Abstract: An outer wall material includes a first transparent member integrally or separately including a transparent plate material and a prism portion; and a reflection member provided on a second side of the prism portion of the first transparent member. The prism portion causes the reflection member to collect light whose angle with respect to a normal line of the plate material is equal to or greater than a predetermined angle and to retro-reflect the collected light, and transmits light whose angle with respect to the normal line of the plate material is less than the predetermined angle.

Abstract: A multiple panel glazing unit including at least two glass spacer bars (2) of toughened glass each having, optionally, opposite sides that are chamfered towards a common end surface (8) and which are sealed to the glass panels (22, 24) of multiple panel glazing unit by a transparent or translucent sealant (38). The use of toughened glass spacers allows the manufacture of multiple panel glazing units to meet given operating requirements, e.g. the ability to withstand externally applied forces such as varying differential air pressure of a given magnitude across the unit, with a smaller inter-glazing panel spacing than if glass spacers that are not toughened are used.

Abstract: A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

Abstract: When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.

Abstract: Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side retainer members having a height less than an uncompressed height defined by the glass microstructure assembly. The methods also comprise compressing the glass microstructure assembly via a load bearing top plate in intimate contact with the top glass layer while heating the glass microstructure assembly and the top plate to a glass sealing temperature, the glass sealing temperature being a temperature sufficient to make glass viscous, wherein the glass microstructure assembly is compressed until the load bearing top plate contacts the side retainer members, and wherein the lower surface of the top plate maintains adhesion to the upper surface of the top glass layer at the glass sealing temperature while the load bearing plate is supported by the side retainer members.

Abstract: A method for forming a fritted cover sheet includes providing a substrate and depositing an initial frit bead on the substrate. Thereafter, at least one additional frit bead is deposited on the substrate such that a base of the at least one additional frit bead contacts a base of an adjacent frit bead thereby forming a frit seal on the substrate.

Abstract: A method for capping a MEMS wafer to form a hermetically sealed device. The method includes applying a glass bonding agent to the cap wafer and burning off organic material in the glass bonding agent. The cap wafer/glass bonding agent combination is then cleaned to reduce lead in the combination. The cleaning is preferably accomplished using an oxygen plasma. The MEMS device is coated with a WASA agent. The cap wafer is then bonded to the MEMS wafer by heating this combination in a capping gas atmosphere of hydrogen molecules in a gas such as nitrogen, argon or neon. This method of capping the MEMS wafer can reduce stiction in the MEMS device.

Abstract: The present invention relates to a getter paste composition, and more particularly, to a getter paste composition which is quickly densified at low densification temperatures to be applied to a device that is weak to heat, provides good adhesiveness, controls moisture and gas effectively and is screen-printable to thereby improve productivity.

Abstract: The present invention relates to a low melting point frit paste composition and a sealing method for an electric element using the same, and more particularly, to a low melting point frit paste composition which is sealable and appropriate for a flat panel, protects an element weak to heat and improves a process yield with good print properties, and a sealing method for an electric element using the same.

Abstract: The present invention relates to a glass frit and a sealing method for an electric element using the same, and more particularly, to a glass frit which provides a good sealing effect to moisture and gas and is processable at low temperatures, and a sealing method for an electric element using the same.

Abstract: The cover according to the invention serves to encapsulate microsystems, wherein the cover comprises or is made of one or more cover units, and at least one cover unit comprises at least one first recess caused by deformation and bounded at least partially by at least one optical window, the quadratic surface roughness thereof being less than or equal to 25 nm. The invention further relates to a method for producing optical components, wherein the method is particularly also suitable for producing a cover according to the invention allowing encapsulation at the wafer level.

Abstract: After sealing layers are formed on peripheral edge parts of a front substrate and a rear substrate, the front substrate and the rear substrate are disposed to be opposed to each other. Current paths are formed in the sealing layers, and power supply is begun. An electric current, which reaches a maximum current value after a current-increasing period of 10% or more of an entire power-supply time, is supplied for a perdetermined time period. The sealing layers are heated and melted by the power supply, and peripheral parts of the front substrate and rear substrate are joined.

