Structure Or Manufacture Of Unitary Devices Formed Of Plural Heads For More Than One Track [n: G9b/5.104, G9b/5.159 And Subgroups Take Precedence; In Thin Film Structure G9b/5.077] {g11b 5/29} Patents (Class G9B/5.075)

Cross-Reference Art Collections

[n: manufacture] {g11b 5/29a} (Class G9B/5.076)
  • MANUFACTURING METHOD FOR A HEAD-STACK ASSEMBLY, APPARATUS FOR INTERCONNECTION OF THE HEAD-STACK ASSEMBLY, AND HEAD-STACK ASSEMBLY
    Publication number: 20110109996
    Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal joining.
    Type: Application
    Filed: December 18, 2009
    Publication date: May 12, 2011
    Inventors: Tetsuya Nakamura, Takahiro Sakai, Masahiko Katoh, Yasushi Inoue, Tetsuya Nakatsuka, Satoshi Kaneko, Masashi Okubo