Search Patents
  • Light emitting device package
    Patent number: 8890297
    Abstract: A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: November 18, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Yu Ho Won, Geun Ho Kim
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME
    Publication number: 20130341654
    Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
    Type: Application
    Filed: August 23, 2013
    Publication date: December 26, 2013
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Min KONG, Choong Youl KIM, Hee Seok CHOI
  • LIGHT EMITTING MODULE
    Publication number: 20140264395
    Abstract: Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Gun Kyo LEE, In Yong PARK, Jong Woo LEE, Ju Young LEE, Yun Min CHO
  • Light emitting device package
    Patent number: 8610255
    Abstract: A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material.
    Type: Grant
    Filed: July 4, 2008
    Date of Patent: December 17, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Yu Ho Won, Geun Ho Kim
  • Light emitting module
    Patent number: 9307596
    Abstract: A light emitting module includes a plurality of light emitting device packages configured to be sequentially turned on or off according to the level of external drive voltage and connected to one another in series. Each of the plurality of light emitting device packages includes a light emitting cell having at least one light emitting device, and an on/off controller configured to control to turn the light emitting cell on or off.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: April 5, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Il Yeong Kang, Ki Soo Kwon, Sang Hoon Lee, Keun Tak Joo, Tae Young Choi
  • Light-emitting diode package
    Patent number: 9349923
    Abstract: Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: May 24, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sangwoo Lee, Sunghee Won
  • Light emitting device package
    Patent number: 9057501
    Abstract: Disclosed is a light emitting device package including a reflective substrate including a chip mounting region, a circuit substrate disposed on the reflective substrate, the circuit substrate including an inside edge defining the chip mounting region and at least one aligning hole disposed at a position spaced from the inside edge, and at least one light emitting diode chip disposed in the chip mounting region, the at least one light emitting diode chip being connected to the circuit substrate through a wire.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: June 16, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hyun Seok Cho
  • LIGHT EMITTING MODULE
    Publication number: 20150028368
    Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.
    Type: Application
    Filed: October 10, 2014
    Publication date: January 29, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Gun Kyo LEE, Jong Woo LEE, Yun Min CHO
  • Light emitting device, light emitting device package and lighting system including the same
    Patent number: 8552443
    Abstract: Provided are a light emitting device, a light emitting device package and a lighting system comprising the same. The light emitting device comprises a light emitting structure comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, and an anti-reflection region on a lateral surface of the light emitting structure.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: October 8, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jeong Hyeon Choi, Jae Wook Kim, Jeung Mo Kang, Du Hyun Kim
  • Semiconductor light emitting device and method of manufacturing the same
    Patent number: 7851813
    Abstract: Provided are a semiconductor light emitting device and a method of manufacturing the same. The semiconductor light emitting layer comprises a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer. The active layer comprises a quantum well layer, a quantum barrier layer, and a dual barrier layer.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: December 14, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventors: Tae Yun Kim, Hyo Kun Son
  • Light emitting device package and light emitting system
    Patent number: 8779446
    Abstract: A light emitting device package according to the embodiment includes a body having a cavity; at least one light emitting device in the cavity; a resin member filled in the cavity while covering the light emitting device; and a fluorescence sheet coupled with a top surface of the body such that the fluorescence sheet is physically separable from the top surface of the body, and including a fluorescence material for converting light emitted from the light emitting device into another light.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: July 15, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sung Ho Park
  • Light emitting device package and light unit having the same
    Patent number: 8536586
    Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
    Type: Grant
    Filed: October 28, 2012
    Date of Patent: September 17, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Light-emitting device
    Patent number: 8735910
    Abstract: Provided are a light-emitting device, a light-emitting device package, and a method for fabricating the light-emitting device. The light-emitting device includes a first light-emitting structure; an insulation layer having non-conductivity, in which a current does not flow, on the first light-emitting structure; a second light-emitting structure on the insulation layer; and a common electrode simultaneously and electrically connected to the first light-emitting structure and the second light-emitting structure.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: May 27, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Dae Sung Kang, Myung Hoon Jung, Sung Hoon Jung
  • Light emitting device package and lighting system including the same
    Patent number: 8841687
    Abstract: Provided are a light emitting device package and a lighting system including the light emitting device package. The light emitting device package includes a package body, at least one electrode on the package body, a light emitting device on the package body, a reflective structure around the light emitting device on the package body and a lens on the light emitting device and the electrode.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: September 23, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Yon Tae Moon, Yun Soo Song, Kwang Kyu Choi
  • LIGHT EMITTIG DEVICE PACKAGE AND IMAGE DISPLAY APPARATUS INCLUDING THE SAME
    Publication number: 20110284885
    Abstract: Disclosed herein is a light emitting device package including first lead frame and second lead frame mounted on a package body, a light emitting device electrically connected to the first lead frame and second lead frame, to emit light of a first wavelength range, and an encapsulant surrounding the light emitting device, the encapsulant comprising phosphors to be excited by the light of the first wavelength range, thereby emitting light of a second wavelength range, and a resin having a refractive index of 1.1 to 1.3.
    Type: Application
    Filed: August 3, 2011
    Publication date: November 24, 2011
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Jun Hee HONG
  • Light emitting device package and light unit having the same
    Patent number: 8692262
    Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: April 8, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Light emitting device and light emitting device package
    Patent number: 8441027
    Abstract: Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a substrate including a plurality of patterns, each pattern including three protrusion parts, a plurality of spaces formed between the patterns, and a light emitting device structure over the patterns and the spaces. Each space includes a medium having a refractive index different from a refractive index of the light emitting device structure.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: May 14, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Chang Bae Lee
  • Light emitting device
    Patent number: 8759846
    Abstract: A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: June 24, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jun Seok Park
  • Nitride semiconductor light emitting device and fabrication method thereof
    Patent number: 7791062
    Abstract: Provided is a nitride semiconductor light emitting device including: a first nitride semiconductor layer; an active layer formed above the first nitride semiconductor layer; and a delta doped second nitride semiconductor layer formed above the active layer. According to the present invention, the optical power of the nitride semiconductor light emitting device is enhanced, optical power down phenomenon is improved and reliability against ESD (electro static discharge) is enhanced.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: September 7, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Suk Hun Lee
  • Semiconductor light emitting device and light emitting apparatus having thereof
    Patent number: 8399890
    Abstract: Embodiments relate to a semiconductor light emitting device and a light emitting apparatus comprising the same. The semiconductor light emitting device according to embodiments comprises a plurality of light emitting cells comprising a plurality of compound semiconductor layers; a plurality of ohmic contact layers on the light emitting cells; a first insulating layer on the ohmic contact layer; a second electrode layer electrically connected to a first light emitting cell of the light emitting cells; and a plurality of interconnection layers connecting the light emitting cells in series.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: March 19, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong