl group having 1 to 6 carbon atoms; and n is an integer of 2 to 10000, which is excellent in electrical insulating properties, heat resistance, mechanical properties, physical properties, dimensional stability and the like, as well as a polybenzoxazole precursor capable of producing the polybenzoxazole resin which is excellent in solubility in solvents and storage stability.
    Type: Application
    Filed: April 4, 2012
    Publication date: December 5, 2013
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Eiichi Honda
  • Patent number: 8536298
    Abstract: A process for preparing polyimide resins comprises stirring a diamine and a dianhydride in a solvent to form a slurry; heating the slurry to a temperature sufficient for the diamine and dianhydride to react wherein the temperature is below the melting point of the dianhydride, below the melting point of the diamine, or below the melting points of the dianhydride and diamine; and reacting the diamine and dianhydride to form a polyimide having sufficient molecular weight to precipitate from the solvent.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: September 17, 2013
    Assignee: SABIC Innovative Platics IP B.V.
    Inventors: Philip L. Angermeier, Robert Edgar Colborn, Robert R. Gallucci, Paul Edward Howson, Tara Jane Mullen, Roy Ray Odle, Albert Santo Stella, John Morgan Whitney
  • Patent number: 8487064
    Abstract: Disclosed herein are polymer compounds and a method for preparing thereof. More specifically, provided are polymer compounds with well-connected, narrow size distribution free-volume element and a method for preparing the polymer compounds by thermal rearrangement for aromatic polyimides containing ortho-positioned functional groups in the solid state.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: July 16, 2013
    Assignee: Industry-University Cooperation Foundation, Hanyang University
    Inventors: Young Moo Lee, Ho-Bum Park, Chul-Ho Jung, Sang-Hoon Han
  • Publication number: 20130053489
    Abstract: This disclosure relates to polyetherimide compositions whose residual phenolic monomers exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed polyetherimides and articles of manufacture comprising the disclosed polyetherimides.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 28, 2013
    Inventors: Robert R. Gallucci, James A. Mahood, Roy R. Odle, Steve Dimond
  • Publication number: 20130021546
    Abstract: A substrate used for a liquid crystal display element having two or more substrates arranged oppositely to each other and a liquid crystal material exhibiting a blue phase between the substrates, where a polar component of surface free energy on a substrate surface in contact with the liquid crystal material is less than 5 mJm?2; and a substrate used for a liquid crystal display element having two or more substrates arranged oppositely to each other and a liquid crystal material exhibiting a blue phase between the substrates, where a polar component of surface free energy on a substrate surface in contact with the liquid crystal material is in the range of 5 to 20 mJm?2, and a contact angle with an isotropic phase of the liquid crystal material on the substrate surface is 50 degrees or less.
    Type: Application
    Filed: August 26, 2010
    Publication date: January 24, 2013
    Applicants: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, JNC PETROCHEMICAL CORPORATION, JNC CORPORATION
    Inventors: Hirotsugu Kikuchi, Shin-ichi Yamamoto, Yasuhiro Haseba, Takafumi Kuninobu
  • Patent number: 8357753
    Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: January 22, 2013
    Assignee: CDA Processing Limited Liability Company
    Inventors: John D. Summers, Thomas Eugene Dueber
  • Patent number: 8303858
    Abstract: The present disclosure relates to the process of making a photochromic composite having a photochromic polymer and a binder polymer. The photochromic polymer is made by solution polymerization of the photochromic monomer and two monomers in the presence of a base and the binder polymer is made by solution polymerization of the two monomers in the presence of a base.