Abstract: A method of manufacturing an image display apparatus is provided and includes the steps of bringing panel members that constitute a display panel of the image display apparatus into a bake processing chamber, subjecting to bake processing the display panel members, lowering a temperature of the display panel members, and bringing the display panel members into a seal-bonding processing chamber. Seal-bonding processing is conducted by local heating to a seal-bonding portion.

Abstract: A method for constructing a mirror blank, including arranging hollow glass balls, on a front face sheet, and in close proximity to each other to permit fusing upon expansion; restricting the expansion of the hollow glass balls with a bounding structure during expansion of the hollow glass balls to force the hollow glass balls into a densely packed array of cells; applying heat to soften the hollow glass balls and increase the pressure within the hollow glass balls as the hollow glass balls fuse with each other during expansion, forming cells, wherein as a result of fusing, the hollow glass balls contact the front face sheet as a result of the increased pressure within the hollow glass balls; annealing and cooling the mirror blank to below annealing temperature associated with the hollow glass balls; and venting the cells.

Abstract: A construction block which has improved thermal insulation qualities, has improved sound transmission migration reduction properties, and which reduces or outright eliminates the effects of a seam failure. The construction block is comprised of a pair of generally parallel faces joined by a plurality of sides. At least one baffle is disposed within the interior chamber and is located along the weld seam that joins the two body member halves of the construction block. A desiccant or insulation gas, or both can be disposed within the interior chamber of the block.

Abstract: The method of manufacturing thin-walled blown glass single layer ornaments with an open spatial body consists in obtaining a raw glass shell with a closed spatial body (10), which is opened by such operations like cutting through, cutting out or cutting off along division lines (12) by means of a mechanical saw, blowpipe or laser, and thus obtained open spatial bodies (14) undergo further treatment in order for the edges to be smoothed, to be joined with other details and for the surfaces to be decorated.

Abstract: A display element has a luminescent body formed on a glass substrate, a glass cap with the rim bonded to the rim of the glass substrate, and a sealing layer of frit formed on the bonding region between the glass substrate and the glass cap. In encapsulating, the display element is placed between a pedestal an a pressing plate, and then a high-power laser beam is provided to penetrate the glass cap to focus on the sealing layer, resulting in sintering frit. Also, pressure is applied to the pedestal and the pressing plate.

Abstract: A vacuum insulating glass (IG) unit and method of manufacturing the same. A peripheral or edge seal (11) of a vacuum IG unit is formed utilizing microwave energy (17) in order to enable tempered glass sheets (2, 3) of the IG unit to retain a significant portion of their original temper strength. In certain exemplary embodiments, the edge seal may be formed of glass frit or solder glass. In certain embodiments, at least a portion (12, 12a, 301) of the edge seal material may be deposited on one or both substrates prior to a thermal tempering process so that during tempering the edge seal material is permitted to diffuse into (i.e., bond to) the glass substrate(s) (2, 3). Optionally, additional edge seal material (303) may be added after tempering. The final edge seal (11) is preferably formed via microwave heating (17) of the edge seal material.

Abstract: The present invention discloses a limited volume insert fused within a vial and the process for forming the same. The insert has a conical body, which tapers to a closed bottom, and an open top with a flange around the periphery thereof. The vial may be of the type where screw threads are located on the outer side of the neck of the vial, a reduced neck vial so that a cap may be snapped onto the vial, or a vial with a cap that is crimped onto the vial. The insert is placed within the vial so that the flange rests on the top of the open end of the vial. The flange and the top of the vial are then heated so that the flange reaches a molten state and the top of the vial reaches a submolten state. A tool is used to apply pressure to the now molten flange so that the flange will fuse to the vial. The tool is then removed and the insert is bonded to the vial without interfering with the placement or removal of a cap on the vial. Therefore, the insert may be emptied easily before the vial is disposed of.

Abstract: A display element has a luminescent body formed on a glass substrate, a glass cap with the rim bonded to the rim of the glass substrate, and a sealing layer of frit formed on the bonding region between the glass substrate and the glass cap. In encapsulating, the display element is placed between a pedestal an a pressing plate, and then a high-power laser beam is provided to penetrate the glass cap to focus on the sealing layer, resulting in sintering frit. Also, pressure is applied to the pedestal and the pressing plate.

