Abstract: The plasma processing apparatus and plasma processing method of the present invention are suitable for the application of plasma processing to etching, ashing, CVD, etc. in the manufacturing of large scale integrated circuits (LSIs) and liquid crystal display panels (LCDs), and useful for the manufacturing of LSIs and LCDs. The apparatus is characterized in that the reaction chamber has its side wall separated into an inner side wall which faces to the interior of the reaction chamber and an outer side wall which faces to the exterior of the reaction chamber, with the inner side wall being isolated electrically from other portions of the reaction chamber and not grounded electrically. This structure improves the repeatability of plasma processing. The apparatus is also characterized in that the inner side wall of reaction chamber is isolated thermally from other portions of the reaction chamber and equipped with temperature control means.

Abstract: Each ferroelectric memory cell has a ferroelectric capacitor connected between a transfer gate and a plate line, and a coupling capacitor connected between one plate electrode of the ferroelectric capacitor and a common line. For each row in a memory cell array, there are provided an erase switch connected between the common line and an erase potential VE, and another erase switch connected between the plate line and a ground potential, wherein these erase switches are turned on to erase all the memory cells in a lump with activating an erase signal. If an intermediate plate electrode is provided between a pair of the plate electrodes of the ferroelectric capacitor, and connected to the common line, the coupling capacitor can be omitted.

Abstract: A diaphragm comprising a resin layer for gas shielding, a rubber layer adapted to be adjacent to a gas chamber of an accumulator, and a rubber layer adapted to be adjacent to an oil chamber of an accumulator, the rubber layers formed on opposite sides of the resin layer. The rubber layer adapted to be adjacent to the gas chamber is formed of a mixture of butyl rubber and ethylene-propylene-diene terpolymer. Also provided is an accumulator including the above diaphragm.

Abstract: In an arrangement of a door harness for a vehicle, a slide guide is arranged within a vehicle door, a harness protector is slidably fit in the slide guide, a door harness is introduced from the one end of the harness protector, and a body harness extending from a vehicle body is coupled with the door harness. In such a configuration, the harness protector is formed of soft resin and is secured to a front pillar of the vehicle body through a protector holder. Thus, when the door is opened or closed, the harness protector itself bends. Therefore, the door harness for a vehicle can be easily arranged in such a manner that an uneven spot is not provided for the vehicle body, a door trim and an inner panel.

Abstract: A keyboard including a housing unit for slidably supporting a key top; and a support panel unit carrying a switch to be operated by the key top. The housing unit can move between a first position apart from the support panel unit and a second position close to the the support panel unit, and the first position is such that the key top vertically shifting from but confronting the switch, when pressed, can operate the switch, and the second position is such that the key top being horizontally deviated from the switch, even if pressed, cannot operate the switch. The housing panel may support the elastic member for supporting the key top upon a main surface thereof, a first horizontal end of the elastic member may be fixed to the housing panel, and a second horizontal end opposite the first end of the elastic member may be movable in the horizontal direction.

Abstract: The invention provides a paper supply apparatus for an image reading apparatus, an image reading apparatus with a paper supply apparatus and a paper supply apparatus which can be used suitably with an image scanner wherein a large amount of paper sheets can be taken out one by one with certainty and read successively and rapidly. The paper supply apparatus successively supplies paper sheets accommodated therein to a paper transport mechanism along which an optical image reading mechanism is disposed, and comprises a paper supply hopper, a paper supply roller located above the paper supply hopper for forwarding the paper sheets accommodated in the paper supply hopper, a paper supply roller driving mechanism for rotating the paper supply roller, and a paper separation mechanism for preventing two or more paper sheets forwarded by the paper supply roller from being sent to the paper transport mechanism.

Abstract: A DC-DC convertor is used as a power source for an electronic apparatus. In this converter, a synchronous rectification transistor is provided in parallel with a flywheel diode. A control circuit of the converter is configured in such a way that a synchronous rectification transistor isolating unit for compulsorily turning off the synchronous rectification transistor for a predetermined fixed period of time, at the activation time of the DC--DC convertor, is included.

Abstract: A manufacturing method and a manufacturing apparatus for a card product such as a non-contact IC card product in which a circuit sheet is coated with a synthetic resin layer, in good efficiency and with a possibility to reduce the manufacturing cost of the product. The manufacturing apparatus has fixed molds 20 and a movable mold 30 which can freely approach or alienate from the other. The movable mold 30 has a piston 33 for reciprocal sliding movement in the movable mold 30 in the direction of approach and alienation. The fixed mold 20 has an injection port 22 for injecting the molten resin, and a concave part 23 is formed on the outer peripheral part surrounding the fixed mold end part opposite to the piston 33. To this concave part 23 there can be fitted a spacer 24 having the same face as the fixed type end face 20a or a spacer for replacement 242 which is replaceable with the spacer 24, and has a projected end face 242a of a certain height from the fixed mold end face 20.

Abstract: In a strut type wheel suspension system comprising a knuckle arm extending vertically from a knuckle, an intermediate part of a knuckle end of a linear damper is attached to a part of the knuckle arm so as to reinforce each other. Thereby, the knuckle arm may be made compact without compromising the camber rigidity or the precision and stability of wheel alignment. Also, the linear damper is not require to be modified from a conventional design.

