With Means To Control Or Modify Temperature Of Apparatus Or Work Patents (Class 83/170)
  • Patent number: 9718202
    Abstract: Method and apparatus for measuring a protrusion length of a protrusion portion on each side of sheet after cutting even when there is variation in positions of cords embedded in the sheet, apparatus with imaging unit that images cross-sectional profile in width direction of sheet including protrusion portions, and generates waveform data from imaging of cross-sectional profile, detect maximum height-positions of crests and of troughs of waveform data, set, based on waveform data, a maximum height-position of crest closest to width end of sheet as maximum height-position of end crest, set a position corresponding to an edge of protrusion portion of sheet, located on more width end side than maximum height-position of end crest, as minimum height-position of a terminal trough, detect distance in width direction of sheet between maximum height-position of end crest and of the terminal trough, and measure protrusion length of protrusion portion based on detected distance.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: August 1, 2017
    Assignee: BRIDGESTONE CORPORATION
    Inventor: Hisashi Takeuchi
  • Patent number: 9600876
    Abstract: Systems for enabling automated electronic processing of tissue samples are provided. A tissue sample intake mechanism receives a tissue sample that is to be processed, and a cutting mechanism cuts the tissue sample to produce a plurality of sections of the tissue sample. Further, a transporting mechanism causes the tissue sections to be moved from a first location to a second location without user intervention. One or more image capturing devices that capture electronic images of the each of the plurality of sections of the tissue sample are also provided in the system. Additionally, a three-dimensional representation engine is provided for generating a three-dimensional representation of the tissue sample. The three-dimensional representation enables viewing of the electronic images associated with the each of the plurality of sections of the tissue sample.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: March 21, 2017
    Assignee: Cerner Innovation, Inc.
    Inventors: Robert E. Whited, John David L. Nolen, Sameer Bhatia
  • Publication number: 20150122097
    Abstract: The present invention relates to a waste fluorescent light end-cutting device. The waste fluorescent light end-cutting device includes a conveyor transferring a waste fluorescent light, a heating wire disposed on each of both sides of the conveyor, a cooling wire subsequently disposed on a rear side of the heating wire, and a suction duct disposed between the cooling wire and the heating wire. A base cap is separated from the waste fluorescent light by using a temperature difference between the heating wire and the cooling wire.
    Type: Application
    Filed: May 9, 2013
    Publication date: May 7, 2015
    Inventor: Seung-Whee Rhee
  • Patent number: 8997615
    Abstract: A microtome comprising a head 32 which holds a sample, an alignment mechanism 50 which aligns the head 32, a body portion 42 which is provided on a back face side of the alignment mechanism 50, a cylindrical coupling portion 41 which couples the body portion 42 with the head 32, a temperature controller 34 in the head 32, and refrigerant piping 40 and electrical wiring 46 for the temperature controller 34, and the alignment mechanism 50 includes a spherical member 68 coupled with the back face side of the head and having a spherical outer periphery and includes retainer portions 70 and 71 retaining the outer periphery of the spherical member 68 slidably along a spherical surface, the spherical member 68 has a through hole 74 which communicates with the hollow portion 43 of the coupling portion 41, the refrigerant piping 40 and the electrical wiring 46 are connected with the temperature controller 34 in the head 32 through the through hole 74 of the spherical member 68 and the hollow portion 43 of the coupling
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: April 7, 2015
    Assignees: Sakura Seiki Co., Ltd., Sakura Finetek Japan Co., Ltd.
    Inventors: Hiroyuki Minemura, Tatsuya Seki
  • Publication number: 20150027283
    Abstract: Described is a method for cutting a pipe (2) made from thermoplastic material, comprising the steps of localised and circumferential heating of an axial portion (3) of the pipe (2) at a predetermined operating temperature and processing, using a cutting tool (4), the heated axial portion (3).
    Type: Application
    Filed: July 27, 2012
    Publication date: January 29, 2015
    Applicant: SICA S.P.A.
    Inventors: Giorgio Tabanelli, Marco Gulminelli
  • Publication number: 20140374980
    Abstract: A printer, method, computer program or cutter accessory for cutting media while printing is provided.
