Nitrogen-containing Reactant Contains An Amine Group Patents (Class 528/229)
  • Patent number: 5093453
    Abstract: A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.
    Type: Grant
    Filed: December 12, 1989
    Date of Patent: March 3, 1992
    Assignee: Administrator of the National Aeronautics and Space Administration
    Inventors: Anne K. St. Clair, Terry L. St. Clair, J. Richard Pratt
  • Patent number: 5093465
    Abstract: Novel polymers containing amide moieties are produced by reaction of a spirodilactam precursor selected from 4-oxoheptanedioic acid compounds or 1,6-dioxa [4.4] spirodilactones, a primary diamine and an aromatic, aliphatic or alicyclic dicarboxylic acid compound. The polymer products have relatively high glass transition temperature.
    Type: Grant
    Filed: June 29, 1990
    Date of Patent: March 3, 1992
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 5091500
    Abstract: Polybenzazole polymers contain perfluorocyclobutane rings to provide a flexible moiety which is stable at high temperatures.
    Type: Grant
    Filed: September 21, 1990
    Date of Patent: February 25, 1992
    Assignee: The Dow Chemical Company
    Inventors: Zenon Lysenko, William J. Harris
  • Patent number: 5091474
    Abstract: A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.
    Type: Grant
    Filed: January 18, 1991
    Date of Patent: February 25, 1992
    Assignee: Toa Nenryo Kogyo Kabushiki Kaisha
    Inventors: Shinkichi Murakami, Osamu Watanabe, Sadahisa Wada, Makoto Miyazaki, Hiroshi Inoue
  • Patent number: 5091502
    Abstract: The present invention relates to a tetraketone of the structure ##STR1##wherein M is a metal atom and R is selected from phenyl, alkyl substituted phenyl or halogen substituted phenyl. The process to prepare this tetraketone is disclosed. The present invention also relates to a process to produce the tetraketone structure(I). The present invention also relates to the novel polymer of the structure: ##STR2##and to the process to produce this novel polymer. R is as defined hereinabove, and Ar is a tetraamine substituted organic moiety having at least one aromatic ring. These polymers are useful as liquid crystals and in non-linear optical devices.
    Type: Grant
    Filed: March 12, 1990
    Date of Patent: February 25, 1992
    Assignee: General Petrochemical Industries Ltd
    Inventors: Subhash C. Narang, Susanna Ventura, Tilak R. Bhardwaj
  • Patent number: 5089593
    Abstract: Polyimides useful in multilayer electronic devices containing the 4,4'-bis(4-amino-2-trifluoromethylphenoxy) biphenyl moiety have low dielectric constants, low moisture uptake, high thermal degradation stability, low glass transition temperature.
    Type: Grant
    Filed: December 22, 1989
    Date of Patent: February 18, 1992
    Assignee: Amoco Corporation
    Inventors: Douglas E. Fjare, Neal R. Nowicki
  • Patent number: 5084557
    Abstract: The present invention provides diamino compounds and liquid crystal aligning films comprising polyimides which are obtained from the said diamino compounds represented by the general formula: ##STR1## wherein R.sub.1 indicates an alkyl group having 3 to 22 carbon atoms, R.sub.2 indicates a hydrogen atom or an alkyl group having 1 to 22 carbon atoms, and R.sub.3 -R.sub.10 indicate a hydrogen atom or a methyl group, respectively.The liquid crystal aligning films are useful for STN mode display cells in realizing a high pretilt angle.
    Type: Grant
    Filed: June 27, 1989
    Date of Patent: January 28, 1992
    Assignee: Chisso Corporation
    Inventors: Shizuo Murata, Naoyoshi Emoto, Kenji Furukawa, Kouichi Kunimune, Ryuji Kobayashi, Masami Tanaka
  • Patent number: 5077380
    Abstract: Compounds containing at least one cyanate group, at least one maleimide group and at least one mesogenic or rodlike moiety are prepared by reacting one or more aminophenols containing one or more mesogenic or rodlike moieties with a stoichimetric quantity of a maleic anhydride per amine group of said aminophenol and then cyanating the resulting phenolic functional maleimide.