Abstract: A method of manufacturing an image display apparatus is provided which includes the steps of: bringing panel members that constitute a display panel of the image display apparatus into a bake processing chamber, subjecting to bake processing the display panel members, lowering a temperature of the display panel members, bringing the display panel members into a seal-bonding processing chamber, and conducting seal-bonding processing by local heating to a seal-bonding portion.

Abstract: There is provided a method of manufacturing a glass panel and the glass panel manufactured by the method, which makes it possible to minimize the projection amount from the glass sheet surface for improved appearance and for reduced possibility of breaking-up of the depressurized condition resulting from contact with an object and also to reliably seal the vent with a relatively easy step. A number of spacers (2) are disposed between a pair of glass sheets (1A, 1B). Outer peripheries of the glass sheets (1A, 1B) are sealed with an outer periphery sealing portion (3) to form a gap (V) between the glass sheets (1A, 1B). A vent (4) is formed in one (1A) of the glass sheets (1A, 1B) for evacuating gas from the gap (V). The gas in the gap (V) is evacuated via the vent (4) to depressurize the gap (V), and then the vent (4) is sealed. A metal solder (6) is employed as a sealing material for sealing the vent (4).

Abstract: In a sealing apparatus used in a process for sealing a glass tube-assembly of a flat-type cathode-ray tube by frits, three of a front panel, a screen panel and a funnel can be sealed together, and the front panel can be prevented from being broken. The sealing apparatus includes a frame for properly positioning a combined assembly in which the front panel, the screen panel and the funnel are butted with each other by frits and the following sealing jig(41) The sealing jig(41) includes a holding means(42) for holding a front panel(2) and a screen panel (3) under the condition that joint surfaces of the front panel and the screen panel are butted with each other by frits The holding means(42) is provided with a first resilient member(43) which is urged against the outer surface of the front panel(2) and a second resilient member (42) which is urged against the outer surface of the screen panel(3).

Abstract: A glass panel includes a pair of glass sheets opposed to each other with a predetermined gap therebetween and having peripheral edges thereof bonded with a metal material to seal the gap air-tightly. The glass sheets are disposed relative to each other with a displacement of 2 mm or less in maximum at respective corresponding end faces thereof along the glass panel surface.

Abstract: A vacuum insulating glass (IG) unit and method of manufacturing the same. A peripheral or edge seal (11) of a vacuum IG unit is formed utilizing microwave energy (17) in order to enable tempered glass sheets (2, 3) of the IG unit to retain a significant portion of their original temper strength. In certain exemplary embodiments, the edge seal may be formed of glass frit or solder glass. In certain embodiments, at least a portion (12, 12a, 301) of the edge seal material may be deposited on one or both substrates prior to a thermal tempering process so that during tempering the edge seal material is permitted to diffuse into (i.e., bond to) the glass substrate(s) (2, 3). Optionally, additional edge seal material (303) may be added after tempering. The final edge seal (11) is preferably formed via microwave heating (17) of the edge seal material.

Abstract: When an object to be heated is heated without temperature nonuniformity in its heated surface, unwanted thermal deformation can be suppressed, and thermal processing precision can be improved. For this purpose, a heat transfer plate for heating a plate-like object to be heated, and a base plate are stacked. A rod heater as a heat source is inserted in the heat transfer plate. The heat transfer plate has a larger thermal conductivity and smaller creep than the base plate.

Abstract: A method for forming a back panel for a plasma display includes preparing a green ceramic tape having a temperature coefficient of expansion (TCE) which matches the TCE of a metal core. Barrier ribs are formed on the back panel by embossing or scribing the green ceramic tape. The formed green ceramic tape is then bonded to the metal core. Finally, the bonded formed green ceramic tape and the metal core are cofired to form the back panel.

Abstract: A composite sealing frame structure and a method for forming a composite sealing frame structure. In one embodiment, a rigid backbone component is provided with a first surface and a second surface. A first sealing material is disposed on the first surface of the rigid backbone component. A second sealing material is disposed on the second surface of the rigid backbone component. The first sealing material is adapted to seal the rigid backbone component to a first portion of a flat panel display. The second sealing material is adapted to seal the rigid backbone component to a second portion of a flat panel display such that the first portion and the second portion of the flat panel display are secured together by the rigid backbone component and the first and the second sealing material.

