Abstract: In an embodiment a circuit includes an inertial measurement unit configured to be oscillated via a driving signal provided by driving circuitry, a lock-in amplifier configured to receive a sensing signal from the inertial measurement unit and a reference demodulation signal which is a function of the driving signal and provide an inertial measurement signal based on the sensing signal, wherein the reference demodulation signal is affected by a variable phase error, phase meter circuitry configured to receive the driving signal and the sensing signal and provide, as a function of a phase difference between the driving signal and the sensing signal, a phase correction signal for the reference demodulation signal and a correction node configured to apply the phase correction signal to the reference demodulation signal so that, in response to the phase correction signal being applied to the reference demodulation signal, the phase error is maintained in a vicinity of a reference value.

Abstract: One of the objects of the present invention is to provide a three-axis micromachined gyroscope which improves the detection sensitivity for detecting angular velocity. Accordingly, the present invention provides a three-axis micromachined gyroscope, including: a base; a vibration part suspended by the base, including a vibration assembly for receiving Coriolis force and generating a position change; a drive electrode for driving the vibration part; a detection part connected with the vibration part for detecting position change of the weights after receiving Coriolis force, and converting the position change of the weight into an electrical signal for outputting; and a swing center of each weight being outside the corresponding weight. When the three-axis micromachined gyroscope receives an angular velocity, the swinging weight is subjected to Coriolis force and a corresponding position change occurs.

Abstract: The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator through the coupling mechanism, and the first resonator and the second resonator are connected with the substrate and are able to be displaced relative to the substrate. The coupling mechanism includes a coupling arm, a support shaft, a first connecting piece and a second connecting piece. The coupling arm includes a first force arm, a second force arm and a coupling portion. The support shaft has one end connected with the substrate, and one other end connected with the coupling portion. The first force arm is connected with the first resonator through the first connecting piece, and the second force is connected with the second resonator through the second connecting piece.

Abstract: An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.

Abstract: A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.

Abstract: According to one embodiment, a sensor includes a base including a first face including a first face region, and a first structure body fixed to the first face region. The first structure body includes a first support portion fixed to the first face region, a second support portion fixed to the first face region, a first movable portion, and a first fixed electrode fixed to the first face region. The first movable portion is supported by the first and second support portions and apart from the base in a first direction crossing the first face region. The first movable portion includes a first movable electrode facing the first fixed electrode, and a first conductive member. A first current flows the first conductive member along a second direction crossing the first direction. A first gap is provided between the first fixed electrode and the first movable portion.

Abstract: A monitoring device is attached to a first leg portion and detects vibration generated in the first leg portion. The monitoring device includes a sensor unit including an inertial sensor, a plate for attachment of the sensor unit, a spacer in contact with the first leg portion, and a bolt for fixation, and is attached to the first leg portion by the bolt with the spacer, the plate, and the sensor sequentially stacked and the spacer is softer than the plate.

Abstract: An angular rate sensor. The sensor includes a Coriolis vibratory gyroscope (CVG) resonator, configured to oscillate in a first normal mode and in a second normal mode; a frequency reference configured to generate a reference signal; and a first phase control circuit. The first phase control circuit is configured to: measure a first phase difference between: a first phase target, and the difference between: a phase of an oscillation of the first normal mode and a phase of the reference signal. The first phase control circuit is further configured to apply a first phase correction signal to the CVG resonator, to reduce the first phase difference. A second phase control circuit is similarly configured to apply a second phase correction signal to the CVG resonator, to reduce a corresponding, second phase difference.

Abstract: In an example embodiment, motion is detected with an IMU utilizing standard deviation. Specifically, an IMU may obtains IMU measurements. An IMU motion detection process may accumulate a particular number of IMU measurements over a time interval to calculate an absolute magnitude of earth rate (ERimu) value and an absolute magnitude of normal gravity value (GNimu). The values calculated may be referred to as a sample. The IMU motion detection process may create sample rolling histories based on a particular number of samples, e.g., consecutive samples. The IMU motion detection process may then calculate standard deviation values for a sample rolling history based on the ERimu and GNimu values included in the sample rolling history. The IMU motion detection process may compare the standard deviation values to respective motion threshold values, which may be adaptive, to determine if a body of interest, e.g., vehicle, is moving or is stationary.

