Search Patents
  • Integrated circuits with backside power rails
    Patent number: 10833003
    Abstract: Semiconductor devices and methods are provided. A method according to the present disclosure includes receiving a substrate that includes a first semiconductor layer, a second semiconductor layer, and a third semiconductor layer; forming a plurality of fins over the third semiconductor layer; forming a trench between two of the plurality of fins; depositing a dummy material in the trench; forming a gate structure over channel regions of the plurality of the fins; forming source/drain features over source/drain regions of the plurality of the fins; bonding the substrate on a carrier wafer; removing the first and second semiconductor layers to expose the dummy material; removing the dummy material in the trench; depositing a conductive material in the trench; and bonding the substrate to a silicon substrate such that the conductive material is in contact with the silicon substrate. The trench extends through the third semiconductor layer and has a bottom surface on the second semiconductor layer.
    Type: Grant
    Filed: May 31, 2019
    Date of Patent: November 10, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chao Chou, Kuo-Cheng Ching, Shi Ning Ju, Wen-Ting Lan, Chih-Hao Wang
  • HEAT VENTILATION APPARATUS
    Publication number: 20120118553
    Abstract: An exemplary heat ventilation apparatus includes a server system having servers, a temperature sensor, a blower unit and a controlling unit electrically connected to the temperature sensor and the blower unit. The temperature sensor is mounted on the server system for sensing a temperature of an interior of the server system. The blower unit is adapted for drawing hot air from the server system to warm buildings. The controlling unit outputs different signals to turn on or turn off the blower unit according to different temperatures of the interior of the server system.
    Type: Application
    Filed: December 27, 2010
    Publication date: May 17, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YAO-TING CHANG, CHAO-KE WEI, HUNG-CHOU CHAN
  • IMAGE CAPTURING MODULE, ENDOSCOPE AND METHOD OF MANUFACTURING IMAGE CAPTURING MODULE
    Publication number: 20230048452
    Abstract: An image capturing module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The first pads are disposed on a first surface of the flexible circuit board and the second pads are disposed on a second surface of the flexible circuit board, wherein the first surface is opposite to the second surface. The image sensor is disposed on the first surface. A distance between the image sensor and the first pads is identical to a distance between the image sensor and the second pads. The flexible circuit board is folded to align and weld the first pads with the second pads, such that a light receiving surface of the image sensor is perpendicular to surfaces of the first and second pads.
    Type: Application
    Filed: August 10, 2021
    Publication date: February 16, 2023
    Applicant: ALTEK BIOTECHNOLOGY CORPORATION
    Inventors: Ting-Cheng Ke, Chao-Yu Chou, Po-Ju Chen
  • HEAT EXCHANGE SYSTEM BETWEEN LIQUEFIED NATURAL GAS AND HEAT DISSIPATION APPARATUS
    Publication number: 20170254480
    Abstract: A heat exchange system includes a cold source, a heat dissipation apparatus, a water storage tank, a heating portion, and a cooling portion. The heating portion is coupled between the cold source and the water storage tank. The cooling portion is coupled between the heat dissipation apparatus and the water storage tank. The cooling portion transmits heat of the heat dissipation apparatus to water of the water storage tank to cool the heating portion, and the heating portion transmits heat of the water of the water storage tank to the cold source to heat the cold source.
    Type: Application
    Filed: May 8, 2016
    Publication date: September 7, 2017
    Inventors: TZE-CHERN MAO, CHIH-HUNG CHANG, YEN-CHUN FU, CHAO-KE WEI, YAO-TING CHANG, HUNG-CHOU CHAN
  • ANTIBODY-DRUG CONJUGATES CONTAINING AN ANTI-MESOTHELIN ANTIBODY AND USES THEREOF
    Publication number: 20210386866
    Abstract: The present disclosure provides an immunoconjugate includes an antibody comprising an antigen-binding fragment that specifically binds to an epitope in mesothelin, N-glycan binding domain and an N-glycan; a linker linking to the N-glycan; and a payload A and a payload B conjugated to the linker, respectively; wherein the payload A and the payload B are the same or different. A pharmaceutical composition comprises the immunoconjugate and a method for treating cancer are also provided in the disclosure.
