Abstract: A pump comprising a housing and a rotor rotatably accommodated in the housing and having an axis of rotation. The housing comprises a resilient seal member, an inlet and an outlet for fluid. The rotor comprises first and second surface areas, and the rotor and housing are cooperatively configured such that the second surface area is radially recessed from the first surface area, forming a chamber with an interior surface of the housing, and the first surface area seals against the interior surface. The seal member is located azimuthally between the outlet and the inlet. The seal member will engage the first and second surface areas, operative to prevent the passage of fluid from the outlet to the inlet as the rotor rotates. An edge of the seal member is coterminous with an aperture through which the fluid can flow.

Abstract: Examples disclosed herein relate to potential blocking impacts. Some of the examples enable obtaining network traffic data of a network that is accessible by a plurality of users. The network traffic data may comprise occurrences of a reputable entity. Some of the examples further enable determining, based on the network traffic data, a potential blocking impact of blocking the reputable entity from the network. Some of the examples further enable providing the potential blocking impact to be used in an application of a network policy to the reputable entity.

Abstract: A plug connector for an electronic device has a deformable seal positioned on it such that when the plug connector is mated to the electronic device a liquid-tight seal is formed between the plug connector and the electronic device. A seal may also be positioned within a receptacle connector cavity of the electronic device such that it forms a liquid-tight seal to a plug connector when the plug connector is mated to the electronic device.

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

Abstract: A cloud-based remote industrial automation site operation system leverages a wide array of configuration and operational data generated by industrial assets of an industrial enterprise to facilitate remote control of automation systems from a cloud platform. Status and operational data generated by industrial assets on the plant floor is migrated to the cloud platform where the remote site operation system resides. The system performs substantially real-time control functions for one or more plant-side automation systems from the cloud platform based on the collected data and one or more control programs that execute on the cloud platform. In this way, the cloud-based services can allow geographically diverse industrial systems to be collectively controlled using a centralized, cloud-based virtual controller. The system can also provide control backup services, allowing control to be switched from a local controller to the cloud-based control in the event of a failure at the local controller.

Abstract: A composite structure (10) includes a first outer skin (12); a second outer skin (14); and a core (16) sandwiched between the first outer skin (12) and the second outer skin (14). The core (16) includes a plurality of spaced apart ridges (18) between the first outer skin (12) and the second outer skin (14), each of the spaced apart ridges (18) extending from one end (20) of the composite structure (10) to an opposite end (22); and a plurality of connecting elements (24) between the first outer skin (12) and the second outer skin (14) configured to intersect with the ridges (18) to form open channels (26) within the core (16).

Abstract: An industrial search and diagnosis system discovers available data items across heterogeneous data platforms that make up an industrial enterprise and indexes the data items in a unified searchable namespace. The system also indexes non-textual or multimedia input, including image data, video data, and audio data. This multimedia data can be indexed by the system in association with the relevant industrial systems (e.g., machines, automation systems, devices, production lines, etc.) so that the system can provide the multimedia data to the user when the relevant industrial systems are searched or invoked. The system also accepts and processes multimedia data from as search criteria or for diagnostic analysis. In an example analysis, users can submit images, audio, or video of an industrial machine or automation system, and the diagnosis system can identify an operational abnormality based on comparative analysis performed on the multimedia information.

Abstract: Systems, methods and apparatus for wireless power transfer and particularly wireless power transfer to remote systems such as electric vehicles are disclosed. In one aspect an induction coil is provided comprising a plurality of substantially co-planar coils formed from one or more lengths of conducting material, each length of conducting material being electrically connectable at each end to a power source or battery, and wherein at least one of the lengths of conducting material is continuously wound around two or more of the coils. In another aspect, a method is provided for forming such an induction coil. In yet another aspect, a switching device is operable to alter the configuration of the coils, for example in response to a detected characteristic of another induction coil or device coupled thereto.

