Search Patents
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Patent number: 8558260Abstract: Disclosed is a light emitting device. The light emitting device comprises a reflective layer comprising an alloy of at least one of an Ag-based alloy, an Al-based alloy, Ag, Al, Rh, or Sn, and at least one of Pd, Cu, C, Sn, In or Cr, and a light emitting semiconductor layer comprising a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer on the reflective layer.Type: GrantFiled: January 15, 2009Date of Patent: October 15, 2013Assignee: LG Innotek Co., Ltd.Inventors: Bong Cheol Kang, Hyun Kyong Cho
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Patent number: 8716738Abstract: A semiconductor light-emitting device includes a light emitting structure on a substrate. The light emitting structure includes a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer. A plurality of transparent layers is disposed on the light emitting structure. A metal layer is disposed between the plurality of transparent layers. An electrode is electrically connected to the metal layer and contacts a portion of the metal layer.Type: GrantFiled: July 3, 2012Date of Patent: May 6, 2014Assignee: LG Innotek Co., Ltd.Inventor: Jung Hyeok Bae
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Patent number: 8791486Abstract: A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.Type: GrantFiled: September 6, 2012Date of Patent: July 29, 2014Assignee: LG Innotek Co., Ltd.Inventor: Bong Kul Min
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Patent number: 8415705Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a plurality of compound semiconductor layers including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; an electrode layer on the plurality of compound semiconductor layers; and a channel layer including protrusion and formed along a peripheral portion of an upper surface of the plurality of compound semiconductor layers.Type: GrantFiled: June 15, 2011Date of Patent: April 9, 2013Assignee: LG Innotek Co., Ltd.Inventor: Hwan Hee Jeong
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Patent number: 8519417Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a plurality of compound semiconductor layers that includes a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer. An electrode is formed on the compound semiconductor layers. A groove is formed at an upper portion of the compound semiconductor layers. An electrode layer is formed under the compound semiconductor layers.Type: GrantFiled: March 16, 2010Date of Patent: August 27, 2013Assignee: LG Innotek Co., Ltd.Inventor: Hwan Hee Jeong
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Patent number: 9257621Abstract: An epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin, 0.05-190 parts by weight, based on 10 parts by weight of the epoxy resin, of a polyester-based curing agent, wherein the epoxy resin comprises a triazine derivative epoxy compound and a siloxane compound containing an alicyclic epoxy group and a siloxane group.Type: GrantFiled: August 25, 2014Date of Patent: February 9, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Sungbae Moon, Jaehun Jeong, Mi Jin Lee, Soomin Lee, Yuwon Lee
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Patent number: 8519418Abstract: Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a sub-mount including a cavity, a light emitting device chip provided in the cavity, an electrode electrically connected to the light emitting chip, a reflective layer formed on a surface of the cavity, a dielectric pattern on the reflective layer, and an encapsulant filled in the cavity.Type: GrantFiled: February 3, 2011Date of Patent: August 27, 2013Assignee: LG Innotek Co., Ltd.Inventor: Sun Kyung Kim
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Patent number: 8269250Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a plurality of compound semiconductor layers, a second electrode layer below the light emitting structure, a channel layer between the light emitting structure and an edge area of the second electrode layer, a buffer layer on the channel layer, and a passivation layer on the buffer layer.Type: GrantFiled: February 12, 2010Date of Patent: September 18, 2012Assignee: LG Innotek Co., Ltd.Inventor: Hwan Hee Jeong
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Patent number: 8269246Abstract: A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.Type: GrantFiled: May 23, 2011Date of Patent: September 18, 2012Assignee: LG Innotek Co., Ltd.Inventor: Bong Kul Min
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Patent number: 8022435Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a plurality of compound semiconductor layers including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; an electrode layer on the plurality of compound semiconductor layers; and a channel layer including protrusion and formed along a peripheral portion of an upper surface of the plurality of compound semiconductor layers.Type: GrantFiled: November 13, 2009Date of Patent: September 20, 2011Assignee: LG Innotek Co., Ltd.Inventor: Hwan Hee Jeong
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Patent number: 7531848Abstract: Provided is a light emission diode package and a fabricating method thereof. The light emission diode package includes a heat sink having a groove, a printed circuit board on the heat sink, a light emission diode on the groove, a reflector coupled to the heat sink, a lead frame included in the reflector and electrically connecting the light emission diode to the printed circuit board and a molding unit on the light emission diode.Type: GrantFiled: December 21, 2006Date of Patent: May 12, 2009Assignee: LG Innotek Co., Ltd.Inventor: Kyoug Ho Shin
