Search Patents
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Publication number: 20110057209Abstract: Provided are a light emitting device. The light emitting device comprises a package body, an insulating layer on a surface of the package body, first and second electrode layers on the insulating layer, a light emitting diode disposed on the package body and electrically connected to the first and second electrode layers, a resistor layer connected to the first electrode layer, a first element part in a first doping region within the package body, a second element part in a second doping region within the package body, and a third electrode layer connected to the first element part and the second element part.Type: ApplicationFiled: August 30, 2010Publication date: March 10, 2011Applicant: LG INNOTEK CO., LTD.Inventor: Geun Ho KIM
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Patent number: 8598601Abstract: The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.Type: GrantFiled: May 13, 2013Date of Patent: December 3, 2013Assignee: LG Innotek Co., LtdInventor: Jun Seok Park
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Patent number: 8890176Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.Type: GrantFiled: January 31, 2014Date of Patent: November 18, 2014Assignee: LG Innotek Co., Ltd.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
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Patent number: 9029877Abstract: Disclosed is a light-emitting diode package according to an embodiment, including; a body having a cavity formed therein, a lead frame placed in the cavity; and a light emitting diode electrically connected to the lead frame while having a slope angle relative to the bottom surface of the cavity, wherein a light emitting part and a non-light emitting part are present on the light emitting diode, and wherein a connection part is provided in a region of the cavity to be connected to at least a region of the non-light emitting part.Type: GrantFiled: March 15, 2012Date of Patent: May 12, 2015Assignee: LG Innotek Co., Ltd.Inventors: Sangwoo Lee, Sunghee Won
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Patent number: 8299477Abstract: A light emitting device that includes a conductive substrate, an insulating layer on the conductive substrate, a plurality of light emitting device cells on the insulating layer, a connection layer electrically interconnecting the light emitting device cells, a first contact section electrically connecting the conductive substrate with at least one light emitting device cell, and a second contact section on the at least one light emitting device cell.Type: GrantFiled: October 13, 2008Date of Patent: October 30, 2012Assignee: LG Innotek Co., Ltd.Inventors: Geun Ho Kim, Yong Seon Song, Yu Ho Won
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Patent number: 9276038Abstract: Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.Type: GrantFiled: March 12, 2014Date of Patent: March 1, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Gun Kyo Lee, In Yong Park, Jong Woo Lee, Ju Young Lee, Yun Min Cho
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Patent number: 10559733Abstract: A light-emitting device package according to an embodiment may include a body; N (herein, N denotes a positive integer of 5 or more) upper pads disposed on the body to be spaced apart from each other; N?1 light-emitting device chips respectively arranged on N?1 upper pads among the N upper pads; and a plurality of first wires for electrically connecting the N?1 light-emitting device chips and the N upper pads to each other by at least one of a plurality of wiring structures.Type: GrantFiled: November 18, 2016Date of Patent: February 11, 2020Assignee: LG INNOTEK CO., LTD.Inventor: Yun Soo Song
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Publication number: 20110089440Abstract: Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a first chip structure including a first reflective layer and a first light emitting structure having a plurality of compound semiconductor layers on the first reflective layer; a second chip structure bonded onto the first chip structure and including a second reflective layer and a second light emitting structure having a plurality of compound semiconductor layers on the second reflective layer; and an electrode on the second chip structure.Type: ApplicationFiled: October 18, 2010Publication date: April 21, 2011Applicant: LG INNOTEK CO., LTD.Inventor: KYUNG WOOK PARK
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Patent number: 8916883Abstract: A light emitting device includes a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer; a reflective layer formed under the light emitting structure; and a transparent supporting layer formed between the light emitting structure and the reflective layer, to emit a light generated from the active layer; and a conductive layer formed under the reflective layer, to surround the reflective layer.Type: GrantFiled: August 23, 2011Date of Patent: December 23, 2014Assignee: LG Innotek Co., Ltd.Inventors: Hwan Hee Jeong, Sang Youl Lee
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Patent number: 9035326Abstract: Disclosed is a light emitting module capable of representing improved heat radiation and improved light collection. there is provided a light emitting module. The light emitting module includes a metallic circuit board formed therein with a cavity, and a light emitting device package including a nitride insulating substrate attached in the cavity of the metallic circuit board, at least one pad part on the nitride insulating substrate, and at least one light emitting device attached on the pad part.Type: GrantFiled: September 23, 2011Date of Patent: May 19, 2015Assignee: LG INNOTEK CO., LTD.Inventor: Yun Min Cho
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Patent number: 8089079Abstract: A light emitting device includes a package body including a multilayer cavity; a first light emitting part including a first light emitting device in a first cavity of a first layer area of the multilayer cavity, and a second light emitting part including a second light emitting device in a second cavity of a second layer area higher than the first layer area.Type: GrantFiled: June 24, 2008Date of Patent: January 3, 2012Assignee: LG Innotek Co., Ltd.Inventor: Kwang Cheol Lee
