Abstract: The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

Abstract: A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the fiberglass is in the form of building insulation. In other embodiments the product is a microglass-based substrate for use in a printed circuit board, battery separator, filter stock, or reinforcement scrim.

Abstract: There is described a process for producing a gel free hyperbranched polyamide polymer having primary amino groups (useful as a crosslinker). The process comprises the step of reacting at least one diamine and at least one unsaturated diester in a molar ratio of diamine to diester greater than 1 but less than 3 (preferably 2.1 to 2.9); to form the polyamide in a two stage reaction Michael addition and then amidation. The diamine in kept in excess with at least 5% of water by total weight of the diamine and diester, a reaction temperature less than the boiling point of the diamine; and is held under reduced pressure (30 mbar to 1 atms). Gelation does not occur even after substantially all ethylenic (—C?C—) double bonds; and >95% ester [—C(O)?O] groups have reacted. This violates the Flory rules which predict a gel would form based on the number of functional groups present and their degree of conversion.

Abstract: This is to provide a polyamide resin which can sufficiently ensure all of a relative viscosity ?r (high degree of polymerization), moldable temperature range estimated from a temperature difference (Td?Tm), heat resistance estimated from a melting point Tm, melt moldability estimated from a temperature difference (Tm?Tc), and low water absorbability as compared with the conventional polyoxamide resin. This is a polyamide resin comprising a dicarboxylic acid-derived unit and a diamine-derived unit being bonded, wherein the above-mentioned dicarboxylic acid contains oxalic acid (Compound A), and the above-mentioned diamine contains 1,6-hexanediamine (Compound B) and 2-methyl-1,5-pentanediamine (Compound C).

Abstract: Provided is a polyamide polymer in which a partial structure represented by the following formula (C) constitutes a portion of the main chain: wherein in Formula (C), RA and RB each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; n and m each independently represent an integer from 0 to 2; Cy represents an unsaturated 6-membered or 7-membered ring which may contain a heteroatom; and * and ** each represent a bonding hand, while * may be a bonding hand extending from RA.

Abstract: Briefly described, embodiments of this disclosure include fibers, methods of making fibers, structures (e.g., textile articles), and carpets.

Abstract: In a two-step precondensate process for preparing polyamides diamines are reacted with dicarboxylic acid dihalides in a polar, non-basic, inert organic liquid medium under conditions such that a condensation product having a low degree of polymerization is formed. The resulting condensation then is contacted with an aqueous solution of a water-soluble acid acceptor by continuously feeding the components into a reactor system having a total residence time from about 2 seconds to about 2 minutes, and having a Peclet number greater than about 3.5 to form a polyamide product having a high degree of polymerization.

Abstract: Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.

Abstract: A process for making partially aromatic polyamides is provided in which an aromatic dicarboxylic acid component, at least 20-100% by weight of the dicarboxylic acid in the acid component is in the form of an alkylated ester, and a diamine component, comprising a diamine having from 6-12 carbon atoms, are admixed in the presence of water and with heating to form polyamide having from 1-100% on a molar basis of N-alkylated amide and amine groups. The polyamides are particularly useful in the manufacture of products intended for use at elevated temperatures or products in which retention of properties at elevated temperatures is required, including articles using injection molding technology, parts for automotive end-uses and electronics. The polyamides can also be formed into films and fibers for use in associated products.

Abstract: A polymeric furanone magenta colorant is disclosed that contains a furanone magenta chromophore having a furanone adduct, the adduct containing at least one alkoxylated phenyl radical, the chromophore further being derived from at least one aromatic aldehyde having a para-nitrogen and containing electron donating groups selected from the group consisting of alkyls, cycloalkyls, and oligomers or polymers derived from alkyleneoxy or aryleneoxy moieties. The colorant can be utilized in resins, waxes and inks.

Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.

Abstract: Disclosed in the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine/diacid salt and/or an amino-acid of a hydrolyzed lactam or lactam to form a modified polyamide. A second embodiment of the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine then contacting the resulting modified diamine with diacid and/or lactam to form a modified polyamide.

Abstract: The invention relates to the use of polyamide moulding compounds, their alloys or blends, which contain at least one homopolyamide, which has been obtained from long-chained aliphatic monomer blocks with cycloaliphatic monomer blocks, in order to manufacture moulded members for optical or electro-optical applications.

