Chalcogen Bonded Directly To The Metal Patents (Class 556/113)
  • Patent number: 7691984
    Abstract: Metal-containing complexes of a tridentate beta-ketoiminate, one embodiment of which is represented by the structure: wherein M is a metal such as calcium, strontium, barium, scandium, yttrium, lanthanum, titanium, zirconium, vanadium, tungsten, manganese, cobalt, iron, nickel, ruthenium, zinc, copper, palladium, platinum, iridium, rhenium, osmium; R1 is selected from the group consisting of alkyl, fluoroalkyl, cycloaliphatic, and aryl, having 1 to 10 carbon atoms; R2 is selected from the group consisting of hydrogen, alkyl, alkoxy, cycloaliphatic, and aryl; R3 is linear or branched selected from the group consisting of alkylene, fluoroalkyl, cycloaliphatic, and aryl; R4 is a branched alkylene bridge with at least one chiral center; R5-6 are individually linear or branched selected from the group consisting of alkyl, fluoroalkyl, cycloaliphatic, aryl, and can be connected to form a ring containing carbon, oxygen, or nitrogen atoms; n is an integer equal to the valence of the metal M.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: April 6, 2010
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Xinjian Lei, Daniel P. Spence, Hansong Cheng
  • Patent number: 7659416
    Abstract: Enediyne compounds of the formula: (1) characterized in that the structure thereof is very simple and the production process is easy, and that the molecular length thereof is shorter than those of compounds having been proposed. Consequently, electrode assemblies comprising any of these enediyne compounds are highly promising in the application to nanomolecular wiring (nanomolecular wire) whose production has been difficult.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: February 9, 2010
    Assignees: Tokyo Institute of Technology, Nissan Chemical Industries, Ltd.
    Inventors: Masamichi Fujihira, Fumie Sato, Yuuki Takayama, Go Ono
  • Patent number: 7652132
    Abstract: The present invention provides a metal-organic framework (“MOF”) comprising a plurality of metal clusters and a plurality of multidentate linking ligands. Each metal of the plurality of metal clusters comprises one or more metal ions. Each ligand of the plurality of multidentate linking ligands connects adjacent metal clusters. The present invention also provides a method of forming the metal-organic framework. The method of the invention comprises combining a solution comprising one or metal ions with a multidentate linking ligand having a sufficient number of accessible sites for atomic or molecular adsorption that the surface area of the resulting metal-organic framework is greater than 2,900 m2/g.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: January 26, 2010
    Assignee: The Regents of the University of Michigan
    Inventors: Omar M. Yaghi, Adam J. Matzger, Jesse L. C. Rowsell
  • Publication number: 20090323508
    Abstract: A photosensitized composite material and a material, an element, a device, and the like, which employ the photosensitized composite material, are provided. In the photosensitized composite material, multiphoton absorption compounds are highly sensitized for practical use by utilizing an enhanced plasmon field. The photosensitized composite material has a structure where the multiphoton absorption compounds are linked to the surface of a fine metal particle through linking groups. The fine metal particle generates an enhanced surface plasmon field in resonance with a multiphoton excitation wavelength. The multiphoton absorption compounds have a molecular structure enabling multiphoton absorption.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 31, 2009
    Inventors: Tatsuya Tomura, Tsutomu Sato, Takeshi Miki, Mikiko Takada, Masaomi Sasaki
  • Publication number: 20090136677
    Abstract: Metal-containing complexes of a tridentate beta-ketoiminate, one embodiment of which is represented by the structure: wherein M is a metal such as calcium, strontium, barium, scandium, yttrium, lanthanum, titanium, zirconium, vanadium, tungsten, manganese, cobalt, iron, nickel, ruthenium, zinc, copper, palladium, platinum, iridium, rhenium, osmium; R1 is selected from the group consisting of alkyl, fluoroalkyl, cycloaliphatic, and aryl, having 1 to 10 carbon atoms; R2 is selected from the group consisting of hydrogen, alkyl, alkoxy, cycloaliphatic, and aryl; R3 is linear or branched selected from the group consisting of alkylene, fluoroalkyl, cycloaliphatic, and aryl; R4 is a branched alkylene bridge with at least one chiral center; R5-6 are individually linear or branched selected from the group consisting of alkyl, fluoroalkyl, cycloaliphatic, aryl, and can be connected to form a ring containing carbon, oxygen, or nitrogen atoms; n is an integer equal to the valence of the metal M.
