Abstract: A discrete pod gas scrubber system for removing contaminants from the air of a work area, such as a paint spray booth. Each scrubber pod includes an inlet section having opposed converging planar walls and side walls, an intermediate section having opposed diverging walls and side walls communicating with the inlet section through a reduced diameter venturi, and an outlet section having a bottom wall perpendicular to the longitudinal axis of the scrubber pod, a diverging top wall and an end wall. The end wall includes an orifice opening and orifice plates for adjusting the orifice opening and the combined lengths of the aligned scrubber pods are between fifty and ninety percent of the total length of the scrubber system, more preferably between sixty percent and eighty five percent of the total length. The scrubber system of this invention significantly reduces the noise generated in the work area normally located above the gas scrubber system.

Abstract: The air drawn into a diesel engine serially passes through a filter and a cavity, which acts as an acoustic attenuator, before being supplied to the cylinders of the diesel engine. In the cavity the air is in a heat transfer relationship with a heat sink for the electronic components of a microprocessor control. The electronic components may be located in the plenum cavity or in a separate chamber but must have a heat transfer relationship with the cavity, such as through a common wall on which the electronic components are mounted. A heat sink may extend into the cavity.

Abstract: An apparatus which absorbs gas that has been discharged from a pipe at a high velocity and which releases the gas to the atmosphere at a reduced velocity and with relatively low noise. The apparatus includes a container which has a container interior, a container inlet through which the gas enters the container interior, and a container outlet, preferably located at the top of the container, through which the gas is released to the atmosphere. The container further includes a container expanded section and a container main section. The container expanded section, which acts to reduce the velocity of the gas, is located intermediate the container inlet and the container main section and has an inner surface cross-sectional area which expands from the container inlet to the container main section. The container also includes deflector vanes for diverting the flow of the gas within the container interior towards the container outlet.

Abstract: An integral filter and resonator apparatus includes filter elements positioned upstream of a Helmholtz resonator. The first embodiment includes filter elements positioned side by side within the housing. Other embodiments include a filter element with a tube which curves slightly downstream from the element. Another embodiment includes coupled chambers for attenuating the noise.

Abstract: A cyclone for treating a gas flow (F) containing dust comprises a cyclone chamber (1) of circular cross section and having a vertical axis, and a central tube (7) of circular cross section, which is coaxially arranged in the upper portion of the cyclone chamber (1). An elongated insert element (10), which is vertically inserted in the central tube (7), is so designed and extends in such a manner downwards in the central tube (7) from the upper end thereof that a circumferential gap (17) exists between the insert element (10) and the central tube (7). This gap (17) has a preferably constant cross-sectional area which does not increase in the direction of the gas flow.

Abstract: A material transfer apparatus and method, the apparatus having a material separating container, a filter unit, a vacuum unit and an exhaust unit, all mounted on a mobile conveyance. Air, carrying the materials to be transferred, is drawn through pneumatic tubing into the separating container where large and small materials are separated, and then into the filter where it is filtered for re-entry into the atmosphere.

Abstract: A method of selectively nickeling a layer of polymerized polyester resin is described. Patterns of electrically conducting nickel are produced on the resin surface by etching the surface of the resin prior to covering the etched surface with a patterned layer of unetched resin which exposes the etched resin in the regions in which metallization is to occur. A palladium plating solution followed by an immersion boron-nickel bath provide the metalization on the etched regions of the resin.

Abstract: An improvement in the process of manufacturing integrated circuits to enhance the yield, including the steps of tracking which of the individual dies on a photomask or related series of photomasks has produced a predominance of defective chips on the semiconductor wafer, then correcting the die images on the master photomasks and then producing new working masks. This procedure may be repeated several times, each time reducing the number of defect-bearing die images on the photomask and thereby providing a means by which a semiconductor device manufacturer can obtain better yields.

Abstract: A novel printed circuit board with a circuit of high precision having a polymer coat layer between a base and a dispersion imaging material layer and a pattern circuit on undispersed portions of the dispersion imaging material layer. Such a printed circuit board is prepared by a simplified process which comprises essentially two steps, namely, exposure of the dispersion imaging material through a circuit pattern mask to obtain a pattern circuit of the unexposed portions and conductive metal plating wherein said unexposed portions are selectively deposited with the conductive metal due to the specific effect of provision of the polymer coat layer directly under the dispersion imaging material layer.