    Type: Grant
    Filed: October 11, 1990
    Date of Patent: December 31, 1991
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5071997
    Abstract: A new class of polyimides and copolyimides made from substituted benzidines and aromatic dianhydrides and other aromatic diamines. The polyimides obtained with said diamines are distinguished by excellent thermal, excellent solubility, excellent electrical properties such as very low dielectric constants, excellent clarity and mechanical properties making the polyimides ideally suited as coating materials for microelectronic apparatii, as membranes for selective molecular or gas separation, as fibers in molecular composites, as high tensile strength, high compression strength fibers, as film castable coatings, or as fabric components.
    Type: Grant
    Filed: July 20, 1989
    Date of Patent: December 10, 1991
    Assignee: University of Akron
    Inventor: Frank W. Harris
  • Patent number: 5066771
    Abstract: A method for producing an imide oligomer soluble in an organic solvent by reacting three components of an aromatic tetracarboxylic acid or its derivative, an aromatic diamine and an end-capping agent, wherein the aromatic diamine is a condensation product of o-ethylamiline with formaldehyde, and the end-capping agent is an ethynyl phthalic acid of the formula: ##STR1## wherein R is a hydrogen atom or a monovalent group selected from the group consisting of an aliphatic group, an alicyclic group and an aromatic group, or its derivative.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: November 19, 1991
    Assignee: Kozo Iizuka, Director-General of Agency of Industrial Science and Technology
    Inventors: Seiichi Hino, Shoichi Satou, Kouji Koura, Osamu Suzuki
  • Patent number: 5064934
    Abstract: Thermosetting Schiff base resins, their preparation and their applications re described.These thermosetting Schiff base resins can be defined as responding to the general formula: ##STR1## Radicals Ar.sub.1, Ar.sub.2 and Ar.sub.3 are chosen so that the softening temperature of the resins is less than about 150.degree. C.The resins can be prepared by direct condensation of an ethynyl benzaldehyde or acetophenone on a telechelic diamine oligomer obtained by reaction of a diamine containing flexibilizing groups on a derivative of benzhydrol tetracarboxylic acid. These Schiff base resins can be used by bulk thermal polymerization particularly to prepare adhesives or composite matrices.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: November 12, 1991
    Assignee: Centre d'Etude des Materiaux Organiques pour Technologies Avancees
    Inventors: Regis Mercier, Thierry Pascal, Bernard Sillion
  • Patent number: 5064933
    Abstract: Benzophenone-type polyimides having repeating groups of the formula ##STR1## where Y and Y' are the same or different and are a chemical bond, --O--, --S--, ##STR2## --CH.sub.2 --, --C(CH.sub.3).sub.2 --, --CF.sub.2, --C(CF.sub.3).sub.2 -- or --Si(CH.sub.3).sub.
    Type: Grant
    Filed: September 4, 1990
    Date of Patent: November 12, 1991
    Assignee: Ethyl Corporation
    Inventor: Mark W. Beltz
  • Patent number: 5061764
    Abstract: A moldable and/or extrudable poly(enamine ketone-co-alkylene ether) block copolymer is disclosed which has the formula shown below: ##STR1## wherein R' is H or alkyl, alkoxyl, cycloalkyl, cycloalkoxyl and aryl and aryloxyl, A is a poly(enamine ketone) sequence and B is a polyalkylene ether sequence. The poly(enamine ketone-co-alkylene ether) block copolymer is preferably prepared under mild condition by reacting a bispropynone with an amine-terminated poly(alkylene ether); a bispropynone with an organic diamine and an amine-terminated poly(alkylene ether); or by reacting a preformed propynone-terminated poly(enamine ketone) with an amine-terminated poly(alkylene ether).The compolymers have excellent mechanical properties, are moldable and extrudable and are useful for the manufacture of articles such as films, sheaths, fibers for textile products, and other moldable and/or extrudable articles and RIM shaping. These materials are also useful as bonded or welded linings and as hot-melt adhesives.
