Abstract: Systems and methods for overmolding a card are provided. A chip fraud prevention system include a device including a chip and a substrate. The chip may be at least partially encompassed in a chip pocket, and the substrate may be at least partially encompassed by the overmold.
Type:
Grant
Filed:
February 18, 2022
Date of Patent:
July 11, 2023
Assignee:
CAPITAL ONE SERVICES, LLC
Inventors:
Daniel Herrington, Stephen Schneider, Tyler Maiman
Inventors:
Judy Vigiletti, Issidor L. Iliev, Thomas Patrick Larsen, Franck Le Charpentier, Nicolas Jeunesse, Sylvie Pompeani, Paul Christopher Bousquet
Inventors:
Judy Vigiletti, Issidor L. Iliev, Thomas Patrick Larsen, Franck Le Charpentier, Nicolas Jeunesse, Sylvie Pompeani, Paul Christopher Bousquet