Abstract: The present invention is directed to a network that includes an output matching network coupled to an amplifier. The output matching network is configured to transform the at least one amplifier transistor output impedance to an output matching network impedance. A combiner network is coupled to the output matching network. The combiner network includes a first quarter wavelength transmission line coupled between the in-phase signal path and a combiner node. The combiner network further includes a bandwidth enhancement element coupled to the quadrature signal path at the combiner node and an impedance transformation element coupled between the combiner node and a load. The impedance transformation element is configured to substantially transform a combined output matching network impedance at the combiner node to the load impedance.
Abstract: An RF power resistor includes: a lossy layer; and a dielectric layer. The lossy layer is shaped and/or sized as a transmission line. The lossy layer is made of a lossy material. The dielectric layer is made of a dielectric material. The lossy layer and the dielectric material are located to be adjacent to each other and in contact with each other.
Abstract: A high frequency amplifier network is provided in which an auxiliary amplifier is available to replace one of a plurality of primary amplifiers. Alternately, the auxiliary amplifier may operate in parallel with one of a plurality of primary amplifiers.
Abstract: A coupler is provided that includes a floating, exposed ground plane that can be partially removed to alter the coupling coefficient of the coupler's transmission lines. According to one embodiment, the coupler is formed using low temperature co-fired ceramic techniques to provide a small, stable and durable device suitable for installations in which miniaturization is required.
Abstract: An RF power resistor includes: a lossy layer; and a dielectric layer. The lossy layer is shaped and/or sized as a transmission line. The lossy layer is made of a lossy material. The dielectric layer is made of a dielectric material. The lossy layer and the dielectric material are located to be adjacent to each other and in contact with each other.
Abstract: An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup.
Abstract: The present invention is directed to a hybrid coupler device that includes a first transmission line structure and a second transmission line structure. The first transmission line structure is interdigitally coupled with the second transmission line structure such that each transmission line in the second transmission line structure is disposed adjacent to a transmission line in the first transmission line structure. The coupling or the mutual capacitance Cd between the transmission lines of the present invention need not be equal; in fact, they all can be different.
Abstract: A 4-way power splitter/combiner circuit providing a plurality of transmission lines of selected impedance and phase shift to define four amplifier ports into which one to four amplifiers may be populated without reconfiguration of the circuit. The circuit provides acceptable VSWR and return loss under each operating condition.
Abstract: A coupler circuit that includes two parallel coupled transmission lines (first transmission line and second transmission line) and a third transmission line, one end of the third transmission line connects to the end of first transmission line at one side, the other end of the third transmission line connects to the end of the second transmission line at the other side. Various coupling value and impedance transforming ratio can be achieved by select corresponding even and odd mode impedance of the coupled transmission lines and characteristic impedance of the crossing transmission line.
Abstract: The present invention is directed to a balun that includes a first coupler structure having a first port of a balanced port pair and an unbalanced port. A second coupler structure includes a second port of the balanced port pair. The second coupler port structure being connected to the first coupler structure such that the second port of the balanced port pair is DC isolated from the first port of the balanced port pair without decoupling components.
Abstract: A Guanella type balun with a conductive enclosure (for example, a re-entrant box) between its coupled lines and the magnetic material enclosing its coupled lines. Some embodiments use coupled strip lines. Some embodiments have dielectric material, such as printed circuit board material inside the re-entrant box along with the coupled strip lines. Preferably, the magnetic material is ferrimagnetic. Some preferred magnetic materials are non-conductive.
Abstract: Signal modulation apparatus includes a PIN diode network which is fed a carrier signal from a carrier signal source and a modulation signal from modulating current output terminal which receives a modulation current directly from a temperature-compensated constant-current amplifier and a signal via a unity gain amplifier from a reference diode which is also fed from the constant-current amplifier which is adapted to receive a modulating signal.
Abstract: A surface mount crossover component comprising first and second conductor lines electrically isolated from one another by an interposed dielectric layer and capacitively isolated from one another by an interposed ground plane layer. Current flowing through the crossover component via one of the conductor lines encounters no substantial interference from current flowing through the other one of the conductor lines.
Abstract: The present invention is directed to an impedance transformation device for use in a system having a characteristic system impedance, the device being characterized by a predetermined bandwidth having a center frequency. The device housing size is one-eighth wavelength of the center frequency. A first coupler is characterized by an even mode impedance and an odd mode impedance. The bandwidth is a function of the even mode impedance and the odd mode impedance substantially corresponds to the component port impedance. At least one second coupler is disposed in parallel with the first coupler and is characterized by the even mode impedance and the odd mode impedance.
Abstract: The present invention is directed to a balun that includes a first coupler structure having a first port of a balanced port pair and an unbalanced port. A second coupler structure includes a second port of the balanced port pair. The second coupler port structure being connected to the first coupler structure such that the second port of the balanced port pair is DC isolated from the first port of the balanced port pair without decoupling components.
Abstract: An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup.
Abstract: The present invention is directed to an impedance transformation device for use in a system having a characteristic system impedance, the device being characterized by a predetermined bandwidth having a center frequency. The device housing size is one-eighth wavelength of the center frequency. A first coupler is characterized by an even mode impedance and an odd mode impedance. The bandwidth is a function of the even mode impedance and the odd mode impedance substantially corresponds to the component port impedance. At least one second coupler is disposed in parallel with the first coupler and is characterized by the even mode impedance and the odd mode impedance.
Abstract: The present invention is directed to a hybrid coupler device that includes a first transmission line structure and a second transmission line structure. The first transmission line structure is interdigitally coupled with the second transmission line structure such that each transmission line in the second transmission line structure is disposed adjacent to a transmission line in the first transmission line structure. The coupling or the mutual capacitance Cd between the transmission lines of the present invention need not be equal; in fact, they all can be different.
Abstract: A Guanella type balun with a conductive enclosure (for example, a re-entrant box) between its coupled lines and the magnetic material enclosing its coupled lines. Some embodiments use coupled strip lines. Some embodiments have dielectric material, such as printed circuit board material inside the re-entrant box along with the coupled strip lines. Preferably, the magnetic material is ferrimagnetic. Some preferred magnetic materials are non-conductive.