    Type: Application
    Filed: November 27, 2007
    Publication date: May 28, 2009
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Xinjian Lei, Daniel P. Spence, Hansong Cheng
  • Publication number: 20090130466
    Abstract: Organometallic precursor complexes containing a metal and ligands containing electron withdrawing groups are disclosed. The complexes are adapted to undergo exothermic adsorption on a fully passivated diffusion barrier layer and on a metal layer deposited on the diffusion barrier layer and to undergo exothermic reduction on the diffusion barrier layer and the metal layer. The metal is preferably copper. Use of the complexes in atomic layer deposition is also disclosed.
    Type: Application
    Filed: November 16, 2007
    Publication date: May 21, 2009
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Hansong Cheng, Diwakar Garg, Pablo Ordejon, Manuel Cobian
  • Publication number: 20090118528
    Abstract: A method for desulfurizing natural gas includes contacting the natural gas with an adsorbent which preferentially adsorbs at least one of hydrogen sulfide, COS, sulfur odorants, or combinations thereof, at a selected temperature and pressure, thereby producing desulfurized natural gas and an at least one of hydrogen sulfide/COS/sulfur odorant/combinations thereof-rich adsorbed component. The adsorbent includes a copper species adapted to form ?-complexation bonds and direct metal-sulfur bonds with the at least one of hydrogen sulfide, COS, sulfur odorants, or combinations thereof, and wherein the preferential adsorption occurs by ?-complexation and direct metal-sulfur bonding.
    Type: Application
    Filed: November 3, 2008
    Publication date: May 7, 2009
    Inventors: Ralph T. YANG, Yuhe WANG, Luis AMESTICA
  • Publication number: 20090074691
    Abstract: This invention relates to certain hydroxyaryl alkanols, alkyl amines, alkyl amino acids, alkyl amino esters, and alkyl amino alkanols (“Hydroxyaryl compounds”) of formula (I). A method of topical application of said hydroxyaryl compounds is also disclosed.
    Type: Application
    Filed: November 29, 2008
    Publication date: March 19, 2009
    Applicant: BIODERM RESEARCH
    Inventor: SHYAM K. GUPTA
  • Publication number: 20090027611
    Abstract: The invention provides a metal nanoparticle comprising a metal and a chiral and/or thiolate group bonded to the metal. The monolayer-protected metal nanoparticle may be used as a chiral dopant in a liquid crystal. Accordingly, the invention also provides a colloidal suspension or dispersion comprising a metal nanoparticle comprising a metal and a chiral and/or thiolate group bonded to the metal, and a liquid crystal.
    Type: Application
    Filed: January 12, 2007
    Publication date: January 29, 2009
    Applicant: The University of Manitoba
    Inventors: Torsten Hegmann, Hao Qi
  • Patent number: 7476371
    Abstract: Process for producing a copper-containing aqueous solution, in which a copper mass is dissolved in the presence of air in an aqueous leach liquor containing monoethanolamine and an acid, wherein the amount of acid equivalents is between 0.05 and about 0.7 times the equivalents of monoethanolamine, and wherein the rate of copper dissolution into the aqueous leach liquor is greater than about 4.3 grams of copper per liter of leach liquor per hour until a product having at least about 80 grams per liter is obtaine.
    Type: Grant
    Filed: February 1, 2005
    Date of Patent: January 13, 2009
    Assignee: Phibro-Tech, Inc.
    Inventors: Hugh W. Richardson, Gang Zhao
  • Publication number: 20080297044
    Abstract: A metal sulfide nanocrystal manufactured by a method of reacting a metal precursor and an alkyl thiol in a solvent, wherein the alkyl thiol reacts with the metal precursor to form the metal sulfide nanocrystals, wherein the alkyl thiol is present on the surface of the metal sulfide nanocrystal, wherein the alkyl thiol is bonded to the sulfur crystal lattice. A metal sulfide nanocrystal manufactured with a core-shell structure by a method of reacting a metal precursor and an alkyl thiol in a solvent to form a metal sulfide layer on the surface of a core, wherein the alkyl thiol is present on the surface of the metal sulfide nanocrystal, wherein the alkyl thiol is bonded to the sulfur crystal lattice. These metal sulfide nanocrystals can have a uniform particle size at the nanometer-scale level, selective and desired crystal structures, and various shapes.