Abstract: Car part made from a polyamide composition wherein the polyamide substantially consists of 60-99 wt. % units derived from aliphatic dicarboxylic acids and diamines and the remaining chain units are derived from cycloaliphatic dicarboxylic acid(s) and an aliphatic diamine or cycloaliphatic diamine(s) and an aliphatic dicarboxylic acid.

Abstract: A process for producing a polyamide from dicarboxylic acid monomer and diamine monomer comprises the steps of: (a) mixing molten dicarboxylic acid monomer and molten diamine monomer in equimolar amounts, thereby producing a molten reaction mixture; (b) flowing the reaction mixture through at least one unvented reaction vessel, the residence time of the reaction mixture in the at least one unvented reaction vessel being between about 0.01 minutes and about 30 minutes, thereby forming a first product stream that comprises polyamide and water of polymerization; and (c) flowing the first product stream through at least one vented vessel, whereby water of polymerization is removed, thereby forming a second product stream that comprises polyamide. The process can operate continuously, and there is no need to add water to the dicarboxylic acid, to the diamine, or to the reaction mixture.

Abstract: A method for the production and use of a catalytically-acting liquid system is offered, which has no or only a small proportion of free lactam, and which is of low viscosity and good storage stability and which directly initiates the anionic lactam polymerization.

Abstract: This invention relates to high temperature, semi-crystalline, semi-aromatic nylon terpolymers with improved shrinkage resistance, made from terephthalic acid (TA), hexamethylene diamine (HMD) and/or 2-methyl pentamethylene diamine (2-MPMD) and another aliphatic dicarboxylic acid as monomers. These polymers display superior % TD (Transverse Direction) annealing shrinkage, as well as very good balance of mechanical performance as high temperature nylons.

Abstract: The invention concerns a process for continuously preparing polyamide 6 with a low dimer content from .epsilon.-caprolactam (fresh lactam) and/or from recycled lactams from extraction and melt-demonomerizing stages. In a plurality of process stages the recycled lactam and/or fresh lactam is hydrolyzed under pressure in the fusible state with water contents of between 3 and 15% and temperatures ranging from 220.degree. C. to 280.degree. C. With a lower constant water content being set, the molten polyamide is then fed to the polymerization process in a further pressure stage incorporating a gas chamber.

Abstract: The invention is relative to weather-resistant polyamides and to methods of their production in which the polymerization or polycondensation of the polyamide-forming monomers (I) is carried out in the presence of 0.02 to 0.7% by weight 4-amino-2,2,6,6-tetraalkylpiperdine (II), 0 to 0.5% by weight of an aliphatic or cycloaliphatic diamine (III) carrying a primary and a tertiary amino group and 0.02 to 0.7% by weight of a 2,6-dialkylphenol (IV) functionalized in 4-position to the OH group and with the formula ##STR1## in which R.sup.1 and R.sup.2 are the same or different alkyl groups with 1 to 6 C atoms, R.sup.3 is either a hydrogen atom or a methyl group, functional group A represents either a free carboxyl group or a carboxyl group esterified with C.sub.1 -C.sub.

Abstract: A process for producing composite materials which can be thermally postformed, with a matrix of polylactam produced by means of activated anionic polymerization is offered.

Abstract: An aromatic polyamide resin composition composed of two types of aromatic polyamide (A) and (B), where (A) is an aromatic polyamide wherein the molar ratio of aromatic polyamide with respect to the monomer components that constitute the polyamide is 0.4 or greater, and (B) is an aromatic polyamide containing an aromatic monomer as the monomer component that constitutes the polyamide and has a recrystallization temperature that is lower than that of the aromatic polyamide (A), where said aromatic polyamide resin composition has a recrystallization temperature that is 10.degree. C. or more lower than the recrystallization temperature of the aromatic polyamide (A).Merit:The aromatic polyamide composition of the present invention has the high heat resistance characteristic of aromatic polyamides, superior dimensional stability with respect to water absorption, and maintenance of physical stability and chemical resistance, while providing improved molding characteristics.

Abstract: A crystalline terpolymer polyamide produced from: (a) an equimolar salt of hexamethylenediamine with adipic acid, (b) an equimolar salt of hexamethylenediamine with terephthalic acid, and (c) 12-aminododecanoic acid or .omega.-laurolactam; a polyamide resin composition comprising (A) the terpolymer polyamide and (B) a modified polyolefin; a polyamide resin composition comprising (A) the terpolymer polyamide, (B) the modified polyolefin, and (C) polyamide 12; a polyamide resin composition comprising (A) the terpolymer polyamide and (D) an inorganic filler and/or a flame retardant; and an automotive part comprising a molding one of these terpolymer polyamide and polyamide resin compositions.