    Type: Grant
    Filed: June 20, 1989
    Date of Patent: October 29, 1991
    Assignee: University of Akron
    Inventors: Frank W. Harris, David D. Russell
  • Patent number: 5061783
    Abstract: The process of the present invention includes first treating a polyamide-acid (such as LARC-TPI polyamide-acid) in an amide-containing solvent (such as N-methylpyrrolidone) with an aprotic organic base (such as triethylamine), followed by dehydrating with an organic dehydrating agent (such as acetic anhydride). The level of crystallinity in the linear aromatic polyimide so produced is maximized without any degradation in the molecular weight thereof.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: October 29, 1991
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Terry L. St. Clair
  • Patent number: 5055550
    Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.
    Type: Grant
    Filed: March 21, 1990
    Date of Patent: October 8, 1991
    Assignee: Hoechst Celanese Corp.
    Inventors: Werner H. Mueller, Dinesh N. Khanna, Rohitkumar H. Vora, Ruediger J. Erckel
  • Patent number: 5055549
    Abstract: The present invention is connected with a process for preparing a novel photosensitive polyimide precursor having excellent shelf stability and high sensitivity and containing less impurities.The process for preparing a photosensitive heat-resistant polymer containing a repeating unit represented by the formula (III) comprises the step of reacting a photosensitive group-containing isoimide represented by the formula (I) with a diamine represented by the formula (II) at a temperature of 0.degree. to 100.degree. C. in the presence of a solvent: ##STR1## wherein R.sup.1 is independently a tetravalent carbon cyclic aromatic group or heterocyclic group; R.sup.2 is independently an aliphatic group having at least 2 carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbon cyclic aromatic group, a heterocyclic group or a polysiloxane group; R.sup.3 is a monovalent organic group having a photosensitive unsaturated group; and D is an oxygen atom or .dbd.N--R.sup.3.
    Type: Grant
    Filed: January 8, 1990
    Date of Patent: October 8, 1991
    Assignee: Chisso Corporation
    Inventors: Hirotoshi Maeda, Kouichi Kunimune
  • Patent number: 5053480
    Abstract: A polyimide resin composed essentially of repeating units represented by the general formula: ##STR1## where R is a divalent aromatic hydrocarbon radical.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: October 1, 1991
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Noriaki Koto, Toyohiko Abe, Hideo Suzuki, Kanji Otsuka
  • Patent number: 5053478
    Abstract: Production of polyenaminonitriles including those which can be cyclized to very stable poly(aminoquinolines) without the evolution of any small molecules and thus in a manner free of volatiles. The polyenaminonitriles are polymers which have desirable dielectric properties, and include those which can be cyclized to poly(aminoquinolines) without the evolution of volatiles to make defect-free films and composites of similar dielectric properties because of this characteristic.
    Type: Grant
    Filed: August 2, 1990
    Date of Patent: October 1, 1991
    Inventors: James A. Moore, Douglas Robello
  • Patent number: 5049649
    Abstract: A colorless, optically clear film consisting essentially of a polyimide of the formula: ##STR1## wherein R is ##STR2## is disclosed. The composition forming the film has a weight average molecular weight, M.sub.w of at least 75,000, and has as an essential characteristic at least about 80% optical transmission at electromagnetic wavelengths of 400 nanometers and above when formed into a thickness of about two thousandths of an inch.
    Type: Grant
    Filed: December 27, 1989
    Date of Patent: September 17, 1991
    Assignee: Hoechst Celanese Corp.
    Inventor: H. Vora Rohitkumar
  • Patent number: 5041520
    Abstract: Disclosed is a process for preparing a polyimide by reacting certain reactants. The reactants include an aromatic diamine which is 3,3'-diaminobenzophenone and/or bis(3-aminophenyl)sulfone, a tetrocarboxylic dianhydride and a dicarboxylic anhydride. A thermally stable polyimide can be obtained which displays excellent processability.
    Type: Grant
    Filed: June 26, 1989
    Date of Patent: August 20, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5039776
    Abstract: Fusible polyimide powders are prepared by the process of this invention. An amic acid amine is first prepared by treating equimolar amounts of a 2,2-bis[4-(aminophenoxy)phenyl]-hexafluoropropane with an unsaturated carbocyclic monoanhydride. The amic acid amine is then mixed with an aromatic tetracarboxylic dianhydride and the mixture heated to form a polyimide precursor. A chemical dehydrating agent is added in an amount sufficient to substantially, fully imidize the precursor. The resulting fusible polyimide powder is finally separated.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: August 13, 1991
    Assignee: Ethyl Corporation
    Inventors: Hsueh M. Li, Adam Nugent, Jr.
