Phosphorus- Or Sulfur-containing Reactant Patents (Class 528/352)
  • Patent number: 9540390
    Abstract: The present invention relates to a process for the manufacturing of pure and substantially oligomers-free 1,4:3,6-dianhydrohexitol di(alkyl carbonate)s which comprises the steps of: a) Preparing a reaction mixture consisting of at least one dianhydrohexitol, at least 2 molar equivalents with respect to the amount of dianhydrohexitol present, of at least one dialkyl carbonate of formula R—O—C(?O)—O—R, where R has the same meaning indicated above, and from 0.01 to less than 0.1 molar equivalents of a transesterification catalyst with respect to the amount of dianhydrohexitol present; and b) Heating the reaction mixture up to its reflux temperature in a reactor preferably equipped with a rectification column comprising a number of theoretical distillation plates sufficient to separate continuously from the reaction mixture by fractional distillation the alcohol obtained or the azeotrope which the alcohol forms with the dialkyl carbonate present in the reaction mixture.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: January 10, 2017
    Assignee: Fundacion Technalia Research & Innovation
    Inventors: Jose Ramon Ochoa Gomez, Silvia Gil Rio, Belen Maestro Madurga, Leire Lorenzo Ibarreta, Olga Gomez De Miranda Jimenez De Aberasturi
  • Publication number: 20140360932
    Abstract: The present disclosure relates to polymeric matrices composed of protected amine compound residues and membranes composed from such polymeric matrices. In particular, the present disclosure relates to a polymeric matrix comprising amine compound residues, acyl compound residues and protected amine compound residues.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 11, 2014
    Inventor: Qingshan Jason NIU
  • Publication number: 20130203937
    Abstract: A poly(amide-imide) block copolymer that includes a first segment including a repeating unit represented by the following Chemical Formula 1 and a second segment including a repeating unit represented by the following Chemical Formula 2: wherein, R1 to R8, and n1 to n5, in Chemical Formula 1 and 2, are defined herein.
    Type: Application
    Filed: November 26, 2012
    Publication date: August 8, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Samsung Electronics Co., Ltd.
  • Patent number: 8399601
    Abstract: A method for preparing dialkyl carbonates of dianhydrohexitol, includes the following steps: (a) preparing an initial reaction mixture containing at least one dianhydrohexitol, at least two mole equivalents of a dialkyl carbonate of formula and a transesterification catalyst; (b) heating the reaction mixture to a temperature greater than or equal to the boiling temperature of the formed alcohol, or of the azeotrope thereof, in a reaction chamber preferably provided with a rectification column including a sufficient number of theoretical distillation plates to separate the resulting alcohol from the reaction mixture. Certain dialkyl carbonates of dianhydrohexitols produced by the method and the use thereof for synthesizing synthetic polymers are also described.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: March 19, 2013
    Assignee: Roquette Freres
    Inventors: Patrick Fuertes, Mathias Ibert, Emilie Josien, Pietro Tundo, Fabio Arico
  • Publication number: 20120322911
    Abstract: The present invention discloses a new type of polyimide membrane with high permeances and high selectivities for gas separations and particularly for CO2/CH4 and H2/CH4 separations. The polyimide membranes have CO2 permeability of 50 Barrers or higher and single-gas selectivity for CO2/CH4 of 15 or higher at 50° C. under 791 kPa for CO2/CH4 separation. The polyimide membranes have UV cross-linkable functional groups and can be used for the preparation of UV cross-linked polyimide membranes having CO2 permeability of 20 Barrers or higher and single-gas selectivity for CO2/CH4 of 35 or higher at 50° C. under 791 kPa for CO2/CH4 separation.
    Type: Application
    Filed: October 21, 2011
    Publication date: December 20, 2012
    Applicant: UOP LLC.
