Search Patents
  • Light emitting device
    Patent number: 9224922
    Abstract: A light emitting device includes at least one layer below or above a reflective layer to prevent delamination of the reflective layer from a layer below and/or above the reflective layer.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: December 29, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Seok Beom Choi
  • Light emitting device package
    Patent number: 8089087
    Abstract: A light emitting device package is provided. The light emitting device package comprises a package body, a light emitting device on the package body, and a light-transmitting light guide member under the light emitting device.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: January 3, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sang Youl Lee
  • LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140077249
    Abstract: A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.
    Type: Application
    Filed: November 22, 2013
    Publication date: March 20, 2014
    Applicant: LG INNOTEK CO., LTD
    Inventors: Bum Chul CHO, Jin Soo PARK
  • Lighting device and lighting system having the same
    Patent number: 9076942
    Abstract: Provided are a lighting device and a lighting system having the same. The lighting device includes a board having a recess, a lead frame disposed in the recess and including a first lead frame protrusion protruding upward, and a light emitting device disposed on the lead frame.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: July 7, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Kyong Jun Kim, Sung Ho Park
  • Semiconductor light emitting device
    Patent number: 9257613
    Abstract: Disclosed is a semiconductor light emitting device. The light emitting device includes a first conductive type semiconductor layer; an active layer on the first conductive type semiconductor layer; and a first electrode pad including a plurality of reflective layers on the first conductive type semiconductor layer.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: February 9, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Geun Ho Kim, Sung Kyoon Kim, Hee Seok Choi
  • Wafer substrate bonding structure and light emitting device comprising the same
    Patent number: 8987920
    Abstract: A wafer substrate bonding structure may be provided that includes: a first substrate; and a conductive thin film which is disposed on the first substrate and includes a resin and conductive corpuscles included in the resin.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: March 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Bum Chul Cho
  • Light emitting apparatus and lighting system
    Patent number: 8916899
    Abstract: Disclosed are a light emitting apparatus and a lighting system. The light emitting apparatus includes a body, a first electrode having a protrusion pattern on the body, a second electrode electrically separated from the first electrode on the body, an adhesive layer on the first electrode including the protrusion pattern, and a light emitting device on the adhesive layer.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: December 23, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jung Min Won
  • Light emitting device package and method of manufacturing the same
    Patent number: 9287466
    Abstract: A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: March 15, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Bum Chul Cho, Jin Soo Park
  • Diode having vertical structure
    Patent number: 9000468
    Abstract: A light emitting diode includes a conductive layer, an n-GaN layer on the conductive layer, an active layer on the n-GaN layer, a p-GaN layer on the active layer, and a p-electrode on the p-GaN layer. The conductive layer is an n-electrode.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: April 7, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Myung Cheol Yoo
  • Light emitting device and light emitting device package
    Patent number: 9209370
    Abstract: A light emitting device includes a light emitting structure below a substrate, in which at least one first contact area and at least one second contact area are defined. A plurality of layers having mutually different refractive indexes is provided below the light emitting structure.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: December 8, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Young Hoon Kim
  • Light-emitting diode package and manufacturing method thereof
    Patent number: 8796717
    Abstract: An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: August 5, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Kyung Ho Shin
  • LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140264428
    Abstract: Disclosed is a light emitting device and a method of manufacturing the same. The light emitting device includes a body, a first electrode installed in the body and a second electrode separated from the first electrode, a light emitting chip formed on one of the first and second electrodes, and electrically connected to the first and second electrodes, and a protective cap projecting between the first and second electrodes.
    Type: Application
    Filed: May 29, 2014
    Publication date: September 18, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Jae Joon YOON
  • Light emitting device
    Patent number: 9142735
    Abstract: Disclosed is a light emitting device including a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, a phosphor plate disposed on the second semiconductor layer, and a bonding portion disposed between the light emitting structure and the phosphor plate, the bonding portion bonding the phosphor plate to the light emitting structure.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 22, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Gun Kyo Lee
  • Light emitting device package
    Patent number: 9362462
    Abstract: Disclosed is a light emitting device package. The light emitting device package includes a body part provided therein with a cavity, a light emitting chip in the cavity, a cover part to cover the cavity, and a light conversion part provided on a bottom surface of the cover part while being separated from the light emitting chip.
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: June 7, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Seung Ryong Park
  • Semiconductor light emitting device
    Patent number: 8680555
    Abstract: Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a plurality of compound semiconductor layers, a passivation layer at the outside of the light emitting structure, a first electrode layer on the light emitting structure, and a second electrode layer under the light emitting structure.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: March 25, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong
  • LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME
    Publication number: 20100102345
    Abstract: Disclosed is an LED package. The LED package comprises a body comprising a cavity at one side thereof, at least one of lead frames comprising a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.
    Type: Application
    Filed: April 17, 2008
    Publication date: April 29, 2010
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Light emitting device
    Patent number: 8546835
    Abstract: Disclosed is a light emitting device. The light emitting device includes a body, a plurality of electrodes in the body, a light emitting chip installed in the body and electrically connected to the electrodes to generate light, and a thermo electric cooler module electrically connected to the electrodes and formed at a lower portion of the light emitting chip to cool the light emitting chip.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: October 1, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Kyung Wook Park
  • Light emitting device package
    Patent number: 7755099
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a base substrate, a frame, and a light emitting device. The base substrate comprises a plurality of electrode pads. The frame is formed of silicon, attached on the base substrate, and has an opening. The light emitting device is electrically connected to the electrode pad in the opening.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: July 13, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Yong Seok Choi
  • Semiconductor light emitting device
    Patent number: 8115227
    Abstract: Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a plurality of compound semiconductor layers, a passivation layer at the outside of the light emitting structure, a first electrode layer on the light emitting structure, and a second electrode layer under the light emitting structure.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: February 14, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong
  • Light-emitting diode package and manufacturing method thereof
    Patent number: 8212274
    Abstract: An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: July 3, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Kyung Ho Shin