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  • Patent number: 6903623
    Abstract: A balanced line switching apparatus that provides high isolation at an expense of a marginal increase of loss. Practical implementation can give as much as 40 dB isolation in a single stage.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: June 7, 2005
    Assignee: Anokiwave, Inc.
    Inventor: Nitin Jain
  • Patent number: 11205858
    Abstract: This patent application describes systems, devices, and methods for element-level self-calculation of phased array vectors by a beam forming ASIC using direct calculation such as for fast beam steering.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: December 21, 2021
    Assignee: Anokiwave, Inc.
    Inventors: Jason Durbin, Nitin Jain
  • Patent number: 10985819
    Abstract: This patent application describes systems, devices, and methods for element-level self-calculation of phased array vectors by a beam forming ASIC using interpolation and a look-up table for calculation of phase setting values such as for fast beam steering.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: April 20, 2021
    Assignee: Anokiwave, Inc.
    Inventors: Jason Durbin, Nitin Jain
  • Patent number: 11728858
    Abstract: This patent application describes systems, devices, and methods for element-level self-calculation of phased array vectors by a beam forming ASIC using interpolation and a look-up table for calculation of phase setting values such as for fast beam steering.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: August 15, 2023
    Assignee: Anokiwave, Inc.
    Inventors: Jason Leo Durbin, Nitin Jain
  • Patent number: 11955722
    Abstract: A phased array system has a substrate, a plurality of elements, a beamforming IC, and a plurality of feedlines electrically coupling the plurality of elements with at least one beamforming IC. In preferred embodiments, the feedlines are non-intersecting, symmetric feedlines that mitigate cross-polarization.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: April 9, 2024
    Assignee: Anokiwave, Inc.
    Inventors: Trang Thai, Jason Leo Durbin
  • Patent number: 9455157
    Abstract: A packaged IC has a package with a die paddle, a signal lead, and a ground lead. The packaged IC also has a die, secured to the package, with a ground pad and a signal pad. The signal pad is electrically connected to the signal lead, and the ground pad is electrically connected to both the die paddle and the ground lead.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: September 27, 2016
    Assignee: Anokiwave, Inc.
    Inventors: Vipul Jain, Noyan Kinayman, Amir Esmaili, Guarav Menon, Nitin Jain
  • Patent number: 11502419
    Abstract: A patch array has a routing printed circuit board with a plurality of layers for routing signals, and a plurality of printed circuit board patches that each has at least one through-via. The plurality of patches are mounted with the routing printed circuit board. In addition, the plurality of printed circuit board patches are formed in compliance with standard printed circuit board rules.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: November 15, 2022
    Assignee: Anokiwave, Inc.
    Inventors: Trang Thai, Jason Leo Durbin, Peter Moosbrugger
  • Patent number: 8179333
    Abstract: A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.
    Type: Grant
    Filed: May 8, 2009
    Date of Patent: May 15, 2012
    Assignee: Anokiwave, Inc.
    Inventors: Fnu Rajanish, Nitin Jain, Gaurav Menon, Angelos Alexanian
  • Publication number: 20100283700
    Abstract: A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.
    Type: Application
    Filed: May 8, 2009
    Publication date: November 11, 2010
    Applicant: Anokiwave, Inc.
    Inventors: Fnu Rajanish, Nitin Jain, Gaurav Menon, Angelos Alexanian
  • Patent number: 6924714
    Abstract: In an embodiment, a termination for a transmission line (or high frequency circuit) includes a matching circuit which provides a matching impedance for the transmission line and an electrical connection between the two, e.g., a bond wire. The electrical connection has a reactance matrix, which, when combined with the impedance provided by the matching circuit, provides a resultant termination resistance.
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: August 2, 2005
    Assignee: Anokiwave, Inc.
    Inventor: Nitin Jain
  • Publication number: 20210235282
    Abstract: A beamforming integrated circuit system is configured to optimize performance. Among other things, the system may run at a lower power than conventional integrated circuits, selectively disable branches to control certain system functions, and/or selectively position ground pads around receiving pads to enhance isolation. The system also may use a beamforming integrated circuit as a distribution circuit for a number of similar or like beamforming integrated circuits.
    Type: Application
    Filed: December 24, 2018
    Publication date: July 29, 2021
    Applicant: ANOKIWAVE, INC.
    Inventors: Pavel Brechko, David W. Corman, Vipul Jain, Shamsun Nahar, Jason Durbin, Nitin Jain
  • Patent number: 11942696
    Abstract: Exemplary embodiments include RF integrated circuit (RFIC) chips including programmable on-chip element swapping circuitry, channel swapping circuitry, and/or phase rotation circuitry to allow a common software implementation or parameter computation to be used across multiple products having different arrangements and orientations of RFICs and elements.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: March 26, 2024
    Assignee: Anokiwave, Inc.