    Inventors: Chunqing Liu, Travis C. Bowen, Emily G. Harbert, Raisa Minkov, Syed A. Faheem, Zara Osman
  • Publication number: 20120163881
    Abstract: Exemplary embodiments provide an intermediate transfer belt, materials and processes for producing an intermediate transfer belt, and an image transfer apparatus used in electrophotographic printing devices, wherein the intermediate transfer belt can comprise a thermosetting polyimide comprising the reaction product of a polyamic acid and a hydroxyl-terminated polybutadiene.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 28, 2012
    Applicant: XEROX CORPORATION
    Inventor: Jin Wu
  • Publication number: 20120097439
    Abstract: The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof.
    Type: Application
    Filed: April 30, 2010
    Publication date: April 26, 2012
    Applicant: PI R&D CO., LTD.
    Inventors: Toshiyuki Goshima, Maw Soe Win, Eika Kyo
  • Publication number: 20120059087
    Abstract: Pressure sensitive adhesives produced from naturally occurring fats and oils are described. Also described are methods of producing the pressure sensitive adhesives. Generally, one or more naturally occurring fats or oils are epoxidized, and then reacted with certain alcohols or amines to thereby obtain the noted pressure sensitive adhesives.
    Type: Application
    Filed: August 16, 2011
    Publication date: March 8, 2012
    Inventors: Carol A. Koch, Prakash Mallya, Charles R. Williams
  • Publication number: 20120016076
    Abstract: In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.
    Type: Application
    Filed: July 13, 2011
    Publication date: January 19, 2012
    Applicant: LG CHEM. LTD.
    Inventors: Sang Woo KIM, Se Jin SHIN, Dong Hyun OH, Kyung Jun KIM
  • Patent number: 7994274
    Abstract: A method for using citraconic anhydride and itaconic anhydride as addition cure end caps in reactions for forming polyamic acid oligomers and polyimide oligomers, is provided. Prepregs and high temperature adhesives made from the resulting oligomers, as well as, high temperature, low void volume composites made from the prepregs, are also provided.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: August 9, 2011
    Assignee: I.S.T. (MA) Corporation
    Inventors: Gary L. Deets, Jianming Xiong
  • Publication number: 20100137553
    Abstract: A thiophene-containing compound polymer represented by Y represents a bivalent hydrocarbon group; R5 represents a hydrogen atom; Z represents a bivalent hydrocarbon group; m represents 1; p represents an integer of 5 to 5,000; B and B? each represent OCH2CH2OH, and A represents a group represented by the following formula (X-III): Ar1 is a substituted or unsubstituted monovalent aromatic group; R1 to R3 each independently represent a hydrogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted aralkyl group; and n representing an integer of 1 to 5.
    Type: Application
    Filed: November 27, 2009
    Publication date: June 3, 2010
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Yoshihiro Ohba, Kazuaki Sato, Mieko Seki, Hidekazu Hirose, Takeshi Agata, Koji Horiba, Akira Imai, Tadayoshi Ozaki, Yohei Nishino, Hirohito Yoneyama, Daisuke Okuda, Toru Ishii, Kiyokazu Mashimo, Katsuhiro Sato
  • Patent number: 7714096
    Abstract: It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: May 11, 2010
    Assignees: Tokyo Institute of Technology, JSR Corporation
    Inventors: Mitsuru Ueda, Shinji Ando, Jin-gang Liu, Yuzi Shibasaki, Yasuhiro Nakamura, Shuichi Sugawara, Miwa Ariyuki, Yuichi Eriyama, Keisuke Kuriyama, Hideaki Takase
  • Publication number: 20090182116
    Abstract: A series of novel phosphorus-containing compounds having the following formula are disclosed: wherein Q, R5, Ar1, Ar2, A, and B are as defined in the specification. The present invention provides a process for the preparation of the compound of formula (I). The present invention also provides a compound of formula (PA) and a process for preparing the same. The present invention further provides a compound of formula (PI) and a process for preparing the same.