Abstract: A technique for ablating a metal workpiece by the use of laser beam radiation at an efficiency higher than heretofore possible and an improved regulation of the ablation process. Undesired side effects of the ablation process are eliminated by the entire and complete ejection of the molten metal at the point of beam impingement so that no material remains on the workpiece in the areas between contiguous points of ablation. The appropriate selection of beam intensity and the selection of pulse shape provide the inventive technique.

Abstract: A semiconductor device fabricated by forming a layer of semicured polyimide resin on a semiconductor body, forming a photoresist layer having a prescribed pattern on said semicured layer, immersing in an etchant consisting of hydrazine and ethylenediamine to said semicured layer through said prescribed pattern, whereby said semicured layer is precisely etched according to said prescribed pattern and prescribed surfaces of said semiconductor body are exposed, curing said semicured polyimide so as to form a layer of said polyimide resin, forming a metal layer on the surface of said polyimide and the prescribed surfaces of said body, and selectively etching said metal layer so as to form a prescribed pattern.

Abstract: A light absorbing medium is interposed between a photosensitive layer, such as a photoresist layer, and the surface upon which the photosensitive layer is to be applied in order to eliminate surface effects which result from the reflection of light which passes through the photosensitive layer and is then reflected upward from the surface back into the photosensitive layer. The light absorbing medium may be either a quarter-wave plate or a filter chosen to absorb light of the energy spectrum to which the photosensitive layer is sensitive.

Abstract: A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively treating the surface with a photopolymerizable composition, comprising an addition polymer containing a plurality of units of the formulae ##STR1## WHERE R and R.sub.1 are each a member taken from the group consisting of ##STR2## and pyrrolidone, R.sub.3 is an alkyl group of 1 to 18 carbons, R.sub.2 is a member selected from the group consisting of H and CH.sub.3 and x is a positive integer of 10 to 1000, to form a polymerized coating thereof on the surface to delineate an exposed surface pattern conforming to a desired metal pattern. The exposed surface pattern is capable of retaining a noble metal ion thereon. The treated surface is then exposed to a noble metal ion to selectively deposit the metal ion on the exposed pattern.

Abstract: A method for producing a light conductor structure having a pair of light conductors embedded in a substrate and electrodes arranged between and along the light conductors, which structure is particularly adapted for use as an electrically controllable coupler, characterized by providing a substrate of an electro-optical material having a c-axis parallel to one surface of the substrate and extending at right angles to the longitudinal axes of the later formed light electrodes, forming a layer of polycrystalline silicon in zones of the substrate, which lie adjacent to second zones of said one surface in which second zones the light conductors will be formed; applying a layer of diffusion material to the silicon layer and the second zones which are free of silicon; diffusing the diffusion material into the substrate by heating to an elevated temperature to form light conductors by increasing the index of refraction of the light conductor above the index of refraction of the remaining portions of the substrate;

Abstract: Method of metallizing, according to a pattern or uniformly, substrates which consist of a resin which contains either throughout its bulk or in a surface layer, a photosensitive semiconductive oxide, which after exposure to light is capable of depositing metal nuclei from a solution of copper ions or ions of a nobler metal, which nuclei are intensified in mass, while by way of pre-treatment the substrate is treated with a dipolar aprotic swelling agent and then with a chemical roughening agent.

Abstract: A method of optically printing conductive characters using charge transfer compounds is provided. The method is characterized by depositing an organic .pi. electron donor compound dissolved in a halogenated hydrocarbon (halocarbon) on a suitable substrate and selectively exposing the so coated substrate to actinic radiation to obtain a permanent, highly conductive, image.

Abstract: Printed circuit boards with plated through-holes are prepared by an electroless plating process using a self-supported, adherent, photohardenable sheet. The self-supported photohardenable sheet preferably is composed of a photopolymerizable material and may be a thick, homogeneous sheet or it may be a sheet reinforced with a foraminous material therein. The self-supported sheet is imagewise exposed to actinic radiation to form an adherent circuit pattern thereon comprising the unexposed areas. Through-holes are introduced into the pad areas of the circuit pattern, powdered catalyst is applied to the adherent pattern and through-holes and the catalytic image is plated in an electroless plating bath. The self-supported sheet may be used without additional catalyzing steps to make single sided, two-sided or multilayered printed circuit boards with plated throughholes and interconnections.

Abstract: An improved process for preparing printed circuit boards whereby through-holes are introduced into an element comprising a substrate, a photosensitive resist layer, and a superposed, strippable support. The through-holes are catalyzed prior to removal of the strippable support. After exposure the imaged photoresist is developed, the catalyzed-through-holes are electrolessly plated and the printed circuit is prepared using the developed image. Single sided, two or more layered printed circuit boards with plated-through-holes and interconnections can be prepared by this process.