    Type: Application
    Filed: December 29, 2011
    Publication date: December 25, 2014
    Inventors: Raimon Castells De Monet, Jesús Garcia Maza, Francisco Guerrero Carvajal
  • Patent number: 8893598
    Abstract: The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: November 25, 2014
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Zhen Liu, Ming Liu, Tao Ding, Hyojung Park
  • Publication number: 20140208906
    Abstract: Cutting device, method and use are for cutting of a line extending from a floating vessel. The cutting device is structured for placement on the vessel. The cutting device comprises: at least one guide structured for directional steering of the line past a cutting area for the line; and at least one of the following cutting-promoting devices: at least one induction coil device directed inwards toward the cutting area and structured for heating, hence weakening, of the line within the cutting area; and at least one moveable cutting knife with an opposite contact surface directed inwards toward the cutting area and also structured for cutting of the line within the cutting area.
    Type: Application
    Filed: February 27, 2014
    Publication date: July 31, 2014
    Applicant: Smart Installations AS
    Inventor: Petter Birkeland
  • Publication number: 20140137713
    Abstract: An apparatus for cutting a workpiece as biospecimen into a section while maintaining living state of cells includes a board on which the workpiece is placed, a device for freezing and fixing the workpiece on the board, and a blade for cutting the frozen workpiece fixed on the board into a section by means of rotary movement in a predetermined rotational direction. A profile of a cutting edge of the blade is a curve showing monotonic increase in distances of a rotational axis to points starting at a nearest point that is the shortest from the axis and ending at a farthest point that is the longest from the axis. The farthest point is behind the nearest point in the rotational direction and the curve is convex opposite to the rotational axis with respect to a straight line connecting the nearest point and the farthest point.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 22, 2014
    Applicants: DAStech, Inc.
    Inventors: Shunji YOSHIDA, Nobuyuki TAKAHASHI, Tsukasa MATSUMOTO
  • Publication number: 20140102145
    Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.
    Type: Application
    Filed: March 8, 2013
    Publication date: April 17, 2014
    Applicant: Saxum LLC
    Inventor: Teo Chong Teck
  • Publication number: 20140096658
    Abstract: A heated utility knife is disclosed for heating a material to be cut in order to soften the material before cutting the material. The heated utility knife comprises a knife portion defining a distal cutting edge, and a heat source configured to direct heat to a region adjacent said cutting edge. Drawing the cutting edge across a material to be cut allows heat from said heat source to be directed to the material to be cut to soften the material prior to cutting.
    Type: Application
    Filed: October 1, 2013
    Publication date: April 10, 2014
    Applicant: Torch Knife LLC
    Inventor: Brandon Bellamy
  • Publication number: 20140060272
    Abstract: A system and method for chilling a food product in or proximate to a food processing device adapted to dice, slice, shred, chop, or cut the food product is disclosed. The disclosed system and method involves a two or three stage application of a liquid cryogen or carbon dioxide snow to cool the food product. The cooling stages include a first stage of cryogen application upstream of the entrance of the food processing device, a second stage of cryogen application or delivery into one or more zones within the food processing device, and a third stage of cryogen application to the region proximate to and downstream of the exit to the food processing device.
    Type: Application
    Filed: November 5, 2013
    Publication date: March 6, 2014
    Inventors: Paul Cyrus Shah, Gary Dee Lang, Bruce Michael Squires, Theodore Hall Gasteyer, III, Balazs Hunek, Steven Michael McCarty
  • Publication number: 20140053697
    Abstract: A system and method for chilling a food product in or proximate to a food processing device adapted to dice, slice, shred, chop, or cut the food product is disclosed. The disclosed system and method involves a two or three stage application of a liquid cryogen or carbon dioxide snow to cool the food product. The cooling stages include a first stage of cryogen application upstream of the entrance of the food processing device, a second stage of cryogen application or delivery into one or more zones within the food processing device, and a third stage of cryogen application to the region proximate to and downstream of the exit to the food processing device.
    Type: Application
    Filed: November 5, 2013
    Publication date: February 27, 2014
    Inventors: Paul Cyrus Shah, Gary Dee Lang, Bruce Michael Squires, Theodore Hall Gasteyer, III, Balazs Hunek, Steven Michael McCarty
  • Publication number: 20140017475
    Abstract: Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line (5) of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line (5) of the glass sheet (G) under a state in which support members (2 (8)) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line (5) toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line (8).
