Abstract: Semiconductor structures and methods of forming the same are provided. In an embodiment, an exemplary method includes depositing a dummy gate material layer over a first fin-shaped active region, patterning the dummy gate material layer to form a dummy gate electrode, wherein the dummy gate electrode has a footing feature at an interface between the first fin-shaped active region and the dummy gate electrode, oxidizing the footing feature and a sidewall portion of the dummy gate electrode to form a dielectric gate spacer, and replacing a remaining portion of the dummy gate electrode with a gate structure.

Abstract: A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.

Abstract: Disclosed in the present disclosure is a screen bracket and a vehicle-mounted rotating screen. The screen bracket includes a rotating base, a connecting shaft, and a limiting member. A first end of the connecting shaft is connected to a display screen, a second end of the connecting shaft rotatably connected to the rotating base, the second end of the connecting shaft defines a plurality of locating holes. The limiting member is fixed to the rotating base, the limiting member has a telescopic rod, and the telescopic rod is disposed towards the connecting shaft. When the connecting shaft rotates to a specified rotation angle, a corresponding locating hole is facing the telescopic rod, and the telescopic rod is configured to clamp the corresponding locating hole in an extended state and detach the corresponding locating hole in a retracted state.

Abstract: The present disclosure describes methods, systems, and devices for scheduling gap coordination. One method includes determining, by a user equipment (UE), a scheduling gap (SG) granularity in a network; and transmitting, by the UE, a message comprising the determined SG granularity to the network. Another method includes receiving, by a network, assistance information from a UE; configuring, by the network based on the assistance information, a SG granularity; transmitting, by the network, reconfiguration information to the UE, the reconfiguration information comprising the determined SG granularity; and receiving, by the network, reconfiguration complete information from the UE.

Abstract: A method for selectively depositing graphene on cobalt caps on copper interconnects for dual damascene structures in a back-end-of-line substrate is provided. The method comprises providing a semiconductor substrate comprising a first dielectric layer, the copper interconnect in the first dielectric layer, and the cobalt cap on the copper interconnect, the cobalt cap having an exposed metal surface, wherein the exposed metal surface comprises cobalt, and selectively depositing carbon layer on the exposed metal surface.

Abstract: An integrated circuit (IC) solder ball mounting apparatus comprises a ball storage unit for storing solder balls, a ball buffer unit configured to receive the solder balls from the ball storage unit in response to one or more pressure-actuated actions, and a gate valve configured to allow the solder balls to transfer to a ball mounting brush configured to place the solder balls onto area array contact structures formed on a wafer containing the integrated circuit.

Abstract: Disclosed are an edge tool configuration method and an electronic device. The edge tool configuration method includes: detecting a placement status of the electronic device through a sensor; reading configuration information of the edge tool according to the placement status, wherein the configuration information includes initial configuration information of the edge tool in a plurality of default placement statuses; placing the edge tool at an edge position in a display interface of a display according to the configuration information in the placement status.

Abstract: A task execution method for a large model, an electronic device, and a storage medium are provided, which relate to a field of artificial intelligence technology, particularly to fields of deep learning technology and large model technology.

Abstract: This application relates to the technical field of coal-fired boilers, and provides a method and an apparatus for improving steam oxidation resistance of a small-diameter boiler tube in a coal-fired boiler. The method includes the following steps: cutting a boiler tube panel from a ceiling of the boiler, vertically hoisting and fixing the boiler tube panel, and cutting out a section from a bottom portion of a lower bend of the boiler tube panel; cleaning an inner tube wall of each tube body in the boiler tube panel; performing oxidation resistance coating sintering on the inner tube wall of each tube body in the boiler tube panel; and performing a welding repair on each tube body in a sintered boiler tube panel. All construction processes of this method can be completed in a furnace during shutdown and maintenance, production efficiency is high, and maintenance duration can be significantly reduced.

Abstract: A circuit board includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer includes a plurality of first conductive portions. The second conductive layer includes a plurality of second conductive portions. A second conductive portion passes through a first via hole in the first insulating layer to be in electrical contact with a first conductive portion. The first conductive layer and the second conductive layer each include at least one main conductive layer, which is capable of creating a first intermetallic compound with solder. At least one of the first conductive layer and the second conductive layer further includes a stop layer capable of creating a second intermetallic compound with the solder. A rate of a reaction between the stop layer and the solder is lower than a rate of a reaction between the main conductive layer and the solder.