    Type: Application
    Filed: June 4, 2021
    Publication date: December 16, 2021
    Applicant: DEVELOPMENT CENTER FOR BIOTECHNOLOGY
    Inventors: SHIH-HSIEN CHUANG, WEI-TING SUN, YING-SHUAN LAILEE, CHUN-LIANG LAI, WUN-HUEI LIN, WIN-YIN WEI, SHIH-CHONG TSAI, CHENG-CHOU YU, CHAO-YANG HUANG
  • LiFePO4 precursor for manufacturing electrode material of Li-ion battery and method for manufacturing the same
    Patent number: 11476462
    Abstract: An LiFePO4 precursor for manufacturing an electrode material of an Li-ion battery and a method for manufacturing the same are disclosed. The LiFePO4 precursor of the present disclosure can be represented by the following formula (I): LiFe(1-a)MaPO4??(I) wherein M and a are defined in the specification, the LiFePO4 precursor does not have an olivine structure, and the LiFePO4 precursor is powders constituted by plural flakes.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: October 18, 2022
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Lih-Hsin Chou, Li-Wen Hu, Chun-Yu Pan, Shao-Ting Hung, Kuei-Chao Wu
  • ELECTRONIC DEVICE AND ELECTRONIC SYSTEM
    Publication number: 20230047240
    Abstract: An electronic device, including a first circuit board, a sensing element, a second circuit board, an electronic element, a light emitting element, and a lens, is provided. The first circuit board has a first surface and a second surface opposite to each other and a first side surface located therebetween. The sensing element is disposed on the first surface and electrically connected to the first circuit board. The second circuit board is located on the second surface and electrically connected to the first circuit board. The second circuit board has a third surface facing the first circuit board and a groove recessed in the third surface. The electronic element is disposed on the second surface and located in the groove. The light emitting element is disposed on the first side surface. The lens is disposed on the sensing element. An electronic system, including the electronic device, is also provided.
    Type: Application
    Filed: November 5, 2021
    Publication date: February 16, 2023
    Applicant: ALTEK BIOTECHNOLOGY CORPORATION
    Inventors: Chao-Yu Chou, Ting Cheng Ke
  • Limiting Hydrogen ion diffusion using multiple layers of SiO2 and Si3N4
    Publication number: 20020146879
    Abstract: A method of fabricating a semiconductor device having a gate structure comprising SiO2 and Si3N4 that exhibits reduced hydrogen diffusion during low temperature chemical vapor deposition of silicon nitride. In the method, a silicon dioxide (SiO2) layer is deposited on a wafer after a gate structure is fabricated. A barrier layer is formed on the silicon dioxide (SiO2) layer. Then a silicon nitride layer is formed over it by low temperature chemical vapor deposition. The barrier layer reduces, and may even altogether prevent, diffusion of the hydrogen absorbed by the silicon nitride layer into the gate oxide and channel during the low temperature chemical vapor deposition of silicon nitride.
    Type: Application
    Filed: December 21, 2001
    Publication date: October 10, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Tzy-Tzan Fu, Kuan-Ting Lin, Chao-Sheng Chou
  • Image capturing module, endoscope and method of manufacturing image capturing module
    Patent number: 11642016
    Abstract: An image capturing module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The first pads are disposed on a first surface of the flexible circuit board and the second pads are disposed on a second surface of the flexible circuit board, wherein the first surface is opposite to the second surface. The image sensor is disposed on the first surface. A distance between the image sensor and the first pads is identical to a distance between the image sensor and the second pads. The flexible circuit board is folded to align and weld the first pads with the second pads, such that a light receiving surface of the image sensor is perpendicular to surfaces of the first and second pads.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: May 9, 2023
    Assignee: ALTEK BIOTECHNOLOGY CORPORATION
    Inventors: Ting-Cheng Ke, Chao-Yu Chou, Po-Ju Chen
  • POWER SUPPLY SYSTEM AND CONTAINER DATA CENTER INCLUDING SAME
    Publication number: 20120013195
    Abstract: A power supply system includes a number of aerogenerators, a number of rectifiers, and a direct current to direct current (DC/DC) converter. A first terminal of each rectifier is connected to a corresponding one of the aerogenerators. A first terminal of the DC/DC converter is connected to second terminals of the rectifiers. A second terminal of the DC/DC converter is connected to a power unit of a container data center. Each rectifier converts the alternating current (AC) generated by the corresponding aerogenerator to a pulsating direct current (DC). The DC/DC converter converts the pulsating DC to a constant voltage DC and supplies power to the power unit.
