Search Patents
  • Self-cascadable phase shifter
    Patent number: 9450572
    Abstract: A self-cascadable phase shifter having a two corresponding pairs of input and output pins. Each pair of input and output pins are interconnected by phase delay circuitry that is isolated from phase delay circuitry interconnecting the other pair of input and output pins so that each pair of input and output pins produces, for example, a 90 degree phase shift. The resulting phase shifter can be used to produce a 90 degree by using one pair of input and output pins or cascading both pairs of input and output pins to provide a 180 degree delay.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: September 20, 2016
    Assignee: Anaren, Inc.
    Inventors: Bo Jensen, Chong Mei
  • RF ATTENUATOR DEVICE AND SYSTEM
    Publication number: 20170019084
    Abstract: A device includes a thermally conductive and electrically insulative substrate having a first major surface and a second major surface. A coupling structure is configured to reduce the RF input signal by substantially a predetermined amount of attenuation power. A tuning circuit is characterized by a tuning reactance substantially matched to a predetermined system impedance. A resistor is disposed on a majority of the first major surface and is characterized by a parasitic capacitance that is substantially negated by the tuning reactance. The resistor includes a first resistive portion and a second resistive portion; each of the first resistive portion and the second resistive portion being configured to direct approximately one-half of the attenuation power to the ground portion.
    Type: Application
    Filed: August 26, 2015
    Publication date: January 19, 2017
    Applicant: Anaren, Inc.
    Inventors: Chong Mei, Bo Jensen
  • Impedance transforming coupler
    Patent number: 8860529
    Abstract: A coupler circuit that includes two parallel coupled transmission lines (first transmission line and second transmission line) and a third transmission line, one end of the third transmission line connects to the end of first transmission line at one side, the other end of the third transmission line connects to the end of the second transmission line at the other side. Various coupling value and impedance transforming ratio can be achieved by select corresponding even and odd mode impedance of the coupled transmission lines and characteristic impedance of the crossing transmission line.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: October 14, 2014
    Assignee: Anaren, Inc.
    Inventors: Chong Mei, Hans P. Ostergaard
  • Laminated Ceramic RF Assembly
    Publication number: 20140159836
    Abstract: The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.
    Type: Application
    Filed: March 14, 2013
    Publication date: June 12, 2014
    Applicant: ANAREN, INC.
    Inventors: Benton O'Neil, Adam Cook, Benjamin Shawley
  • High power RF circuit
    Patent number: 8969733
    Abstract: The present invention is directed to an RF device that includes a ceramic layer characterized by a ceramic layer dielectric constant and includes an RF circuit arrangement having a predetermined geometry and predetermined electrical characteristics. The ceramic layer dissipates thermal energy generated by the RF circuit via substantially the entire ceramic surface area. A first dielectric layer comprises a thermoplastic material and has a predetermined first thickness and a first dielectric constant. The predetermined electrical characteristics of the RF circuit arrangement are a function of the ceramic layer dielectric constant. A relative softness of the thermoplastic material is a function of the RF device operating temperature.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: March 3, 2015
    Assignee: Anaren, Inc.
    Inventors: Chong Mei, Michael J. Len, Hans P. Ostergaard
  • Doherty power amplifier network
    Patent number: 9209511
    Abstract: The present invention is directed to a network that includes an output matching network coupled to an amplifier. The output matching network is configured to transform the at least one amplifier transistor output impedance to an output matching network impedance. A combiner network is coupled to the output matching network. The combiner network includes a first quarter wavelength transmission line coupled between the in-phase signal path and a combiner node. The combiner network further includes a bandwidth enhancement element coupled to the quadrature signal path at the combiner node and an impedance transformation element coupled between the combiner node and a load. The impedance transformation element is configured to substantially transform a combined output matching network impedance at the combiner node to the load impedance.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: December 8, 2015
    Assignee: Anaren, Inc.
    Inventor: Chong Mei
  • ENCAPSULATION OF CIRCUIT TRACE
    Publication number: 20190029122
    Abstract: An approach for protecting the circuit trade of a printed circuit board from oxidation that may occur due the permeability of the underlying substrate. A layer of silver is positioned between the circuit trace and the substrate, such as by immersion plating, during manufacturing of the printed circuit board. The layer of silver is preferably applied over the seed-conductor after a negative photo resist layer has been applied to the substrate and before the copper is plated to form the circuit trace. The resist and seed-conductor outside of the circuit trace may then be removed to leave the protected circuit trace. An additional layer of silver may be plated over the copper trace to protect the exterior and side surface of the trace.