  • Patent number: 5037944
    Abstract: Novel thermosetting resins are produced from low molecular weight linear alternating polymers of carbon monoxide and a suitable curing agent. The resin compositions are particularly useful as coatings.
    Type: Grant
    Filed: November 9, 1989
    Date of Patent: August 6, 1991
    Assignee: Shell Oil Company
    Inventors: Abraham A. Smaardijk, Arris H. Kramer
  • Patent number: 5037948
    Abstract: A novel class of cyano-, cyanoalkyl-, carboxy- or carboxyalkylaryl-substituted 1,6-diaza [4.4] spirodilactams, having a cyano-, cyanoalkyl-, carboxy- or carboxyalkylaryl substituent attached to each spiro ring nitrogen atom, are useful for the preparation of polyesters and polyamides.
    Type: Grant
    Filed: August 15, 1990
    Date of Patent: August 6, 1991
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 5037949
    Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(amino(halo)phenoxyphenyl)hexafluoroisopropyl]diphenyl ether.
    Type: Grant
    Filed: March 6, 1990
    Date of Patent: August 6, 1991
    Assignee: Hoechst Celanese Corp.
    Inventors: Werner H. Mueller, Dinesh N. Khanna, Rohitkumar H. Vora, Ruediger J. Erckel
  • Patent number: 5034504
    Abstract: Novel polyamide polymers incorporating moieties of a [4.4] spirodilactam with spiro ring nitrogens in the 1- and 6- spiro ring positions and moieties of a primary diamine are produced by reaction of the primary diamine and a spirodilactam precursor selected from 4-oxoheptanediotic acid compounds or [4.4] spirodilactones having spiro ring oxygen atoms in the 1- and 6- spiro ring positions.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: July 23, 1991
    Assignee: Shell Oil Company
    Inventor: Pen C. Wang
  • Patent number: 5032667
    Abstract: Described herein are amide and/or imide containing polymers based on novel monomers that contain isoalkylidene bridges. These polymers have excellent toughness combined with high temperature stability, low water absorption, and good melt-fabricability.
    Type: Grant
    Filed: December 20, 1989
    Date of Patent: July 16, 1991
    Assignee: Amoco Corporation
    Inventors: James E. Harris, Abe Berger, Vilas M. Chopdekar, Markus Matzner, James Spanswick
  • Patent number: 5030704
    Abstract: A polyphenylquinoxaline which consists of 1 to 100 mole percent of structural elements of the formula (IV) ##STR1## and of 0-99 mole percent of the following repeat unit of formula (V) ##STR2## where R is selected from the group consisting of H, an alkyl group, a carbocyclic aromatic group, a heterocyclic aromatic group, or an alkoxy group, Ar.sub.1 is a carbocyclic aromatic or heterocyclic aromatic group, and B is selected from the representative group consisting of:Ar.sub.2 --Z--Ar.sub.3 (i)where Ar.sub.2 and Ar.sub.3 are the same or different carbocyclic aromatic or heterocyclic aromatic group and Z is selected from the representative group consisting of CO, SO or SO.sub.2 ;Z'--Ar.sub.4 --Z' (ii)where Z' is an activated carbocyclic aromatic or heterocyclic aromatic group and Ar.sub.4 is an aliphatic group, a carbocyclic aromatic or heterocyclic aromatic group. A process for manufacture a self polymerizable phenylquinoxaline subject to polymerization by aromatic nucleophilic substitution.
    Type: Grant
    Filed: June 20, 1989
    Date of Patent: July 9, 1991
    Assignee: The University of Akron
    Inventors: Frank W. Harris, Joseph E. Korleski
  • Patent number: 5028688
    Abstract: Novel poly(amideimide) polymers and a method for the production thereof, which polymers are characterized by moieties of a 1,6-diaza [4.4] spirodilactam and of a bis(maleimide) alternating with the non-amino portion of a primary diamine wherein the amino groups are not located upon adjacent carbon atoms. The polymers are thermoplastic polymers of relatively high glass transition temperature.
