Three Or More Contacts Patents (Class D14/438)
  • Semiconductor device and method of forming multi-layer shielding structure with layers of ferromagnetic material, protective material, laminate material or conductive material over the semiconductor device
    Patent number: 12327799
    Abstract: A semiconductor device has a substrate and electrical components disposed over the substrate. An encapsulant is disposed over the substrate and electrical components. A multi-layer shielding structure is formed over the encapsulant. The multi-layer shielding structure has a first layer of ferromagnetic material and second layer of a protective layer or conductive layer. The ferromagnetic material can be iron, nickel, nickel iron alloy, iron silicon alloy, silicon steel, nickel iron molybdenum alloy, nickel iron molybdenum copper alloy, iron silicon aluminum alloy, nickel zinc, manganese zinc, other ferrites, amorphous magnetic alloy, amorphous metal alloy, or nanocrystalline alloy. The first layer can be a single, homogeneous material. The protective layer can be stainless steel, tantalum, molybdenum, titanium, nickel, or chromium. The conductive layer can be copper, silver, gold, or aluminum.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: June 10, 2025
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: ChangOh Kim, JinHee Jung, JiWon Lee, YuJeong Jang
  • Radio frequency modem
    Patent number: D442171
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: May 15, 2001
    Assignee: Bellwave, Inc.
    Inventor: Seung-Chul Jang
  • Front security knob for a computer memory module
    Patent number: D544866
    Type: Grant
    Filed: August 3, 2005
    Date of Patent: June 19, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Qiang Wang, Minh H. Nguyen, Alan B. Doerr
  • Wireless notebook adapter
    Patent number: D564521
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: March 18, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: Calvin Y. Liu, Hung-Bing Chen
  • Cartridge for a wireless gateway system
    Patent number: D632299
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: February 8, 2011
    Inventor: Dennis J. King
  • Router interface card
    Patent number: D664544
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: July 31, 2012
    Assignee: Cisco Technology, Inc.
    Inventors: George Youzhi Yi, Lwin O. Tint
  • Detachable assembly of memory module
    Patent number: D722601
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: February 17, 2015
    Assignee: Adata Technology Co., Ltd.
    Inventor: Yujen Yang
  • Recording and data storage medium
    Patent number: D902940
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: November 24, 2020
    Assignee: SONY INTERACTIVE ENTERTAINMENT INC.
    Inventors: Yuya Hirano, Nobuyuki Sugawara, Hideo Niikura
  • Tip for integrated circuit test pin
    Patent number: D942290
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: February 1, 2022
    Assignee: JOHNSTECH INTERNATIONAL CORPORATION
    Inventor: John Nelson