Abstract: A position estimation apparatus, a position estimation method, and a program that can estimate a position of a tracker with high accuracy while the power consumption is reduced is provided. An estimation result storage section (50) stores a result of estimation of a position of a tracker (12). An acceleration data acquisition section (52) repeatedly acquires acceleration data indicative of an acceleration of the tracker (12) from a sensor that detects an acceleration of the tracker (12). An estimation result updating section (56) updates the result of estimation on the basis of the result of estimation of a position of the tracker stored in the estimation result storage section (50) and the acquired latest acceleration data. A velocity information acquisition section (54) acquires information of the velocity of the tracker (12).

Abstract: The present invention relates to a sensor suite comprising at least one sensor. More particularly, the present invention relates to a sensor suite for measuring absolute and/or relative position, location and orientation of an object on or in which the sensor suite is employed. The present invention further relates to improved, novel sensor types for use in the sensor suite. More particularly, the present invention relates to an improved, novel magnetometer that is self-calibrating and scalable. Still more particularly, the present invention relates to such a magnetometer that is miniaturized. Further embodiments of the present invention relate to systems and methods for providing location and guidance, and more particularly for providing location and guidance in environments where global position systems (GPS) are unavailable or unreliable (GPS denied and/or degraded environments).

Abstract: A write assist circuit is provided. The write assist circuit includes a transistor switch coupled between a bit line voltage node of a cell array and a ground node. An invertor is operative to receive a boost signal responsive to a write enable signal. An output of the invertor is coupled to a gate of the transistor switch. The write assist circuit further includes a capacitor having a first end coupled to the bit line voltage node and a second end coupled to the gate node. The capacitor is operative to drive a bit line voltage of the bit line voltage node to a negative value from the ground voltage in response to the boost signal.

Abstract: An angular velocity sensor includes: a substrate; a drive beam supported via a support member with a fixing part; a drive weight supported with the drive beam; a detection weight supported via a beam part including a detection beam with the drive weight; and a detection part in the detection beam generating an electric output corresponding to a displacement of the detection beam when an angular velocity is applied. When the angular velocity is applied while the drive weight and the detection weight vibrate and are driven by the drive beam, the detection beam is displaced in a direction intersecting the vibration direction. The angular velocity is detected based on a change of an output voltage of a detection piezoelectric film in accordance with a displacement of the detection beam.

Abstract: Described herein are accelerometers, apparatus and systems incorporating accelerometers, and techniques for electrostatically adjusting a stiffness of a spring system in an accelerometer. Embodiments featuring resonant and/or quasi-static accelerometers are described. In certain embodiments, an accelerometer is a microelectromechanical systems (MEMS) device including a proof mass, an anchor, a spring attached to the proof mass, a sense electrode, and a tuning electrode. The spring and the proof mass form a spring system suspended from the anchor. The sense electrode is configured to generate a signal indicating movement of the proof mass based on application of a first signal. The tuning electrode is configured to receive an electrostatic tuning signal, the electrostatic tuning signal being separate from the first signal and providing a negative contribution to an overall stiffness of the spring system. The electrostatic tuning signal can be used to adjust the stiffness based on a measured acceleration.

Abstract: A physical quantity detection circuit including a differential amplification circuit that differentially amplifies a signal pair based on a first signal containing a first physical quantity component and a first vibration leakage component and a second signal containing a second physical quantity component having a phase opposite the phase of the first physical quantity component and a second vibration leakage component having the same phase as the phase of the first vibration leakage component, an adder circuit that adds the signal pair, a first synchronous wave-detection circuit that performs synchronous wave-detection on a signal based on an output signal from the differential amplification circuit, a second synchronous wave-detection circuit that performs synchronous wave-detection on a signal based on an output signal from the adder circuit, a physical quantity detection signal generation circuit that generates a physical quantity detection signal based on an output signal from the first synchronous wave

Abstract: A circuit device includes a detection signal terminal to which a detection signal from a vibrator is input, a digital signal terminal that performs at least one of an input and an output of a digital signal, a detection circuit, and a signal generation circuit that generates a noise reduction signal based on the digital signal. The detection circuit includes an amplification circuit that amplifies the detection signal. The amplification circuit performs addition processing of a signal obtained by amplifying the detection signal and the noise reduction signal.