    Type: Grant
    Filed: August 20, 1990
    Date of Patent: July 2, 1991
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 5026822
    Abstract: A novel composition consisting essentially of a polyimide of the formula: ##STR1## wherein R is: ##STR2## is disclosed and claimed. The composition has a weight average molecular weight, M.sub.w of at least 75,000 and a polydispersity of from about 1.8 to about 2.6.
    Type: Grant
    Filed: July 12, 1988
    Date of Patent: June 25, 1991
    Assignee: Hoechst Celanese Corp.
    Inventor: Rohitkumar H. Vora
  • Patent number: 5025084
    Abstract: A polyimide-forming composition comprising(A) a polycarboxylic acid partial ester of formulaHOOC--R.sup.1 --COOR.sup.2 Iwhere R.sup.1 denotes a divalent ethylenically unsaturated aliphatic or cycloaliphatic group of 2 to 20 carbon atoms, and R.sup.2 denotes the residue, after removal of a hydroxyl group, of an alcohol having from 4 to 20 carbon atoms which has a cycloaliphatic, aromatic or heterocyclic ring and is polymerizable on heating in the presence of an acid,(B) a partial ester of formula I above in which R.sup.1 denotes a group of formula II ##STR1## where Ar.sup.1 denotes a tetravalent aromatic group of 6 to 20 carbon atoms linked through aromatic carbon atoms thereof to the indicated carbon atoms, and R.sup.2 is as defined above,(C) an aromatic primary polyamine and(D) a heat-activable substance which releases an acid at a temperature of 100.degree. C. or above.
    Type: Grant
    Filed: July 10, 1990
    Date of Patent: June 18, 1991
    Assignee: Ciba-Geigy Corporation
    Inventors: Bryan Dobinson, Mark R. Southcott
  • Patent number: 5017677
    Abstract: Polyquinoline copolymers and mixtures of polyquinoline homopolymers and copolymers having unique properties are provided. The copolymers can include random copolymers, block copolymers, and tri-block copolymers.
    Type: Grant
    Filed: November 18, 1988
    Date of Patent: May 21, 1991
    Assignee: Colorado State University Research Foundation
    Inventor: John K. Stille
  • Patent number: 5015699
    Abstract: Broadly, the present invention relates to a magnetically active organometallic Schiff base polymer having a molecular weight of between about 4,000 and 50,000 daltons.In an additional aspect, the present invention relates to a process for the preparation of magnetically active organometallic polymer having a molecular weight of between about 4,000 and 50,000 daltons, wherein the polymer comprises a multiplicity of Schiff base tridentate chelating groups having the capacity to combine with the iron (II) or iron (III) ion of an organic salt, which process comprises:(a) combining at least one organic diamine including hydrazine with at least one organic diketone or dialdehyde in an anhydrous dipolar aprotic solvent for a time sufficient to produce the polymer at a temperature of between about 50.degree. and 200.degree. C.
    Type: Grant
    Filed: July 22, 1988
    Date of Patent: May 14, 1991
    Assignee: Osaka Gas Co., Ltd.
    Inventors: David B. Cotts, Louisa M. Brodrecht, Robert C. Bening, Jr.
  • Patent number: 5011906
    Abstract: A photoconductive imaging member comprised of a photogenerating layer, and a charge transport layer comprised of the N,N-bis(biarylyl)aniline charge transport polymers of the formula ##STR1## wherein A and B are independently selected from bifunctional linkages; Z is alkylenedioxy, arylenedioxy, or substituted derivatives thereof; R and R' are alkyl, aryl, alkoxy, aryloxy, or halogen; x and y are mole fractions wherein x is greater than 0 and the sum of x and y is equal to 1.0; a and b are the numbers 0, 1 or 2; and n represents the number of monomer units.
    Type: Grant
    Filed: March 30, 1990
    Date of Patent: April 30, 1991
    Assignee: Xerox Corporation
    Inventors: Beng S. Ong, Barkev Keoshkerian, Giuseppa Baranyi
  • Patent number: 5010168
    Abstract: Copolyamides are described comprising: (1) 0.22-0.28 mole fraction units derived from terephthalic acid; (2) 0.2-0.28 mole fraction units derived from paraphenylene diamine; (3) 0.22-0.28 mole fraction units derived from isophthalic acid; and (4) 0.22-0.28 mole fraction units derived from a 3,3'- or 4,4'-diamine of diphenyl methane, diphenylpropane-2,2, diphenyl cyclohexane-1,1, diphenyl ether, diphenyl sulfide, diphenyl sulphone, or benzophenone.