    Type: Application
    Filed: July 19, 2017
    Publication date: January 24, 2019
    Applicant: ANAREN, INC.
    Inventors: Michael J. Len, Bo Jensen
  • RF TERMINATION
    Publication number: 20170256835
    Abstract: The present invention is directed to an RF termination device that includes a substrate having a first meandered transmission line disposed on a first surface thereof. The meandered first transmission line has a predetermined first transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the first meandered transmission line is configured as an open circuit. A second meandered transmission line is disposed on the first major surface adjacent the first meandered transmission line. The meandered second transmission line has a predetermined second transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the second meandered transmission line is coupled to the other end of the first transmission line and the other end is coupled to ground.
    Type: Application
    Filed: March 7, 2016
    Publication date: September 7, 2017
    Applicant: ANAREN, INC.
    Inventor: CHONG MEI
  • WIDEBAND DOHERTY AMPLIFIER NETWORK
    Publication number: 20140253246
    Abstract: The present invention is directed to an amplifier system that includes a main amplifier configured to amplify and a peak amplifier that operates only in a high power mode. An impedance matching network is coupled to at least the peak power amplifier. An impedance transformation device is coupled to at least a portion of the impedance matching network. The impedance transformation device is configured as a balun in the high power mode. The balun includes a first input and second input coupled to the main amplifier and the peak amplifier respectively. The impedance transformation device is configured as an unbalanced line impedance transformer in the low power mode because the predetermined output impedance substantially grounds the second input. The Doherty device is characterized by an impedance transformation ratio of at least 4:1 and a relative bandwidth greater than or equal to 40%.
    Type: Application
    Filed: March 11, 2013
    Publication date: September 11, 2014
    Applicant: Anaren, Inc
    Inventor: Chong Mei
  • HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY
    Publication number: 20170309983
    Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 26, 2017
    Applicant: Anaren, Inc.
    Inventors: Michael Len, Hans Peter Ostergaard
  • Computer implemented system for locating users and a method thereof
    Patent number: 9390613
    Abstract: A computer implemented system and method for locating a user have been envisaged. The system, in accordance with the embodiments herein includes a handheld device configured to identify the present location of the user, along with the audiovisual information corresponding to the identified location of the user. The handheld device transmits that location information and the audiovisual information to a centralized server, only in the event that the user performs a predetermined gesture. Subsequently, the centralized server processes the location information and the corresponding audiovisual information, and identifies at least one electronic communication device accessible to at least one of rescue personnel, and subsequently transmits the location information and the audiovisual information, to the identified electronic communication device, preferably along with an SOS message.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: July 12, 2016
    Assignee: Anaren, Inc.
    Inventors: Yang Yu, Vijay Parmar
  • Wideband Doherty amplifier network
    Patent number: 8896373
    Abstract: The present invention is directed to an amplifier system that includes a main amplifier configured to amplify and a peak amplifier that operates only in a high power mode. An impedance matching network is coupled to at least the peak power amplifier. An impedance transformation device is coupled to at least a portion of the impedance matching network. The impedance transformation device is configured as a balun in the high power mode. The balun includes a first input and second input coupled to the main amplifier and the peak amplifier respectively. The impedance transformation device is configured as an unbalanced line impedance transformer in the low power mode because the predetermined output impedance substantially grounds the second input. The Doherty device is characterized by an impedance transformation ratio of at least 4:1 and a relative bandwidth greater than or equal to 40%.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: November 25, 2014
    Assignee: Anaren, Inc.
    Inventor: Chong Mei
  • SURFACE MOUNTABLE CIRCULATOR
    Publication number: 20100259336
    Abstract: The present invention is directed to a surface mountable circulator/isolator device that includes a first dielectric layer having an electric circuit formed thereon. A second center dielectric layer is disposed adjacent the first dielectric layer, the center dielectric layer including an opening formed therein, the opening being aligned relative to the electric circuit. A ferrite element is disposed in the opening such that the ferrite abuts the electric circuit and is aligned in two-dimensions relative to the electric circuit. A third dielectric layer is disposed adjacent the second center layer. The third dielectric layer includes a ground plane formed on each major surface thereof. The first dielectric layer, the second center dielectric layer, the ferrite element, and the third dielectric layer are bonded together to form a laminated multi-layer structure. A permanent magnet is bonded to the second ground plane.
    Type: Application
    Filed: April 14, 2010
    Publication date: October 14, 2010
    Applicant: ANAREN, INC.
    Inventors: Graeme Bunce, Thomas Lingel
  • Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer
    Patent number: 9270003
    Abstract: The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 23, 2016
    Assignee: Anaren, Inc.