Abstract: Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

Abstract: A bulk acoustic wave resonator apparatus includes a resonator member, at least one anchor structure coupling the resonator member to a substrate, and a comb-drive element connected to the resonator member. The comb-drive element includes first comb fingers protruding from the resonator member, and second comb fingers of a different material than the first comb fingers interdigitated with the first comb fingers to define sub-micron capacitive gaps therebetween. Respective sidewalls of the first comb fingers are oppositely-tapered relative to respective sidewalls of the second comb fingers along respective lengths thereof, such that operation of the comb-drive element varies the sub-micron capacitive gaps at the respective sidewalls thereof. Related devices and fabrication methods are also discussed.

Abstract: A physical quantity sensor includes a drive vibrator, a detection vibrator, and an elastic deformation portion disposed between the drive vibrator and the detection vibrator and elastically deformable along a first axis in which the drive vibrator and the detection vibrator are aligned, in plan view, and in which the drive vibrator and the detection vibrator vibrate in reverse phases along the first axis. The drive vibrator and the detection vibrator vibrating alternately repeat approaching and separating from each other along the first axis.

Abstract: A physical quantity sensor includes: a substrate; a movable object disposed displaceably with respect to the substrate; an electrode provided at a position facing the movable object on the substrate; an anchor portion fixing the movable object to the substrate; and a beam that is a rotation shaft of the movable object and connects the anchor portion and the movable object to each other, in which the movable object includes a first mass portion provided at one side of the beam, and a second mass portion provided at the other side of the beam, a first spring provided between the first mass portion and the beam, and a second spring provided between the second mass portion and the beam.

Abstract: A microelectromechanical (MEMS) sensor comprises MEMS components located within a MEMS layer and located relative to one or more electrodes. A plurality of proof masses are located within the MEMS layer and are not electrically coupled to each other within the MEMS layer. Both the first proof mass and the second proof mass move relative to at least a common electrode of the one or more electrodes, such that the relative position of each of the proof masses relative to the electrode may be sensed. A sensed parameter may be determined based on the sensed relative positions.

Abstract: A processor-implemented method for vector analysis to extract a speed of a rotating part of a machine is provided. The processor-implemented method including receiving, by a processor, two channel synchronous signals derived from at least two sensors coupled to the machine and positioned 90° with respect to each other; determining, by the processor, a plurality of vector angles for a plurality of samples from the two channel synchronous signals to identify a period; determining, by the processor, a time difference based on a sample rate and a number of the plurality of samples that are within the period; determining, by the processor, the speed based on a time difference. A system for carrying out the method is also provided.

Abstract: Agricultural electronics include many components. The components can be connected via an electronic link that connects the various components to components of an agricultural implement. This can include the use of a component type identifier and a master module. The identifier and the module can communicate data, including identification data and instructional data, to easily acknowledge and operate various electrical components of the agricultural implement. Additional sensors can be included to provide even additional data that is communicated between the module and the components of the agricultural implement to aid in providing instructions for operation and to provide additional data information.

Abstract: A vibrating structure angular rate sensor is provided which comprises a substrate; a plurality of flexible supporting structures fixed to the substrate; an annular member which is flexibly supported by the plurality of supporting structures to move elastically relative to the substrate; and an electrical drive system configured to drive the annular member to oscillate in a primary mode of oscillation with a resonant frequency f1. The plurality of supporting structures comprises at least one active supporting structure which carries an active electrical connection from the annular member to the drive system; and at least one passive supporting structure which does not carry an active electrical connection from the annular member to the drive system.