    Type: Application
    Filed: January 14, 2009
    Publication date: July 16, 2009
    Applicant: National Chung Hsing University
    Inventors: Ching-Hsuan LIN, Chia Wei CHANG, Tsung Li LIN
  • Publication number: 20080319159
    Abstract: A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Inventors: Hyman Ralph Lubowitz, Thomas Karl Tsotsis
  • Patent number: 7288603
    Abstract: An object of the present invention is to obtain a novel polymeric material capable of forming a solid polymer electrolyte excellent not only in processability, solvent resistance and durability/stability but also in ion conductivity by introducing sulfonic acid group or phosphonic acid group into a polybenzazole compound having excellent properties in view of heat resistance, solvent resistance, mechanical characteristics and the like. Means attaining the object of the present invention is a polybenzazole compound including an aromatic dicarboxylic acid bond unit having sulfonic acid group and/or phosphonic acid group and satisfying either a condition that inherent viscosity measured in concentrated sulfuric acid is in the range of 0.25 to 10 dl/g or a condition that inherent viscosity measured in a methanesulfonic acid solution is in the range of 0.1 to 50 dl/g.
    Type: Grant
    Filed: November 12, 2001
    Date of Patent: October 30, 2007
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Yoshimitsu Sakaguchi, Kota Kitamura, Hiroaki Taguchi, Junko Nakao, Shiro Hamamoto, Hiroshi Tachimori, Satoshi Takase
  • Patent number: 7148314
    Abstract: A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary amine functionality and at least one other functionality selected from the group consisting of sulfonic acids, sulfonic acid salts or mixtures thereof.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: December 12, 2006
    Assignee: General Electric Company
    Inventors: Robert R. Gallucci, Tara J. Smith
  • Patent number: 7109287
    Abstract: Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transition (Tg) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides.
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: September 19, 2006
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: John W. Connell, Joseph G. Smith, Jr., Paul M. Hergenrother, Kent A. Watson, Craig M. Thompson
  • Patent number: 6987163
    Abstract: The invention relates to a modified polybenzimidazole (PBI), membranes that are fabricated from these polymers, and their use in electrochemical applications. These membranes have high ionic conductivity and are suitable for solid polymer electrolytes in electrochemical applications, especially for high temperature polymer electrolyte membrane (PEM) fuel cells.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: January 17, 2006
    Assignee: Research Foundation of the State University of New York
    Inventors: Israel Cabasso, Youxin Yuan, Frederick E. Johnson
  • Patent number: 6979721
    Abstract: This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs and composites. The polyimides are particularly useful in the preparation of fiber-reinforced, high-temperature composites for use in various engine parts including inlets, fan ducts, exit flaps and other parts of high speed aircraft.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: December 27, 2005
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Mary Ann B. Meador, Aryeh A. Frimer
  • Patent number: 6924348
    Abstract: A polyimide excelling in heat resistance, chemical resistance, water repellency, dielectric characteristics, electrical characteristics, and optical characteristics and a polyamide acid useful as the raw material therefor are provided. Specifically, a polyamide acid containing a chlorine atom and a fluorine atom and comprising a repeating unit represented by the following formula (1): (wherein X and X? independently denote a divalent organic group; Y and Y? independently denote a chlorine, bromine, or iodine atom; p and p? denote independently denote the number of fluorine atom {F in the formula (1)} bonded to the relevant benzene ring, representing an integer of 0-3; q and q? independently denote an integer of 0-3; and p+q total 3, and p?+q? total 3).