    Type: Grant
    Filed: December 8, 1989
    Date of Patent: April 23, 1991
    Assignee: Akzo nv
    Inventor: Doetze J. Sikkema
  • Patent number: 5003039
    Abstract: High temperature polymeric materials, which are easily process into void-free components, are needed for use in composites for advanced aerospace applications. These materials could bridge the gap between currently-used polymeric materials and ceramics or metal. Phthalonitrile resins can be used as high temperature polymeric material and 1,3-bis(3-aminophenoxy)benzene can be used as a curing agent to reduce voids and benzene can be used as a curing agent to reduce voids and blisters formed from volatiles during polymerization.
    Type: Grant
    Filed: November 18, 1988
    Date of Patent: March 26, 1991
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Teddy M. Keller
  • Patent number: 5003031
    Abstract: Novel polyimides and co-polyimides are prepared by the condensation polymerization of an aryl diamine with dioxydiphthalic anhydride or a mixture thereof with oxydiphthalic anhydride. The polyimides and co-polyimides prepared exhibit a low moisture absorption and improved dielectric properties and can be tailored to provide a composition having desirable mechanical properties, specifically, rigidity.
    Type: Grant
    Filed: May 15, 1989
    Date of Patent: March 26, 1991
    Assignee: Occidental Chemical Corporation
    Inventors: Willis T. Schwartz, Jeffrey S. Stults
  • Patent number: 4999418
    Abstract: Disclosed are colored polyester compositions comprising a polyester having reacted therewith or copolymerized therein at least one residue of an anthraquinone compound having the formula ##STR1## wherein AQ is the residue of a 9,10-anthraquinone radical; R.sup.1 and R.sup.2 are the same or different and are unsubstituted or substituted alkyl, cycloalkyl or aryl; X is a group reactive with at least one of the functional groups of the monomers from which the polyester is prepared; and n is 1 or 2. The described anthraquinone compounds possess improved thermal stability and thus are not decomposed at the high temperatures at which polyesters are prepared. Also disclosed are shaped articles, particularly containers, fabricated from the colored polyester compositions.
    Type: Grant
    Filed: August 31, 1989
    Date of Patent: March 12, 1991
    Assignee: Eastman Kodak Company
    Inventors: James J. Krutak, Max A. Weaver, Clarence A. Coates, Jr., Samuel D. Hilbert, Wayne P. Pruett, William W. Parham
  • Patent number: 4999419
    Abstract: Polyimide addition copolymers of improved physical properties and thermal stability are prepared by reacting ethylenically unsaturated bis-imides with compounds having two methylene groups activated by adjacent carbonyl groups. The copolymers may be made in the presence of catalytic amounts of amines or with greater amounts of polyamines. The polymers are useful in producing molding powders, prepregs, laminates, circuit boards, encapsulants and metal clad shapes.
    Type: Grant
    Filed: February 6, 1989
    Date of Patent: March 12, 1991
    Assignee: Creative Assets and Consulting Corporation
    Inventor: Alfred J. Restaino
  • Patent number: 4997908
    Abstract: Disclosed is a substantially fully imidized diglyme-insoluble, N-methylpyrrolidone-soluble polyimidesiloxane which is the reaction product of a dianhydride, about 1 to about 5% by weight of a mono-anhydride, and a mixture of about 20 to about 50% by weight siloxane diamine and about 50 to about 70% by weight non-siloxane diamine. The non-siloxane diamine is a mixture of about 33 to about 50 mole percent of a first diamine having the general formula ##STR1## and about 50 to about 67 mole percent of a second diamine having the general formula ##STR2## were each "X" is independently selected from hydrogen and halogen and each "Y" is independently selected from --CH.sub.2 --, ##STR3## The polyimidesiloxanes are very useful in coating wire, cable, and circuit boards.