    Type: Grant
    Filed: March 8, 2010
    Date of Patent: November 6, 2012
    Assignee: Xerox Corporation
    Inventors: Kentaro Morimitsu, Adela Goredema, Gabriel Iftime, Peter M. Kazmaier, Roger E. Gaynor
  • Patent number: 8263221
    Abstract: Disclosed are processes for preparing polyareneazole polymers characterized as providing polymer solutions having an inherent viscosity of at least about 22 dl/g at 30° C. at a polymer concentration of 0.05 g/dl in methane sulfonic acid. Polyareneazoles, filaments and yarns are also disclosed.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: September 11, 2012
    Assignees: Magellan Systems International, LLC, E.I. du Pont de Nemours and Company
    Inventors: Doetze Jakob Sikkema, David J. Rodini, Qinghong Fu Adkins, Steven R. Allen, Christopher William Newton
  • Publication number: 20120160317
    Abstract: A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T). One of B and B? is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1˜4, A and A? are identical or different aromatic diamines, and at least one of A and A? is aromatic diamine with ether groups, and A could be the same as or different from A?.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chyi-Ming Leu, Chih-Cheng Lin, Chi-Fu Tseng, Hsueh-Yi Liao
  • Publication number: 20120122033
    Abstract: A polymer precursor including a part which sequences an unsaturated bond having a ? electron orbit and a single bond alternately is disclosed. The polymer precursor has a first functional group and a second functional group which form a repeating unit constituting a polymer skeleton of an end product by an intramolecular reaction. At least a part of a conjugated state formed by the ? electron orbit in the molecule is disconnected or weakened due to a three-dimensional structure of the molecule and a transmittance with respect to an electromagnetic wave of at least one wavelength selected from the group consisting of 436 nm, 405 nm, 365 nm, 248 nm and 193 nm is improved.
    Type: Application
    Filed: November 30, 2011
    Publication date: May 17, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Katsuya SAKAYORI
  • Publication number: 20120108759
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Application
    Filed: April 6, 2010
    Publication date: May 3, 2012
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Publication number: 20120101213
    Abstract: Provided are a polyimide which is inexpensive, has various excellent material properties including strength, heat resistance, low moisture absorption, mold releasability (detachability), dielectric properties, electrical properties, and optical properties, and can exhibit a high level of water repellency, and a polyamic acid composition useful as a raw material therefor. Also provided are the polyimide which can give a polyimide composition that, besides having such excellent material properties, is capable of having a controlled surface resistivity, and a polyamic acid composition useful as a raw material therefor.
    Type: Application
    Filed: June 28, 2010
    Publication date: April 26, 2012
    Applicant: NIPPON SHOKUBAI CO, LTD
    Inventors: Kozo Tajiri, Go Masuda, Tomomi Makino, Atsushi Okada
  • Patent number: 8153753
    Abstract: A polyamide having at least an alicyclic or aromatic group exhibiting a light transmittance of 80% or more in the wavelength region of 450 to 700 nm is produced by using an aramide polymer comprising specific structural units at an amount of 50 mol % or more. Colorless transparent alicyclic or aromatic polyamide films having high rigidity and high thermal resistance are provided by using the polyamide. Further, the invention provides various optical members made by using the polyamide or the polyamide films, and polyamide copolymers.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: April 10, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Hideki Moriyama, Akimitsu Tsukuda
  • Publication number: 20120042777
    Abstract: A method of separating components of a gas mixture, the method comprising: passing the gas mixture through a benzoxazole-based polymer membrane at a temperature of from about 30° C. to about 400° C., wherein the benzoxazole-based polymer membrane is represented by the formula: as is defined herein.
    Type: Application
    Filed: October 28, 2011
    Publication date: February 23, 2012
    Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
    Inventors: Young Moo LEE, Keun-Young Kim, Chul-Ho Jung, Ho-Bum Park, Hye Jin Kwon, Sang Hoon Han
  • Publication number: 20120016076
    Abstract: In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.
    Type: Application
    Filed: July 13, 2011
    Publication date: January 19, 2012
    Applicant: LG CHEM. LTD.
    Inventors: Sang Woo KIM, Se Jin SHIN, Dong Hyun OH, Kyung Jun KIM
  • Publication number: 20110301305
    Abstract: According to the present invention, a polymer is obtained by polycondensation of a fluorinated dicarboxylic acid derivative of the general formula (M-1) or an acid anhydride of the fluorinated dicarboxylic acid with a polyfunctional compound having two to four reactive groups corresponding in reactivity to carbonyl moieties of the fluorinated dicarboxylic acid derivative or acid anhydride. [Chem. 134] AOCF2C-Q-CF2COA???(M-1) In the above formula, Q represents a divalent organic group having a substituted or unsubstituted aromatic ring; and A and A? each independently represent an organic group. This polymer exhibits a sufficiently low dielectric constant for use as a semiconductor protection film and has the capability of forming a film at a relatively low temperature of 250° C. or lower.
    Type: Application
    Filed: February 18, 2010
    Publication date: December 8, 2011
    Applicant: CENTRAL GLASS COMPANY, LIMITED
    Inventors: Yoshimi Isono, Satoru Narizuka, Hidehisa Nanai, Kazuhiro Yamanaka
  • Publication number: 20110230605
    Abstract: Disclosed herein are polymer compounds and a method for preparing thereof. More specifically, provided are polymer compounds with well-connected, narrow size distribution free-volume element and a method for preparing the polymer compounds by thermal rearrangement for aromatic polyimides containing ortho-positioned functional groups in the solid state.