Abstract: A vibrating structure angular rate sensor comprises a substrate; a plurality of supporting structures fixed to the substrate; an annular member flexibly supported by the plurality of supporting structures 204; a drive system arranged to apply a periodic driving force such that the annular member 202 oscillates, in use, in a primary mode of vibration at a resonant frequency f1, with an amplitude of motion that generates a restoring force from the plurality of supporting structures 204; and a pick-off system arranged to determine the amplitude of motion of a secondary mode of vibration at a resonant frequency f2, in which oscillation of the annular member 202 is induced by the Coriolis force resulting from an angular rate experienced by the sensor 100. In use, the restoring force has a non-linear relationship with the amplitude of motion and a number p of supporting structures is selected such that f1=f2.

Abstract: A micromechanical spring structure, including a spring beam and a rigid micromechanical structure, the spring beam including a first end and an opposing second end along a main extension direction. The spring beam includes a fork having two support arms on at least one of the two ends, which is anchored to the rigid micromechanical structure, the two support arms being anchored to a surface of the rigid micromechanical structure, which extends perpendicular to the main extension direction of the spring beam.

Abstract: Provided is a gyroscope including: a first inertial body that is displaceable in a first direction and a second direction perpendicular to the first direction; a second inertial body that is displaceable in the first direction and the second direction; a third inertial body that is displaceable in the first direction and the second direction; a fourth inertial body that is displaceable in the first direction and the second direction; a first connection unit that supports the first inertial body; a second connection unit that supports the second inertial body; a third connection unit that supports the third inertial body; a fourth connection unit that supports the fourth inertial body; and a connection body that is provided among the first inertial body, the second inertial body, the third inertial body, and the fourth inertial body and connects the first inertial body, the second inertial body, the third inertial body, and the fourth inertial body.

Abstract: A MEMS gyroscope is equipped with: at least a first mobile mass suspended from the top of a substrate by means of elastic suspension elements coupled to anchor points rigidly fixed to the substrate, in such a manner as to be actuated in an actuating movement along a first axis of a horizontal plane and to carry out a measurement movement along a vertical axis, transverse to the horizontal plane, in response to a first angular velocity acting about a second axis of the horizontal plane, transverse to the first axis. The elastic suspension elements are configured in such a manner as to internally compensate unwanted displacements out of the horizontal plane along the vertical axis originating from the actuating movement, such that the mobile mass remains in the horizontal plane during the actuating movement.

Abstract: A micromechanical yaw rate sensor includes a substrate and a rotationally oscillating mass having a rotationally oscillating mass bearing. The rotationally oscillating mass bearing includes a rocker bar, a rocker spring rod which resiliently connects the rocker bar to the substrate, and two support spring rods which resiliently connect, on opposite sides of the rocker spring rod, the rocker bar to the rotationally oscillating mass.

Abstract: Systems and methods for converting a capacitance signal into a band-limited voltage signal for improved signal processing are disclosed herein. Such systems can include a capacitance-to-voltage converter configured to convert a capacitive signal from a capacitive device that operates at a mechanical frequency into a raw voltage signal, a clock generator configured to convert the mechanical frequency into one or more clock signals, and a filter component configured to apply a band-pass filter response to the raw voltage signal to convert the raw voltage signal into a band-limited voltage signal. The clock generator can be configured to apply the one or more clock signals to the filter component to drive a first pole and a second pole of the band-pass filter response to track the mechanical frequency of the capacitive device such that the geometric mean of the first pole and the second pole is substantially equal to the mechanical frequency.

Abstract: An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.

Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.

Abstract: Angular accelerometers are described, as are systems employing such accelerometers. The angular accelerometers may include a proof mass and rotational acceleration detection beams directed toward the center of the proof mass. The angular accelerometers may include sensing capabilities for angular acceleration about three orthogonal axes. The sensing regions for angular acceleration about one of the three axes may be positioned radially closer to the center of the proof mass than the sensing regions for angular acceleration about the other two axes. The proof mass may be connected to the substrate though one or more anchors.

Abstract: According to one embodiment, a vibration device includes a first movable unit including first and second movable portions arranged in a direction parallel to a first axis and enabled to vibrate in the direction parallel to the first axis, a second movable unit enabled to vibrate in a direction parallel to a second axis perpendicular to the first axis, and a connection unit configured to connect the first and second movable units together, wherein the following relationship is satisfied fi>(1+1/(2Qa))fa where a resonant frequency of the first movable unit in an in-phase mode is denoted by fi, a resonant frequency of the first movable unit in an anti-phase mode is denoted by fa, and a Q factor of resonance of the first movable unit in the anti-phase mode is denoted by Qa.

