Search Patents
  • Publication number: 20160282913
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Application
    Filed: June 3, 2016
    Publication date: September 29, 2016
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Publication number: 20200356148
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Application
    Filed: July 28, 2020
    Publication date: November 12, 2020
    Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
  • Patent number: 6525935
    Abstract: A low profile highly accessible computer enclosure with a processor plenum for cooling high power processors is disclosed. The enclosure includes one or more air movement devices that discharge air into a plenum. The plenum channels the air to a location proximate to one or more high power processors where it is discharged over the processors. The velocity of the air is sufficient to achieve a convection coefficient that will cool the high power processors. The enclosure can also be slidably mounted in a computer rack and include a multi-section top cover. While the computer is operating, an operator can access, inspect, service, repair, or replace components within server by sliding the server out of the front and/or rear of the computer rack and then removing one or more of the cover sections.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: February 25, 2003
    Assignee: Appro International, Inc.
    Inventor: Matthew P. Casebolt
  • Publication number: 20130330975
    Abstract: An interposer for electrically coupling a battery-management circuit board in a power supply and a motherboard is described. The interposer includes: a substrate having a top surface and a bottom surface; first spring connectors, disposed on the top surface, which electrically couple to the battery-management circuit board; and second spring connectors, disposed on the bottom surface and electrically coupled to the first spring connectors, which electrically couple to the motherboard. Spring connectors in a first subset of the first and second spring connectors that convey power signals have a first vertical height, and spring connectors in a second subset of the first and second spring connectors that convey monitoring signals for the power supply have a second, smaller vertical height. In this way, the first subset is activated before the second subset is activated, thereby ensuring that an electrical path for the power signals is established first.
    Type: Application
    Filed: April 1, 2013
    Publication date: December 12, 2013
    Applicant: Apple Inc.
    Inventors: Ron A. Hopkinson, Eric A. Knopf, Eugene Kim, Peter M. Arnold, Jim Hwang, Matthew P. Casebolt
  • Publication number: 20140362522
    Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 11, 2014
    Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
  • Patent number: 9207729
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: December 8, 2015
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Publication number: 20170308134
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Application
    Filed: June 29, 2017
    Publication date: October 26, 2017
    Inventors: Brett W. DEGNER, Caitlin Elizabeth KALINOWSKI, Richard D. KOSOGLOW, Joshua D. BANKO, David H. NARAJOWSKI, Jonathan L. BERK, Michael E. LECLERC, Michael D. MCBROOM, Asif IQBAL, Paul S. MICHELSEN, Mark K. SIN, Paul A. BAKER, Harold L. SONTAG, Wai Ching YUEN, Matthew P. CASEBOLT, Kevin S. FETTERMAN, Alexander C. CALKINS, Daniel L. MCBROOM
  • Patent number: 9946315
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: April 17, 2018
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 9735528
    Abstract: An interposer for electrically coupling a battery-management circuit board in a power supply and a motherboard is described. The interposer includes: a substrate having a top surface and a bottom surface; first spring connectors, disposed on the top surface, which electrically couple to the battery-management circuit board; and second spring connectors, disposed on the bottom surface and electrically coupled to the first spring connectors, which electrically couple to the motherboard. Spring connectors in a first subset of the first and second spring connectors that convey power signals have a first vertical height, and spring connectors in a second subset of the first and second spring connectors that convey monitoring signals for the power supply have a second, smaller vertical height. In this way, the first subset is activated before the second subset is activated, thereby ensuring that an electrical path for the power signals is established first.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: August 15, 2017
    Assignee: Apple Inc.
    Inventors: Ron A. Hopkinson, Eric A. Knopf, Eugene Kim, Peter M. Arnold, Jim Hwang, Matthew P. Casebolt
  • Patent number: 11650634
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: May 16, 2023
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 9974206
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 15, 2018
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 6490153
    Abstract: A computer system with densely-mounted components and effective cooling is provided. A hard drive mounting structure for “hot swap” hard drives utilizes a hard drive assembly in which a hard drive is mounted between a pair of parallel rails connected by a retaining portion. The rails provide a precise mechanism for loading and unloading the “hot swap” drive, without increasing the overall height of each hard drive assembly. A handle with double-cam actuation is used during insertion and removal of the hard drive assembly. In accordance with the present invention, two half-height hard drives may be stacked in a server mountable in a 2U rack. A tool-less lock is provided for releasably securing expansion cards to the computer case without the use of screws.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: December 3, 2002
    Assignee: California Digital Corporation
    Inventors: Matthew P. Casebolt, Robert E. Ogrey
  • Patent number: 9964999
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 8, 2018
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 7411784
    Abstract: A computer system is provided, including: a computer chassis configured to retain a motherboard having a plurality of I/O (input/output) connectors mounted thereon; and an electrically conductive door movable from an open position to a closed position, wherein when said door is in the open position, the I/O connectors are exposed, and when said door is in the closed position, the I/O connectors are covered. A method of operating a computer including a motherboard having a plurality of I/O (input/output) connectors mounted thereon is provided. The method includes operating the computer to generate electromagnetic signals, and blocking the electromagnetic signals with an electrically conductive door movable from an open position to a closed position, wherein when said door is in the open position, the I/O connectors are exposed, and when said door is in the closed position, the I/O connectors are covered.
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: August 12, 2008
    Assignee: Rackable Systems, Inc.
    Inventors: Giovanni Coglitore, Jack E. Randall, Matthew P. Casebolt
  • Patent number: 11256307
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: February 22, 2022
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. Mcbroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 9069535
    Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: June 30, 2015
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
  • Patent number: 9913400
    Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: March 6, 2018
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
  • Patent number: 10248171
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: April 2, 2019
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 10254805
    Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: April 9, 2019
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
  • Patent number: 9285846
    Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: March 15, 2016
    Assignee: Apple Inc.
    Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
Narrow Results

Filter by US Classification