    Type: Application
    Filed: July 17, 2008
    Publication date: December 4, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shin Ae Jun, Eun Joo Jang, Seong Jae Choi
  • Publication number: 20080254216
    Abstract: [PROBLEMS] To provide a metal complex compound capable of being suitably used for manufacturing a metal-containing thin film by the CVD method and a method for preparing a metal-containing thin film. [MEANS FOR SOLVING PROBLEMS] A metal complex compound comprising a ?-diketonato ligand having an alkoxyalkyl-methyl group, and a method for preparing a metal-containing thin film using the metal complex compound by the CVD method.
    Type: Application
    Filed: March 15, 2005
    Publication date: October 16, 2008
    Applicant: Ube Industries, Ltd.
    Inventors: Takumi Kadota, Chihiro Hasegawa, Kouhei Watanuki, Hiroyuki Sakurai, Hiroki Kanato
  • Patent number: 7402296
    Abstract: Disclosed is a method of stabilizing copper(II) hydroxide, the method comprising the sequential steps of: (a) combining copper(II) hydroxide, a water-soluble phosphate and water to form a mixture; and (b) drying the mixture. Also disclosed is stabilized copper(II) hydroxide prepared according to said method and a composition comprising stabilized copper(II) hydroxide prepared according to said method and at least one of a surfactant, a solid diluent or a liquid diluent.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: July 22, 2008
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Matthew Richard Oberholzer
  • Patent number: 7393555
    Abstract: The invention relates to dicopper(I) oxalate complexes stabilized by neutral Lewis bases, such as alkenes or alkynes, and to the use of dicopper(I) oxalate complexes as precursors for the deposition of metallic copper, in which the neutral Lewis bases used are alkynes, alkenes, triarylphosphines, CO or isonitriles.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: July 1, 2008
    Assignee: BASF Aktiengesellschaft
    Inventor: Katrin Koehler
  • Patent number: 7390832
    Abstract: The present invention is related to a novel method for oxidizing or splitting nucleic acids at specific points on a complementary nucleic acid segment using a dinuclear copper-based compound of Formula I. Additionally, the present invention is related to a novel treatment of cancer, tumors, and cancer cells using a dinuclear copper-based compound of formula I or a naked ligand of Formula II.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: June 24, 2008
    Assignees: The University of Maryland, The Johns Hopkins University
    Inventors: Steven E. Rokita, Kenneth D. Karlin, Lei Li, Narasimha N. Murthy
  • Patent number: 7273944
    Abstract: Provided are preservation formulations and methods, e.g., formulations for the preservation of wood. In particular, provided are methods for the production of copper monoethanolamine aqueous solutions from metallic copper and monoethanolamine.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: September 25, 2007
    Assignee: Arch Chemicals, Inc.