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: August 2, 2005
    Assignees: Nippon Shokubai Co., Ltd., NTT Advanced Technology Corporation
    Inventors: Kozo Tajiri, Masayoshi Kuwabara, Yasunori Okumura, Tohru Matsuura, Noriyoshi Yamada
  • Patent number: 6919418
    Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: July 19, 2005
    Inventors: Farid Fouad Khouri, Daniel Joseph Brunelle, Donald Scott Johnson
  • Patent number: 6916898
    Abstract: A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound indicated by chemical formula (1) below and a phenol indicated by chemical formula (2) below: in formula (1), X represents —CH2— or —N(CH3)—, and in formula (2), R1 and R2 may be the same as, or different from, each other and represent each any one of —H, —OH, —CH3, —C2H5, —C3H7, —C4H9, —C5H11, —C6H13, —C7H15, —C8H17, —C9H19, —C10H21, —OCH3, —O(C6H5), —NO2, —Cl, —Br and —F.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 12, 2005
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Takashi Kuroki, Atsushi Shibuya, Shoji Tamai
  • Patent number: 6849706
    Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: February 1, 2005
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Havva Yagci Acar, Farid Fouad Khouri, William David Richards
  • Patent number: 6828408
    Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: December 7, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Okamoto, Manabu Hirakawa
  • Publication number: 20040166311
    Abstract: The present invention is directed to a process for electrostatically spinning fibers of polyamic acid and the fibers thus produced as well as the nonwoven webs that may be formed from the fibers. According to the processes of the present invention, polyamic acid solutions may be electrostatically spun to form fibers of very small diameter, such as, for instance, less than about 5 &mgr;m in average diameter. The fibers may be formed into a nonwoven web having very high specific surface area and large porosity. The polyamic acid may be converted to polyimide to form a polyimide nonwoven web. The polyimide nonwoven web may then be activated through a carbonization process to enhance the electrochemical properties of the web. The nonwoven webs of the invention may be utilized in a variety of electrochemical applications including, for example, electrical double layer capacitors.
    Type: Application
    Filed: February 25, 2003
    Publication date: August 26, 2004
    Applicant: Clemson University
    Inventors: Kap Seung Yang, Yeong Og Choi
  • Patent number: 6693162
    Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: February 17, 2004
    Assignee: Kaneka Japan Corporation
    Inventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
  • Patent number: 6680363
    Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: January 20, 2004
    Assignee: Hitachi Cable, Ltd.
    Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
  • Patent number: 6586561
    Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 1, 2003
    Assignee: Case Western Reserve University
    Inventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
  • Patent number: 6531568
    Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: March 11, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Atsushi Shibuya, Tomomi Okumura, Hideaki Oikawa, Yoshihiro Sakata, Takashi Kuroki, Yuichi Okawa, Shoji Tamai
  • Patent number: 6376644
    Abstract: Biodegradable polymers are described comprising the recurring monomeric units shown in formula I or II: wherein X is —O— or —NR′—, where R′ is H or alkyl; L is a branched or straight chain aliphatic group having from 1-20 carbon atoms; M1 and M2 are each independently (1) a branched or straight chain aliphatic group having from 1-20 carbon atoms; or (2) a branched or straight chain, oxy-, carboxy- or amino-aliphatic group having from 1-20 carbon atoms; Y is —O—, —S— or —NR′—, where R′ is H or alkyl; R is H, alkyl, alkoxy, aryl, aryloxy, heterocyclic or heterocycloxy; the molar ratio of x:y is about 1; the molar ratio n:(x or y) is between about 200:1 and 1:200; and the molar ratio q:r is between about 1:99 and 99:1; wherein said biodegradable polymer is biocompatible before and upon biodegradat.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: April 23, 2002
    Assignees: Guilford Pharmaceuticals, Inc., Johns Hopkins University School of Medicine
    Inventors: Hai-Quan Mao, Kam W. Leong, Zhong Zhao, James P. English
  • Patent number: 6350817
    Abstract: Phenylethynyl containing reactive additives were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynylphthalic anhydride in glacial acetic acid to form the imide in one step or in N-methyl-2-pyrrolidinone to form the amide acid intermediate. The reactive additives were mixed in various amounts (10% to 90%) with oligomers containing either terminal or pendent phenylethynyl groups (or both) to reduce the melt viscosity and thereby enhance processability. Upon thermal cure, the additives react and become chemically incorporated into the matrix and effect an increase in crosslink density relative to that of the host resin. This resultant increase in crosslink density has advantageous consequences on the cured resin properties such as higher glass transition temperature and higher modulus as compared to that of the host resin.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: February 26, 2002
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventors: John W. Connell, Joseph G. Smith, Jr., Paul M. Hergenrother
  • Publication number: 20010031853
    Abstract: The present invention provides PMR-type polyimides that exhibit lower melt viscosities than PMR-type polyimides of the prior art. These PMR-type polyimides are created by incorporating flexible linkages, such as kinked structures and twisted or non-coplanar moietes into the backbone structure of the PMR. Specifically, the present invention provides for the production of PMR-type polyimides having 2,2′-disubstituted biaryls in the polymer backbone.