Abstract: The purpose of this invention is obtaining a gyroscope with high Q factor, high as fabricated symmetry and reducing the quadrature error. One aspect of this invention is a gyroscope including a semiconductor chip. This semiconductor chip comprising a substrate, first mass, second mass, connection unit. The first mass can move in any direction of a X-Y plane. The second mass can move in any direction of the X-Y plane. The connection unit located between the first mass and the second mass mechanically connects the first mass and the second mass.

Abstract: A two-axis microelectromechanical systems (MEMS) gyroscope having four proof masses disposed in respective quadrants of a plane is described. The quad proof mass gyroscope may comprise an inner coupler passing between a first and a third proof mass and between a second and a fourth proof mass, and coupling the four proof masses with one another. The quad proof mass gyroscope may further comprising a first outer coupler coupling the first and the second proof masses and a second outer coupler coupling the third and the fourth proof masses. The outer couplers may have masses configured to balance the center of masses of the four proof masses, and may have elastic constants matching the elastic constant of the inner coupler. The quad gyroscope may further comprise a plurality of sense capacitors configured to sense angular rates.

Abstract: A gyroscope includes at least one anchor and a plurality of gyroscope spring elements coupled to the at least one anchor. The gyroscope also includes a plurality of concentric rings coupled to the plurality of gyroscope spring elements and configured to encircle the plurality of gyroscope spring elements. The gyroscope further includes an excitation/detection/tuning unit electrostatically coupled to the plurality of concentric rings.

Abstract: A microelectromechanical gyroscope, includes: a supporting body; a first movable mass and a second movable mass, which are oscillatable according to a first driving axis and tiltable about respective a first and second sensing axes and are symmetrically arranged with respect to a center of symmetry; first sensing electrodes and a second sensing electrodes associated with the first and second movable masses and arranged on the supporting body symmetrically with respect to the first and second sensing axis, the first and second movable masses being capacitively coupled to the respective first sensing electrode and to the respective second sensing electrode, a bridge element elastically coupled to respective inner ends of the first movable mass and of the second movable mass and coupled to the supporting body so as to be tiltable about an axis transverse to the first driving axis.

Abstract: A sensor device for an electronic apparatus is provided with: a sensing structure generating a first detection signal; and a dedicated integrated circuit, connected to the sensing structure, detecting, as a function of the first detection signal, a first event associated to the electronic apparatus and generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of a temporal evolution of the first detection signal, and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.

Abstract: A sensor drive includes at least one first seismic mass and an operating apparatus. The operating apparatus is configured to put the first seismic mass into oscillatory motion such that (i) a projection of the oscillatory motion of the first seismic mass onto a first spatial direction is a first harmonic oscillation of the first seismic mass at a first frequency, and (ii) a projection of the oscillatory motion of the first seismic mass onto a second spatial direction oriented at an angle to the first spatial direction is a second harmonic oscillation of the first seismic mass at a second frequency not equal to the first frequency. A method includes operating such a sensor device having at least one seismic mass.

Abstract: An integrated MEMS structure includes a driving assembly anchored to a substrate and actuated with a driving movement. A pair of sensing masses suspended above the substrate and coupled to the driving assembly via elastic elements is fixed in the driving movement and performs a movement along a first direction of detection, in response to an external stress. A coupling assembly couples the pair of sensing masses mechanically to couple the vibration modes. The coupling assembly is formed by a rigid element, which connects the sensing masses and has a point of constraint in an intermediate position between the sensing masses, and elastic coupling elements for coupling the rigid element to the sensing masses to present a first stiffness to a movement in phase-opposition and a second stiffness, greater than the first, to a movement in phase, of the sensing masses along the direction of detection.

