Abstract: A conditioning assembly for conditioning an article (D), such as a fluid dispenser, under vacuum, the assembly including an airtight enclosure (E) for receiving an article (D) for conditioning under a vacuum; the assembly being characterized in that the enclosure (E) includes a conditioning element (21) that is movable inside the enclosure, the enclosure (E) being connected to a suction chamber (C) that includes a piston (22) that is capable of causing the volume of the chamber (C) to vary, the conditioning element (21) and the piston (22) being constrained to move together in a manner such that a movement of the piston (22) in the direction for increasing the volume of the chamber (C) causes suction to be generated in the enclosure (E).

Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.