    Type: Application
    Filed: June 7, 2011
    Publication date: January 16, 2014
    Inventors: Yasuo Teranishi, Yasuhiro Matsumoto, Taiki Minari, Takaya Furuta
  • Publication number: 20140000431
    Abstract: An articulating band saw apparatus provides a frame that includes a vertically extending section having upper and lower end portions. An elevator moves between the upper and lower end portions of the frame. A first hydraulic actuator is supported on the elevator for movement therewith. A first arm provides arm end portions, the first arm supported by the first hydraulic actuator. An end of the first arm supporting a second hydraulic actuator that is spaced away from the first hydraulic actuator. The second hydraulic actuator supports a second arm. An endless band type saw is mounted on the free end of the second arm generally opposite the second actuator. The band saw is movable by articulation of the first and second actuators and resulting movement of the first and second arms. In one embodiment, the band saw is a diamond wire saw.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 2, 2014
    Inventors: Galen R. Clark, II, Michael Todd Martin, Gary L. Siems
  • Publication number: 20130340583
    Abstract: The present invention provides a liquid crystal substrate cutting device used for cutting a liquid crystal substrate along a cutting line, and the liquid crystal substrate cutting device comprises a heating unit and a cutter unit. The heating unit moves along the cutting line and heats the liquid crystal substrate to soften a sealant covered on the cutting line, and the cutter unit moves along the cutting line to further cut the liquid crystal substrate. The present invention comprises the heating unit for heating the liquid crystal substrate along the cutting line to soften the sealant covered on the cutting line such that the cutter unit can precisely cut the liquid crystal substrate without abnormity of the feeding distance of the cutter unit which cause the liquid crystal substrate to break. Therefore, the scrap-rate is reduced.
    Type: Application
    Filed: June 28, 2012
    Publication date: December 26, 2013
    Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO. LTD.
    Inventors: Zhen Liu, Ming Liu, Tao Ding, Hyojung Park
  • Publication number: 20130091999
    Abstract: A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.
    Type: Application
    Filed: December 6, 2012
    Publication date: April 18, 2013
    Applicant: AVERY DENNISON CORPORATION
    Inventor: Avery Dennison Corporation
  • Publication number: 20130055866
    Abstract: A tile saw includes a base, a frame assembly disposed on the base, a first rail disposed on the frame assembly, the first rail having a longitudinal axis, a table slidingly disposed on the first rail, a support assembly disposed on the base, a saw assembly supported by the support assembly, the saw assembly comprising a motor, a cutting wheel driven by the motor, the saw assembly being pivotable about a horizontal axis substantially parallel to the longitudinal axis, and a switch electrically connected to the motor and disposed on the support assembly so that, when the motor assembly is pivoted about the horizontal axis, the switch remains stationary.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 7, 2013
    Applicant: BLACK & DECKER INC.
    Inventors: Gregg L. Sheddy, James D. Schroeder, Peter Chaikowsky, Darren B. Moss, Warren A. Ceroll, Stuart J. Wright, William D. Spencer, Jiangang Zhao, William S. Taylor, Frank A. Mannarino
  • Patent number: 8371354
    Abstract: A method and apparatus enables linered label applicators to use labels on thin liners. Linered labels comprise a composite of an elongate sheet of thin or light-weight temporary liner having a precut label adhered to a low adhesion surface. The cut-out labels on the liner are fed into the linered label applicator. The use of support mechanisms other then vacuum application on rollers enables the use of thinner liner sheets on labels. A die head for cutting or perforating labels comprising adhesive on label stock comprising a die head having at least 80% of its outer surface comprising flat areas between cutting edges, multiple cutting edges on the outer surface, and an internal volume in the die head, the internal volume for carrying coolant liquid into and out of the volume so as to cool the outer surface of the die head when the coolant temperature is at least 10° C. cooler than the outer surface of the die head.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: February 12, 2013
    Assignee: Avery Dennison Corporation
    Inventor: Robert Phillips
  • Publication number: 20130032015
    Abstract: A cutting device 1 comprises: a guiderail (18) that is formed into a ring shape along the circumference around the central axis (10c) of a cutting drive unit (10); a laser irradiation unit (22) that is movable along the guiderail, and irradiates a laser at a predetermined inclination angle onto an object (30) to be cut; a preset cutting position derivation unit (26a) for deriving a preset cutting position that corresponds to a preset cutting portion, which is the portion to be cut by a cutting tool (10b) after a predetermined amount of time; a stopping position derivation unit (26b) for deriving the stopping position of the laser irradiation unit on the guiderail with the preset cutting position that was derived as a target; and a laser irradiation drive unit (24) for moving the laser irradiation unit to the derived stopping position.