    Type: Application
    Filed: March 2, 2001
    Publication date: October 18, 2001
    Inventors: Ronald K. Eby, Michael Meador, Christopher A. Gariepy
  • Patent number: 6303743
    Abstract: A polyimide for optical communications, which is expressed by the formula (1), a method of preparing the same, and a method of forming multiple polyimide films using the polyimide, wherein the formula (1) is given by X1, X2, X3, A1, A2, B1, B2, B3, D1, D2, E1, E2, Y1, Y2, Y3, Y4, Y5, Y6, Y7, and Y8, are independently selected from the group consisting of hydrogen atom, halogen atom, alkyl group, halogenated alkyl group, aryl group and halogenated aryl group; Z is a simple chemical bond or selected from the group consisting of —O—, —CO—, —SO3—, —S—, —(T)m—, —(OT)m— and —(OTO)m—, wherein T is alkylene or arylene group substituted by at least one of halogen atom and halogenated alkyl group and m is an integer from 1 to 10; and n is an integer from 1 to 39.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: October 16, 2001
    Assignee: SamSung Electronics Co., Ltd.
    Inventors: Kyung-hee You, Kwan-soo Han, Tae-hyung Rhee
  • Publication number: 20010020082
    Abstract: The invention relates to sulphonated polyimides, notably of formula (I) 1
    Type: Application
    Filed: April 20, 2001
    Publication date: September 6, 2001
    Inventors: Sylvain Faure, Michel Pineri, Pierre Aldebert, Regis Mercier, Bernard Sillion
  • Publication number: 20010019787
    Abstract: The invention relates to sulphonated polymides, notably of formula (I) 1
    Type: Application
    Filed: April 20, 2001
    Publication date: September 6, 2001
    Inventors: Sylvain Faure, Michel Pineri, Pierre Aldebert, Regis Mercier, Bernard Sillion
  • Patent number: 6265521
    Abstract: Polyether polymers such as polyetherimides are prepared by a two-step reaction. The first step is the reaction between an alkali metal salt of a dihydroxy-substituted aromatic hydrocarbon, such as bisphenol A disodium salt, and a substituted aromatic compound such as 1,3-bis[N-(4-chlorophthalimido)]benzene, the alkali metal salt being employed in an amount less than stoichiometric. The intermediate low molecular weight polymer thus produced then undergoes reaction with additional alkali metal salt. By this method, a polyether polymer of closely controlled molecular weight can be conveniently prepared.
