Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.

Abstract: An airtight apparatus includes a package and a lid. The lid is bonded to the package and defines an airtight space, together with the package. The lid includes an optical window which allows the passage of optical signals, a holding part which holds the optical window, and a deformable part which is formed on an outer circumferential edge of the holding part and which is able to deform when applied with a load smaller than a load that deforms the holding part.

Abstract: An apparatus for charging a metallic canister having a filler opening therein with a gas under pressure and then sealing the opening to provide a closed, pressurized canister including means having a guide passageway therethrough, engageable with the canister in sealing engagement with the guide passageway communicating with the filler opening of the canister, means for conveying a gas under pressure to the guide passageway of the sealing means when the sealing means is disposed in sealing engagement with the canister, rotary means for dispensing a welding ball for delivery through the sealing means to be deposited on the canister across the filler opening therein and means for fusing the welding ball when positioned on the canister to close the filler opening in the canister.

Abstract: An apparatus for charging a metallic canister having a filler opening therein with a gas under pressure and then sealing the opening to provide a closed, pressurized canister including means having a guide passageway therethrough, engageable with the canister in sealing engagement with the guide passageway communicating with the filler opening of the canister, means for conveying a gas under pressure to the guide passageway of the sealing means when the sealing means is disposed in sealing engagement with the canister, rotary means for dispensing a welding ball for delivery through the sealing means to be deposited on the canister across the filler opening therein and means for fusing the welding ball when positioned on the canister to close the filler opening in the canister.

Abstract: The invention is directed to an apparatus for filling and sealing a canister having a weldable end wall. A weld head assembly includes a head having a welding electrode disposed within an opening for receiving a pressurized gas and defining a terminal end. The head further has a seal operably associated with the terminal end for engaging the end wall of the canister. A ball shuttle assembly includes a shuttle block having a passage for receiving the weld ball. The ball shuttle assembly further includes a device for positioning the shuttle block whereby the weld ball is in substantially coaxial alignment with the opening, and moving the weld ball into the opening of the weld head. The passage of the shuttle block is fluidly disassociated from the opening in the weld head when the seal is engaged with the end wall of the canister.