Abstract: An example crown assembly includes a button tube, a crown, a spring piece, a switch, and a fastening frame. The crown includes a crown cap and a crown stem that are connected. The spring piece includes a first plate, an elastic arm, and a second plate. Two ends of the elastic arm are connected to the first plate and the second plate. When pressure is exerted on the crown cap, the crown stem is capable of moving along the axis and pushing the first plate away from the end that is of the elastic arm and that is connected to the second plate, to enable the first plate to press the switch. The elastic arm is capable of generating elastic deformation, and when the pressure on the crown cap is released, the first plate is capable of pushing the crown stem away from the switch under elasticity of the elastic arm.

Abstract: Disclosed are apparatuses, systems, and techniques that implement training and deployment of speech-augmented language models for efficient capturing and processing of speech inputs. The techniques include processing, using a speech model, an audio input in a first language to generate a first portion of an input into a language model (LM). A second portion of the input into the LM includes represents a text context associated with the audio input. The techniques further include receiving, from the LM, an output that includes a speech-to-text conversion of the audio input.

Abstract: Systems and methods of message filtering in a multi-region multi-active architecture are provided. A client device receives a data message, the data message comprising a region tag and an account tag. The client device determines whether the region tag corresponds to a region server assigned to serve the client device. In response to determining the region tag corresponds to the region server assigned to serve the client device, the client device determines whether an account identification (ID) associated with the client device matches the account tag of the data message. In response to determining the account ID matches the account tag, the client device consumes the data message.

Abstract: A conduit system for transporting gas from a gas containing chamber for processing a substrate from which semiconductor devices are formed includes a liner with a spiral vent. The conduit system utilizes a curtain of gas to prevent or reduce deposition of material onto an inner surface of the conduit transporting the gas from the gas containing chamber.

Abstract: The present disclosure relates to adaptively overlapping redo writes. A log writer, while operating in a thin mode, may assign a first log writer group of a plurality of log writer groups to write one or more first redo log records to an online redo log in response to determining that a pipelining parameter is satisfied. The thin mode may be associated with one or more target sizes that are less than one or more target sizes associated with a thick mode. The log writer may determine to operate the thick mode based at least in part on at least a portion of the plurality of log writer groups being unavailable to write one or more second redo log records to the online redo log.

Abstract: A charging method for a battery pack includes sending, by a battery management module of the battery pack, a charging request for a first current to a charging pile for charging, controlling, by the battery management module in response to determining that first-current charging of the battery pack meets a first predetermined condition, the battery pack to perform pulse discharge, and controlling, by the battery management module in response to determining that the pulse discharge of the battery pack meets a second predetermined condition, the battery pack to stop discharging, and sending a charging request for a second current to the charging pile for charging. The second current is less than the first current.

Abstract: Disclosed in the present application are a method and apparatus for controlling a wheel loader, and a wheel loader and a storage medium, wherein an original trigger condition for KickDown is preset in the wheel loader. The method for controlling a wheel loader comprises: acquiring a way for releasing KickDown of a wheel loader; determining the current state of the wheel loader on the basis of the way for releasing KickDown; and when the current state of the wheel loader is working state, adjusting an original trigger condition to a first trigger condition, wherein the first trigger condition is easier to trigger than the original trigger condition.

Abstract: The present invention provides a hypersonic large internal contraction ratio air inlet channel having stepless adjustable air release valve, including an air inlet channel front body, an air-discharging slit cover plate, sidewalls, a lip cover, air-discharging cavities, valve plates, partition plates, a rotatable shaft, an expansion section and a driver. The valve plates are rotated through the driver according to the actual working conditions of air inlet channel, the minimum cross-section of the air discharging flow path is thus changed, and a stepless dynamic adjustment of the air discharging flow of the air inlet channel can be realized, so that the aerodynamic performance of the air inlet channel is improved, and the air discharging resistance of the air vehicle is reduced.

Abstract: A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a barrier layer over a surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer. The chip package structure includes a conductive pad over the insulating layer. The conductive pad has a first portion passing through the insulating layer and the barrier layer and connected to the conductive via structure. The chip package structure includes a conductive bump over the conductive pad. The chip package structure includes a second substrate. The chip package structure includes an underfill layer between the first substrate and the second substrate.