Abstract: A process is disclosed for preparing a polyamide by polymerizing a diacid and a diamine, aminocarboxylic acid or lactam in the presence of excess of either acid or amine such that the ratio of acid to amine end groups or the ratio of amine end groups to acidend groups in the polymer is at least 2.0:1.0.

Abstract: Improved high temperature polyamides, and particularly partially aromatic polyamides, containing less than about 40 .mu.eq/g carboxylic acid endgroups, when stabilized with a copper-containing thermal stabilizer, the polyamides exhibit improved thermal oxidative stability.

Abstract: A process for the activated anionic lactam polymerization is proposed, wherein a liquid system is employed, which simultaneously contains activator and anionic catalyst for the polymerization of the lactam.

Abstract: A polyamide resin composition having good molding fluidity, heat and chemical resistance and dimensional stability is provided containing: (A) 30-90 weight percent, based on components (A) and (B), of a polyamide resin containing (i) 10-99 weight percent, based on components (i) and (ii) of an aromatic polyamide containing a carboxylic acid component derived from terephthalic acid or a mixture of terephthalic and isophthalic acid in which the isophthalic acid constitutes 40 mole percent or less of the mixture, and an aliphatic diamine component derived from a mixture of hexamethylene diamine and 2-methylpentamethylene diamine; and (ii) 1-90 weight percent, based on components (i) and (ii), of at least one polyamide selected from the group consisting of polyamides containing repeat units derived from alipathic dicarboxylic acids and alipathic diamines and polyamides containing repeat units derived from aliphatic aminocarboxylic acids; and (B) 10-70 weight percent, based on components (A) and (B), of an inorgan

Abstract: This invention concerns a low temperature process for the manufacture of nylon.

Abstract: A process for producing precondensates of partially crystalline or amorphous, thermoplastically processable, partially aromatic polyamides or copolyamides, and the use of the higher molecular weight of polyamides, accessible from the precondensates, for producing molding compositions, which are further processable by means of suitable processing techniques, involves the control of temperature and water vapor partial pressure, in a batch process.

Abstract: Partly aromatic semicrystalline thermoplastic polyamide molding compositions containA) from 40 to 100% by weight of a copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, andB) from 0 to 50% by weight of a fibrous or particulate filler,C) from 0 to 30% by weight of an elastomeric polymer andD) from 0 to 30% by weight of conventional additives and processing assistants,the percentages by weight of components A) to D) together giving 100%.

Abstract: Colorless, transparent copolyamides, made up of monomers based on cycloaliphatic diamines and aromatic dicarboxylic acids and a maximum of 20 mol % of further polyamide-forming aliphatic monomers, which have glass transition temperatures of at least 175.degree. C., their blends and alloys, along with the molded articles that can be produced from them and a process for their preparation are proposed.

Abstract: The invention provides a continuous process for the preparation of polyamides, equipment in which the polymerization process can be conducted, and process control methods for said polymerization process.

Abstract: A polyamide hot melt adhesive is provided. It comprises the polyamide condensation product of substantially equivalent quantities of (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids and (b) an amine component consisting essentially of (i) two or more non-cyclic aliphatic diamines and (ii) one or more amine-terminated polyglycol diamines. The amine component is substantially free of piperazine-containing polyamines. The adhesive has an open time of at least 120 seconds. Preferred non-cyclic aliphatic diamines are ethylenediamine and 1,6-diaminohexane, preferably present in about equimolar amounts. The composition may further comprise an aromatic sulfonamide plasticizer. The adhesive is particularly useful for spraying applications.

Abstract: A low temperature process for polymerizing nylon monomers to freely flowing polymers is disclosed. The polymerization process is carried out at lower than conventional polymerization temperatures and produces a freely flowing polymer without thermal degradation.

