Search Patents
  • Wireless charging substrate and device
    Patent number: 10291079
    Abstract: Provided is a wireless charging board including: a coil pattern; a soft magnetic layer having one side on which the coil pattern is disposed; and a heat dissipation layer disposed on the other side of the soft magnetic layer and including a first uneven pattern portion.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: May 14, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Man Hue Choi, Hyun Gyu Park, Seok Bae, Sang Won Lee
  • Semiconductor light emitting device
    Patent number: 8680555
    Abstract: Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a plurality of compound semiconductor layers, a passivation layer at the outside of the light emitting structure, a first electrode layer on the light emitting structure, and a second electrode layer under the light emitting structure.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: March 25, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong
  • LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20140353703
    Abstract: Disclosed is a light emitting device package including a body including a recess, first and second electrodes disposed on the body, a light emitting device provided on the first electrode, and a molding part disposed on the light emitting device. At least one of the body and the molding part includes benzotriazol (BTA).
    Type: Application
    Filed: May 28, 2014
    Publication date: December 4, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Ji Na KWON, Jeong Hyun NA, Ho Ki KWON
  • Light emitting device
    Patent number: 8710528
    Abstract: A light emitting device including a substrate, a first conductive semiconductor layer on the substrate, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, and a reflective layer under the substrate and including a light reflection pattern configured to reflect light emitted by the active layer in directions away from the reflective layer.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: April 29, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jeong Soon Yim
  • Semiconductor light emitting device and method of manufacturing the same
    Patent number: 8093611
    Abstract: A semiconductor light emitting device and a method of manufacturing the same are provided. The semiconductor light emitting device comprises a first conductive semiconductor layer comprising a concave portion, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: January 10, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hyo Kun Son
  • Semiconductor light emitting device
    Patent number: 8115227
    Abstract: Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a plurality of compound semiconductor layers, a passivation layer at the outside of the light emitting structure, a first electrode layer on the light emitting structure, and a second electrode layer under the light emitting structure.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: February 14, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong
  • Semiconductor light emitting device
    Patent number: 7816701
    Abstract: A semiconductor light emitting device is provided. The semiconductor light emitting device comprises: a first conductive semiconductor layer; an active layer on the first conductive semiconductor layer; a first quantum dot layer on the active layer; and a second conductive semiconductor layer on the first quantum dot layer.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: October 19, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Kyung Jun Kim
  • Light emitting device package
    Patent number: 7755099
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a base substrate, a frame, and a light emitting device. The base substrate comprises a plurality of electrode pads. The frame is formed of silicon, attached on the base substrate, and has an opening. The light emitting device is electrically connected to the electrode pad in the opening.
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: July 13, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Yong Seok Choi
  • Light emitting device and manufacturing method thereof
    Patent number: 8791480
    Abstract: A light emitting device according to the embodiment includes a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, a current spreading layer on the second conductive semiconductor layer, a bonding layer on the current spreading layer, and a light extracting structure on the bonding layer.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: July 29, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: June O Song
  • Semiconductor light emitting device having one or more recesses on a layer
    Patent number: 8263985
    Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer comprising a plurality of recesses on the active layer.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: September 11, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sung Min Choi
  • SEMICONDUCTOR LIGHT EMITTING DEVICE
    Publication number: 20090315050
    Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a first semiconductor layer, a second semiconductor layer, an active layer formed between the first semiconductor layer and the second semiconductor layer, a first reflective electrode on the first semiconductor layer to reflect incident light, and a second reflective electrode on the second semiconductor layer to reflect the incident light.
    Type: Application
    Filed: December 17, 2007
    Publication date: December 24, 2009
    Applicant: LG Innotek Co., Ltd.
    Inventor: Sang Youl Lee
  • Semiconductor light emitting device and a method for manufacturing the same
    Patent number: 7888696
    Abstract: Disclosed is a semiconductor light emitting device comprising a reflective structure layer comprising a dopant layer and a roughness layer, a first conductive semiconductor layer on the reflective structure layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: February 15, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventor: Dae Sung Kang
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 8436384
    Abstract: Disclosed are a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises a substrate, in which concave-convex patterns are in at least a portion of a backside of the substrate, and a light emitting structure on the substrate and comprising a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: May 7, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Ho Sang Yoon
  • LIGHT EMITTING DEVICE WITH ENCAPSULANT FORMED WITH BARRIERS AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME
    Publication number: 20130234188
    Abstract: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.
    Type: Application
    Filed: April 8, 2013
    Publication date: September 12, 2013
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jung Ha HWANG, Kyoung Woo JO
  • Semiconductor light emitting device
    Patent number: 9356197
    Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a first semiconductor layer, a second semiconductor layer, an active layer formed between the first semiconductor layer and the second semiconductor layer, a first reflective electrode on the first semiconductor layer to reflect incident light, and a second reflective electrode on the second semiconductor layer to reflect the incident light.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: May 31, 2016
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sang Youl Lee
  • LIGHTING EMITTING DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
    Publication number: 20110309391
    Abstract: Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity.
    Type: Application
    Filed: September 5, 2008
    Publication date: December 22, 2011
    Applicant: LG INNOTEK CO., LTD
    Inventors: Bum Chul Cho, Geun Ho Kim, Sung Jin Son, Jin Soo Park
  • Light emitting device package
    Patent number: 8044423
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a base substrate, a frame, and a light emitting device. The base substrate comprises a plurality of electrode pads. The frame is formed of silicon, attached on the base substrate, and has an opening. The light emitting device is electrically connected to the electrode pad in the opening.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: October 25, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventor: Yong Seok Choi
  • Light emitting device array
    Patent number: 8354686
    Abstract: A light emitting device array is provided comprising a printed circuit board on which a plurality of electrode patterns having the same width is formed, a light emitting device package disposed on a predetermined number of electrode patterns and a power supply line disposed on at least one of the remaining electrode pattern except for the predetermined number of electrode patterns.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: January 15, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventors: HongBoem Jin, HanCheol Kim
  • Sub-mount for mounting light emitting device and light emitting device package
    Publication number: 20080006837
    Abstract: A sub-amount for mounting a light emitting device and a light emitting device package using the sub-mount are disclosed. The light emitting device package includes a package body having a mount for mounting a light emitting device, and through holes, electrodes formed on the package body, and a reflective layer arranged on one of the electrodes formed on an upper surface of the package body. The reflective layer has openings for enabling the light emitting device to be coupled to the electrodes.
    Type: Application
    Filed: December 5, 2006
    Publication date: January 10, 2008
    Applicant: LG ELECTRONICS INC. AND LG INNOTEK CO., LTD
    Inventors: Chil Keun Park, Ki Chang Song, Geun Ho Kim, Yu Ho Won
  • Semiconductor light-emitting device
    Patent number: 8227823
    Abstract: The semiconductor light-emitting structure has a plurality of compound semiconductor layers; a current spreading layer comprising a multi-layered transparent electrode layer on the plurality of compound semiconductor layers and a metal layer between the transparent electrode layers; and a second electrode electrically connected to the current spreading layer.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: July 24, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jung Hyeok Bae