    Inventors: Eugene A. Pasek, Jayesh P. Patel, Susan M. Thomason, Eric W. Lummus, Kenneth E. Cogan
  • Patent number: 7238820
    Abstract: The invention concerns novel copper or silver complexes and their use for gas-phase chemical deposition of metal copper or silver almost free of impurities.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: July 3, 2007
    Assignee: Centre National de la Recherche Scientifique
    Inventor: Pascal Doppelt
  • Patent number: 7196210
    Abstract: The ability to design and construct solid-state materials with pre-determined structures is a grand challenge in chemistry. An inventive strategy based on reticulating metal ions and organic carboxylate links into extended networks has been advanced to a point that has allowed the design of porous structures in which pore size and functionality can be varied systematically. MOF-5, a prototype of a new class of porous materials and one that is constructed from octahedral Zn—O—C clusters and benzene links, was used to demonstrate that its 3-D porous system can be functionalized with the organic groups, —Br, —NH2, —OC3H7, —OC5H11, —H4C2, and —H4C4, and its pore size expanded with the long molecular struts biphenyl, tetrahydropyrene, pyrene, and terphenyl.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: March 27, 2007
    Assignee: The Regents of the University of Michigan
    Inventors: Omar M. Yaghi, Mohamed Eddaoudi, Hailian Li, Jaheon Kim, Nathaniel Rosi
  • Patent number: 7189867
    Abstract: A compound having the formula CF3—CH(OH)—CH2—(L)n—CH2—SH or a disulfide thereof. Each L is substituted or unsubstituted methylene, substituted or unsubstituted oxyalkylene, and alkyl-substituted or unsubstituted siloxanylene. The compound is free of carboxysilane linkages. The value of n is a positive integer. A metal surface having the group CF3—CH(OH)—CH2—(L)n—CH2—S— bound thereto. A method of making CF3—CH(OH)—CH2—(L)n—CH2—SH by: reacting OHC—CH2—(L)n—CH2—X with (trifluoromethyl)trialkylsilane to form CF3—CH(OH)—CH2—(L)n—CH2—X; reacting the intermediate with a thiocarbonyl compound to form an adduct; and hydrolyzing the adduct followed by protonation. X is a halogen.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: March 13, 2007
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: James H Wynne, Arthur W Snow
  • Patent number: 7169947
    Abstract: The invention relates to dicopper(I) oxalate complexes stabilised by neutral Lewis base components and to the use thereof as precursors for the deposition of metallic copper. The neutral Lewis bases used are alkynes or alkenes containing at least one silyl or ester group, or nitrites, saturated or unsaturated nitrogen ligands, phosphites, trialkyl-phosphines or oxygen- or sulfur-containing ligands.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: January 30, 2007
    Assignee: Basf Aktiengesellischaft
    Inventors: Katrin Koehler, Franc Meyer
  • Patent number: 7141688
    Abstract: The present invention is directed to novel fluorinated dye stabilizers having both high quenching efficiency and solubility in halogenated solvents. These dye stabilizers have shown a significantly effect on improving the dye fastness in hostile photooxidation conditions.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: November 28, 2006
    Assignee: SiPix Imaging, Inc.
    Inventors: Kai-Chia Feng, Ying-Syi Li, Jin Yang, HongMei Zang, Haiyan Gu, Sundaravel P. Ananthavel, Rong-Chang Liang
  • Patent number: 7034169
    Abstract: Metal complexes, containing copper, silver, gold, cobalt, ruthenium, rhodium, platinum, palladium, nickel, osmium, and/or indium, and methods for making and using same are described herein. In certain embodiments, the metal complexes described herein may be used as precursors to deposit metal or metal-containing films on a substrate through, for example, atomic layer deposition or chemical vapor deposition conditions.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: April 25, 2006
    Assignee: Air Products and Chemicals, Inc.
    Inventor: John Anthony Thomas Norman
  • Patent number: 7022469
    Abstract: A silver halide emulsion is disclosed, comprising at least one monovalent Au(I) complex coordinated with a compound represented by the following formula (1): R1—Ch—R2??(1) wherein R1 and R2 each independently represents an alkyl group, an alkenyl group, an alkynyl group, an aryl group or a heterocyclic group, R1 and R2 may combine with each other to form a 3-, 4-, 5-, 6- or 7-membered ring, and Ch represents a sulfur atom, a selenium atom or a tellurium atom.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: April 4, 2006
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Hiroyuki Suzuki, Hirotomo Sasaki
  • Patent number: 6982341
    Abstract: A volatile copper aminoalkoxide complex of formula (I) can form a copper thin film having an improved quality by metal organic chemical vapor deposition (MOCVD): wherein, R1, R2, R3 and R4 are each independently C1-4 alkyl optionally carrying one or more fluorine substituents; and m is an integer in the range of 1 to 3.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: January 3, 2006
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Yunsoo Kim, Chang Gyoun Kim, Taek-Mo Chung, Sun Sook Lee, Ki-Seok An, Taek Seung Yang, Hong Suk Jang
  • Patent number: 6965045
    Abstract: An organic metal precursors containing one or more organic ligands bonded to one or more metal atoms, wherein the organic ligand is rapidly dissociated from the metal atom upon exposure to light and degraded leaving a metal or a metal oxide. By using the organic metal precursors, an electroconductive, metal-containing patterned film can be easily deposited on a substrate at room temperature under atmospheric pressure without using photosensitive resins.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: November 15, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Won Cheol Jung, Seok Chang, Soon Taik Hwang, Young Hun Byun
  • Patent number: 6930193
    Abstract: An isoreticular metal-organic framework (IRMOF) and method for systematically forming the same. The method comprises the steps of dissolving at least one source of metal cations and at least one organic linking compound in a solvent to form a solution; and crystallizing the solution under predetermined conditions to form a predetermined IRMOF. At least one of functionality, dimension, pore size and free volume of the IRMOF is substantially determined by the organic linking compound.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: August 16, 2005
    Assignee: The Regents of the University of Michigan
    Inventors: Omar M. Yaghi, Mohamed Eddaoudi, Hailian Li, Jaheon Kim, Nathaniel Rosi
  • Patent number: 6905532
    Abstract: Process for producing a copper-containing aqueous solution, in which a copper mass is dissolved in the presence of an oxidant in an aqueous leach liquor containing monoethanolamine and (HMEA)2CO3. The leach liquor is produced by partially carbonating the monoethanolamine.
