Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: Provided is a light emitting device. The light emitting device includes a plurality of metal layers spaced from each other, a first insulation film having an opened area in which a portion of the plurality of metal layers is opened, the first insulation film being disposed around top surfaces of the plurality of metal layers, a light emitting chip disposed on at least one of the plurality of metal layers, the light emitting chip being electrically connected to the other metal layer, a resin layer disposed on the plurality of metal layers and the light emitting chip, and a first guide member formed of a non-metallic material, the first guide member being disposed on the first insulation film.

Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: Provided is a light emitting device package. The light emitting device package comprises a body formed of a silicon-based material; an insulating layer having a first opening on a surface of the body; a first and second metal layers disposed on the insulating layer; a light emitting device having a plurality of compound semiconductor layers disposed on a top surface of the body and connected to the first and second metal layers; and a protection device disposed on the body and electrically connected to the light emitting device, wherein the insulating layer has a second opening on a bottom surface of the body, wherein a first portion of the first metal layer is connected to the protective device and is disposed in the second opening of the insulating layer.

Abstract: Embodiments provide a light emitting device package including a first lead frame and a second lead frame, a light emitting device electrically connected to each of the first lead frame and the second lead frame, the light emitting device having a first electrode pad asymmetrically formed on a top surface thereof, and a reflective member disposed around the light emitting device to reflect light emitted from the light emitting device. The reflective member is configured such that a standard deviation of tilts of a reflective surface of a first area, in which the first electrode pad is disposed, is greater than a standard deviation of tilts of a reflective surface of a second area opposite to the first area.

Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.

Abstract: A light emitting apparatus includes a light emitting diode including a body with a light emitting diode chip packaged therein and a plurality of lead electrodes contacted with one side of the body and a board including a plurality of electrode pads connected to lower surfaces of the lead electrodes of the light emitting diode. The lower surfaces of the lead electrodes of the light emitting diode correspond to top surfaces of electrode pads of the board with same shapes. The lower surfaces of the lead electrodes of the light emitting diode are disposed within a region of top surfaces of the electrode pads of the board, respectively.

Abstract: A light emitting device includes a metal base, an electrical circuit layer provided at an upper side of the metal base for providing a conductive path, a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base, an insulating layer sandwiched between the metal base and the electrical circuit layer, an electrode layer provided at an upper side of the electrical circuit layer, and a wire for electrically connecting the electrode layer and the light emitting device. The light emitting device package has improved light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Abstract: A light emitting device package includes a body, a first reflective cup and a second reflective cup disposed in a top surface of the body spaced from each other, a connection pad disposed in the top surface of the body spaced apart from the first reflective cup and the second reflective cup, a recess formed in the top surface of the body spaced apart from the first reflective cup, the second reflective cup, and the connection pad, a first semiconductor light emitting device disposed in the first reflective cup, a second semiconductor light emitting device disposed in the second reflective cup, and a Zener diode disposed in the recess, wherein the first reflective cup and the second reflective cup are recessed from the top surface of the body.

Abstract: A light emitting device includes a package body, a light emitting diode, a transparent resin material, and a wire. The package body includes a bottom part and a side part. The bottom part includes a first electrode and a second electrode electrically connecting the upper surface and the bottom surface of the bottom part, respectively. The side part includes an upper surface including a trench and a bottom surface being in contact with the upper surface of the bottom part, wherein the upper surface of the bottom part is lower than the upper surface of the side part such that the package body includes a cavity surrounded by the side part, and the bottom surface of the bottom part includes a second opened portion that divides the first electrode and the second electrode, and wherein a portion of the transparent resin material is disposed inside of the trench.

Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a conductive support member disposed under the second conductive semiconductor layer, an insulating layer disposed between the second conductive semiconductor layer and the conductive support member, and a stepped conductive layer disposed between the second conductive semiconductor layer and the conductive support member. The stepped conductive layer includes a lower parts and an upper parts. The upper parts are directly contacted with the second conductive semiconductor layer. The lower parts are disposed between the insulating layer and the conductive support member. The insulating layer is laterally disposed between the plurality of upper parts.

Abstract: Provided is a light emitting device package. The light emitting device package includes a body having a cavity, a plurality of lead frames within the cavity, a light emitting device on at least one of the plurality of lead frames, and a moisture permeation prevention member between each of the lead frames and the body. Each of the lead frames includes a first frame disposed within the cavity, a second frame disposed on a lower surface of the body, and a third frame connecting the first frame to the second frame. The second frame of the lead frames is disposed within the body and at least one portion of the second frame is inclined with respect to the lower surface of the body. The moisture permeation prevention member is disposed on at least third frame of each of the lead frames.

Abstract: A light emitting device includes a light emitting structure having a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer. A first electrode is electrically connected to the first conductive semiconductor layer and is provided under the light emitting structure, and a second electrode is electrically connected to the second conductive semiconductor layer and is provided under the light emitting structure. A first contact portion is provided through the light emitting structure and includes a first region electrically connected to the first electrode. A second region contacts a top surface of the first conductive semiconductor layer, and an insulating ion implantation layer is provided around the first contact portion to insulate the first contact portion from the second conductive semiconductor layer.

Abstract: The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.

Abstract: A light emitting device according to the embodiment includes a substrate; a protective layer on the substrate; a electrode layer on the protective layer; a light emitting structure disposed on the electrode layer to generate light and provided with a first semiconductor layer, an active layer under the first semiconductor layer, and a second conductive semiconductor layer under the active layer; and a first electrode having a first end disposed on a top surface of the light emitting structure and a second end disposed on the protective layer. The protective layer comes into Schottky contact with at least one of the electrode layer and the first electrode.

Abstract: A light emitting diode package including a substrate; a plurality of electrodes on the substrate; a light emitting diode on the substrate; at least one wire connecting the light emitting diode and at least a first electrode of the plurality of electrodes; a reflecting member formed around the light emitting diode and being spaced apart from the light emitting diode; a cavity included in the reflecting member; a mold material including in the cavity; and a heat sink disposed under the light emitting diode and configured to emit heat generated by the light emitting diode. Further, a connection portion connecting the plurality of electrodes extends under a surface of the substrate through a portion of the substrate, and an inside surface of the reflecting member has a step-shape structure.

Abstract: Disclosed are a light emitting device package and a light unit including the same. The light emitting device package includes a body; a first lead frame having a first cavity in a first region of the body; a second lead frame having a second cavity in a second region of the body; a first bonding part adjacent to a first lateral side of the body and extended from the first cavity of the first lead frame; a second bonding part adjacent to a second lateral side of the body, which is opposite to the first lateral side of the body, and extended from the second cavity of the second lead frame; a first light emitting device in the first cavity; a second light emitting device in the second cavity; a third cavity adjacent to the first bonding part; a first protective device in the third cavity.