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Patent number: 8901582Abstract: A light-emitting device has a first light-emitting structure a second light-emitting structure on a top surface of the first light-emitting structure, an insulation layer between a top surface of the first light-emitting structure and a bottom surface of the second light-emitting structure; and a first electrode contacted with the second conductive type semiconductor layer and the third conductive type semiconductor layer. The first electrode contacts the insulation layer and the first electrode has a thickness thicker than that of the insulating layer.Type: GrantFiled: October 2, 2013Date of Patent: December 2, 2014Assignee: LG Innotek Co., Ltd.Inventors: Dae Sung Kang, Myung Hoon Jung, Sung Hoon Jung
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Patent number: 9169988Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board which has a cavity and includes a metal board, an insulation layer, and a circuit pattern, an insulation board disposed in the cavity, at least one light emitting device disposed on the insulation board, first and second pads disposed on the insulation board to be electrically connected with the light emitting device, and a conductive pad for electrically connecting the second pad and the circuit pattern.Type: GrantFiled: March 6, 2012Date of Patent: October 27, 2015Assignee: LG INNOTEK CO., LTD.Inventors: Nam Seok Oh, Yun Min Cho, Jong Woo Lee
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Patent number: 8878200Abstract: The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.Type: GrantFiled: October 29, 2013Date of Patent: November 4, 2014Assignee: LG Innotek Co., Ltd.Inventor: Jun Seok Park
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Patent number: 9006869Abstract: A light emitting device package is provided comprising a light emitting device including at least one light emitting diode and a body including a first lead frame on which the light emitting device is mounted and a second lead frame spaced apart from the first lead frame, wherein at least one of the first and second lead frames is extending to a bending region in a first direction by a predetermined length on the basis of an outer surface of the body and is bent in a second direction intersecting the first direction.Type: GrantFiled: June 30, 2011Date of Patent: April 14, 2015Assignee: LG Innotek Co., Ltd.Inventor: JaeJoon Yoon
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Patent number: 9893246Abstract: A lighting may include a substrate, a light emitting device disposed on the substrate, a wavelength conversion layer which is disposed on the light emitting device and converts a part of first light emitted from the light emitting device into second light having a wavelength different from that of the first light, and a resin which is disposed on the substrate and buries the light emitting device and at least a portion of the wavelength conversion layer. An area of the top surface of the wavelength conversion layer is greater than that of the bottom surface of the wavelength conversion layer. The side surface of the wavelength conversion layer is inclined at a predetermined angle with respect to the top surface or the bottom surface.Type: GrantFiled: May 11, 2015Date of Patent: February 13, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Shuhei Matsuda, Tomohiro Sampei
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Patent number: 9276169Abstract: Provided are a light emitting device, a light emitting device package, and a lighting system including the same. The light emitting device includes a second electrode layerelectrode, a light emitting structure, a texture, and a current spreading layer. The light emitting structure is on second electrode layerelectrode, and includes a second conductive type semiconductor layer, an active layer on the second conductive type semiconductor layer, and a first conductive type semiconductor layer on the active layer. The texture is on at least one portion of the light emitting structure. The current spreading layer is on the light emitting structure provided with the texture.Type: GrantFiled: October 20, 2010Date of Patent: March 1, 2016Assignee: LG INNOTEK CO., LTD.Inventor: Sun Kyung Kim
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Patent number: 8101956Abstract: Discussed is a semiconductor LED package. The semiconductor LED package includes a packet body having a cavity, a semiconductor light emitting device in the cavity of the package body; and a plurality of reflective frames, each of the reflective frames having a bottom frame in the cavity of the package body, and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame, wherein the plurality of reflective frames are electrically separated from each other.Type: GrantFiled: May 24, 2011Date of Patent: January 24, 2012Assignee: LG Innotek Co., Ltd.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
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Patent number: 11450788Abstract: In an embodiment, disclosed is a semiconductor device comprising: a semiconductor structure which comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first electrode which is electrically connected to the first conductive semiconductor layer; and a second electrode which is electrically connected to the second conductive semiconductor layer, wherein an area ratio between an area of an upper surface of the second conductive semiconductor layer and an area of an outer surface of the active layer is 1:0.0005 to 1:0.01.Type: GrantFiled: March 22, 2019Date of Patent: September 20, 2022Assignee: LG INNOTEK CO., LTD.Inventors: Yong Tae Moon, Ji Hyung Moon, Sang Youl Lee
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Publication number: 20130062632Abstract: Disclosed are a light emitting device package and a lighting system in which the light emitting device package includes a first cavity in a first region of the body, a second cavity in a second region of the body, first and second lead frames spaced apart from each other in the first cavity, a third lead frame spaced apart from the second lead frame in the second cavity, a first light emitting device on the first and second lead frames in the first cavity, a second light emitting device on the second and third lead frames in the second cavity, and a molding member in the first and second cavities.Type: ApplicationFiled: December 14, 2011Publication date: March 14, 2013Applicant: LG INNOTEK CO., LTD.Inventor: Buem Yeon LEE