    Type: Grant
    Filed: November 10, 2003
    Date of Patent: June 14, 2005
    Assignee: Phibro-Tech, Inc.
    Inventors: Hugh W. Richardson, Gang Zhao
  • Patent number: 6905531
    Abstract: Process for producing a copper-containing aqueous solution, in which a copper mass is dissolved in the presence of an oxidant in an aqueous leach liquor containing monoethanolamine and (HMEA)2CO3. The leach liquor is produced by partially carbonating the monoethanolamine.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: June 14, 2005
    Assignee: Phibro Tech, Inc.
    Inventors: Hugh W. Richardson, Gang Zhao
  • Patent number: 6822107
    Abstract: Copper precursors of the formula (I): wherein: Cu is Cu(I) or Cu(II); x is an integer having a value of from 0 to 4; each of R, R′ and R″ may be the same as or different from one another and each is independently selected from the group consisting of H, C1-C6 alky), C1-C6 perfluoroalkyl and C6-C10 aryl; when Cu is Cu(I), A is a Lewis base; when Cu is Cu(II), A is: wherein x, R, R′ and R″ are as specified above.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: November 23, 2004
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Thomas H. Baum, Gautam Bhandari, Chongying Xu
  • Patent number: 6818783
    Abstract: This invention is directed to a group of novel homologous eight membered ring compounds having a metal, such as copper, reversibly bound in the ring and containing carbon, nitrogen, silicon and/or other metals. A structural representation of the compounds of this invention is shown below: wherein M and M′ are each a metal such as Cu, Ag, Au and Ir; X and X′ can be N or O; Y and Y′ can be Si, C; Sn, Ge, Al, or B; and Z and Z′ can be C, N, or O. Substituents represented by R1, R2, R3, R4, R5, R6, R1′, R2′, R3′, R4′, R5′, and R6′ will vary depending on the ring atom to which they are attached. This invention is also directed to depositing metal and metal-containing films on a substrate, under ALD or CVD conditions, using the above novel compounds as precursors.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: November 16, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: John Anthony Thomas Norman, David Allen Roberts, Morteza Farnia, Melanie Anne Boze
  • Patent number: 6784319
    Abstract: Compositions comprising (±)-2-((dimethylamino)methyl)cyclohexanone, a transition-metal salt, and an organic solvent and methods of preparing (±)-cis-2-((dimethylamino)methyl)-1-(aryl)cyclohexanols, in particular (±)-cis-2-((dimethylamino)methyl)-1-(3-methoxyphenyl)cyclohexanol, are disclosed herein. In one embodiment, the (±)-2-((dimethylamino)methyl)cyclohexanone and transition-metal salt are in the form of a (±)-2-((dimethylamino)methyl)cyclohexanone:transition-metal salt complex. In another embodimemt, aryl is 3-methoxyphenyl.
    Type: Grant
    Filed: September 15, 2003
    Date of Patent: August 31, 2004
    Assignee: Euro-Celtique, S.A.