    Inventors: Benton O'Neil, Adam Cook, Benjamin Shawley
  • WIDEBAND GYSEL POWER DIVIDER
    Publication number: 20190051964
    Abstract: A power divider capable of implementation in a compact multilayer surface mount component to perform power division/combining with low insertion loss, wide bandwidth, design flexibility and high power handling capabilities. The power divider has a first pair of coupled transmission lines interconnecting the input to the outputs, a second pair of coupled transmission lines interconnecting the output ports to grounded isolation resistors, and a single transmission line interconnecting the second pair of coupled transmission lines. The surface mount implementation is by a first layer supporting the ports, a second layer providing edge coupled lines, a third layer having ground plane, a fourth layer and a fifth layer each supporting one of a pair of broadside coupled lines, a sixth layer with another ground plane, and a seventh layer including a single line interconnecting the broadside coupled lines.
    Type: Application
    Filed: August 9, 2017
    Publication date: February 14, 2019
    Applicant: Anaren, Inc.
    Inventors: David Senior, Chong Mei
  • WIDEBAND RF DEVICE
    Publication number: 20170026201
    Abstract: An RF device includes an impedance transformation circuit having a plurality of first RF couplers. Each first RF coupler includes a first portion of a first transmission line winding disposed on at least one first printed circuit board (PCB) and is configured to be electromagnetically coupled to a first portion of a second transmission line winding disposed on at least one second printed circuit board (PCB). The RF device also includes a balun circuit includes a plurality of second RF couplers coupled to balanced port connections, each second RF coupler including a second portion of the first transmission line winding wound around the first portion of a first transmission line winding and configured to be electromagnetically coupled to a second portion of the second transmission line winding wound around the first portion of a second transmission line winding.
    Type: Application
    Filed: July 20, 2015
    Publication date: January 26, 2017
    Applicant: Anaren, Inc.
    Inventors: Chong Mei, Ying Huang
  • RF termination
    Patent number: 9929456
    Abstract: The present invention is directed to an RF termination device that includes a substrate having a first meandered transmission line disposed on a first surface thereof. The meandered first transmission line has a predetermined first transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the first meandered transmission line is configured as an open circuit. A second meandered transmission line is disposed on the first major surface adjacent the first meandered transmission line. The meandered second transmission line has a predetermined second transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the second meandered transmission line is coupled to the other end of the first transmission line and the other end is coupled to ground.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: March 27, 2018
    Assignee: ANAREN, INC.
    Inventor: Chong Mei
  • Magnetic Instrument Pickup
    Publication number: 20120272815
    Abstract: Various improvements and configurations for magnetic musical instrument pickups. Many of the embodiments discussed herein include printed circuit board (pcb) coils, but other embodiments may involve conventional wire wound coils. In some embodiments, the coils (pcb and/or wire wound) are encased in rigid encasement material (see DEFINITIONS section) to reduce microphony and make a quieter pickup. Also, the use of pcb coils allows for many and various new coil shapes and/or configurations because the footprint and stacking of pcb traces are relatively easy to control and/or change. Also disclosed are electromagnetic field interference reduction techniques and integration of multiple coils directly into a single pcb substrate and/or scratchpate. Also disclosed is the use of Hallbach biasing magnet arrays in connection with wire wound and/or pcb coils.
    Type: Application
    Filed: June 14, 2012
    Publication date: November 1, 2012
    Applicant: ANAREN, INC.
    Inventors: Thomas Lingel, Graeme Bunce, Mark Bowyer
  • Stress relieved high power RF circuit
    Patent number: 9350062
    Abstract: The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: May 24, 2016
    Assignee: ANAREN, INC.
    Inventors: Hans P. Ostergaard, Michael J. Len, Chong Mei, Brian K. Buyea
  • Surface mountable circulator
    Patent number: 8183952
    Abstract: The present invention is directed to a surface mountable circulator/isolator device that includes a first dielectric layer having an electric circuit formed thereon. A second center dielectric layer is disposed adjacent the first dielectric layer, the center dielectric layer including an opening formed therein, the opening being aligned relative to the electric circuit. A ferrite element is disposed in the opening such that the ferrite abuts the electric circuit and is aligned in two-dimensions relative to the electric circuit. A third dielectric layer is disposed adjacent the second center layer. The third dielectric layer includes a ground plane formed on each major surface thereof. The first dielectric layer, the second center dielectric layer, the ferrite element, and the third dielectric layer are bonded together to form a laminated multi-layer structure. A permanent magnet is bonded to the second ground plane.
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: May 22, 2012
    Assignee: Anaren, Inc.
    Inventors: Graeme Bunce, Thomas Lingel
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