Abstract: A copolymerized polyamide, comprising amide bonds formed by an aliphatic diamine with 4 to 14 carbon atoms and terephthalic acid, with the existence ratios of distributed respectively adjacent amide bonds satisfying the following formulae (A) and (B), and with the half-crystallization time satisfying the following formula (C).0.9.ltoreq.[XY]obs./[XY]calcd.<1.1 (A)0.9.ltoreq.[XX]obs./[XX]calcd.<1.1 (B)wherein X stands for an amide bond formed by an aliphatic diamine with 4 to 14 carbon atoms and terephthalic acid, and Y stands for any other amide bond than X. [XY] refers to the rate at which X and Y are adjacent to each other among all the amide bonds in the polymer structure, and [XX] refers to the rate at which X and X are adjacent to each other among all the amide bonds in the polymer structure. [XY] calcd. and [XX] calcd. are respectively the values of [XY] and [XX] calculated on the assumption that X and Y amide bonds are distributed statistically at random, and [XY] obs. and [XX] obs.

Abstract: A process for producing an aromatic polyamide film comprising forming a thin layer of an optically isotropic dope in which an aromatic polyamide is dissolved in a polar amide, immersing the thin layer dope in a polar solvent kept at a temperature not higher than -20.degree. C. to coagulate the dope to form a film and drying the film in the presence of an isocyanate compound. Said process can produce directly a transparent film from an aromatic polyamide dope without requiring the step of dissolving the aromatic polyamide in conc. sulfuric acid, does not require any acid resistant equipment and is inexpensive.

Abstract: A process for the copolymerization of (1) a carboxylic acid comprising terephthalic acid and mixtures thereof with isophthalic acid with (2) a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The pressure in the polymerization process is maintained at at least about 2.15 MPa for a period of at least about 40 minutes so that the resultant copolyamide, when annealed, has less than 1% by weight based on the total weight of the copolyamide of fractions having melting points greater than 320.degree. C. Use of lower pressures and times tends to result in formation of a high melting fraction.

Abstract: A process for the preparation of a copolyamide involving copolymerization of (1) a carboxylic acid of terephthalic acid or a terephthalic acid/isophthalic acid mixture with (2) a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The combined amount of isophthalic acid and 2-methyl pentamethylene diamine is controlled so that the resultant copolyamide exhibits few, if any, high melting fractions.

Abstract: A process for the manufacture of a partially aromatic polyamide is disclosed. The process comprises the polymerization stages of, in sequence, feeding to a reactor a slurry of at least one aromatic dicarboxylic acid and at least one aliphatic diamine, then with the incremental addition of water and in the presence of 0.05 to 2% by weight of a monocarboxylic acid, heating the slurry to a temperature of at least 270.degree. C. while maintaining a pressure of at least 1.2 MPa. The preferred dicarboxylic acid is 2,6 naphthalene dicarboxylic acid. The polyamides may be used in the manufacture of products using melt processing techniques.

Abstract: Shaped articles, such as fibers, formed of a polyamide formed by salt-blending the polyamide precursor salt with a cationic dye modifier, such as the dimethyl ester of 5-sulfoisophthalic acid, followed by polymerization, are rendered resistant to staining by acid dyes at ambient conditions either by adding an acid dye to the polymer melt or by dyeing with an acid dye from an acid dyebath at pH 2 to 7 and 60.degree. to 100.degree. C. so that the shaped article contains from at least 0.0048 and preferably at least 0.0096 wt % of an acid dyestuff. In a preferred aspect of the invention, the shaped articles are oriented, crimped, heat-set fibers for use as the facing in carpets.

Abstract: Semi-crystalline, semi-aromatic copolyamides derived from terephthalic acid and mixtures comprising an alkylpentamethylene diamine and hexamethylenediamine by a process including thermal polycondensation in a closed system of the autoclave type.

Abstract: Mixtures of salts of organic carboxylic acids and organic compounds of non-salt character, dissolved in a C.sub.1 -C.sub.4 alkanol, can be concentrated or separated with a semipermeable membrane made from a copolyamide or copolyimide-amide which contains (a) a first aromatic diamine radical and (b) a second aromatic diamine radical which carries --SO.sub.3 M groups, where M is H.sup..sym., a monovalent to polyvalent metal cation or an ammonium cation. Provided the first diamine radical contains C.sub.1 -C.sub.4 alkyl groups in the o-positions to the amino groups, the copolymers are radiation-sensitive and can be used for producing protective layers or relief images, development being carded out in an aqueous alkaline medium.

Abstract: Polyamides and polyamide fibers having a major proportion of hexamethyleneadipamide units and minor proportions of at least two other amide units, one of those other amide units being those of 2-methylpentamethylenediamine are disclosed.

