Electrical Component Lead Trimming Patents (Class 83/929.2)
  • Patent number: 7082681
    Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. The stub contacts may be formed by trimming the leads of an existing vertical surface mount package. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: August 1, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Larry D. Kinsman, Walter L. Moden, Warren M. Farnworth
  • Patent number: 6839962
    Abstract: A micromechanical structure is described which is disposed on a base body and requires protection from environmental influences by a covering body. Furthermore, electrical contacts are necessary for establishing contacts for the micromechanical structure. By skillfully carrying out a sawing-into operation and a sawing-through operation, it is possible to expose the electrical contact.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: January 11, 2005
    Assignee: Infineon Technologies AG
    Inventors: Robert Aigner, Florian Plötz, Sven Michaelis, Michael Brauer
  • Publication number: 20040074353
    Abstract: A method for removing from a carrier a carrier part with a housing arranged thereon, wherein prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separating edge to be arranged. The invention also relates to a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, manufactured with the present method. The invention moreover relates to an apparatus for performing the method.
    Type: Application
    Filed: December 3, 2003
    Publication date: April 22, 2004
    Inventors: Adrianus Wilhelmus Van Dalen, Henri Joseph Van Egmond
  • Patent number: 6634098
    Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.
    Type: Grant
    Filed: July 20, 1999
    Date of Patent: October 21, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Larry D. Kinsman, Walter L. Moden, Warren M. Farnworth
  • Patent number: 6247229
    Abstract: Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, step 1 provides a plastic sheet having an adhesive first surface. Step 2 provides a patterned metal sheet on the first surface of the plastic sheet. The patterned metal sheet includes an array of package sites. Each package site is formed to include a die pad and a plurality of leads around the die pad. Step 3 places an integrated circuit device on each of the die pads. Step 4 connects a conductor between the integrated circuit device and the leads of the respective package site. Step 5 applies an encapsulating material onto the array. Step 6 hardens the encapsulating material. Step 7 removes the first plastic sheet. Step 8 applies solder balls to the exposed surfaces of the leads. Finally, step 9 separates individual packages from the encapsulated array.
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: June 19, 2001
    Assignee: Ankor Technology, Inc.
    Inventor: Thomas P. Glenn