    Inventors: Lewis N. Cohen, Robert J. McMorrow, Jason Leo Durbin, Vipul Jain
  • Publication number: 20140022834
    Abstract: A circuit arrangement for assigning identification address to each element of an array of elements of a phased array, or assigning a unique digital word to a isolated circuit. In one embodiment two external resistors are used to provide an analog voltage. That voltage can be converted to digital word and stored in a chip using latches and registers. The stored digital word can then be use as address for the army element used in phased array. Thereby access to the array element can achieved using the address as a header of a digital bit stream.
    Type: Application
    Filed: November 3, 2011
    Publication date: January 23, 2014
    Applicant: ANOKIWAVE, INC.
    Inventor: Nitin Jain
  • Patent number: 11418971
    Abstract: A beamforming integrated circuit system is configured to optimize performance. Among other things, the system may run at a lower power than conventional integrated circuits, selectively disable branches to control certain system functions, and/or selectively position ground pads around receiving pads to enhance isolation. The system also may use a beamforming integrated circuit as a distribution circuit for a number of similar or like beamforming integrated circuits.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: August 16, 2022
    Assignee: Anokiwave, Inc.
    Inventors: Pavel Brechko, David W. Corman, Vipul Jain, Shamsun Nahar, Jason Durbin, Nitin Jain
  • Patent number: 8260342
    Abstract: Two or more transceiver units can interact with each other via millimeter wave radio frequency signals. One of the transceiver units can detect time-varying signals having specific waveforms in order to initiate an action such as establishment of a communication link, powering a piece of equipment and the like. The time-varying signal can be generated by a user moving one of the transceiver units and/or by passing an non-transmissive obstruction in between the transceiver units. Related apparatus, systems, and methods are also disclosed.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: September 4, 2012
    Assignee: Anokiwave, Inc.
    Inventors: Nitin Jain, Fnu Rajanish, Gaurav Menon
  • Patent number: 10742288
    Abstract: A beamforming integrated circuit has a single channel with a transmit chain and a receive chain. The transmit chain is configured to transmit an output signal and, in a corresponding manner, the receive chain is configured to receive an input signal. The integrated circuit also has separate horizontal and vertical polarity ports, and a double pole, double throw switch operably coupled between the chains and the ports. The double pole, double throw switch is configured to switch between operation in a first mode and a second mode.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: August 11, 2020
    Assignee: ANOKIWAVE, INC.
    Inventors: Robert J. McMorrow, Vipul Jain, Wade C. Allen, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Nitin Jain
  • Patent number: 11082079
    Abstract: Exemplary embodiments dynamically select the LO frequency and mixer mode (i.e., low-side LO injection or high-side LO injection) for upconversion based on the desired RF output frequency in order to mitigate the effects of spurious and LO leakage signals that could violate radiation emission limits, e.g., in the case where the IF signal frequency is smaller than the RF operating band. By dynamically switching the LO frequency and mixer mode as a function of the requested operating RF channel, low-level emissions and spurious signal compliance with restricted bands can be achieved.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: August 3, 2021
    Assignee: ANOKIWAVE, INC.
    Inventors: Robert Ian Gresham, Shmuel Ravid, Kristian N. Madsen, Tissana T. Kijsanayotin
  • Patent number: 10777888
    Abstract: A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, and a plurality of (on chip) interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a signal interface, a first ground interface, and a second ground interface. The signal interface is configured to communicate an RF signal, and both the first and second ground interfaces are adjacent to the signal interface. The system also has a material ring circumscribing the plurality of interfaces, and at least one RF ground path coupled with the material ring.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: September 15, 2020
    Assignee: ANOKIWAVE, INC.
    Inventors: Vipul Jain, Noyan Kinayman, Robert J. McMorrow, Kristian N. Madsen, Shamsun Nahar, Nitin Jain
  • Patent number: 9154217
    Abstract: Methods, apparatuses, computer program products, and computer readable media are disclosed herein. In one aspect, an apparatus can include a transmission line configured to accept a radio frequency signal from an antenna, wherein the antenna is configured to receive the radio frequency signal from a satellite. The apparatus can further include a system on a chip comprising a direct conversion receiver, a digital signal processor configured to process a digital representation of a baseband receive waveform to determine received information, and a wireless networking interface configured to send the received information to a satellite communications indoor unit.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: October 6, 2015
    Assignee: ANOKIWAVE, INC.
    Inventors: Nitin Jain, David Corman
  • Patent number: 10587044
    Abstract: A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, a bottom surface, and a plurality of interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a plurality of static interfaces and a plurality of RF interfaces. The plurality of static interfaces are on the bottom surface of the microchip and adjacent to each other. The plurality of RF interfaces are also on the bottom surface of the microchip, but radially outward of the plurality of static interfaces. The microchip is configured to be flip chip mounted.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: March 10, 2020
    Assignee: Anokiwave, Inc.
    Inventors: Vipul Jain, Noyan Kinayman, Robert J. McMorrow, Kristian N. Madsen, Shamsun Nahar, Nitin Jain
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