    Type: Application
    Filed: May 20, 2011
    Publication date: September 22, 2011
    Applicant: Industry-University Cooperation Foundation, HANYANG UNIVERSITY
    Inventors: Young-Moo Lee, Ho-Bum Park, Chul-Ho Jung, Sang-Hoon Han
  • Publication number: 20110215283
    Abstract: The present disclosure relates to the process of making a photochromic composite having a photochromic polymer and a binder polymer. The photochromic polymer is made by solution polymerization of the photochromic monomer and two monomers in the presence of a base and the binder polymer is made by solution polymerization of the two monomers in the presence of a base.
    Type: Application
    Filed: March 8, 2010
    Publication date: September 8, 2011
    Applicant: XEROX CORPORATION
    Inventors: Kentaro Morimitsu, Adela Goredema, Gabriel Iftime, Peter M. Kazmaier, Roger E. Gaynor
  • Patent number: 8013103
    Abstract: Disclosed herein are polymer compounds, a method for preparing thereof. More specifically, provided are polymer compounds with well-connected, narrow size distribution free-volume element and a method for preparing the polymer compounds by thermal rearrangement for aromatic polyimides containing ortho-positioned functional groups in the solid state.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: September 6, 2011
    Assignee: Industry-University Cooperation Foundation, HANYANG UNIVERSITY
    Inventors: Young-Moo Lee, Sang-Hoon Han, Chul-Ho Jung, Ho-Bum Park
  • Patent number: 7964698
    Abstract: The benefits of liquid crystal polymers and polyetherimides are combined in an all-aromatic thermoplastic liquid crystalline polyetherimide. Because of the unique molecular structure, all-aromatic thermotropic liquid crystal polymers exhibit outstanding processing properties, excellent barrier properties, low solubilities and low coefficients of thermal expansion in the processing direction. These characteristics are combined with the strength, thermal, and radiation stability of polyetherimides.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: June 21, 2011
    Assignee: United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Erik S. Weiser, Theodorus J. Dingemans, Terry L. St. Clair, Jeffrey A. Hinkley
  • Patent number: 7790831
    Abstract: In accordance with the present invention there are provided hyperbranched benzobisazole polymers having repeating units of the formulas: and hyperbranched bibenzazole polymers having repeating units of the formulas: wherein Q is —S— or —NH—; the terminal groups X and Y are COOH and respectively, with their total number (X+Y) equals n+1, where n=degree of polymerization. The ratio X:Y can be controlled by varying the stoichiometric ratio of trimesic acid (A3 monomer) and 2,5-diamino-1,4-dimercaptobenzene dihydrochloride (B2 monomer) from 1:1 to 1.1.35.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: September 7, 2010
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Loon-Seng Tan, David H. Wang, Jong-Beom Baek
  • Patent number: 7652125
    Abstract: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: January 26, 2010
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takashi Enoki, Atsushi Izumi, Yumiko Yamamoto, Takahiro Harada
  • Patent number: 7605222
    Abstract: Copolyetherimides compositions having high glass transition temperatures and outstanding ductility are presented. The copolyetherimides having Mw of at least 40,000 comprising isomeric bis(phthalimide) structural units within a relatively narrow range of isomer proportions exhibited Tgs of at least 240° C. and outstanding Notched Izod values. The copolyetherimides comprise oxydianiline residues and structural units of the formulas (I) and (II) (III).
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: October 20, 2009
    Assignee: SABIC Innovative Plastics IP B.V.
