Search Patents
  • Light emitting device and light emitting device package including the same
    Patent number: 8785952
    Abstract: A light emitting device is disclosed. The light emitting device includes a first electrode and a second electrode, which have different areas, thereby achieving enhanced bonding reliability.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: July 22, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Dongwook Park
  • PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20110169021
    Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.
    Type: Application
    Filed: March 21, 2011
    Publication date: July 14, 2011
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Bo Geun PARK
  • Light emitting device and method of manufacturing the same
    Patent number: 8297793
    Abstract: Disclosed is a light emitting device and a method of manufacturing the same. The light emitting device comprises a substrate comprising a cavity, a multi-color light emitting unit on a first region of the cavity, and a white light emitting unit on a second region of the cavity.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: October 30, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Wan Ho Kim
  • Light emitting device and light emitting device package
    Patent number: 8390014
    Abstract: Disclosed is a light emitting device including a second conductive semiconductor layer; an active layer on the second conductive semiconductor layer; a first semiconductor layer on the active layer, the first semiconductor layer having at least one lateral side with a step portion; and a lateral electrode on the step portion formed at the at least one lateral side of the first semiconductor layer.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: March 5, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hyo Kun Son
  • Semiconductor light emitting device
    Patent number: 8653545
    Abstract: A semiconductor light emitting device that includes a first conductive type semiconductor layer, a first electrode, a insulating layer, and an electrode layer. The first electrode has at least one branch on the first conductive type semiconductor layer. The insulating layer is disposed on the first electrode. The electrode layer is disposed on the insulating layer.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: February 18, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Woo Sik Lim, Sung Ho Choo
  • Light-emitting diode package and manufacturing method thereof
    Patent number: 8212274
    Abstract: An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: July 3, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Kyung Ho Shin
  • Semiconductor light emitting device
    Patent number: 8253156
    Abstract: Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a IH-V group compound semiconductor, a reflective layer comprising mediums, which are different from each other and alternately stacked under the light emitting structure, and a second electrode layer under the reflective layer.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: August 28, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hyung Jo Park
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 7791094
    Abstract: Disclosed are a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises a substrate, in which concave-convex patterns are in at least a portion of a backside of the substrate, and a light emitting structure on the substrate and comprising a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: September 7, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Ho Sang Yoon
  • LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM
    Publication number: 20110095323
    Abstract: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a first semiconductor layer comprising a plurality of vacant space parts, an active layer on the first semiconductor layer, and a second conductive type semiconductor layer on the active layer. Each of the plurality of air-lenses has a thickness less than that of the first semiconductor layer.
    Type: Application
    Filed: October 27, 2010
    Publication date: April 28, 2011
    Applicant: LG INNOTEK CO., LTD.
    Inventor: Sang Hoon Han
  • Light emitting device and method of fabricating the same
    Patent number: 8138513
    Abstract: A light emitting device package comprises: a substrate; first and second conduction members on the substrate; a light emitting diode on the substrate, the light emitting diode being electrically connected with the first and second conduction members; and a phosphor layer on the light emitting diode.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: March 20, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventors: Yu Ho Won, Geun Ho Kim
  • SEMICONDUCTOR DEVICE PACKAGE INCLUDING A PASTE MEMBER
    Publication number: 20120256225
    Abstract: A semiconductor device package is provided. The semiconductor device package comprises a package body; a plurality of electrodes comprising a first electrode on the package body; a paste member on the first electrode and comprising inorganic fillers and metal powder; and a semiconductor device die-bonded on the paste member, wherein a die-bonding region of the first electrode comprises a paste groove having a predetermined depth and the paste member is formed in the paste groove.
    Type: Application
    Filed: June 15, 2012
    Publication date: October 11, 2012
    Applicant: LG INNOTEK CO., LTD.
    Inventor: CHOONG YOUL KIM
  • Light emitting device package and lighting system
    Patent number: 8530918
    Abstract: Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a body including a cavity and formed in a transmittive material; a plurality of lead electrodes in the cavity; an isolation member disposed between the lead electrodes; a light emitting device electrically connected to the lead electrodes in the cavity; and a molding member on the light emitting device.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: September 10, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Ji Won Jang
  • Light emitting device
    Patent number: 8384110
    Abstract: A lighting emitting device includes a conductive substrate; a first conductive layer formed on the conductive substrate; a second conductive layer formed on the first conductive layer; a second semiconductor layer formed on the second conductive layer; an active layer formed on the second semiconductor layer; a first semiconductor layer being formed on the active layer and including a charge distribution layer; and an insulation layer.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: February 26, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jae Wook Kim
  • Light emitting device package and light unit having the same
    Patent number: 8022415
    Abstract: Discussed is an LED package The LED package includes a body having a cavity at one side thereof, at least one of lead frames having a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: September 20, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Light emitting device, method for manufacturing light emitting device, and light emitting apparatus
    Patent number: 7956376
    Abstract: A light emitting device according to the embodiment includes a reflecting layer; an adhesion layer including an oxide-based material on the reflecting layer; an ohmic contact layer on the adhesion layer; and a light emitting structure layer on the ohmic contact layer.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: June 7, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong
  • Light emitting device
    Patent number: 8039863
    Abstract: Provided is a light emitting device. The light emitting device comprises a package body, a plurality of electrodes, a light emitting diode, and a lens. The package body comprises a trench. The plurality of electrodes is disposed on and/or in the package body. The light emitting diode is disposed on the package body and is electrically connected to the electrodes. The lens is disposed on an inner side of the trench.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: October 18, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventor: Bum Chul Cho
  • Light emitting device package
    Patent number: 8461609
    Abstract: A light emitting device package is provided. The light emitting device package may include a housing including a cavity, a light emitting device disposed within the cavity, a filler filled in the cavity in order to seal the light emitting device, a fluorescent layer disposed on the filler, and an optical filter being disposed within the filler and transmitting light with a particular wavelength.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: June 11, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Nam Seok Oh
  • Light emitting device package
    Patent number: 8269249
    Abstract: A light emitting device package including a package body including a plurality of discrete and separated three-dimensional-shaped indentations formed in an undersurface of the package body and configured to dissipate heat generated in the package body, a cavity in the package body, and a light emitting device including at least one emitting diode in the cavity of the package body and configured to emit light.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: September 18, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Yong Seon Song
  • Semiconductor light emitting device
    Patent number: 7859003
    Abstract: Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a plurality of compound semiconductor layers, a passivation layer at the outside of the light emitting structure, a first electrode layer on the light emitting structure, and a second electrode layer under the light emitting structure.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: December 28, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong
  • Semiconductor light emitting device
    Patent number: 8466485
    Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, a second conductive semiconductor layer under the active layer, a second electrode layer under the second conductive semiconductor layer, and a transmissive conductive layer at least one part between the second conductive semiconductor layer and the second electrode layer.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: June 18, 2013
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong