Abstract: A glass-moulded type semiconductor device comprising semiconductor arrangement composed of at least one semiconductor pellet having at least one P-N junction, edges of which are exposed to peripheral surfaces of the semiconductor pellet, a pair of electrodes secured to opposite ends of the semiconductor arrangement through a brazing material, a first mould glass layer secured to the entire circumferential surface of the semiconductor arrangement and extending to the surfaces of the electrodes for passivating the P-N junction of the semiconductor arrangement, and a second mould glass in the form of at least one layer secured to the surface of said first mould glass layer.
Abstract: A sealing glass composition comprises a PbO-containing glass frit, two particulate refractory fillers having controlled particle size distributions, and optionally at least one additive to prevent the chemical reduction of the PbO when the frit is fired in the presence of reducing conditions. The sealing glass composition is useful as a package sealant. It is especially useful as a solder glass for sealing a face plate portion to a funnel portion of a color television picture tube at temperatures of about 400.degree. C. A particulate glass composition for use in preparing the sealing glass composition, a sealing glass paste and methods of using the sealing glass and paste are provided.
Abstract: A method and apparatus for the rapid, high-capacity pressurization of hot-isostatic pressing vessels, specifically of the type adapted for the hot-isostatic pressing of alloy shapes from powder metallurgy alloy charges. This is achieved by pressurizing with argon gas which is obtained by pumping cryogenic liquid argon at relatively low pressure to a relatively higher pressure and vaporizing said pumped liquid argon to produce said gas, which gas after use in the vessel for compacting is reclaimed and reliquefied for reuse.