Abstract: A partially crystalline copolyamide formed from an aromatic carboxylic acid that is terephthalic acid or a mixture of terephthalic acid and isophthalic acid containing less than 40% of isophthalic acid, and an aliphatic diamine that is a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The aliphatic diamine is at least 40%, molar basis, of hexamethylene diamine and the amount of isophthalic acid plus 2-methyl pentamethylene diamine is in the range of 15-35%, molar basis, of the total amount of aromatic carboxylic acid and aliphatic diamine. The copolyamides have a melting point of 280.degree.-330.degree. C. The copolyamide preferably has a heat of fusion of greater than 17 J/g. The copolyamide may be moulded into articles, spun into fibres or formed into films, and used in a wide variety of end-uses especially where high temperature properties are required.

Abstract: A colorless and transparent, amorphously processable polyamide molding composition which has a good resistance to stress cracking and good impact strength and is resistant to alcohols, esters, ketones, fuels and boiling water, comprising the reaction product ofI. a linear aliphatic dicarboxylic acid;II.a) 35-60 mol % of trans,trans-bis(4-aminocyclohexyl)-methane; andII.b) 65-40 mol % of other aliphatic, cycloaliphatic, araliphatic or aromatic diaminesas starting components, the molar ratio of components I and II varying in the range from 0.95 to 1.05:1, preferably 0.98 to 1.02:1.The polyamide molding composition is particularly suitable for use for spectacle frames, apparatus inspection windows and covers and lamp covers.

Abstract: Amorphous or semicrystalline semi-aromatic copolyamides are prepared, with significantly reduced loss of amino reactant, by polycondensing an acidic monomer which includes at least one aromatic dicarboxylic acid having from 8 to 18 carbon atoms with an amino comonomer consisting essentially of an alkylpentamethylenediamine, or salt thereof, wherein said polycondensation is carried out in a closed reaction zone.

Abstract: The present invention relates to semi-crystalline, semi-aromatic copolyamides, derived from terephthalic acid and mixtures comprising an alkylpentamethylenediamine and hexamethylenediamine.

Abstract: Mixtures of salts of organic carboxylic acids and organic compounds of non-salt character, dissolved in a C.sub.1 -C.sub.4 alkanol, can be concentrated or separated with a semipermeable membrane made from a copolyamide or copolyimide-amide which contains (a) a first aromatic diamine radical and (b) a second aromatic diamine radical which carries --SO.sub.3 M groups, where M is H.sup..sym., a monovalent to polyvalent metal cation or an ammonium cation. Provided the first diamine radical contains C.sub.1 -C.sub.4 alkyl groups in the o-positions to the amino groups, the copolymers are radiation-sensitive and can be used for producing protective layers or relief images, development being carried out in an aqueous alkaline medium.

Abstract: Copolyamide adhesive compositions have a diamine component and a dicarboxylic acid component. The diamine component includes the reaction residues of at least two diamines selected from non-cyclic aliphatic diamines, cycloaliphatic diamines, and aromatic diamines. The dicarboxylic acid component includes the reaction residues of at least two dicarboxylic acids selected from non-cyclic aliphatic dicarboxylic acids, cycloaliphatic dicarboxylic acids, and aromatic dicarboxylic acids. One of the residues is mono-alkyl branched asymmetric. The composition is free from aliphatic omega aminocarboxylic acids or lactams having 12 carbon atoms or less. When one of the dicarboxylic acids is a polymerized fatty acid, the diamine component does not contain a cycloaliphatic diamine.

Abstract: A thermoplastic polyamide comprising a copolyamide which is the reaction product of a hexamethylene diamine unsubstituted or substituted with at least one alkyl group, and a bis(4-aminocyclohexyl) alkane which is substituted adjacent to the amino groups, and a dicarboxylic acid. Molded bodies made therefrom have high rigidity and tensile strength over a broad temperature range, low water uptake, high dimensional stability, low permeability to oxygen, and high distortion temperatures. They are particularly suitable for injection molding and extrusion particularly when they are modified to improved impact strength, especially for the preparation of thin walled or large surface area shapes.

Abstract: A process for the copolymerization of (1) a carboxylic acid consisting of terephthalic acid and mixtures thereof with isophthalic acid with (2) a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The combined amount of isophthalic acid and 2-methyl pentamethylene diamine is controlled so that the resultant copolyamide, when annealed, has less than 1% by weight based on the total weight of the copolyamide of fractions having melting points greater than 320.degree. C. Preferably, the combined amount of isophthalic acid and 2-methyl pentamethylene diamine is greater than 27.5%, molar basis, of the total amount of acid and diamine.