    Inventors: Robert J. Kupper, Andreas Stumpf
  • Patent number: 6696586
    Abstract: This invention relates to an organothiosulfonato Au(I) complex having the formula [A—SO2S—Au—SSO2—A]n−M+n wherein M is a cationic counter ion; A is a substituted or unsubstituted organic group; and n is 1 to 4; and wherein the compound is symmetrical. It further relates to the synthesis of said compounds.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: February 24, 2004
    Assignee: Eastman Kodak Company
    Inventors: Brian P. Cleary, Roger Lok, Weimar W. White
  • Patent number: 6677490
    Abstract: The invention relates to a method for producing a mixture of alcohols/ketones by decomposing an alkyl hydroperoxide, particularly to a method for producing a cyclohexanol/cyclohexanone by decomposing cyclohexyl hydroperoxide in the presence of a heterogeneous catalyst. According to the invention, the reaction is carried out in the presence of a heterogeneous catalyst containing an organometallic segment fixed on the surface of a porous solid compound such as silicon. The organometallic segment can be formula (I).
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: January 13, 2004
    Assignee: Rhodia Polyamide Intermediates
    Inventors: James Clark, Eric Fache, Ducan Macquarrie, Peter Price, John Rafelt
  • Patent number: 6660632
    Abstract: The invention is directed to a photoresist-free method for depositing films composed of metals, such as copper, or its oxides from metal complexes. More specifically, the method involves applying an amorphous film of a metal complex to a substrate. The metal complexes have the formula MfLgXh, wherein M is selected from the group consisting of Ti, V, Cr, Au, Mn, Fe, Co, Ni, Cu, Zn, Si, Sn, Li, Na, K, Ba, Sr, Mo, Ru, Pd, Pt, Re, Ir, and Os; L is a ligand of the formula (R2NCR′2CR″2O), wherein R, R′ and R″ are independently selected from H, CnHm, and CnHmAxBy, wherein A and B are independently selected from main group elements and f, g, h, n, m, x and y represent integers; and X is an anion independently selected from N3, NCO, NO3, NO2, Cl, Br, I, CN, OH, H and CH3. These films, upon, for example, thermal, photochemical or electron beam irradiation may be converted to the metal or its oxides.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: December 9, 2003
    Assignee: EKC Technology, Inc.
    Inventors: Ross H. Hill, Yo Mao Shi
  • Patent number: 6649783
    Abstract: Compositions comprising (±)-2-((dimethylamino)methyl)cyclohexanone, a transition-metal salt, and an organic solvent and methods of preparing (±)-cis-2-((dimethylamino)methyl)-1-(aryl)cyclohexanols, in particular (±)-cis-2-((dimethylamino)methyl)-1-(3-methoxyphenyl)cyclohexanol, are disclosed herein. In one embodiment, the (±)-2-((dimethylamino)methyl)cyclohexanone and transition-metal salt are in the form of a (±)-2-((dimethylamino)methyl)cyclohexanone:transition-metal salt complex. In another embodimemt, aryl is 3-methoxyphenyl.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: November 18, 2003
    Assignee: Euro-Celtique, S.A.
    Inventors: Robert J. Kupper, Andreas Stumpf
  • Patent number: 6646147
    Abstract: Process for producing a copper-containing aqueous solution, in which a copper mass is dissolved in the presence of an oxidant in an aqueous leach liquor containing monoethanolamine and (HMEA)2CO3. The leach liquor is produced by partially carbonating the monoethanolamine.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: November 11, 2003
    Assignee: Phibrotech, Inc.