    Type: Application
    Filed: September 20, 2010
    Publication date: January 19, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YAO-TING CHANG, CHAO-KE WEI, HUNG-CHOU CHAN
  • HEAT DISSIPATING SYSTEM FOR DATA CENTER
    Publication number: 20170127571
    Abstract: A heat dissipating system for a data center includes a data center and an air processing unit. The data center includes an enclosure and an electronic device, and defines a first air vent and a second air vent. The air processing unit includes a case and an air processing device. The case defines a first air inlet, a second air inlet, and a first air outlet. At least one air inlet damper is mounted on the case, and a first return air damper is mounted in the case. The data center can adjust cooling based on ambient temperature through the air inlet damper and the first return air damper.
    Type: Application
    Filed: November 19, 2015
    Publication date: May 4, 2017
    Inventors: TZE-CHERN MAO, CHIH-HUNG CHANG, YEN-CHUN FU, YAO-TING CHANG, CHAO-KE WEI, HUNG-CHOU CHAN
  • DATA CENTER AND AUXILIARY POWER SUPPLY UNIT THEREOF
    Publication number: 20120049783
    Abstract: An auxiliary power supply unit of a data center includes a thermoelectric chip module and a direct current/alternating current (DC/AC) voltage converter connected to the thermoelectric chip module. The thermoelectric chip module includes a number of thermoelectric chips. At least one sidewall of each thermoelectric chip contacts a hot pipe of the data center. The thermoelectric chips generate a direct current (DC) voltage when a temperature difference between the sidewalls of each thermoelectric chip exists. The DC/AC voltage converter converts the DC voltage into an alternating current (DC) voltage to power an air treatment device of the data center.
    Type: Application
    Filed: September 24, 2010
    Publication date: March 1, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YAO-TING CHANG, CHAO-KE WEI, HUNG-CHOU CHAN
  • Recognition system and image augmentation and training method thereof
    Patent number: 11823438
    Abstract: A recognition system and an image augmentation and training method thereof are provided. The image augmentation and training method of a recognition system includes the following steps. A plurality of image frames are obtained, wherein each of the image frames includes an object pattern. A plurality of environmental patterns are obtained. The object pattern is separated from each of the image frames. A plurality of image parameters are set. The image frames, based on the object patterns and the environmental patterns, are augmented according to the image parameters to increase the number of the image frames. A recognition model is trained using the image frames.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: November 21, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ting-Hsun Cheng, Yu-Ju Chao, Hsin-Cheng Lin, Chih-Chia Chang, Yu-Hsin Lin, Sen-Yih Chou
  • Electronic device and electronic system
    Patent number: 11586030
    Abstract: An electronic device, including a first circuit board, a sensing element, a second circuit board, an electronic element, a light emitting element, and a lens, is provided. The first circuit board has a first surface and a second surface opposite to each other and a first side surface located therebetween. The sensing element is disposed on the first surface and electrically connected to the first circuit board. The second circuit board is located on the second surface and electrically connected to the first circuit board. The second circuit board has a third surface facing the first circuit board and a groove recessed in the third surface. The electronic element is disposed on the second surface and located in the groove. The light emitting element is disposed on the first side surface. The lens is disposed on the sensing element. An electronic system, including the electronic device, is also provided.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: February 21, 2023
    Assignee: ALTEK BIOTECHNOLOGY CORPORATION
    Inventors: Chao-Yu Chou, Ting Cheng Ke
  • SYSTEM FOR EXCHANGING HEAT BETWEEN LIQUEFIED NATURAL GAS AND A HEAT DISSIPATION APPARATUS
    Publication number: 20190093824
    Abstract: A heat exchange system employed to gasify liquid natural gas (LNG) or for other required purpose includes the cold substance such as LNG, a heat dissipation apparatus, a water storage tank, a heating portion, and a cooling portion. The heating portion is coupled between the cold substance and the water storage tank. The cooling portion is coupled between the heat dissipation apparatus and the water storage tank. The cooling portion transmits heat of the heat dissipation apparatus to water of the water storage tank to cool the heating portion, and the heating portion transmits heat of the water of the water storage tank to the cold substance.