Abstract: Seal material bars and methods for forming seal material bars, a seal material frame and a method for forming a seal material frame, and a method for forming a flat panel display. Bars of seal material are made by extruding a mixture of glass frit and organic compound. In one embodiment, the glass frit bars have joining features formed in them. Ceramic material is also extruded so as to form seal material bars. The seal material bars are placed between the backplate and the faceplate and glass frit slurry is placed between adjoining seal material bars. Alternatively, seal material bars having joining features are used by mating joining features of adjoining seal material bars. A heating step melts the seal material so as to form a sealed interior region. Alternatively, the bars of seal material are used to form a seal material frame that is disposed between the faceplate and the backplate.

Abstract: A low-E sputter-coated layer system for automotive and architectural purposes of the basic Si.sub.3 N.sub.4 /NiCr/Ag/NiCr/Si.sub.3 N.sub.4 type improved by either an undercoat of TiO.sub.2 or the use of stainless steel in the Si.sub.3 N.sub.4 layers, or both. By selection of appropriate thicknesses the layer coatings may be rendered heat treatable. I.G. units are an advantage product in which the coatings may be employed.

Abstract: A semiconductor acceleration sensor has a silicon detecting body and a glass substrate. The silicon detecting body has a weight, a supporting frame, and beams for coupling the weight to the supporting frame, which are integrally processed from a silicon wafer. At least one semiconductor strain gauge is formed on a surface of a beam. The glass substrate is electrostatically joined with the supporting frame of the silicon detecting body. Furthermore, a gap portion is formed between a surface of the glass substrate and a lower surface of the weight.

Abstract: The present provides a method for making glass pressure sensors in batch. First glass plates of appropriate dimensions are scribed. Then electrodes are sputters onto each of the plates, followed by screen printing a frit layer and crossover tabs. The plates are then preglazed and bonded together to form a plurality of sensors. The plates are then scribed and broken along the scribes to form individual sensors.

Abstract: A structure, such as a flat-panel device, is sealed together by a gap-jumping technique in which an edge (44S) of a wall (44) is positioned near a matching sealing area (40S) of a plate structure (40) such that a gap (48) at least partially separates the edge of the wall from the sealing area of the plate structure. The gap usually has an average height of 25 .mu.m or more. Energy is then transferred locally to material of the wall along the gap to cause material of the wall and the plate structure to bridge the gap and seal the plate structure to the wall. The energy-transferring step is typically performed with light energy provided by a laser (56). Local energy transfer can also be utilized to tack the plate structure to the wall at multiple spaced-apart locations (44A) along the wall. The tacking operation is typically performed as a preliminary step to sealing the plate structure to the wall.

Abstract: A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.

Abstract: The invention relates to a process for producing a vacuum in an insulating glazing composed of two glass sheets (2, 3) separated by pins (4). According to the invention, one of the glass sheets includes a hole (12) which is plugged by a softened ball after the vacuum has been achieved. The invention also relates to an insulating glazing whose glass sheets are separated by pins (4) and joined at their periphery by a sealing joint.

Abstract: A method of manufacturing a liquid crystal display device, in which predetermined portions of two glass plates bonded to each other with a sealing member interposed therebetween and constituting the display device, can be cut without turning over the bonded two glass plates and without breaking necessary portions thereof. In the method of manufacturing the liquid crystal display device, first, an upper one of the bonded two glass plates is half cut from its upper surface with a blade, and unnecessary portions of the upper glass plate are removed by the use of a vacuum suction head. Thereafter, predetermined portions of exposed portions of a lower one of the bonded two glass plates are fully cut with the blade. In accordance with it, it is not necessary to turn over the the bonded two glass plates-to cut it into a plurality of units, and, therefore, a cutting process can be performed automatically.

Abstract: According to the bonding method of flat electrodes of the present invention, a crystal glass material is arranged between electrodes, heated, and melted while the flat electrodes are pressured, and the melted crystal glass material is fused and re-crystallized to the surface of each flat electrode, so that the flat electrodes can be bonded with strong bonding force. Since a plate-like spacer or an application glass of a low melting point is not used in the method, disadvantages resulting from the spacer or the glass can be removed.