Abstract: Aerosolized compositions including a cyclic oligosaccharide; a fragrance; a volatile solvent; and a propellant; wherein the aerosolized composition is free of nonvolatile solvents are described herein. The aerosolized compositions and methods disclosed herein may provide a longer lasting fragrance.

Abstract: The present disclosure relates to a packaging process to enhance thermal and electrical performance of a wafer-level package. The wafer-level package with enhanced performance includes a first thinned die having a first device layer, a multilayer redistribution structure, a first mold compound, and a second mold compound. The multilayer redistribution structure includes package contacts on a bottom surface of the multilayer redistribution structure and redistribution interconnects connecting the first device layer to the package contacts. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define a cavity within the first mold compound and over the first thinned die. The second mold compound fills the cavity and is in contact with the top surface of the first thinned die.

Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die, a multilayer redistribution structure, a first mold compound, and a second mold compound. The first thinned die includes a first device layer formed from glass materials. The multilayer redistribution structure includes redistribution interconnects that connect the first device layer to package contacts on a bottom surface of the multilayer redistribution structure. Herein, the connections between the redistribution interconnects and the first device layer are solder-free. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.

Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die, a multilayer redistribution structure, a first mold compound, and a second mold compound. The first thinned die resides over a top surface of the multilayer redistribution structure. The multilayer redistribution structure includes at least one support pad that is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first thinned die. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.

Abstract: A controller may control a system for extracting liquid water from air comprising a thermal unit, a primary desiccant wheel, and a regeneration fluid path. The controller may comprise a plurality of sensors, a plurality of motors, and a microcontroller coupled to the plurality of sensors and the plurality of motors. The microcontroller may be configured to determine a water extraction efficiency based on at least one signal received from at least one of the plurality of sensors and maximize the water extraction efficiency by adjusting a speed of at least one of the plurality of motors in response to the determined water extraction efficiency. The water extraction efficiency may be a value obtained by multiplying a regeneration fluid flow rate within the regeneration fluid path by an absolute humidity of air on a side of the primary desiccant wheel opposite a side in communication with the thermal unit.

Abstract: The present disclosure is directed to methods, compositions, devices and kits which pertain to the attachment of surgical meshes to tissue by application of an energy source to the meshes and tissue in the presence of a bonding material.

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

Abstract: A multiple sensor array for breath acetone measurement has a semiconductor sensor that measures concentration of a set of volatile organic compounds. An electrochemical sensor measures volatile organic compounds or other gasses such as carbon monoxide. At least one correction sensor that measures other breath properties can also form a part of the multiple sensor array, providing information on physical properties such as pressure and temperature, and information related to individual gases including carbon monoxide, water vapor, hydrogen, ethylene oxide, and the like. An acetone concentration calculation module takes measured values from the multiple sensor array to measure breath acetone, which can be stored and displayed for a user.

Abstract: An exemplary shingle includes at least one coated shingle sheet defining a headlap portion and a tab portion each having opposed upper and lower surfaces. A first line of adhesive is adhered to one of the upper surface of the headlap portion and the lower surface of the tab portion, and includes a first thermally activated adhesive material. A second line of adhesive is adhered to one of the upper surface of the headlap portion and the lower surface of the tab portion, and includes a second thermally activated adhesive material having a minimum activation temperature less than a minimum activation temperature of the first thermally activated adhesive material.

Abstract: An adhesive application valve comprising an applicator, a Z-axis actuator operably connected to the applicator, wherein the Z-axis actuator and the rotation device are each capable of moving independently of each other to position the applicator in a position to apply an amount of adhesive to a top substrate prior to bonding with a bottom substrate is provided. Furthermore, a machine comprising an end effector, and an adhesive application valve configured to apply an amount of adhesive onto the top substrate, the end effector configured to place the top substrate into a position of engagement with the adhesive application valve, and place the top substrate onto the bottom substrate to facilitate initial contact between the adhesive applied to the top substrate and a fill material applied to the bottom substrate is also provided. A method of optical bonding is further provided.