    Type: Grant
    Filed: August 7, 2000
    Date of Patent: July 24, 2001
    Assignee: General Electric Company
    Inventors: Thomas Joseph Fyvie, Peter David Phelps, Paul Edward Howson, Donald Frank Rohr, Ganesh Kailasam, Elliott West Shanklin
  • Patent number: 6265520
    Abstract: Disclosed is a solvent soluble polyimide and a method for making thereof, which characterizes by producing a solvent soluble polyimide with low electric conductivity through the polymerization of an anhydride and a diamine under the condition with or without catalyst.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: July 24, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Hui-Lung Kuo, Chein-Dhau Lee, Yi-Chun Liu, Shih-Chi Yang
  • Patent number: 6245881
    Abstract: The invention relates to sulphonated polyimides, notably of formula (I) The invention also relates to an ion exchange membrane that includes such a polyimide and a fuel cell that includes such a membrane. The membranes of the invention have excellent durability and low cost and the fuel cells can be used, in particular, in electric vehicles.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: June 12, 2001
    Assignees: Commissariat a l'Energie Atomique, Centre National de la Recherche Scientifique
    Inventors: Sylvain Faure, Michel Pineri, Pierre Aldebert, Régis Mercier, Bernard Sillion
  • Patent number: 6217996
    Abstract: An aromatic polyimide film composed of a biphenyltetracarboxylic acid unit and a phenylenediamine unit, and having a thickness of 5-150 &mgr;m and an elongation of 45-90% shows, in combination with an electroconductive film, improved mechanical characteristics, when it has the following tensile modulus and a tear resistance measured by Elmendorf tearing tester: a tensile modulus of 750-1,300 kg/mm2 and a tear resistance of 350-1,500 g/mm in the case that the thickness is 50 &mgr;m or less; a tensile modulus of 650-1,200 kg/mm2 and a tear resistance of 550-1,500 g/mm in the case that the thickness is 50-100 &mgr;m; and a tensile modulus of 550-1,100 kg/mm2 and a tear resistance of 550-1,500 g/mm in the case that the thickness is 100 &mgr;m or more.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: April 17, 2001
    Assignee: Ube Industries, Ltd.
    Inventors: Tomohiko Yamamoto, Takeshi Uekido, Toshiyuki Nishino, Hiroshi Inoue, Takuji Takahashi
  • Patent number: 6197920
    Abstract: The present invention relates to the synthesis of new type of diamine monomer, 1,3-bis(4-amonophenoxy)naphthalene, and with such a compound to produce a series of aromatic polymers, including polyamide, polyimide, copoly(amide-imide)s, etc., such polymers having excellent resistance to heat and mechanical properties.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: March 6, 2001
    Assignee: China Textile Institute
    Inventors: Kun Lin Cheng, Wen-Tung Chen
  • Patent number: 6184337
    Abstract: The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. wherein X is —SO2— or —C(═O)—OCH2CH2O—C(═O)—, and R1, R2, R3 and R4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: February 6, 2001
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Takeshi Nishigaya, Fumiyoshi Yamanashi
  • Patent number: 6166173
    Abstract: Biodegradable polymers are described comprising the recurring monomeric units shown in formula I or II: wherein X is --O-- or --NR'--, where R' is H or alkyl; L is a branched or straight chain aliphatic group having from 1-20 carbon atoms; M.sub.1 and M.sub.2 are each independently (1) a branched or straight chain aliphatic group having from 1-20 carbon atoms; or (2) a branched or straight chain, oxy-, carboxy- or amino-aliphatic group having from 1-20 carbon atoms; Y is --O--, --S-- or --NR'--, where R' is H or alkyl; R is H, alkyl, alkoxy, aryl, aryloxy, heterocyclic or heterocycloxy; the molar ratio of x:y is about 1; the molar ratio n:(x or y) is between about 200:1 and 1:200; and the molar ratio q:r is between about 1:99 and 99:1; wherein said biodegradable polymer is biocompatible before and upon biodegradat.
    Type: Grant
    Filed: April 2, 1998
    Date of Patent: December 26, 2000
    Assignees: Guilford Pharmaceuticals Inc., Johns Hopkins University
    Inventors: Hai-Quan Mao, Kam W. Leong, Zhong Zhao, James P. English
  • Patent number: 6153563
    Abstract: A sealed pouch of a single layer polyolefin film having a thickness of from about 0.005 to 0.001 inch and a melting point below about 280.degree. F. which is soluble in a lubricating oil base. The pouch contains a solid lithium hydroxide or lithium fatty acid salt or mixtures thereof for use in preparing greases.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: November 28, 2000
    Assignee: Lithchem International
    Inventors: W. Novis Smith, Joel McCloskey, Andrew Atterbury
  • Patent number: 6103864
    Abstract: The polyimides are derived from solutions of at least one low-boiling organic solvent, e.g. isopropanol containing a mixture of polyimide-forming monomers. The monomeric solutions have an extended shelf life at ambient (room) temperatures as high as 80.degree. C. and consist essentially of a mixture of monoalkyl ester-acids, alkyl diester-diacids and aromatic polyamines wherein the alkyl radicals of the ester-acids are derived from lower molecular weight aliphatic secondary alcohols having 3 to 5 carbon atoms per molecule such as isopropanol, secondary butanol, 2-methyl-3-butanol, 2 pentanol or 3-pentanol. The solutions of the polyimide-forming monomers have a substantially improved shelf-life and are particularly useful in the aerospace and aeronautical industry for the preparation of polyimide reinforced fiber composites such as the polyimide cured carbon composites used in jet engines, missiles, and for other high temperature applications.