    Type: Application
    Filed: July 26, 2012
    Publication date: February 7, 2013
    Applicant: FUJI JUKOGYO KABUSHIKI KAISHA
    Inventor: Hirozi Nishikawa
  • Publication number: 20120297943
    Abstract: A device for cutting a fibrous preform, for production of a part made of a composite material by injection of resin under vacuum. The device includes a die for receiving the preform, on which a template of outer edges of the part is referenced, a mechanism cutting outer edges of the preform according to the template, and a mechanism for cooling the preform that is suitable for solidifying a liquid forming a substrate for the preform.
    Type: Application
    Filed: February 10, 2011
    Publication date: November 29, 2012
    Applicant: SNECMA
    Inventors: Christophe Grosbois, Damien Hebuterne
  • Publication number: 20120196073
    Abstract: A method and system of manufacturing a panel, such as a vinyl floor tile, with one or more profiled edges, wherein the edge is moved along one or more machining tools to form the profiled edge wherein the panel is cooled at least in an area containing the edge, wherein the cooling takes place before and/or during machining of the edge. Covering element manufactured this way, comprising at least one profiled edge at least partly within a thermoplastic section, the edge being profiled to form a tongue-in-groove interlocking connection with a matching profiled edge of a corresponding covering element.
    Type: Application
    Filed: September 1, 2010
    Publication date: August 2, 2012
    Applicant: Spanolux N.V.-Div. Balterio
    Inventors: Bruno Paul Louis Vermeulen, Jan Eddy De Rick
  • Patent number: 8215216
    Abstract: A blade lubrication system for a sawmill having a blade, chain or band saw, and a control mechanism for activating said blade, chain or band. The blade lubrication system automatically activates cooling and cleaning of the blade, or band when the control mechanism is activated, and automatically deactivates the cooling and cleaning of the blade, chain or band when the control mechanism is deactivated.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: July 10, 2012
    Assignee: Norwood Industries Inc.
    Inventor: Peter Dale
  • Publication number: 20120111161
    Abstract: The present invention relates to a piercing apparatus and a piercing method which drive a punch. The piercing apparatus includes a local heating device for heating part of the workpiece in a temperature range less than a melting point of the workpiece and a punch driving device for driving the punch toward the part of the workpiece which was heated by the local heating device. The piercing method includes a local heating step for heating part of the workpiece in a temperature range less than a melting point of the workpiece and a stamping step for driving the punch toward the part of the workpiece which was heated in the local heating step.
    Type: Application
    Filed: September 16, 2011
    Publication date: May 10, 2012
    Applicant: DENSO CORPORATION
    Inventors: Ken KURIKI, Takashi HOSHIYAMA, Yuusuke HARA
  • Publication number: 20120064603
    Abstract: Methods and apparatus for selectively accessing a portion of a sterile cryopreserved sample are disclosed. The apparatus may include a container configured to receive the cryopreserved sample and having a first portion and a second portion, a heat sink chamber surrounding the first portion of the container, and a heat source adjacent to the second portion of the container. The chamber may be configured to maintain a non-accessed portion of the sample in a cryopreserved state. The heat source may be configured to separating an accessed portion of the sample from the non-accessed portion of the sample while maintaining the viability of the accessed portion while the non-accessed portion is maintained in the cryopreserved state.