Abstract: A method of strain gauge fabrication is presented herein. The method includes: providing a first substrate having a cavity side; providing a second substrate having a semiconductor side; positioning the second substrate in relation to the first substrate such that the semiconductor side and the cavity side are contactable; processing the second substrate such that the first and second substrates are substantially joined via the semiconductor side and the cavity side; and etching the second substrate to define a strain gauge cantilevered over the cavity side of the first substrate.

Abstract: A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially configured with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.

Abstract: A MEMS sensor for measuring rotational motion about a first axis includes a frame, a base structure under the frame, a drive mass mounted in the frame for rotational movement about a second axis perpendicular to the first axis, and a first drive paddle in the drive mass. A first link includes a first end coupled to a first spring that movably couples the first drive paddle to the drive mass and a second end coupled to a second spring that movably couples the first link to the frame. A drive system includes an electrode aligned to exert electromotive force to pivot the first drive paddle and move the drive mass about the second axis. Deflection of the drive mass is greater than deflection of the first drive paddle when the drive system is operating.

Abstract: An acceleration sensor includes: a moving electrode extending in at least one of a first direction and a second direction perpendicular to the first direction, and including a plurality of planar patterns connected with each other; and an opposing electrode forming a capacitance with the moving electrode, wherein the plurality of planar patterns include: a first frame pattern; a first anchor pattern fixing the moving electrode to a surrounding structure; a first spring pattern connecting the first frame pattern and the first anchor pattern and having a stretching direction of the first direction; a second spring pattern connecting the first frame pattern and the first anchor pattern and having a stretching direction of the second direction; a wing pattern; and a third spring pattern connecting the first frame pattern and the wing pattern and having a stretching direction of a third direction perpendicular to the first and second directions.

Abstract: A micromechanical sensor is provided as including a substrate having a main extension plane and a mass element movable relative to the substrate, the movable mass element being coupled to the substrate via a spring structure, the spring structure including a first and a second spring element, the first and second spring elements extending essentially in parallel to each other in sections and being coupled to each other in sections, the spring structure including a first and a second compensation element for quadrature compensation, the first compensation element being connected to the first spring element, the second compensation element being connected to the second spring element, the first spring element having a first spring structure width extending along a transverse direction, the second spring element having a second spring structure width extending along the transverse direction, the first compensation element in a first subarea extending in parallel to the transverse direction along a first width, t

Abstract: A resonator device includes a base including a fixed section and a movable section connected to the fixed section, a resonator element including a first base section, a second base section, and a vibration arm, one end of which is connected to the first base section and the other end of which is connected to the second base section, the first base section being fixed to the fixed section and the second base section being fixed to the movable section, a weight section connected onto the movable section, and a stress relaxing section provided between a connection region of the weight section and the vibration arm.

Abstract: A rotation rate sensor for detecting a rotational movement of the rotation rate sensor about a rotational axis extending within a drive plane of the rotation rate sensor include: a first rotational element, a second rotational element and a drive structure moveable in parallel to the drive plane, the first rotational element being drivable about a first center of rotation to achieve a first rotational vibration in parallel to the drive plane, the second rotational element being drivable about a second center of rotation to achieve a second rotational vibration in parallel to the drive plane, the drive structure being (i) coupled to the first and second rotational elements, and (ii) configured to generate a drive mode in phase opposition of the first and second rotational vibrations.

Abstract: A physical quantity sensor includes a vibration element that performs drive vibration, an acceleration detection chip that detects an acceleration, a semiconductor element which is electrically connected to at least one of the vibration element and the acceleration detection chip, and a package that has a storage space for storing the vibration element, the acceleration detection chip and the semiconductor element. The semiconductor element is fixed to the package, the acceleration detection chip is fixed to the package with the semiconductor element interposed therebetween, and at least a portion of the acceleration detection chip overlaps the vibration element when the package is seen in a plan view.

Abstract: A sensor device for an electronic apparatus is provided with: a sensing structure generating a first detection signal; and a dedicated integrated circuit, connected to the sensing structure, detecting, as a function of the first detection signal, a first event associated to the electronic apparatus and generating a first interrupt signal upon detection of the first event. The dedicated integrated circuit detects the first event as a function of a temporal evolution of the first detection signal, and in particular as a function of values assumed by the first detection signal within one or more successive time windows, and of a relation between these values.