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Patent number: 8217413Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.Type: GrantFiled: March 21, 2011Date of Patent: July 10, 2012Assignee: LG Innotek Co., Ltd.Inventor: Bo Geun Park
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Patent number: 8125000Abstract: Disclosed is a light emitting device package. The light emitting device package includes a semiconductor substrate comprising a first surface at a first depth from an upper surface of the semiconductor substrate and a second surface at a second depth from the first surface; and a light emitting part on the second surface of the semiconductor substrate.Type: GrantFiled: June 21, 2011Date of Patent: February 28, 2012Assignee: LG Innotek Co., Ltd.Inventors: Geun Ho Kim, Yu Ho Won
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Patent number: 8766308Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, a second conductive semiconductor layer under the active layer, a second electrode layer under the second conductive semiconductor layer; and an insulating layer on an outer peripheral surface of at least two layers of the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer.Type: GrantFiled: August 9, 2013Date of Patent: July 1, 2014Assignee: LG Innotek Co., Ltd.Inventor: Woo Sik Lim
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Patent number: 9006886Abstract: A light emitting device package is disclosed. The light emitting device package includes a body, first and second lead frames disposed on the body, and a light emitting device connected to the first and second lead frames, wherein at least one of the first and second lead frames includes first and second regions having different thicknesses.Type: GrantFiled: May 29, 2012Date of Patent: April 14, 2015Assignee: LG Innotek Co., Ltd.Inventors: Gyu Hyeong Bak, Myoung Kyo Kim, Tae Uk Ha, Kyung Min Je
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Patent number: 8890297Abstract: A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material.Type: GrantFiled: December 20, 2011Date of Patent: November 18, 2014Assignee: LG Innotek Co., Ltd.Inventors: Yu Ho Won, Geun Ho Kim
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Patent number: 8487336Abstract: A light emitting device package is provided. The light emitting device package includes a substrate including a first cavity having a first depth and a lateral surface inclined with respect to a bottom surface and a second cavity having a second depth recessed from the bottom surface of the first cavity and a lateral surface perpendicular to the bottom surface of the first cavity, a first electrode layer and a second electrode layer on the substrate, and a light emitting diode within the second cavity, the light emitting diode being electrically connected to the first and second electrode layers.Type: GrantFiled: August 31, 2009Date of Patent: July 16, 2013Assignee: LG Innotek Co., Ltd.Inventor: Hyung Jo Park
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Patent number: 7592638Abstract: Provided is an LED package. It is easy to control luminance according to the luminance and an angle applicable. Since heat is efficiently emitted, the LED package is easily applicable to a high luminance LED. The manufacturing process is convenient and the cost is reduced. The LED package includes a substrate, an electrode, an LED, and a heatsink hole. The electrode is formed on the substrate. The LED is mounted in a side of the substrate and is electrically connected to the electrode. The heatsink hole is formed to pass through the substrate, for emitting out heat generated from the LED.Type: GrantFiled: October 19, 2006Date of Patent: September 22, 2009Assignee: LG Innotek Co., Ltd.Inventor: Wan Ho Kim
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Patent number: 8525209Abstract: A semiconductor light emitting device including a second electrode layer; a light emitting unit including a plurality of compound semiconductor layers under one portion of the second electrode layer; a first insulating layer under the other portion of the second electrode; an electrostatic protection unit including a plurality of compound semiconductor layer under the first insulating layer; a first electrode layer electrically connecting the light emitting unit to the electrostatic protection unit; and a wiring layer electrically connecting the electrostatic protection unit to the second electrode layer.Type: GrantFiled: January 31, 2012Date of Patent: September 3, 2013Assignee: LG Innotek Co., Ltd.Inventor: Hwan Hee Jeong
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Patent number: 8841687Abstract: Provided are a light emitting device package and a lighting system including the light emitting device package. The light emitting device package includes a package body, at least one electrode on the package body, a light emitting device on the package body, a reflective structure around the light emitting device on the package body and a lens on the light emitting device and the electrode.Type: GrantFiled: September 20, 2012Date of Patent: September 23, 2014Assignee: LG Innotek Co., Ltd.Inventors: Yon Tae Moon, Yun Soo Song, Kwang Kyu Choi