    Type: Application
    Filed: May 4, 2010
    Publication date: March 15, 2012
    Applicant: American Fluoroseal Corporation
    Inventors: Richard W. Childs, Herb Cullis, Sumithira Vasu, Phillippe Jean Broussard, Kevin Douglas Clark, Eric Kelsey Harting
  • Publication number: 20110283851
    Abstract: The invention relates to a method and to a hot forming system for producing press-hardened formed components of sheet steel, comprising a furnace (8) by means of which sheet steel which is to be hot formed, can be at least partially heated to austenitization temperature, and comprising a press system (10) for hot forming and press-hardening of the sheet steel heated in the furnace. To make it possible to use available pressing capacities and to reach a high number of strokes and thus a high productivity, the invention provides for a heating device (7) to be arranged upstream of the furnace (8), by means of which the sheet steel (2) can be at least partially heated to a temperature of below the austenitization temperature, preferably to a temperature in the range of from 500 to 700° C., and for the press system (10) to be embodied in a multi-stage manner, wherein a first part (10.
    Type: Application
    Filed: May 21, 2010
    Publication date: November 24, 2011
    Applicants: THYSSENKRUPP SOFEDIT S.A.S., THYSSENKRUPP UMFORMETECHNIK GMBH
    Inventors: Jens Overrath, Oliver Straube, Jean-Jacques Lety, Stéphane Anquetil
  • Patent number: 8062593
    Abstract: A selecting apparatus for selecting cell/tissue mass includes a base, a feeding mechanism and a dividing mechanism. The base has a platform for placing the cell/tissue mass. The feeding mechanism, disposed on the base, moves relative to the platform. The dividing mechanism, disposed on the feeding mechanism, includes a first cutting set and a second cutting set connected therewith. The second cutting set reciprocally moves between a first position and a second position, toward the first cutting set. The feeding mechanism moves the dividing mechanism above the platform, aligning the dividing mechanism with a portion of the cell/tissue mass, and moves the first cutting set toward the cell/tissue mass, cutting into the portion of the cell/tissue mass. The second cutting set moves from the first position to the second position, limiting the portion of the cell/tissue mass between the first cutting set and the second cutting set.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: November 22, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Wannhsin Chen, Lih-Tao Hsu, Yeou-Bin Guu, Yu Mei Chen
  • Patent number: 8047107
    Abstract: A paper cutting system includes a cutting assembly, a transport moving a web through the cutting assembly, a vacuum plenum utilizing a vacuum source to control the web moving through the cutting assembly, an air source providing purge air to the cutting assembly for removal of debris, and a heat exchanger normalizing a temperature of the purge air with respect to a temperature of ambient air prior to the purge air reaching the cutting assembly. The heat exchanger may be operated using the vacuum source.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: November 1, 2011
    Assignee: Pitney Bowes Inc.
    Inventors: Carlos L. DeFigueiredo, Boris Rozenfeld, John W. Sussmeier, Daniel J. Williams, Anthony E. Yap
  • Publication number: 20110197728
    Abstract: Systems and methods are provided for cutting slices of food product from a larger portion of the food product, whereby the systems and methods can reduce down-time associated with some of the portions of the equipment during cleaning. Components of the system requiring more frequent cleaning can be readily disconnected from those components requiring less frequent cleaning. Further, substitute components can be connected to those components requiring less frequent cleaning to reduce their down-time while the other components are being cleaned.
    Type: Application
    Filed: February 12, 2010
    Publication date: August 18, 2011
    Applicant: Kraft Foods Global Brands LLC
    Inventors: Rory J. Redemann, Timothy T. Watson
  • Publication number: 20110179924
    Abstract: According to an aspect of the present invention, there is provided a bench cutting machine including: a motor that drives a cutting blade; a fan that is driven by the motor to generate a fan air; a base portion; a cutting portion that accommodates the cutting blade over the base portion; and a supporting portion that movably supports the cutting portion, wherein rotational directions of the fan and the cutting blade are arranged to be the same.
    Type: Application
    Filed: September 15, 2009
    Publication date: July 28, 2011
    Applicant: Hitachi Koki Co., Ltd.
    Inventors: Hirohisa Tomita, Shigehuru Ushiwata
  • Publication number: 20110132522
    Abstract: A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.
    Type: Application
    Filed: July 14, 2009
    Publication date: June 9, 2011
    Applicant: AVERY DENNISON CORPORATION
    Inventors: Alan Green, Dennis Rene Benoit
  • Patent number: 7950314
    Abstract: At the time of cutting stacked sheet members, a knife or a punch pierces the sheet members at positions such as along a cutting line, in a region outside the cutting line, or in a seam allowance inside the cutting line. By moving the knife or the punch vertically, heat is applied to the sheet members such that the seam members are welded (i.e., fused) together vertically. Even if at the time of cutting stacked sheet members having low air permeability, it is possible to prevent warpage or slippage of the sheet members, and cutting is performed accurately.