    Inventors: Qing Ye, David Bruce Hall, William David Richards, Daniel Joseph Brunelle, Havva Yagci Acar
  • Patent number: 7582719
    Abstract: Hyperbranched benzazole polymers having repeating units of the formula: wherein Q is —O—, —S— or —NH—, and the terminal groups R are carboxylic acids with their total number equals n+1. A generic method for preparing the polymers is provided. Also provided are the star block copolymers derived from these hyperbranched benzazole polymers and linear poly(ether-ketones) having the following generic formula where x and y are the numbers of repeat units for each poly(ether-ketone) chain; the placement of the carbonyl moieties in the repeat units of the poly(ether-ketone) chains can be either meta or para to the phenoxy groups; the maximal number of poly(ether-ketone) chains is n+1, where n=number of repeat units for hyperbranched polybenzazole). A general method for synthesizing these star block copolymers is provided.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: September 1, 2009
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Loon-Seng Tan, Jong-Beom Baek
  • Patent number: 7169878
    Abstract: A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl group having from 1 to 22 carbon atoms, or a cyclic substituent selected from aromatic rings, aliphatic rings, heterocyclic rings and their substituted groups, and n is an integer of from 2 to 5. And, a polyimide precursor and a polyimide synthesized by using the diamine compound; and a treating agent for liquid crystal alignment containing the polyimide precursor and/or the polyimide.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: January 30, 2007
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata
  • Patent number: 7148314
    Abstract: A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary amine functionality and at least one other functionality selected from the group consisting of sulfonic acids, sulfonic acid salts or mixtures thereof.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: December 12, 2006
    Assignee: General Electric Company
    Inventors: Robert R. Gallucci, Tara J. Smith
  • Patent number: 7129318
    Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: October 31, 2006
    Assignee: I.S.T. (MA) Corporation
    Inventors: Gary L. Deets, Jianming Xiong
  • Patent number: 7078477
    Abstract: In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine. The tetracarboxylic acid component is selected from the group consisting of tetracarboxylic dianhydrides represented by the following formula 1: wherein R is as defined in the specification, and tetracarboxylic acids and their derivatives represented by the following formula 2: wherein R and Y1 to Y4 are as defined in the specification. Unlike the conventional techniques using an excessively large amount of a chemical imidation agent such as acetic anhydride and a chemical imidation catalyst such as triethylamine, in the process of the present invention, the solvent-soluble polyimide having a high polymerization degree is easily produced in a solvent with good productivity by using only a catalytic amount of the tertiary amine.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: July 18, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hiroki Oguro, Shuta Kihara, Tsuyoshi Bito
  • Patent number: 7074882
    Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: July 11, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Takami Hikita, Hisae Sugihara, Amane Mochizuki
  • Patent number: 7074880
    Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: July 11, 2006
    Assignee: Aspen Aerogels, Inc.
    Inventors: Wendell Rhine, Jing Wang, Redouane Begag
  • Patent number: 7071282
    Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: July 4, 2006
    Assignee: General Electric Company
    Inventors: Havva Acar, Daniel Joseph Brunelle
  • Patent number: 7053168
    Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 30, 2006
    Assignee: General Electric Company
    Inventors: Norberto Silvi, Mark Howard Giammattei, Paul Edward Howson, Farid Fouad Khouri
  • Patent number: 7041773
    Abstract: Polyimide sulfone resins are provided with a glass transition temperature of from 200–350° C., residual volatile species concentration of less than 500 ppm and a total reactive end group concentration of less than about 120 milliequivalents/kilogram resin. The resins have high heat capability and good melt stability. Methods to prepare the said resins and articles made from the resins are also provided.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: May 9, 2006
    Assignee: General Electric Company
    Inventors: Robert R Gallucci, Roy Ray Odle
  • Patent number: 7026436
    Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 11, 2006
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Kuppusamy Kanakarajan
  • Patent number: 7022810
    Abstract: A new class of hybrid organic-inorganic materials, and methods of synthesis, that can be used as a proton exchange membrane in a direct methanol fuel cell. In contrast with Nafion® PEM materials, which have random sulfonation, the new class of materials have ordered sulfonation achieved through self-assembly of alternating polyimide segments of different molecular weights comprising, for example, highly sulfonated hydrophilic PDA-DASA polyimide segment alternating with an unsulfonated hydrophobic 6FDA-DAS polyimide segment. An inorganic phase, e.g., 0.5–5 wt % TEOS, can be incorporated in the sulfonated polyimide copolymer to further improve its properties. The new materials exhibit reduced swelling when exposed to water, increased thermal stability, and decreased O2 and H2 gas permeability, while retaining proton conductivities similar to Nafion®. These improved properties may allow direct methanol fuel cells to operate at higher temperatures and with higher efficiencies due to reduced methanol crossover.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: April 4, 2006
    Assignee: Sandia Corporation
    Inventor: Christopher J. Cornelius
  • Patent number: RE43880
    Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260-280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100-500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232-280° C. (450-535° F.) without any solvent.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: December 25, 2012
    Assignee: The United States of America as Represented by the Administrator of National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang