Abstract: A semiconductor device and method of manufacture are provided wherein semiconductor devices are attached over a semiconductor substrate. A seal ring within the semiconductor device is extended to include a first bond metal within a bonding layer and bonded to a second bond metal over the semiconductor substrate. Such a seal ring provided a more complete protection from cracking and delamination.

Abstract: Aspects of the disclosure include methods and systems for dynamically creating tagged search results. An exemplary method includes identifying, responsive to receiving a search query, search results. The search results include a plurality of web page links to respective web pages. The method includes identifying, for each web page, one or more page features, generating a plurality of descriptive tags for the respective web pages, generating one or more page-tag pairs by pairing a web page of the respective web pages with a descriptive tag of the plurality of descriptive tags, and determining a relevance score for each page-tag pair. One or more descriptive tags having a relevance score above a predetermined threshold are selected. Tagged search results are provided that include the plurality of web page links and, for each web page link, the selected one or more descriptive tags for the respective web page.

Abstract: A Schottky diode includes a substrate with an epitaxy layer on which a cathode region and an anode region are defined. A cathode structure and an anode structure are formed in the cathode region and the anode region respectively and horizontally separated by a distance. The anode structure includes a plurality of p-type doped regions diffused from the epitaxy layer toward the substrate, with an interval is formed between adjacent two p-type doped regions. A backside metal film and a backside protection layer are sequentially formed on a back surface of the substrate. Since the manufacturing of the Schottky diode does not involve wire bonding and molding processes, the overall thickness of the Schottky diode is reduced and heat dissipation is improved. With the backside metal film on the back side of the substrate, an equivalent resistance and a forward voltage of the Schottky diode can be reduced.

Abstract: A power tool apparatus includes a housing, a control board, a working part, a motor and a fan. The housing has a battery pack cavity. The battery pack cavity is configured to install a battery pack. The control board is disposed within the housing. The working part is disposed on the housing. The motor is disposed within the housing. The motor drives the working part to operate. The air duct is disposed within the housing. The air duct is configured for heat dissipation of the power tool apparatus. The fan is fixedly connected to an output shaft of the motor. The fan is configured to drive air to flow along the air duct when rotating. The housing has at least two air inlets and at least one first air outlet. The air duct is disposed between the air inlets and the first air outlet.

Abstract: A semiconductor structure includes a semiconductor substrate, an epitaxy layer, a dielectric layer, a semiconductor layer, a first semiconductor device and a second semiconductor device. The semiconductor substrate has first region and a second region. The epitaxy layer is disposed on and within the first region of the semiconductor substrate. The dielectric layer is disposed on and within the second region of the semiconductor substrate. The semiconductor layer is disposed on the dielectric layer and within the second region. The first semiconductor device is formed on the epitaxy layer. The second semiconductor device is formed on the semiconductor layer.

Abstract: A device includes a substrate, an isolation structure over the substrate, a gate structure over the isolation structure, a gate spacer on a sidewall of the gate structure, a source/drain (S/D) region adjacent to the gate spacer, a silicide on the S/D region, a dielectric liner over a sidewall of the gate spacer and on a top surface of the isolation structure, wherein a bottom surface of the dielectric liner is above a top surface of the silicide layer and spaced away from the top surface of the silicide layer in a cross-sectional plane perpendicular to a lengthwise direction of the gate structure.

Abstract: A joint including a first part and a second part rotatable relative to each other about a rotation axis, the second part having a second surface; a dynamic seal arranged to dynamically seal against the second surface; and a static seal arranged to seal a gap between the first part and the dynamic seal, and arranged to push the dynamic seal against the second surface; wherein the static seal in the gap is exposed to an external region outside the joint. An industrial device including a joint is also provided.

Abstract: A water cooling device includes a first collector, a second collector and a plurality of tubes. The first collector includes a receiving chamber and a plurality of distribution chamber. The receiving chamber has an inlet for receiving a working fluid. Each of the distribution chambers includes a first wall portion and a second wall portion opposite to the first wall portion. The first wall portion has an opening communicating with the receiving chamber. The second wall portion has an outlet. Each of the tubes is connected to the outlet of one of the distribution chambers on one end, and is connected to the second collector on another end.

Abstract: A method for controlling infusion of a medication into a patient includes obtaining a rise time of a second infusion device; determining a first infusion end time of a first infusion device; and outputting a pre-start message to the second infusion device at a time at as far in advance of the least before the first infusion end time as the rise time. The second infusion device reaches a target infusion rate before the first infusion end time, so that after the end of the infusion of the first infusion device, the second infusion device can directly start the infusion at the target infusion rate. This avoids large flow rate fluctuations and provides continuous, uninterrupted infusion at a desired, more stable rate, reducing the probability of large changes in the patient's vital signs and improving the safety of the infusion.

Abstract: A data processing method, apparatus and device, a storage medium, and a program product are disclosed. The method may include: acquiring free-viewpoint video data, the free-viewpoint video data comprises at least one texture map and/or at least one depth map; encapsulating the at least one texture map and/or the at least one depth map in at least one media track; and processing the free-viewpoint video data according to target-viewpoint information.

Abstract: A display panel, a method for detecting and compensating the display panel, and a display device are provided. The display panel includes a first voltage terminal, a gate driving circuit, and a detection circuit. The gate driving circuit includes multiple stages of first output terminals; and the detection circuit includes a voltage divider circuit, multiple first switching units, and multiple second switching units. The voltage divider circuit includes multiple stages of voltage output terminals, and the voltage output terminals and the first output terminals are arranged in one-by-one correspondence; the first switching units and the voltage output terminals are arranged in one-by-one correspondence; the second switching units and the first switching units are arranged in one-by-one correspondence; and the second switching units have second terminals connected to a second output terminal.

Abstract: A light head includes a light head housing and a light source. The light head housing is made of silicone material by integrally-forming, the light head housing includes an inner chamber and a through hole for connecting the inner chamber to the outside, the inner chamber includes a large chamber for accommodating the light source and a light-transmitting chamber connected with the large chamber. A lighting assembly is further proposed, including a lighting housing and the above-mentioned light head, wherein the light head is arranged at one end of the lighting housing, and the lighting housing includes a base for holding the hollow sleeve, the base is provided with a hollow sleeve mounting hole, the base further includes a hollow silicone plug.

Abstract: Provided are methods, systems, and computer program products for verifying a card image file. A system may include at least one processor programmed or configured to parse a card image file to determine card data represented by the card image file, generate a plurality of simulated payment transactions based on the card data, each simulated payment transaction including simulated transaction data, issue a plurality of commands to the payment device emulator, the plurality of commands based on the simulated transaction data for the plurality of simulated payment transactions, receive a plurality of command responses generated by the payment device emulator based on the plurality of commands, and verify the card image file based on the plurality of command responses and the card data.

Abstract: To arrange a power unit, an electric power conversion unit, and engine-related components compactly, a drive motor, a reduction drive, a generator, and an engine body are integrally arranged in this order in a vehicle width direction of a power unit compartment such that respective heights thereof are substantially the same. An electric power conversion unit, in which a motor inverter, an electric power generation inverter, and a DC/DC converter are integrated, is arranged above the drive motor, the reduction drive, and the generator. Engine-related components such as a low-voltage battery, an air cleaner, and an oil filter are arranged above the engine body.

Abstract: A method, applied to an electronic device comprising a camera and a temperature sensor, wherein the method comprises displaying a temperature measurement interface, receiving, from a user, a temperature measurement operation, measuring, in response to the temperature measurement operation and using the temperature sensor, a first temperature of a measured object, collecting, using the camera, a picture of the measured object, determining, based on the picture, a type of the measured object, matching, based on the type, a first temperature algorithm for the measured object, and determining, based on the first temperature and first algorithm, a second temperature of the measured object.

Abstract: The present disclosure describes a semiconductor device with a nitrided capping layer and methods for forming the same. One method includes forming a first conductive structure in a first dielectric layer on a substrate, depositing a second dielectric layer on the first conductive structure and the first dielectric layer, and forming an opening in the second dielectric layer to expose the first conductive structure and a portion of the first dielectric layer. The method further includes forming a nitrided layer on a top portion of the first conductive structure, a top portion of the portion of the first dielectric layer, sidewalls of the opening, and a top portion of the second dielectric layer, and forming a second conductive structure in the opening, where the second conductive structure is in contact with the nitrided layer.

Abstract: The present disclosure relates to a method for predicting an amount of water-sealed gas in a high-sulfur water-bearing gas reservoir. The method solves the problem that no method has yet been proposed for predicting the amount of water-sealed gas in a high-sulfur water-bearing gas reservoir. According to the technical solution, the method includes: considering that the volume of the gas reservoir does not change during the production of the constant-volume gas reservoir, deriving, based on a material balance method, a material balance equation of the high-sulfur water-bearing gas reservoir in consideration of water-sealed gas and water-soluble gas, solving and drawing a chart of water-sealed gas in the high-sulfur water-bearing gas reservoir by an iterative algorithm, obtaining a recovery factor of the high-sulfur water-bearing gas reservoir in consideration of water-sealed gas and water-soluble gas, and further obtaining the amount of water-seal gas in the high-sulfur water-bearing gas reservoir.

Abstract: A method for establishing a variation model related to circuit characteristics for performing circuit simulation includes: performing first, second, third, and fourth Monte Carlo simulation operations according to a first netlist file and predetermined process model data to generate a first, a second, a third, and a fourth performance simulation results, respectively, where the first netlist file is arranged to indicate a basic circuit in a circuit system; and execute a performance simulation results expansion procedure according to the first, the second, the third, and the fourth performance simulation results to generate a plurality of performance simulation results to establish the variation model, for performing the circuit simulation to generate at least one circuit simulation result according to one or more performance simulation results among the plurality of performance simulation results, where the number of the plurality of performance simulation results is greater than four.

Abstract: This disclosure relates to wireless communication methods that utilize and enable the communication of an indication of a listen-before-talk (LBT) mode from a wireless access node to a mobile station.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of a side surface of the semiconductor device. The redistribution structure is disposed over the semiconductor device and a first side of the encapsulating material. The adhesive residue is disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device.