    Type: Grant
    Filed: December 26, 2003
    Date of Patent: May 31, 2011
    Assignee: Shima Seiki Manufacturing, Ltd.
    Inventor: Morita Toshiaki
  • Patent number: 7950315
    Abstract: A saw includes a base, a frame assembly disposed on the base, a first rail disposed on the frame assembly, and a table slidingly disposed on the first rail. The table has an upper surface for supporting a workpiece. A support assembly is disposed on the frame. A saw assembly is supported by the support assembly. The saw assembly includes a motor, a cutting wheel driven by the motor, a guard portion covering an upper portion of the cutting wheel, and a fluid delivery assembly configured to direct fluid toward the cutting wheel. The fluid assembly includes a flexible nozzle with a hole. The nozzle is configured to direct airflow created by the cutting wheel away from the hole.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: May 31, 2011
    Assignee: Black & Decker Inc.
    Inventors: Gregg L. Sheddy, James D. Schroeder, Peter Chaikowsky, Darren B. Moss, Warren A. Ceroll, Stuart J. Wright, William D. Spencer, Jiangang Zhao, William S. Taylor, Frank A. Mannarino
  • Patent number: 7942996
    Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure includes the steps of: compressing and deforming the multilayer structure, while extending respective layers of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer and surface resin layers of the multilayer structure to the abutting portion A of the push cutter and the cutter receiving portion.
    Type: Grant
    Filed: August 14, 2009
    Date of Patent: May 17, 2011
    Assignees: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.
    Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta
  • Publication number: 20100300423
    Abstract: A method of making a compound semiconductor substrate includes providing a GaN compound semiconductor single crystal ingot, and cutting the ingot with a cutter to form a GaN single crystal substrate. The cutting is performed while controlling a temperature in a contact portion between the ingot and the cutter to be not more than 160° C. such that a cut surface of the GaN single crystal substrate has an arithmetical mean waviness (Wa) not more than 9 ?m.
    Type: Application
    Filed: March 19, 2010
    Publication date: December 2, 2010
    Applicant: HITACHI CABLE, LTD.
    Inventor: Yuichi Oshima
  • Patent number: 7842236
    Abstract: A selecting apparatus for selecting cell/tissue mass includes a base, a feeding mechanism and a dividing mechanism. The base has a platform for placing the cell/tissue mass. The feeding mechanism, disposed on the base, moves relative to the platform. The dividing mechanism, disposed on the feeding mechanism, includes a first cutting set and a second cutting set connected therewith. The second cutting set reciprocally moves between a first position and a second position, toward the first cutting set. The feeding mechanism moves the dividing mechanism above the platform, aligning the dividing mechanism with a portion of the cell/tissue mass, and moves the first cutting set toward the cell/tissue mass, cutting into the portion of the cell/tissue mass. The second cutting set moves from the first position to the second position, limiting the portion of the cell/tissue mass between the first cutting set and the second cutting set.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: November 30, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Wannhsin Chen, Lih-Tao Hsu, Yeou-Bin Guu, Yu Mei Chen
  • Patent number: 7833379
    Abstract: An end face of an intermediate layer of a multilayer structure is stably covered by surface resin layers at a time of cutting the multilayer structure. A cutting method of the multilayer structure 10 includes the steps of: compressing and deforming the multilayer structure, while extending respective layers 11, 12, 13 of the multilayer structure to provide a thin thickness portion, so that an upper layer bites into a lower layer by pushing a push cutter 15, by a predetermined amount, into the multilayer structure supported by a cutter receiving portion 14, in a fused state of at least one of the resin layers forming the multilayer structure; and push-cutting the compressed thin thickness portion S till the push cutter abuts against the cutter receiving portion so as to converge an intermediate layer 11 and surface resin layers 12, 13 of the multilayer structure to the abutting portion A of the push cutter 15 and the cutter receiving portion 14.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: November 16, 2010
    Assignees: Toyo Seikan Kaisha, Ltd., Asano Laboratories Co., Ltd.