    Inventors: Hugh W. Richardson, Gang Zhao
  • Patent number: 6620956
    Abstract: Nitrogen containing analogs of Copper II &bgr;-diketonates which analogs are more stable source reagents for copper deposition when substantially free of solvents of excess ligands. The nitrogen containing analogs replace —O— with —N(R″)— wherein R″ is an alkyl group having from one to four carbon atoms. Replacement of each —O— is preferred although replacement of one —O— per cyclic ring is sufficient to improve stability of the copper source reagents. The source reagent can be purified by sublimation to remove solvents and excess ligands prior to semiconductor processing.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: September 16, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Ling Chen, Barry Chin
  • Patent number: 6613924
    Abstract: Organosilver complexes with &bgr;-diketonates and neutral coordinating ligands are useful as silver precursors in chemical vapor deposition processes. The &bgr;-diketonates include 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate (hfac), acetylacetonate (acac), 2,2,6,6-tetramethyl-3,5-heptanedionate (tmhd), 1,1,1-trifluoro-2,4-pentanedionate, (tfac), 2,2,7-trimethyl-3,5-octanedionate (tmod), 1,1,1-trifluoro-5,5-dimethyl-2,4-pentanedionate (tfh) 1,1,1,2,2,3,3,7,7,8,8,9,9,9-tetradecafluoro-4,6-nonanedionate (tdf). Neutral coordinating ligands include triphenylphosphine, tributylphosphine, pyridine, tetramethylethanediamine (TMEDA) and tetramethylpropanediamine (TMPDA).
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: September 2, 2003
    Assignee: Research Foundation of State of New York
    Inventors: John T. Welch, Silvana C. Ngo, Kulbinder K. Banger
  • Patent number: 6599587
    Abstract: Disclosed is an organometallic precursor for forming a metal pattern, having a structure defined by the following Formula 1, and a method of forming the metal pattern using the same, in which the conductive metal pattern is readily formed through an exposing step without using a photo-resist.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: July 29, 2003
    Assignee: Samsung Eleectronics Co., Ltd.
    Inventors: Min Chul Chung, Soon Taik Hwang, Young Hun Byun, Euk Che Hwang
  • Patent number: 6538147
    Abstract: The present invention provides a copper precursor according to the formula (R3COOCR2COR1)Cu+1{L}x, where x is 1, 2 or 3 and L is a neutral ligand. The precursors in the present invention, which are low melting solids or distillable liquids with high volatility and thermal stability, can be vaporized without decomposition and used to deposit high quality copper films. The improved stability of the copper compounds in the present invention enables them to reproducibly produce selective copper films on metallic or electrically conductive surfaces.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: March 25, 2003
    Inventor: Hyungsoo Choi
  • Patent number: 6534665
    Abstract: The present invention relates to metallocenes, wherein the two cyclopentadienyl rings are connected to each other by a single carbon atom characterized by the following general formula III where each A, equal to or different from each other, is selected from the group consisting of: hydrogen, OR3, NRR4, or SR5; and to compounds of formula IV wherein each B, equal to or different from each other, is selected from the group consisting of: OH, NRH or SH, obtained by hydrolizing the corresponding oxygen, nitrogen or sulfur containing groups from compounds of formula III. These compounds are used as active catalyst components in the polymerization of olefins.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: March 18, 2003
    Assignee: Repsol Quimica S.A.
    Inventors: Maria Francisca Martinez Nu{overscore (n)}ez, Antonio Mu{overscore (n)}oz-Escalona LaFuente, Bego{overscore (n)}a Pe{overscore (n)}a Garcia, Pilar LaFuente Ca{overscore (n)}as
  • Publication number: 20030003722
    Abstract: A method of forming a film on a substrate using one or more complexes containing one or more chelating O- and/or N-donor ligands. The complexes and methods are particularly suitable for the preparation of semiconductor structures using chemical vapor deposition techniques and systems.
    Type: Application
    Filed: August 19, 2002
    Publication date: January 2, 2003
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Brian A. Vaartstra
  • Patent number: 6486334
    Abstract: Disclosed are thiol-functionalized phospholipids that have been covalently linked to a gold and/or silver substrate, methods for making them, and intermediates useful for such purposes. The resulting material creates a biomimetic surface that can be included in a conduit containing blood.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: November 26, 2002
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Hyuk Yu, Charles M. Strother, Xiqun Jiang, Sangwook Park
  • Publication number: 20020103394
    Abstract: An organometallic copper complex having the following formula is favorably employable for preparing copper metal film by chemical vapor deposition: 1
    Type: Application
    Filed: November 6, 2001
    Publication date: August 1, 2002
    Inventors: Takumi Kadota, Tsutomu Takai, Kouhei Watanuki
  • Patent number: 6372928
    Abstract: A layer forming material is a compound which has a structure of six-membered ring coordinated to Cu and containing Si, and of which general formula is represented by the following chemical formula: wherein X1 and X2 are elements of the VI group of the same or different types which are coordinate-bonded to Cu, and of which examples include O, S, Se, Te and the like, at least one of Y1, Y2 and Y3 is Si, L is a group which has a double or triple bond and which is able to supply electrons to Cu, and each of R1 and R2 is any of SiF3, SiH3, CF3 and CH3 for example.