    Type: Application
    Filed: November 29, 2018
    Publication date: March 28, 2019
    Inventors: TZE-CHERN MAO, CHIH-HUNG CHANG, YEN-CHUN FU, CHAO-KE WEI, YAO-TING CHANG, HUNG-CHOU CHAN
  • RECOGNITION SYSTEM AND IMAGE AUGMENTATION AND TRAINING METHOD THEREOF
    Publication number: 20220147763
    Abstract: A recognition system and an image augmentation and training method thereof are provided. The image augmentation and training method of a recognition system includes the following steps. A plurality of image frames are obtained, wherein each of the image frames includes an object pattern. A plurality of environmental patterns are obtained. The object pattern is separated from each of the image frames. A plurality of image parameters are set. The image frames, based on the object patterns and the environmental patterns, are augmented according to the image parameters to increase the number of the image frames. A recognition model is trained using the image frames.
    Type: Application
    Filed: February 24, 2021
    Publication date: May 12, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ting-Hsun CHENG, Yu-Ju CHAO, Hsin-Cheng LIN, Chih-Chia CHANG, Yu-Hsin LIN, Sen-Yih CHOU
  • Limiting hydrogen ion diffusion using multiple layers of SiO2 and Si3N4
    Patent number: 6596576
    Abstract: A method of fabricating a semiconductor device having a gate structure comprising SiO2 and Si3N4 that exhibits reduced hydrogen diffusion during low temperature chemical vapor deposition of silicon nitride. In the method, a silicon dioxide (SiO2) layer is deposited on a wafer after a gate structure is fabricated. A barrier layer is formed on the silicon dioxide (SiO2) layer. Then a silicon nitride layer is formed over it by low temperature chemical vapor deposition. The barrier layer reduces, and may even altogether prevent, diffusion of the hydrogen absorbed by the silicon nitride layer into the gate oxide and channel during the low temperature chemical vapor deposition of silicon nitride.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: July 22, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Tzy-Tzan Fu, Kuan-Ting Lin, Chao-Sheng Chou
  • Power supply system and container data center including same
    Patent number: 8471402
    Abstract: A power supply system includes a number of aerogenerators, a number of rectifiers, and a direct current to direct current (DC/DC) converter. A first terminal of each rectifier is connected to a corresponding one of the aerogenerators. A first terminal of the DC/DC converter is connected to second terminals of the rectifiers. A second terminal of the DC/DC converter is connected to a power unit of a container data center. Each rectifier converts the alternating current (AC) generated by the corresponding aerogenerator to a pulsating direct current (DC). The DC/DC converter converts the pulsating DC to a constant voltage DC and supplies power to the power unit.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: June 25, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yao-Ting Chang, Chao-Ke Wei, Hung-Chou Chan
  • Heat exchange system between liquefied natural gas and heat dissipation apparatus
    Patent number: 10330262
    Abstract: A heat exchange system includes a cold source, a heat dissipation apparatus, a water storage tank, a heating portion, and a cooling portion. The heating portion is coupled between the cold source and the water storage tank. The cooling portion is coupled between the heat dissipation apparatus and the water storage tank. The cooling portion transmits heat of the heat dissipation apparatus to water of the water storage tank to cool the heating portion, and the heating portion transmits heat of the water of the water storage tank to the cold source to heat the cold source.
    Type: Grant
    Filed: May 8, 2016
    Date of Patent: June 25, 2019
    Assignee: Cloud Network Technology Singapore Pte. Ltd.
    Inventors: Tze-Chern Mao, Chih-Hung Chang, Yen-Chun Fu, Chao-Ke Wei, Yao-Ting Chang, Hung-Chou Chan
  • System for exchanging heat between liquefied natural gas and a heat dissipation apparatus
    Patent number: 10415757
    Abstract: A heat exchange system employed to gasify liquid natural gas (LNG) or for other required purpose includes the cold substance such as LNG, a heat dissipation apparatus, a water storage tank, a heating portion, and a cooling portion. The heating portion is coupled between the cold substance and the water storage tank. The cooling portion is coupled between the heat dissipation apparatus and the water storage tank. The cooling portion transmits heat of the heat dissipation apparatus to water of the water storage tank to cool the heating portion, and the heating portion transmits heat of the water of the water storage tank to the cold substance.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: September 17, 2019
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Chih-Hung Chang, Yen-Chun Fu, Chao-Ke Wei, Yao-Ting Chang, Hung-Chou Chan
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