    Inventors: Kikuo Matsuoka, Shinji Tanaka, Yasuyo Sano, Toshihiro Takai, Kenichi Mizoguchi, Hideki Usami, Tomoaki Haruta
  • Patent number: 7815761
    Abstract: A method and apparatus enables linered label applicators to use labels on thin liners. Linered labels comprise a composite of an elongate sheet of thin or light-weight temporary liner having a precut label adhered to a low adhesion surface. The cut-out labels on the liner are fed into the linered label applicator. The use of support mechanisms other then vacuum application on rollers enables the use of thinner liner sheets on labels. A die head for cutting or perforating labels comprising adhesive on label stock comprising a die head having at least 80% of its outer surface comprising flat areas between cutting edges, multiple cutting edges on the outer surface, and an internal volume in the die head, the internal volume for carrying coolant liquid into and out of the volume so as to cool the outer surface of the die head when the coolant temperature is at least 10° C. cooler than the outer surface of the die head.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: October 19, 2010
    Assignee: Advanced Label Systems, Inc.
    Inventor: Robert Phillips
  • Patent number: 7802507
    Abstract: To fabricate automatically a high quality sliced piece by preventing a temperature change of a surface of an enveloped block, there is provided an automatic sliced piece fabricating apparatus including a fixed base for mounting to fix an enveloped block, cutting means including a cut blade arranged on the fixed base for cutting out a sliced piece from the enveloped block by moving the cut blade and the fixed base relative to each other, a cabinet for containing the fixed base and the cutting means at inside thereof, sliced piece carrying means for carrying the cut-out sliced piece to outside of the cabinet, and temperature adjusting means for adjusting at least a surrounding temperature of the enveloped block to a predetermined temperature by supplying cold wind a temperature of which is controlled from outside at inside of the cabinet.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: September 28, 2010
    Assignee: Seiko Instruments Inc.
    Inventors: Tetsumasa Ito, Tatsuya Miyatani, Koji Fujimoto
  • Publication number: 20100133718
    Abstract: The present invention relates to a method for producing a medicament dosage form which consists of at least one piece which in each case comprises at least one medicament and at least one additive, the medicament and the additive being mixed and extruded from a die as a strand and the strand being cut into pieces of precise weight. The invention additionally relates to a device.
    Type: Application
    Filed: November 30, 2009
    Publication date: June 3, 2010
    Applicant: GRUNENTHAL GMBH
    Inventors: Elisabeth ARKENAU-MARIC, Johannes Bartholomäus, Dieter Schateikis
  • Publication number: 20100107834
    Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
    Type: Application
    Filed: April 9, 2009
    Publication date: May 6, 2010
    Applicant: HTC CORPORATION
    Inventors: Yao-Hsiang Lai, Ta-Cheng Liu, Jung-Hung Hung, Yu-Meng Lin, Kuo-Lung Yang
  • Publication number: 20100077817
    Abstract: The invention provides a metal working fluid composition which comprises a morpholine compound and an isothiazoline compound and a metal working method which makes use of the metal working fluid composition. The composition is excellent in antiseptic properties, and can widely be applied to metal working techniques such as cutting, grinding, form rolling, press working and plastic working techniques.
    Type: Application
    Filed: February 1, 2008
    Publication date: April 1, 2010
    Inventors: Koichi Goto, Yuji Aizawa, Satoshi Mima
  • Patent number: 7673546
    Abstract: A microtome (1), having a knife (9) for sectioning a specimen (5) for subsequent microscopic examination, is described. The microtome (1) comprises a cooled specimen holder (2) for receiving the specimen (5), the specimen holder (2) being connected to a coolant circuit (3). Additionally associated with the specimen holder (2) is a cooled thermal conduction plate (4) that can be placed over the specimen (5).
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: March 9, 2010
    Assignee: Leica Biosystems Nussloch GmbH
    Inventors: Claudia Dorenkamp, Stefan Künkel
  • Publication number: 20100031790
    Abstract: A machining system includes a support configured to retain an article, such as a rotor disk, having an area, such as a surface of a slot in the disk. A cutting tool, for example, a broach, is movable relative to the support to cut the area. A heating member, such as a laser, is configured to locally heat the area of the article. In one example, the cutting tool includes a body having a cutting edge. The heating member is supported by the body and is configured to provide heat adjacent to the cutting edge. The cutting edge cuts the locally heated area while the area is still heated.