    Type: Grant
    Filed: November 13, 1989
    Date of Patent: March 5, 1991
    Assignee: Occidental Chemical Corporation
    Inventor: Chung J. Lee
  • Patent number: 4996268
    Abstract: A carbinol-containing polyimide oligomer terminated with epoxide-reactive end groups has the structure ##STR1## wherein Ar is ##STR2## R.sup.1 and R.sup.2 are independently divalent organic radicals; R.sup.3 is a trivalent organic radical; Y is an epoxide-reactive group (e.g.); m is 0 or 1 and n is 0-10. Suitable epoxide-reactive groups include a phenol, thiol, amine, or carboxyl group. Polyimide-polyepoxide adducts are prepared by reacting the polyimides with a polyepoxide, preferably a diepoxide used in excess. The polyimide oligomers are useful as coatings or adhesives. The adducts are useful as adhesives, for composites, and particularly for impregnating the fiberglass sheets which are used to form circuit boards.
    Type: Grant
    Filed: February 17, 1989
    Date of Patent: February 26, 1991
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Jules E. Schoenberg
  • Patent number: 4988795
    Abstract: An amphiphilic polyimide precursor having at least 70% by mole of the recurring unit of the formula (1): ##STR1## wherein R.sup.1 is a tetravalent group having at least 2 carbon atoms, R.sup.2 is a bivalent group having at least 2 carbon atoms, and R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are hydrogen atom or a monovalent group having 1 to 30 carbon atoms selected from an aliphatic group, an alicyclic group, an aromatic group, a group in which an aliphatic group is combined with an alicyclic group or an aromatic group, and their groups substituted by a halogen atom, nitro group, amino group, cyano group, methoxy group or acetoxyl group, provided that at least one, preferably at least two, of R.sup.3, R.sup.4, R.sup.5 and R.sup.
    Type: Grant
    Filed: September 7, 1989
    Date of Patent: January 29, 1991
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Uekita, Hiroshi Awaji
  • Patent number: 4987219
    Abstract: A copolymeric amphiphilic polyimide precursor having the recurring unit of the formula (1): ##STR1## wherein R.sup.1 is a tetravalent group having at least 2 carbon atoms, R.sup.2 is a bivalent group having at least 2 carbon atoms, and R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are hydrogen atom or a monovalent group having 1 to 30 carbon atoms selected from the group consisting of an aliphatic group, an alicyclic group, an aromatic group, a group in which an aliphatic group is combined with an aromatic group, or an alicyclic group, and their groups substituted by a halogen atom, nitro group, amino group, cyano group, methoxy group or acetoxyl group, provided that at least one of R.sup.3, R.sup.4, R.sup.5 and R.sup.6 is neither hydrogen atom nor the above-mentioned group which has 1 to 11 carbon atoms; a part of at least one of said R.sup.1 and said R.sup.2 being substituted with a group having a valence different therefrom.
    Type: Grant
    Filed: April 22, 1987
    Date of Patent: January 22, 1991
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Uekita, Hiroshi Awaji
  • Patent number: 4983705
    Abstract: A thermoplastic polymer having a repeating unit of the formula (I), (II), or (III): ##STR1## where LG is a linking group and W is an oligomeric chain selected from the group consisting of polyether, a polythioether, a polyetherthioether, polycarbonyl, or polysulfonyl, or a copolymer thereof.
    Type: Grant
    Filed: January 17, 1989
    Date of Patent: January 8, 1991
    Assignee: Dayco Products, Inc.
    Inventors: Charles M. Lewis, Nasser Pourahmady
  • Patent number: 4981944
    Abstract: A liquid coating composition is provided which comprises, as a binder, an addition polymer containing on average 2 or more pendant activated unsaturated groups and, as a crosslinking agent, a compound containing on average 2 or more primary amino groups. The pendant activated unsaturated groups of the addition polymer are based upon fumaric, maleic and/or itaconic acid and/or anhydrides thereof. The liquid coating compositions of the present invention provide the particular advantage of rapid cure at ambient temperatures.
    Type: Grant
    Filed: June 14, 1989
    Date of Patent: January 1, 1991
    Assignee: Akzo N. V.
