Tensioned Patents (Class 73/335.14)
  • Patent number: 12253449
    Abstract: Provided are a physical property measurement method, a physical property measurement device, and a probe that can simply measure physical properties of a surface layer portion of an object. A physical property measurement method includes a step of bringing a probe into contact with a surface layer portion of a liquid or gel-like object and maintaining a contact state, a step of measuring a height of the object rising along the probe in contact with the object, and a step of calculating viscous properties or elastic properties of the surface layer portion of the object using the measured height of the object rising along the probe.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: March 18, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Tadashi Kajiya, Daisuke Sawai, Koji Miyata, Hiroyuki Noda