    Type: Application
    Filed: August 6, 2008
    Publication date: February 11, 2010
    Inventors: Tahany Ibrahim El-Wardany, Sergei F. Burlatsky, Changsheng Guo, Wayde R. Schmidt
  • Publication number: 20090277314
    Abstract: A film of material may be formed by providing a semiconductor substrate having a surface region and a cleave region located at a predetermined depth beneath the surface region. During a process of cleaving the film from the substrate, shear in the cleave region is carefully controlled. According to certain embodiments, an in-plane shear component (KII) is maintained near zero, sandwiched between a tensile region and a compressive region. In one embodiment, cleaving can be accomplished using a plate positioned over the substrate surface. The plate serves to constrain movement of the film during cleaving, and together with a localized thermal treatment reduces shear developed during the cleaving process. According to other embodiments, the KII component is purposefully maintained at a high level and serves to guide and drive fracture propagation through the cleave sequence.
    Type: Application
    Filed: May 4, 2009
    Publication date: November 12, 2009
    Applicant: Silicon Genesis Corporation
    Inventor: Francois J. Henley
  • Publication number: 20090183613
    Abstract: A microtome system has a cryomicrotome with a sectioning device in which is provided a preparation holder and a knife edge that are guided past one another inside a working space during a sectioning operation, in order to produce thin sections of a preparation retained in the preparation holder. A micromanipulator is operable outside the working space. With the micromanipulator, a tool for retention of a specimen support is positioned proximate the knife edge during a sectioning operation in order to receive the sections that are produced, preferably for substantially stationary retention of the specimen support.
    Type: Application
    Filed: December 17, 2008
    Publication date: July 23, 2009
    Applicant: LEICA MIKROSYSTEME GMBH
    Inventors: Reinhard Lihl, Michael Zimmermann
  • Patent number: 7563339
    Abstract: A cutting device (10) for cutting a material (12) and providing a cut portion of the material (12). The device comprises a heating assembly comprising an electrical induction arrangement (32) for heating the cut portion of the material by induction heating.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: July 21, 2009
    Assignee: Relco U.K. Limited
    Inventors: David Gill, Mark Gill
  • Publication number: 20090151525
    Abstract: The saw and cutting blades of this invention have an electroless nickel boron coating applied from a bath containing metal stabilizers. The metal stabilizer is usually introduced into the coating from an electroless coating bath and is co-deposited into the coating. The source of the metal stabilizer is usually a metal compound or salt that is used to stabilize the nickel boron bath.
    Type: Application
    Filed: December 13, 2007
    Publication date: June 18, 2009
    Inventor: McComas Ed
  • Patent number: 7536937
    Abstract: A fabric material has a base fabric, a pile layer on a surface of the base fabric, and an adhesive layer of a hot-melt adhesive on another surface of the base fabric. The adhesive layer contains a wax whose melting point Tm1 is from 20° C. to 50° C. lower than the melting point Tm2 of the base polymer. The fabric material is heated by a heating device to at least (Tm1+5)° C. and (Tm2?5)° C., and then cut by a ultrasonic wave cutter 23. Thus the fabric material can be cut without generating the chaffs of the adhesive agent and the fiber offscums. As a result, the pollution is not made in the cutting process, and the cutting of the fabric material is made continuously and stably. Without the adhesion of the chaffs, the teremp which has a good surface formed by the cutting.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: May 26, 2009
    Assignee: Fujifilm Corporation
    Inventors: Hidetoshi Kawasaki, Ken Shimizu
  • Publication number: 20090032505
    Abstract: A cutting device for cutting a hard-brittle material along a cutting path is provided. The cutting device includes a cooling source having a first output terminal for providing a first cooling effect along the cutting path, and a heating source having a second output terminal disposed in the first output terminal for providing a heating effect following the first cooling effect along the cutting path.
    Type: Application
    Filed: September 27, 2007
    Publication date: February 5, 2009
    Applicant: NATIONAL APPLIED RESEARCH LABORATORIES
    Inventors: Kuo-Cheng Huang, Chien-Yao Huang, Shih-Feng Tseng, Wen-Hong Wu