Abstract: A hollow structural glass block is slotted by cutting or grinding to allow the installation of a specifically sized decorative panel insert into the interior of the block. The decorative insert is preferably comprised of stained, iridescent, or etched glass. A bead of clear silicone rubber caulking is applied to the bottom edge of the insert prior to slipping the insert through the slot. The silicone rubber caulking functions as an adhesive to secure the bottom edge of the insert stationary to the bottom interior of the block. The top edge of the insert is positioned between the edges of the block defining the slot. The slot, and the top exposed edge of the insert lying therein is covered with a layer of clear silicone rubber to secure the insert and seal the interior of the glass block against the entrance of moisture and mortar. Additionally, substantial thermal insulating values are maintained in the decorative blocks due to the sealed nature when completed.

Abstract: A method is provided for making a hermetically sealed package for a power semiconductor wafer having substantially entirely silicon materials selected to have coefficients of thermal expansion closely matching that of the power semiconductor wafer. A semiconductor wafer such as a power diode includes a layer of silicon material having first and second device regions on respective sides. An electrically conductive cap and base of silicon are disposed in electrical contact with the first and second regions of the semiconductor device, respectively. An electrically insulative sidewall of silicon glass material surrounds the semiconductor wafer, is spaced from an edge thereof, and is bonded to the cap and base for hermetically sealing the package.

Abstract: For filling the inner space of an insulating glass panel (1) with argon, one glass pane is maintained at a distance from the spacer frame in the region of one corner (2) during pressing of the insulating glass panel (1), by holding this glass pane at a spacing from the spacer frame by pivoting of a portion (12) of the press plate (11), with the aid of suction cups (19, 20) provided at this portion (12). Through the thus-formed gap, a probe (4) for feeding argon and a probe (5) for exhausting air from the inner space of the insulating glass panel are introduced. The probe (4) blowing argon into the inner space is oriented in parallel to the lower horizontal leg of the insulating glass panel (1), and the other probe (5), exhausting air and/or air-argon mixture, exhibits an orifice pointing obliquely upwardly, i.e. away from the other probe (4).

Abstract: A method is provided for making a hermetically sealed package for a power semiconductor wafer with silicon materials selected to have coefficients of thermal expansion closely matching that of the power semiconductor water. A semiconductor wafer such as a power diode has a layer of silicon material having first and second device regions on respective sides thereof. An electrically conductive cap and base of silicon are disposed in electrical contact with the first and second regions of the semiconductor device, respectively. An electrically insulative sidewall of silicon glass material surrounds the semiconductor wafer, is spaced from the edge, and is bonded to the cap and base for hermetically sealing the package. The glass sidewall is directly bonded to the base by bringing the base and sidewall into intimate contact under a slight pressure and heating to a temperature at which the glass wets the silicon base, holding this temperature for a time and then cooling the composite to complete the bond.

Abstract: An insulated glass unit formed from a pair of glass sheets, one of which has an electroconductive coating, i.e. a first sheet, is fabricated by positioning the first sheet on a vacuum support and the other sheet, i.e. second sheet, spaced above the first sheet a sufficient distance therefrom to prevent arcing during electrical heating of the marginal edges of the second sheet. After the marginal edges of the second sheet are heated to a temperature sufficient to cause sagging of the marginal edges, the two sheets are brought together to join the marginal edges by fusion. A strip heater heats the edges of the sheet to a temperature sufficient to prevent chilling of the marginal edges of the upper sheet when contacting the marginal edges of the lower sheet. Thereafter, the sheets are separated from one another and air moved between the sheets to bloom the edes. After blooming the edges, the joined glass sheets are annealed, and an insulating gas moved into the airspace through a pore hole.

Abstract: The invention relates to a device for producing essentially cone-shaped flat bodies, whose surface area consists of n attached segments, (preferably 4, 6, 8), each composed of a number of attached glass pieces connected to one another, particularly Tiffany-style lampshades, whereby the boundary lines of adjoining segments lie in a common plane or a straight line, having a base body or form cone for placing glass pieces to be soldered, a bottom plate placed at the form cone and a rod, that is positioned in the middle of the bottom plate and form cone.