Abstract: A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.

Abstract: A space heater for heating air from within a room with a heat exchanger connected to a burner and discharging heated air into the room has a room temperature sensor for detecting a room temperature and a controller for controlling the burner with a freeze prevention temperature set to prevent indoor facilities from being frozen. When the detected room temperature drops to or below the freeze prevention temperature, the controller operates the burner and controls the burner with a lower limit for an amount of heat in the burner with which no moisture condensation occurs in the heat exchanger.

Abstract: A depletion type MISFET is formed on a surface of the semiconductor substrate, MISFET including a source region, a drain region, a channel region between the source and drain regions, a gate insulating film on the channel region, and a gate electrode on the gate insulating film. An impurity diffusion region is formed in a surface layer of the semiconductor substrate. An interconnect electrically connects the gate electrode and impurity diffusion region. A p-n junction is reversed biased when a voltage sufficient for cutting off the MISFET is applied to the gate electrode relative to the channel region, an electric path between the impurity diffusion region and the channel region is made non-conductive. Pads are connected to the gate electrode, source region, and drain region.

Abstract: In renovating an existing underground pipe with a new metal pipe installed inside the underground pipe, the invention provides a method of repairing the existing underground pipe characterized by transporting a metal tubular material as wound up in the form of a roll to a repair site, the tubular material being deformed to a flat folded form so as to be diminished in effective outside diameter and to be restorable to a metal pipe of an outside diameter corresponding to the inside diameter of the underground pipe when inflated by application of pressure from inside, installing the roll of tubular material on the ground, subsequently inserting the tubular material into the underground pipe through an underground work pit while unwinding the tubular material from the roll, closing opposite ends of the inserted portion of the tubular material, and thereafter restoring the closed portion of the tubular material to a metal pipe of circular cross section by applying pressure thereto from inside with a pressure fluid

Abstract: A semiconductor memory includes a non-volatile memory cell, a writing circuit writing data into the non-volatile memory cell, an erasing circuit erasing data from the non-volatile memory cell, and a memory circuit holding the number of times of erasing data from the non-volatile memory cell.

Abstract: Even when there is a large change in unevenness on the surface of an area to be exposed, scanning exposure is carried out without reducing the throughput by accurately bringing the surface of the area into focus to the image plane. Focus position measuring areas (15F and 15R) are set apart from a slit-shaped illumination field (3) by respective sections (16F and 16R) with a predetermined width in the scanning direction. To carry out scanning exposure for a shot area on a wafer, the shot area is covered by the measuring area (15F), for example, at an approach start point of the wafer, and the focus position of the surface of the shot area is measured at detecting points (P.sub.11 to P.sub.53) in the measuring area (15F). On the basis of the result of the measurement, controlled variables for the surface position of the wafer are determined to bring the wafer surface in the illumination field (3) into focus to the image plane during scanning exposure by an autofocusing method and an autoleveling method.

Abstract: In a golf club head having a face body, the face body is composed of a hybrid of an amorphous phase layer and a crystal phase layer. The crystal phase layer is disposed on a reverse face side of a face. And, thickness of the face body is 0.5 mm to 5.0 mm, thickness of the amorphous phase layer is, on average in whole area of the face body, more than 50% of the thickness of the face body, and thickness of the crystal phase layer is arranged to be 0.01 mm to 3.0 mm.

Abstract: In order to achieve reliable welding, by reducing welding scars, of a flat conductor to another bonding member by an ultrasonic welding machine, a curved beveled portion facing a bonding member, a plurality of indented grooves running at a right angle to the direction of vibration of the horn tip and flat surfaces, which come in contact with a bonding member, are formed at either one of or both of the horn tip and the anvil, wherein the curved beveled portions, the indented grooves and the flat surfaces are formed facing opposite a low strength conductive member, and the indented grooves are formed at a width that is smaller than that of the flat surfaces provided between the individual indented grooves and curved beveled portions are formed at the edges where the indented grooves meet the flat surfaces.

Abstract: In combination, an electric terminal with an electric contact portion, the contact portion having a hollow square shape and comprising a ceiling wall with a shoulder formed at an end thereof on a side opposite a side where a mating terminal is fitted, a side wall, and a stabilizer including an extension plate extending in a height direction from the side wall and bent back on a side of the ceiling wall to provide a double layered plate; a connector housing with a terminal receiving cavity formed therein; and a terminal locking device mountable in a preliminary locked and full locked positions on the connector housing. The terminal locking device is movable from the preliminary locked position to the full locked position only when the electric terminal has been fully inserted into the terminal receiving cavity.

Abstract: A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also subjected to isotropic etching to deepen the grooves. The method can further includes additional anisotropic and isotropic etchings. Also, a method for fabricating a metallic bump forming plate member is disclosed. This method uses the above described crystalline plate having the grooves, and includes fabrication of a replica using the crystalline plate as an original, and fabrication of a metallic bump forming plate member using the replica as an original.

Abstract: A fixing unit is provided with a fixing heat roller, a first reel supplying a cleaning member which cleans a surface of the fixing heat roller, a second reel taking up the cleaning member from the first reel, and a unidirectional clutch mechanism intermittently driving the second reel in a direction to take up the cleaning member using rotation of the fixing heat roller.