Iron Application Only Patents (Class 53/82)
  • Patent number: 8381493
    Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: February 26, 2013
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takayuki Nishiura, Yoshio Mezaki, Yoshiki Yabuhara
  • Patent number: 6212854
    Abstract: An apparatus for charging a metallic canister having a filler opening therein with a gas under pressure and then sealing the opening to provide a closed, pressurized canister including means having a guide passageway therethrough, engageable with the canister in sealing engagement with the guide passageway communicating with the filler opening of the canister, means for conveying a gas under pressure to the guide passageway of the sealing means when the sealing means is disposed in sealing engagement with the canister, rotary means for dispensing a welding ball for delivery through the sealing means to be deposited on the canister across the filler opening therein and means for fusing the welding ball when positioned on the canister to close the filler opening in the canister.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: April 10, 2001
    Assignee: RWC, Inc.
    Inventors: Brian P. Tobin, Ronald W. Richardson, Jr., James R. Harrington, Douglas M. Leonard
  • Patent number: 5829223
    Abstract: An apparatus for charging a metallic canister having a filler opening therein with a gas under pressure and then sealing the opening to provide a closed, pressurized canister including means having a guide passageway therethrough, engageable with the canister in sealing engagement with the guide passageway communicating with the filler opening of the canister, means for conveying a gas under pressure to the guide passageway of the sealing means when the sealing means is disposed in sealing engagement with the canister, rotary means for dispensing a welding ball for delivery through the sealing means to be deposited on the canister across the filler opening therein and means for fusing the welding ball when positioned on the canister to close the filler opening in the canister.
    Type: Grant
    Filed: July 10, 1996
    Date of Patent: November 3, 1998
    Assignee: RWC, Incorporated
    Inventors: Brian P. Tobin, Ronald W. Richardson, Jr., James R. Harrington, Douglas M. Leonard