    Type: Grant
    Filed: January 14, 1999
    Date of Patent: August 15, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: William B. Alston, Gloria S. Gahn
  • Patent number: 6096850
    Abstract: Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a 4,4'-(hexafluoroisopropylidene)diphthalic acid dianhydride, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: August 1, 2000
    Assignee: Nippon Mektron Limited
    Inventors: Lin-chiu Chiang, Jenq-Tain Lin, Nobuyuki Sensui
  • Patent number: 6090909
    Abstract: Disclosed is an aligning film having good liquid crystal orientation, which can be obtained by irradiating polyimide comprising N-(2-(3,5-diaminobenzoyl)oxyethyl)-.alpha.-phenylmaleimide and 1,2,3,4-cyclobutanetetracarboxylic dihydride with polarized UV-rays without employing such methods as rubbing treatment and oblique deposition.
    Type: Grant
    Filed: February 4, 1999
    Date of Patent: July 18, 2000
    Assignee: Chisso Corporation
    Inventors: Takashi Kato, Nobuyuki Otsuka, Hideo Sato, Shizuo Murata
  • Patent number: 6031068
    Abstract: The object of the present invention is to provide polyimide composition having such excellent property as low water absorption and low hygroscopic swelling, and a base tape for a TAB carrier tape and a FPC.The another object of the present invention is to provide polyimide composition comprising polyimide consisting of a repeating unit of the general formula (1): ##STR1## The further object of the present invention is to provide a base tape for a TAB carrier tape containing polyimide film made from said polyimide composition as a base film and a FPC containing polyimide film made from said polyimide composition as an insulating material.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: February 29, 2000
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventor: Kohji Okada
  • Patent number: 5998569
    Abstract: A composition of matter comprising a polyamic acid/ester having an amide pendant group directly substituting an acid site of the polyamic acid is provided, which composition when cured provides a colored polymer film when the amide group is a chromophore. The resulting polymer which may be applied as a film to semiconductor chips to provide an optically sensitive semiconductor chip comprises a partially imidized polyamic acid wherein an amide pendant group is directly attached to one acid moiety of the polyamic acid and the other acid group imidized with the adjacent amino group of the polyamic acid. The polymers are useful as optical filters on semiconductor chips and for photoresist applications.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: December 7, 1999
    Assignee: International Business Machines Corporation
    Inventors: Dennis P. Hogan, Harold G. Linde
  • Patent number: 5985969
    Abstract: Polyimide precursor solutions comprise an organic liquid and the reaction product of an aromatic dianhydride and an aromatic diaminobenzoxazole capped, on at least one terminal end, with a bifunctional chain extender. The bifunctional chain extender has one functional group reactive with the amine of the aromatic diaminobenzoxazole or the anhydride of the aromatic dianhydride and another functional group which does not form amic acid linkages, but which is capable of further reaction to increase the molecular weight of the polyimide precursor under conditions other than those used to react the aromatic diamine and aromatic dianhydride to form the polyimide precursor. These polyimide precursors can be converted into polyimidebenzoxazole polymers.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: November 16, 1999
    Assignee: The Dow Chemical Company
    Inventors: William J. Harris, Wen-Fang Hwang
  • Patent number: 5969079
    Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## R.sub.R =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --,--S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.theta.=--C.tbd.N, --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.
    Type: Grant
    Filed: October 21, 1994
    Date of Patent: October 19, 1999
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard