Abstract: Disclosed are novel catalyst systems and method for curing a peroxide-curable ethylenically unsaturated (e.g. acrylic or vinyl) composition wherein the catalyst system is a combination of the peroxide curing agent and a Cu.sup.+1 activator or a combination of a peroxide curing agent and an activator system comprising a furfuryl alcohol and an acid catalyst. Also disclosed is a new catalyst system for curing ring compounds (e.g. epoxides) which comprises a combination of ferrocene and a diazonium salt of a Lewis acid. Preferred curable compositions are adhesives and especially acrylic adhesives and epoxy adhesives. Also disclosed is a new adhesion promoter which improves the adhesion of acrylic adhesive.

Abstract: Copper-diamine complexes such as copper(II)-di-t-butylethylenediamine dibromide are prepared by the reaction of a dihalide such as 1,2-dibromoethane with an amine such as t-butylamine and a basic copper(II) compound such as cupric oxide in a nitrile solvent. The diamine can be liberated from the complex by reacting it with a complexing agent such as an ethylenediaminetetraacetic acid salt.

Abstract: Copper(I)-diamine-chloride complexes are prepared by the reaction of cuprous chloride with a diamine such as N,N'-di-t-butylethylenediamine. Said complexes are reacted with phenoxides such as potassium 2,6-xylenoxide to produce the corresponding copper(I)-diamine-phenoxide complexes, which are useful for the preparation of polyphenylene oxides by oxidative coupling of various phenols such as 2,6-xylenol.

Abstract: Novel complexes are prepared from water-soluble compounds having at least one amidocarbonylic unit and a square planar organometallic compound.