    Inventors: Tamme Bartels, Gerardus J. W. M. Maters
  • Patent number: 4981946
    Abstract: A marine paint composition comprising a polymer of the formula: ##STR1## wherein R is alkyl, monocyclic cycloalkyl, monocyclic heterocyclic, aromatic, siloxy, silyl and the alkyl, alkoxy, carboxyl and amino substituted derivatives thereof, and n is about 70 to 700, and a suitable carrier.
    Type: Grant
    Filed: December 5, 1988
    Date of Patent: January 1, 1991
    Inventor: Semih Erhan
  • Patent number: 4980447
    Abstract: The present invention provides polyamide-polyimide and polybenzoxazole-polyimide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkyl, perfluoroalkyl or perfluoroarylalkyl having from 1 to 10 carbon atoms and a carbon-carbon double bond directly linking the two aromatic groups, and R is selected from the group consisting of hydrogen, hydroxy and C.sub.1 to C.sub.4 alkoxy.The polyamide-polyimide polymers of this invention are prepared by reacting compounds of the above formula, alone or admixed with other aromatic diamines, with one or more aromatic tetarcarboxylic acids or anhydrides thereof. Polybenzoxazole-polyimide derivatives of such polyamide-polyimide polymers are prepared utilizing compounds of the above formula wherein R is hydroxy or C.
    Type: Grant
    Filed: March 9, 1989
    Date of Patent: December 25, 1990
    Assignee: Hoechst Celanese Corp.
    Inventor: Dinesh N. Khanna
  • Patent number: 4978573
    Abstract: Disclosed herein are free-standing, pinhole-free, ultrathin polyimide films having thickness of about 400 angstroms or less and a process to prepare them. The films find particular utility in separatory applications.
    Type: Grant
    Filed: March 15, 1990
    Date of Patent: December 18, 1990
    Assignee: Hoechst Celanese Corp.
    Inventor: Rachel S. Kohn
  • Patent number: 4978737
    Abstract: Polyimides derived from the reaction product of 3,3'-6 F diamine or 4,4'-6 F diamine and pyromellitic dianhydride (PMDA) can be rendered solvent soluble while at the same time exhibiting an improvement in both mechanical and electrical properties by the inclusion of at least one other dianhydride having a diaryl nucleus in the reaction media. Suitable such dianhydrides include bis (3,4 dicarboxy phenyl) ether dianhydride (ODPA), 3,3'4,4' benzophenone tetracarboxylic dianhydride (BTDA), 3,3',4,4' diphenyl tetracarboxylic acid dianhydride (BPDA) and 2,2 bis(3,4 dicarboxyphenyl) hexafluoropropane dianhydride (6F-DA). Such polyimides are soluble in common organic solvents such as methyl ethyl ketone or N methyl pyrrolidone, and exhibit excellent film forming properties with improved mechanical and electrical properties as compared to the corresponding homopolyimides. They possess excellent heat stability (Tg's in excess of about 350.degree. C.
    Type: Grant
    Filed: July 12, 1988
    Date of Patent: December 18, 1990
    Assignee: Hoechst Celanese Corp.
    Inventor: Rohitkumar H. Vora
  • Patent number: 4978736
    Abstract: Novel poly(amideimide) polymers and a method for the production thereof, which polymers are characterized by moieties of a 1,6-diaza [4.4] spirodilactam and of a bis(maleimide) alternating with the non-amino portion of a primary diamine wherein the amino groups are not located upon adjacent carbon atoms. The polymers are thermoplastic polymers of relatively high glass transition temperature.
    Type: Grant
    Filed: January 2, 1990
    Date of Patent: December 18, 1990
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 4978734
    Abstract: The present invention provides polyamide-polyamide and polybenzoxazole-polyamide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkylene, perfluoroalkylene or perfluoroalkylene having from 1 to 10 carbon atoms and a bond directly linking the two aromatic groups and R is selected from the group consisting of hydrogen, hydroxy and C.sub.1 to C.sub.4 alkoxy.The polyamide-polyamide polymers of this invention are prepared by reacting compounds of the above formula, alone or admixed with othr aromatic diamines, with one or more aromatic or aliphatic dicarboxylic acid or amide-forming derivatives thereof.
    Type: Grant
    Filed: March 9, 1989
    Date of Patent: December 18, 1990
    Assignee: Hoechst Celanese Corp.
    Inventor: Dinesh N. Khanna