    Type: Grant
    Filed: January 7, 1998
    Date of Patent: April 16, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akemi Kawaguchi, Yuka Terai, Kousaku Yano
  • Patent number: 6369256
    Abstract: Volatile low melting solid Cu(II) metal complexes are provided which are capable of depositing a copper film on various substrates under CVD conditions in the absence of reducing carrier gas H2. These CU(II) metal complexes are represented by the structure formula: Cu(OCCF3R1CH2NHR2)2 wherein R1 is selected from hydrogen, C1-C4 lower-alkyl or perfluorinated C1-C4 lower-alkyl groups, e.g., CH3, and CF3, etc., and wherein R2 is C1-C6 lower-alkyl or C1-C6 lower-alkene, which may be substituted by one or more fluorine atoms, by a C1-C6 lower-alkoxy group or by a C1-C6 di-lower-alkyl amino group, provided that when R1 is CF3, R2 is other than hydrogen or methyl. A process for depositing copper film using these Cu(II) metal complexes is also provided.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: April 9, 2002
    Assignees: National Research Council of Canada, National Tsing-Hua University
    Inventors: Yun Chi, Peng-Fu Hsu, Tsung-Wu Lin, Chao-Shiuan Liu, Arthur J. Carty
  • Patent number: 6365746
    Abstract: This invention relates to an organomercapto Au(I) complex having the formula [(M—SOL)n—A—S—Au—S—A—(SOL—M)n]M wherein M is a cationic counterion; SOL is a solubilizing group: A is a substituted or unsubstituted divalent organic linking group; and n is 1 to 4 and wherein the compound is symmetrical. It further relates to a method of manufacturing an organomercapto Au(I) complex comprising reacting an Au (I) complex with an organomercapto ligand and isolating the resulting organomercapto Au(I) complex from the reaction mixture.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: April 2, 2002
    Assignee: Eastman Kodak Company
    Inventors: Roger Lok, Weimar W. White, Brian P. Cleary
  • Patent number: 6355821
    Abstract: Methods of forming metal alkoxides and methods of forming precursor solutions of metal alkoxides suitable for the coating of glass in the manufacture of electrochromic devices are disclosed. The method of forming metal alkoxides involves dissolving the metal halide in an anhydrous solvent and reacting it with an alcohol and (together with the addition of the alcohol or subsequently) adding an epoxide, and then evaporating-off the volatile components of the reaction product to leave a solid metal alkoxide that is substantially free of halide. The alkoxide may then be dissolved in a solvent including an alcohol (preferably ethanol) containing a small proportion of water to produce a precursor solution suitable for coating glass, the coating then being hydrolyzed to form a sol-gel and then baked to remove volatile components and to yield a thin layer of metal oxide.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: March 12, 2002
    Assignee: Sustainable Technologies Australia Limited
    Inventors: Andrew Joseph Koplick, Susan Marie Jenkins
  • Patent number: 6242625
    Abstract: In an acid leach copper extraction circuit for leaching copper values from copper ores using a water-immiscible organic solvent solution containing a copper extractant and an acid strip solution, the improvement wherein the stripped organic solvent solution is contacted with copper-free fresh aqueous acid to remove additional copper values therefrom, and then the resulting super stripped organic and the copper-containing aqueous acid are sent to the copper extraction circuit.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: June 5, 2001
    Assignee: Henkel Corporation
    Inventor: Gary A. Kordosky
  • Patent number: 6221285
    Abstract: The preparation of organomagnesium compounds from organic halides, especially aromatic chloro compounds, and magnesium metal in the presence of a transition metal compound as a catalyst.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: April 24, 2001
    Assignee: Studiengesellschaft Kohle mbH
    Inventors: Borislav Bogdanović, Manfred Schwickardi