Combined With Means To Heat Tool And/or Work Patents (Class 82/51)
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Patent number: 11890684Abstract: An anvil for a cutting tool includes an anvil body. A curved passage extends from an inlet opening in the anvil body to an outlet opening in the anvil body. The anvil body can be made by an additive manufacturing process. The anvil body includes a top surface, a bottom surface, and a side surface between the top surface and the bottom surface. The side surface includes at least three side surface portions and at least three corner portions. Each corner portion is disposed between respective pairs of the side surface portions. At least one corner portion includes a surface that extends radially outward from a central axis of the anvil relative to extensions of a respective pair of side surface portions. The central axis extends between the top and bottom surfaces, wherein the extensions of the respective pair of side surface portions intersect within the periphery of the anvil.Type: GrantFiled: January 24, 2023Date of Patent: February 6, 2024Assignee: SECO TOOLS ABInventors: Andreas J. Larsson, Bjorn Gustafsson
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Publication number: 20140265029Abstract: A fabric cutting system and/or method can include a mandrel having a body and first and second legs, a chuck, the chuck configured to receive either one of the legs or body to rotatingly support the mandrel. The mandrel can be rotated and the fabric mounted on the mandrel can be cut about the leg at a location beyond the end of the other leg. One of the legs can include a leg extension removable from a leg base that when removed allows the other leg to be cut beyond the end of the leg base. The fabric can be cut with a cutting laser, which may be a multi-axis laser, and/or have low power.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: Atex Technologies Inc.Inventors: Danny Severino, Paul Van Hulle, Timothy Warner
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Publication number: 20110048183Abstract: A machining process and apparatus capable of increasing removal rates achievable when machining titanium and its alloys. The process includes heating a portion of a workpiece with a laser beam, cryogenically cooling a cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece, and machining the heated portion of the workpiece with the cutting tool. The apparatus includes a cutting tool, a device for heating a portion of a workpiece with a laser beam prior to being machined with the cutting tool, and a device for cryogenically cooling the cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece. The cryogenic fluid is circulated around the cutting tool to achieve a temperature differential between the workpiece and the cutting tool that is capable of improving removal rates and extending tool life at cutting speeds of, for example, above 100 m/min.Type: ApplicationFiled: February 19, 2010Publication date: March 3, 2011Applicant: PURDUE RESEARCH FOUNDATIONInventor: Yung C. Shin
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Patent number: 5859405Abstract: A method and a device for the precision turning of a workpiece made of a heat-treatable steel permits a dry hard precision turning of hardened workpiece surfaces without tempering. In order also to allow precision turning and hardening of unhardened workpiece surfaces which are simultaneous in terms of production time, use is made of the local temporary heating of the workpiece caused by machining. The workpiece surface is heated further locally by the action of a laser beam, in the region directly behind the cutter, up to the transformation temperature of the material to be machined via an optical fiber integrated in the tool. The surface is then self-quenched and, as a result, hardened close to the surface. At the same time, the surface temperature at the point of action of the laser beam can be recorded thermographically and, this actual temperature signal can be used to adjust the power of the laser beam so as to maintain the desired temperature.Type: GrantFiled: April 1, 1997Date of Patent: January 12, 1999Assignee: Daimler-Benz AGInventors: Ulrich Golz, Peter Linden, Xiaoyi Liu, Matthias Merkel, Peter Mueller-Hummel
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Patent number: 4995286Abstract: An automatic flash removing apparatus, according to the present invention, comprises a flash removing cutter edge carried by a cutter holder. The cutter holder is movable with carrying the cutter edge relative to a molded product. On the other hand, the molded product is supported on a product support which can drive the product relative to the cutter edge so that the portion of the product having flash to be removed is placed in opposition to the cutter edge. The cutter holder is associated with a pressure regulator means for adjusting pressure to depress the cutter edge toward the product. Regulated depression pressure may avoid fluctuation of smoothness of the product after removing the flash.Type: GrantFiled: September 19, 1988Date of Patent: February 26, 1991Assignee: Nihon Plast Co., Ltd.Inventors: Sadao Kobayashi, Hidemi Tomono, Kazunobu Yoshida
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Patent number: 4779497Abstract: A method of cutting off a masking film of a silicon wafer comprising the steps of rotating the silicon wafer, feeding a heat wire continuously to the outer periphery of the silicon wafer and cutting off the outer periphery of the masking film along the outer perphery of the silicon wafer.Type: GrantFiled: January 23, 1987Date of Patent: October 25, 1988Assignee: Teikoku Seiki Kabushiki KaishaInventor: Masahiro Lee
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Patent number: 4603609Abstract: The invention provides an apparatus for cutting a sheet-like member such as an adhesive tape applied to a surface of a semiconductor wafer at the periphery of said semiconductor wafer.The apparatus comprises a heating rod to be brought into contact with the periphery of the semiconductor wafer, heating means for heating the heating rod, urging means for relatively urging the heating rod against the periphery of the semiconductor wafer, and a moving mechanism for relatively moving the heating rod along the periphery of the semiconductor wafer. The heating rod is moved relative to the periphery of the semiconductor wafer as the heating rod is urged against the periphery of the semiconductor wafer, and thereby the sheet-like member applied to the semiconductor wafer is melted and cut at the periphery of the semiconductor wafer.Type: GrantFiled: October 17, 1984Date of Patent: August 5, 1986Assignee: Disco Abrasive Systems, Ltd.Inventor: Ono Takatoshi
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Patent number: 4535216Abstract: A hot metal-working tool 10 using electrical resistance heating. Metal-working tool 10 comprises seat 12, cutting insert 14 and chipbreaker 16. Electrical current source 35 provides current which flows between metal working edge 30 of insert 14 and the shear zone 80 of a workpiece 72 during the machine operation. Cutting insert 14 comprises two structural components, one of which 26, contacts chip 82 thereby providing a second path for current flow between tool 10 and shear zone 80. Shear zone 80 may thus be heated by current not passing through metal-working edge 30. The invention also provides for the flow of coolant fluid through internal passages in tool 10. The coolant fluid removes heat from metal working region 28 and is then discharged to bathe the region proximate metal working edge 30.Type: GrantFiled: October 14, 1983Date of Patent: August 13, 1985Assignee: Rockwell International CorporationInventor: Michael L. Cassidenti
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Patent number: 3945277Abstract: Method and apparatus for conditioning a tire for truing by removing flat spots, and for subsequently truing the tire. Tire conditioning is accomplished by applying heat directly to the tire sidewalls and by concurrently rotating the tire while laterally maintaining tire position with rollers. Tire truing apparatus includes a mandrel which may be adjustably supported by the tire conditioning apparatus, and a truing cutter mounted at an elevated location to reduce or eliminate clogging with removed rubber.Type: GrantFiled: September 6, 1974Date of Patent: March 23, 1976Inventors: C. Bernie McGehee, J. Samuel Rees, Luther J. Johnson, Jr.