Abstract: A cathode ray storage tube provided with a storage target having a multiplicity of segments of the collector electrode extending through the dielectric layer of the storage target. These segments comprise glass beads secured together and to a surface of an insulating support plate, a conductive collector electrode coating is applied onto the support plate surface and glass bead segments and then the storage dielectric layer is applied thereover which has proper thickness so that the segments extend above the dielectric thereby providing collector areas for collecting secondary emitted electrons from the dielectric.

Abstract: A method of optically printing conductive characters using charge transfer compounds is provided. The method is characterized by depositing an organic .pi. electron donor compound dissolved in a halogenated hydrocarbon (halocarbon) on a suitable substrate and selectively exposing the so coated substrate to actinic radiation to obtain a permanent, highly conductive, image.

Abstract: An exposure method for exposing to a pattern a photosensitive material formed over a substrate having a reflective surface uses a light source having beam components of different wavelengths. The beam from the light source is used to project an exposure pattern upon the photosensitive material through a predetermined mask pattern to thereby form a combined standing wave pattern with the aid of the light beam incident on the photosensitive material and the light beam reflected by the reflective surface. The photosensitive material is disposed in the reduced peak value region of the combined standing wave pattern as the result of the interposition of a transparent layer between the reflecting surface and the photosensitive layer. Thus, the photosensitive material is pattern-exposed to a substantially uniform sensitizing energy.

Abstract: Process for preparing photographic materials yielding on imagewise exposure to radiation a direct positive image is provided, which comprises the deposition of a thin layer of catalytically active metal onto a carrier base on the surface of which has been deposited an intermediate adhesive layer or surface filled by the deposition thereon and in direct contact therewith of a second thin layer of a photosensitive inorganic compound capable of reacting catalytically with the metal layer when activated upon exposure to radiation, so that the metal layer is destroyed on the illuminated areas but remains intact on the nonilluminated areas of the photographic material, creating in this way a direct positive metal image, capable of being stabilized and intensified.

Abstract: A process for making chip carriers using an anodized aluminum substrate iudes punching registration holes and center holes in the aluminum substrate, anodizing the aluminum and laminating copper foil to the substrate. Photo resist, etching and plating steps follow.

Abstract: A method of forming a circuit mask is disclosed. The method comprises selectively heating a portion of a cell comprising a liquid crystal above the transition temperature of the liquid crystal material to render the portion capable of scattering a desired radiant energy. An artwork master is thus formed having a pattern delineated therein capable of transmitting the desired radiant energy therethrough. A member having a surface sensitive to the desired radiant energy is positioned in a desired spatial relationship with the master. The master is exposed to the desired radiant energy whereby the radiant energy is transmitted through the pattern to expose at least a portion of the sensitive surface thereto. The exposed sensitive surface is treated to form the circuit mask having a pattern capable of transmitting light therethrough.

Abstract: Non-conductive real images are formed on substrates by depositing reducible metal salt compositions thereon from an aqueous acidic solution of pH 1.5-5 containing bromide ions and exposing the coated substrates to radiant energy to reduce the metal salt to metallic nuclei and to produce a real image of metal, which is intensified and built up by electroless metal deposition. The metal salt composition can either be selectively deposited and then exposed, or uniformly deposited and then selectively exposed, to produce the real image.

Abstract: Sensitizing processes and the resulting new articles of manufacture, suitable for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising bases coated with a halide containing aqueous sensitizing solution of pH 1.5-4.0 that deposits a layer of copper, nickel, cobalt or iron salts or salt compositions, which on exposure to radiant energy, such as heat, light, etc., is converted to a layer of metal nuclei which is non-conductive, but which is capable of catalyzing the deposition of metal onto the base from an electroless metal deposition solution in contact with the metal nuclei.

Abstract: A novel copper (I) complex having the formulaCu[P(OR).sub.3 ].sub.n BH.sub.3 CNwherein R is lower alkyl and n is an integer from 1 to 3 is employed as an actinic radiation sensitive component in an imaging process comprising imagewise exposing a support carrying the copper (I) complex to actinic radiation and developing an image in a chemical or physical development bath. The complex has excellent speed and may be handled under room light conditions prior to development.

Abstract: A channeled photosensitive element and a process and apparatus for laminating the same are described. In particular, a substantially solid, photoresist-forming layer having grooves or channels therein is applied with pressure to a surface having raised areas, such as a printed circuit board without entrapping air bubbles.