Abstract: A method for assembling and soldering pieces of stained glass involves placing a template to outline a mosaic fit of glass pieces on a workboard by nailing flat sided nails to the outer perimeter of the glassware as defined by the template in which glass pieces are cut and wrapped with copper foil positioned on the template with attaching the support assembly to a rotatable workboard which is positioned to solder the glassware together in which the template is subsequently removed and the glassware turned and rotated on the workboard and the glassware is soldered together.

Abstract: Method for bonding the edges of all-glass multiple panes, particularly all-glass double panes, whereby the individual panes moving through an elongated tunnel furnace or the like are cut to size, may potentially be washed, are subjected to an at least partial edge smoothing, are aligned with one another and, after being pre-heated to a pre-heating temperature lying below the deformation temperature of the glass, are bonded to one another at the horizontal and vertical pane edges, being bonded while standing upright, characterized in that individual panes cut to size and potentially washed are individually pre-heated lying on their surface facing away from the pane interspace of the all-glass multiple pane to be manufactured, and in that the individual panes are subsequently placed upright and are placed together to form groups of individual panes in accord with an all-glass multiple pane to be manufactured, whereupon the edge bonding ensues; further, apparatus for the implementation thereof.

Abstract: A low pressure mercury vapor discharge lamp forms an electric discharge path by the use of a bulb placed on an end plate and the bulb is formed by a process which results in the connecting outer side surfaces of juxtaposed glass tubes through communication holes formed in the outer side surfaces respectively. The process involves placing the juxtaposed glass tubes so that their outer surfaces are opposed in a contacting state. A portion of each of the glass tubes is heated in order to form a communication hole through the utilization of a burner inserted through an open end into the interior of each of the glass tubes in order to cause fusion of that particular portion in each tube to thereby form the communication hole by wind pressure.

Abstract: A translucent block includes a pair of parallel upper and lower faces each having a generally irregular hexagonal shape. There are a pair of generally rectangular, opposing sides which are parallel with each other, have a first preselected height and a first preselected width, and are perpendicular and joined to the upper and lower faces. A first pair of generally rectangular, opposing ends are parallel with each other, have the first preselected height and a second preselected width, and are perpendicular and joined to the upper and lower faces. A second pair of generally rectangular, opposing ends are parallel with each other, have the first preselected height and the second preselected width, and are perpendicular and joined to the upper and the lower faces. One of the first pair of ends is joined to one of the second pair of ends with a predetermined angle of ninety degrees therebetween. Each of the first pair of ends and each of the second pair of ends are respectively joined to one of the pair of sides.

Abstract: In an apparatus for mounting, within the glass neck of a cathode ray tube envelope, an electron gun assembly which includes the usual glass stem in the form of a disk with an exhaust tubulation extending centrally therefrom for eventual evacuation of the envelope, an upright support tube is provided with a central bore which is closed at its lower end and opened at the upper end for receiving the exhaust tubulation when the electron gun assembly is supported by such tube with the stem above the upper end of the support tube, and the support tube further has longitudinal passages therein spaced outwardly from the central bore and isolated from the latter, such longitudinal passages opening at ends thereof adjacent the upper end of the support tube.

Abstract: It is desirable to have a camera tube in which the signal plate has a low capacity. This may be achieved by taking a conductor from the signal plate through the glass faceplate. Previous methods of manufacturing a faceplate in which a conductor is embedded have proved unsatisfactory because of difficulty in carrying them out, and distortion and incomplete fusion of glass.A graphite mould having a base and walls contains and supports two glass blocks and a conductor and permits a degree of fluidity of the glass to be obtained which gives good fusion.

Abstract: An article of manufacture is disclosed for use in a projection televison system. A cathode ray picture tube has a face panel with a rearwardly extending skirt and a window for receiving a cathodoluminescent imaging screen. The tube has a seal land which defines a plane whose normal makes a non-zero acute angle with respect to the axis of said window. The article is for use in a system having a cathode ray picture tube whose projection optical axis is on the axis of a remotely located viewing screen, and at least one displaced axis cathode ray picture tube; that is, a tube whose projection optical axis is displaced from the axis of the viewing screen by a non-zero acute angle. The method according to the invention provides for compensating for the non-linear magnification distortion of the projected image caused by the displacement of the tube off the viewing screen axis.