Abstract: Semiconductor structures and a method of producing the same comprising coating the surface of a semiconductor body with a first inorganic insulating layer; coating an electrical conductor path on the first insulating layer; coating an organic layer which includes a compatible compound therein which vaporizes at a relatively low temperature onto select points or portions of the conductor path; coating a second inorganic insulating layer on all exposed surfaces of the conductor path, the organic layer and the first insulating layer; and heating the resulting structure to a temperature sufficient to vaporize the compatible compound within the organic layer and remove areas of the second insulating layer which superimposed the organic layer so as to unmask the select portions of the conductor path for access to external electrical connection means.

Abstract: A photopolymerizable paste composition comprising film-forming solid inorganic particulate material, a polymer binder, unsaturated monomers, and an organic initiator dispersed in a hydrogenated terpene solvent provides a screen printable paste composition compatible with thick-film techniques used for fabricating electrically conductive and dielectric patterns and layers on substrates for electronic circuits.

Abstract: A method for use in forming thin film patterns in the fabrication of integrated circuits. The method involves depositing a bottom layer of positive photoresist material on a substrate, and forming over the bottom layer, a discrete light-transparent top layer of positive photoresist material which is less solubilized in developer after exposure to light than is the material in the bottom layer. The top and bottom layers are preferably separated by an intermediate layer of a light-transparent polymeric material which is immiscible in the bottom layer and unaffected by the subsequently applied top layer.The composite structure is exposed to a selected pattern of light, e.g., through a mask, and developer for the positive photoresist material is applied to the top and bottom layers. In the case where an intermediate layer is used, the top layer is developed first.

Abstract: A method for fabricating a liquid crystal display device includes the steps of providing a pair of insulated electrode-carrying plates, depositing on the surface of one of the plates, overlying the electrodes a layer of photopolymeric material approximately 0.0005 inches in thickness, masking and light exposing the photopolymeric layer and thereafter developing a way with a suitable solvent a predetermined area of material to provide a cavity in the photopolymeric layer through which the electrodes on the plate are accessible. On the surface of the second one of the plates whereat the second set of electrodes are located, a layer of photopolymeric material of approximately 0.

Abstract: A glass or other dielectric backed transducer structure is formed by utilizing a series of processes including at least one electrostatic bond. The processes enable one to bond a semiconductor wafer to a dielectric as a glass wafer. Then by selectively removing certain conductively semiconductor, one obtains a "thin ribbon" piezoresistive bridge secured to a thin glass wafer. The resultant structure is entirely unanticipated by the prior art.A glass part is also formed by electrostatically bonding a glass wafer to a semiconductor wafer, polishing the glass to a desired depth, masking the polished glass layer according to a desired pattern representative of the glass part, etching away all the glass except the desired pattern, and thence removing all the semiconductor.

Abstract: A method of depositing a metal on a surface of a substrate is disclosed. A surface of the substrate is sensitized with a photosensitive sensitizer comprising a photosensitive species of (1) an element selected from Ni, Mn, U, Mo and W, or (2) a combination of elements comprising Pd and an element selected from In and Ce. The sensitized surface is exposed to a suitable source of radiation, e.g., ultraviolet radiation, to delineate a surface pattern, corresponding to a desired metal pattern, containing a species of at least one selected element which is either (1) capable of reducing an activation metal ion to catalytic activating metal or (2) capable of being reduced to a catalytic activating metal such as catalytic palladium. The ultraviolet radiation-delineated surface pattern is then exposed or treated with a solution comprising an activating metal ion to reduce and deposit thereon an activating metal.

Abstract: A method of applying an anti-reflective coating, particularly a metal oxide coating to a solar cell during the manufacture of such cell.

Abstract: this process applies to printed circuits obtained by the imagewise deposition of nickel using a procedure such as that described in U.S. Pat. No. 3,853,589 followed by electroless copper plating onto the nickel pattern. We have found that by depositing the nickel before the copper, as compared with direct deposition of the copper, gives less deposition on the areas between the conductive paths and hence better insulation between them.The process can be performed in five stages including (a) coating a substrate, for instance by a gravure technique, with an active agent including a water-soluble quaternized bipyridilium compound, e.g. N,N'-dimethyl-4,4'-bipyridilium dimethosulphate or N,N'-bis(4-cyanophenyl)4,4"-bipyridilium dichloride and a suitable binder therefore such as polyvinyl alcohol, (b) imagewise exposing the coating where the conductive paths are to be deposited to sensitizing radiation, (c) contacting the surface with a solution of palladium chloride in hydrochloric acid, preferably containing 0.